WO2004023523A3 - Apparatus and process for manufacturing solder balls - Google Patents

Apparatus and process for manufacturing solder balls Download PDF

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Publication number
WO2004023523A3
WO2004023523A3 PCT/US2003/027643 US0327643W WO2004023523A3 WO 2004023523 A3 WO2004023523 A3 WO 2004023523A3 US 0327643 W US0327643 W US 0327643W WO 2004023523 A3 WO2004023523 A3 WO 2004023523A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder balls
manufacturing solder
solder
oxide growth
coating
Prior art date
Application number
PCT/US2003/027643
Other languages
French (fr)
Other versions
WO2004023523A2 (en
Inventor
Richard F Foulke
Jung-Hoon Chun
Juan C Rocha
Nannaji Saka
Original Assignee
Massachusetts Inst Technology
Richard F Foulke
Jung-Hoon Chun
Juan C Rocha
Nannaji Saka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology, Richard F Foulke, Jung-Hoon Chun, Juan C Rocha, Nannaji Saka filed Critical Massachusetts Inst Technology
Priority to AU2003265911A priority Critical patent/AU2003265911A1/en
Publication of WO2004023523A2 publication Critical patent/WO2004023523A2/en
Publication of WO2004023523A3 publication Critical patent/WO2004023523A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3603—Halide salts
    • B23K35/3605—Fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

An apparatus and method of forming fluxless solder balls includes forming solder balls from a supply of solder. A coating is formed on the solder balls for limiting naturally occurring oxide growth on the solder balls before significant natural oxide growth on the solder balls has occurred. The coating allows the solder balls to be soldered without using flux.
PCT/US2003/027643 2002-09-05 2003-09-04 Apparatus and process for manufacturing solder balls WO2004023523A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003265911A AU2003265911A1 (en) 2002-09-05 2003-09-04 Apparatus and process for manufacturing solder balls

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/236,061 2002-09-05
US10/236,061 US20040149084A1 (en) 2002-09-05 2002-09-05 Apparatus and process for manufacturing solder balls

Publications (2)

Publication Number Publication Date
WO2004023523A2 WO2004023523A2 (en) 2004-03-18
WO2004023523A3 true WO2004023523A3 (en) 2004-12-23

Family

ID=31977607

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/027643 WO2004023523A2 (en) 2002-09-05 2003-09-04 Apparatus and process for manufacturing solder balls

Country Status (3)

Country Link
US (1) US20040149084A1 (en)
AU (1) AU2003265911A1 (en)
WO (1) WO2004023523A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11639881B1 (en) 2014-11-19 2023-05-02 Carlos A. Rosero Integrated, continuous diagnosis, and fault detection of hydrodynamic bearings by capacitance sensing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994326A (en) * 1987-10-27 1991-02-19 Tamura Kaken Co., Ltd. Solder powders coated with fluorine compounds, and solder pastes
WO1994017941A1 (en) * 1993-02-06 1994-08-18 Osprey Metals Limited Production of powder
US5616164A (en) * 1992-03-19 1997-04-01 Fujitsu Limited Methods for making metal particle spherical and removing oxide film solder paste and soldering method
EP1038628A1 (en) * 1998-10-01 2000-09-27 Mitsui Mining & Smelting Co., Ltd. Unleaded solder powder and production method therefor
WO2000074132A1 (en) * 1999-06-01 2000-12-07 Alpha Metals, Inc. Method of protective coating bga solder alloy spheres
US6250540B1 (en) * 1999-04-30 2001-06-26 International Business Machines Corporation Fluxless joining process for enriched solders

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824861A1 (en) * 1988-07-21 1990-01-25 Productech Gmbh METHOD FOR PRODUCING SOLDERED CONNECTIONS
US4941929A (en) * 1989-08-24 1990-07-17 E. I. Du Pont De Nemours And Company Solder paste formulation containing stannous fluoride
US5266098A (en) * 1992-01-07 1993-11-30 Massachusetts Institute Of Technology Production of charged uniformly sized metal droplets
US5431315A (en) * 1993-05-15 1995-07-11 Massachusetts Institute Of Technology Apparatus for applying uniform metal coatings
US5736074A (en) * 1995-06-30 1998-04-07 Micro Fab Technologies, Inc. Manufacture of coated spheres
JP3557845B2 (en) * 1997-04-15 2004-08-25 セイコーエプソン株式会社 Wax or solder material
DE60142119D1 (en) * 2000-10-02 2010-06-24 Asahi Kasei Emd Corp PARTICLES OF A FUNCTIONAL METAL ALLOY.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994326A (en) * 1987-10-27 1991-02-19 Tamura Kaken Co., Ltd. Solder powders coated with fluorine compounds, and solder pastes
US5616164A (en) * 1992-03-19 1997-04-01 Fujitsu Limited Methods for making metal particle spherical and removing oxide film solder paste and soldering method
WO1994017941A1 (en) * 1993-02-06 1994-08-18 Osprey Metals Limited Production of powder
EP1038628A1 (en) * 1998-10-01 2000-09-27 Mitsui Mining & Smelting Co., Ltd. Unleaded solder powder and production method therefor
US6250540B1 (en) * 1999-04-30 2001-06-26 International Business Machines Corporation Fluxless joining process for enriched solders
WO2000074132A1 (en) * 1999-06-01 2000-12-07 Alpha Metals, Inc. Method of protective coating bga solder alloy spheres

Also Published As

Publication number Publication date
AU2003265911A1 (en) 2004-03-29
US20040149084A1 (en) 2004-08-05
AU2003265911A8 (en) 2004-03-29
WO2004023523A2 (en) 2004-03-18

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