WO2004023126A1

WO2004023126A1 - Mounting method and manufacturing method for silicon micro sensor, and silicon micro sensor

Info

Publication number: WO2004023126A1
Application number: PCT/JP2003/011275
Authority: WO
Inventors: Shunsuke Maeda; Shogo Hamatani; Yoshihiko Kohmura; Takio Kojima; Takafumi Ooshima
Original assignee: Ngk Spark Plug Co., Ltd.
Priority date: 2002-09-03
Filing date: 2003-09-03
Publication date: 2004-03-18
Also published as: JPWO2004023126A1

Abstract

A mounting method for a silicon micro sensor capable of assuring the basic performances of the silicon micro sensor by controlling the positional relation between a sensor element and a case to a specified positional relation after the sensor element is adhered to the case, comprising the steps of adhering the rear surface (50B) of the sensor element (50) to the bottom surface (41B) of the adhesion recessed part (41) of a gas sensor (10) through a sheet-like adhesive member (48), wherein the adhesive member (48) has a thickness of (d1) to realize that the surface (50A) of the sensor element (50) is generally flush with the installation surface (40A) of the element case (40) when the sensor element (50) is completely adhered to the adhesion recessed part (41).

Description

Description Mounting method and manufacturing method of silicon microphone opening sensor and silicon microsensor

The present invention relates to a silicon microsensor configured by mounting a sensor element having a detection mechanism on a silicon substrate in a case. Background art

Conventionally, silicon microsensors have been widely used in various applications, for example, when detecting gas property changes and measuring gas concentrations. Some of the sensor elements used in such silicon microsensors have a structure in which a portion where a detection mechanism is provided is thinned by using semiconductor micromachining technology. In the sensor element having this structure, a gap is formed between a thinned portion and a non-thinned portion. Hereinafter, the structure of the sensor element having such a gap is referred to as a “diaphragm structure”. Such a diaphragm structure is used, for example, in a silicon microsensor in which a detection mechanism detects gas heat of combustion by measuring the heat of combustion of the gas to thermally insulate the detection mechanism from other parts in the sensor element. It plays a role of reducing the heat capacity of the detection mechanism when the sensor element is mounted on the case.

Conventionally, the mounting of the sensor element having the diaphragm structure on the case has been performed by bonding the case and the sensor element with a paste-like adhesive. (See, for example, Japanese Patent Application Laid-Open No. 2001-129886). Disclosure of the invention

However, in the conventional bonding method described above, since the paste-like adhesive can flow when the case and the sensor element are bonded, even if the amount of the adhesive used is kept constant, the adhesive in the bonding range is uniform. It was difficult to achieve a precise distribution, and it was difficult to obtain the intended positional relationship between the case and the sensor element after the adhesive had solidified. Such a positional relationship between the case and the sensor element may affect the basic performance of the silicon microphone sensor such as the detection accuracy of the detection mechanism. Therefore, there is a high need to solve the above problem from the viewpoint of improving the basic performance of the silicon microsensor.

Therefore, the present invention solves the above-mentioned problems, and controls the positional relationship between the sensor element and the case after bonding the sensor element to the case to a desired positional relationship, thereby ensuring the basic performance of the silicon microsensor. For the purpose, the following configuration was adopted. The mounting method of the first silicon microsensor of the present invention,

A method for mounting a silicon microsensor for housing a sensor element having a detection mechanism on a silicon substrate in a case,

A concave portion capable of accommodating the sensor element is formed in the case, at least a bottom surface of the concave portion that is in contact with the sensor element is formed flat;

A sheet-shaped adhesive member whose thickness has been adjusted in advance is disposed on the bottom surface of the concave portion, and the sensor element is fitted into the concave portion, and is fixed to the bottom surface by the adhesive member.

Is the gist. The second method of mounting a silicon microphone opening sensor of the present invention is a method of mounting a silicon microsensor for housing a sensor element having a detection mechanism on a silicon substrate in a case.

On the back surface of the sensor element, a sheet-like adhesive member having a size that can be inserted into the concave portion and having a thickness adjusted in advance is attached,

The sensor element is fitted into the recess, and is fixed to the bottom surface by the adhesive member.

Is the gist.

In the first method for mounting a silicon microsensor of the invention, a sheet-like adhesive member whose thickness has been adjusted in advance is disposed on the bottom surface of the concave portion provided in the case, and the sensor element is fitted into the concave portion. It is adhesively fixed to the bottom surface of the recess by an adhesive member. In the second method for mounting a silicon microsensor of the present invention, a sheet-shaped adhesive member having a predetermined thickness is attached to the back surface of the sensor element, and the sensor element is provided in a case. It fits into the recess and is adhesively fixed to the bottom surface of the recess by an adhesive member. By bonding and fixing using a sheet-shaped bonding member in this way, the positional relationship between the case and the sensor element after bonding can be freely adjusted by changing the thickness of the bonding member at the mounting stage. Thus, it is possible to obtain a desired positional relationship in the mounted silicon microsensor. By obtaining a desired positional relationship in this way, it becomes easy to secure the basic performance of the silicon microsensor after mounting.

The recess that can accommodate the sensor element is located on the surface of the case where the sensor element is located. It is formed at a certain depth on a certain placement surface, and the pre-adjusted thickness of the sheet-like adhesive member is determined by disposing the sensor element in the recess and bonding and fixing the sensor element element surface and the case. It is also preferable that the dimension is such that the plane is substantially flush with the plane. If mounting is performed using such a thick adhesive member, the surface of the sensor element and the surface of the case are substantially flush with each other in the mounted silicon microsensor. Therefore, it is possible to effectively prevent the flow of the detection target from being disturbed in the vicinity of the detection mechanism of the sensor element, and to ensure a smooth flow. Here, the dimension that is substantially flush means that the step between the element surface of the sensor element and the arrangement surface of the case is 0.3 mm or less.

A gap is provided in the sensor element by removing a part of the sensor element so that the place where the detection mechanism is arranged becomes thin, and a sheet-like adhesive member corresponds to the gap of the sensor element. The location may have an opening having a shape corresponding to the opening of the gap. According to this configuration, when the sensor element is bonded to the concave portion of the case, unnecessary adhesive flows into the gap of the sensor element and adheres to the thinned portion (thin portion) of the gap. The thin portion can be prevented from being damaged when heat is applied to the sensor element in the curing step or the like.

The sheet-like adhesive member may be a member containing a thermosetting adhesive as a component. If such an adhesive member is used, the heated sensor element is fitted into the concave portion and pressure-bonded, so that the adhesive member can be bonded and fixed to the bottom surface. In such a case, the sensor element is heated in advance, and the remaining heat is used to fix the sensor element in the bonding recess, so that the mounting efficiency accompanying the bonding can be increased.

The method for manufacturing the silicon microphone opening sensor of the present invention is as follows. (A) preparing a detection mechanism on the surface of the silicon substrate;

(B) a step of preparing a sensor element having a thin-walled portion where the detection mechanism is disposed, on the element surface on the side where the detection mechanism is disposed;

(C) a step of preparing a case in which a recess for accommodating the sensor element is formed on an arrangement surface on a side where the sensor element is arranged;

(D) a step of preparing a sheet-like adhesive member;

(E) adhering the sensor element to the recess by interposing the adhesive member between a bottom surface of the recess and an element back surface opposite to the element surface of the sensor element;

The gist is that it is provided.

In the method for manufacturing a silicon microsensor according to the above invention, the sensor element is bonded to the concave portion by a sheet-like adhesive member interposed between the back surface of the element and the bottom surface of the concave portion of the case. For this reason, by changing the thickness of the bonding member at the manufacturing stage, the positional relationship between the case and the sensor element after bonding can be freely adjusted, and the desired position in the manufactured silicon microsensor can be adjusted. It is possible to get a relationship. By obtaining the desired positional relationship in this way, it becomes easier to ensure the basic performance of the silicon microsensor after manufacturing.

In the manufacturing method described above, in the step (E), when the sensor element is bonded to the recess, an element surface of the sensor element and an arrangement surface of the case are substantially flush with each other; After the sensor element is bonded to the sensor element, a signal for electrically connecting the sensor element and the case is provided between the element surface of the sensor element bonded to the recess and the arrangement surface of the case. (G) mounting the signal line on the surface of the element or the arrangement surface of the case, and the detection mechanism. And a step of (H) molding a part, to which the signal line is attached, with a filler. By making the element surface of the sensor element and the arrangement surface of the case substantially flush with each other, and providing a partition material on the element surface or the case arrangement surface, the space between the element surface or the case arrangement surface and the partition material is reduced. A gap is less likely to be formed in the gap, and the filler is less likely to flow out of the gap when the portion where the signal line is mounted is molded with the filler. Therefore, it is possible to prevent the silicon microsensor from causing a defect such as detection failure or breakage due to the filler flowing out from the gap.

In the case where the case includes a terminal exposed on the bottom surface of the concave portion and the sensor element includes an electrode connected to the detection mechanism on a side facing the exposed terminal of the case, in the above step (D), the terminal and the terminal It is also preferable to prepare a sheet-like bonding member having conductivity only in the direction to the electrodes. In this case, by bonding the sensor element to the recess, the electrode of the sensor element and the terminal of the case are electrically connected via the bonding member. Accordingly, in the manufacturing stage, connection work such as bonding between the electrode of the sensor element and the terminal of the case becomes unnecessary, and the manufacturing efficiency can be improved.

The silicon microsensor of the present invention,

A sensor element having a structure in which a detection mechanism is disposed on a silicon substrate, and where the detection mechanism is disposed is thin;

A case in which a recess for housing the sensor element is formed,

An adhesive member laid on the bottom surface of the concave portion and bonding the concave portion and the sensor element,

The gist is that the adhesive member is a sheet-like member.

In the silicon microsensor of the above invention, the sensor element has a sheet-like bonding portion. It is adhered to the bottom of the concave portion of the case via a material. Therefore, it is possible to freely control the positional relationship between the case and the sensor element by changing the thickness of the adhesive member, and it is easy to secure the basic performance of the silicon microphone opening sensor by controlling the positional relationship. .

Such a recess for accommodating the sensor element is formed at a predetermined depth on an arrangement surface, which is a surface of the case on which the sensor element is arranged, so that the element surface of the sensor element and the arrangement surface of the case are substantially flush. good. In this way, no step is formed near the detection mechanism of the sensor element, and no trouble is caused by the existence of the step. Such problems may include, for example, generation of turbulence when a gas to be detected flows near the detection mechanism, and accumulation of dust on a step. Of course, it is sometimes desirable to generate turbulence, etc. by not flushing. In such a case, it can be dealt with by changing the thickness of the adhesive member according to the conditions.

In addition, a gap is provided on the back surface of the sensor element so that the location where the detection mechanism is disposed is thin, and an adhesive member is provided at a location corresponding to the gap of the sensor element, corresponding to the opening of the gap. It is also possible to have a shape with a shaped opening. According to this configuration, when the sensor element is bonded to the concave portion of the case, even if unnecessary adhesive flows into the gap of the sensor element, the adhesive easily flows out of the opening. It can be prevented from adhering to the thinned part.

Alternatively, a configuration may be provided in which a recess having an internal space of a predetermined volume is provided at a position corresponding to the opening of the adhesive member on the bottom surface of the recess of the case. According to this configuration, since the volume of air existing around the thinned portion of the sensor element is increased by the space within the recess, the air pressure increases near the thinned portion. It is possible to effectively prevent damage to the thin and thin portions. After the sensor element is fitted and fixed in the recess by adjusting the thickness of the sheet-shaped adhesive member in advance, a gap having a predetermined volume is provided in the opening between the bottom surface of the recess and the back surface of the sensor element. It is also preferable to set the dimension to provide With this configuration, the sensor element is bonded and fixed to the recess, so that a gap that is continuous with the gap in the gap is provided. Therefore, even if a recess is not formed on the bottom surface of the recess of the case, the above-described gap can sufficiently secure the above-described damage prevention characteristics, and the manufacturing efficiency can be improved. Further, when the above-described recess is formed on the bottom surface of the recess of the case, since the air space is further enlarged by leaving no gap or communicating with the recess, the above-described damage prevention characteristics can be further improved. it can.

Further, the case is provided with a terminal that is exposed at the location of the adhesive member on the bottom surface of the concave portion, and the sensor element is provided with an electrode connected to the detection mechanism on the side facing the exposed terminal of the case. In addition, a sheet-shaped member having conductivity only in the direction between the terminal and the electrode can be used. In this case, connection between the electrode of the sensor element and the terminal of the case can be easily realized, and the configuration can be simplified. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an explanatory diagram showing a plan view of a catalytic combustion type combustible gas sensor 10 according to one embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a cross section when the catalytic combustion type combustible gas sensor 10 shown in FIG. 1 is cut along line 2-2.

FIG. 3 is an explanatory diagram schematically showing the sensor element 50.

FIG. 4 shows the contact combustion type flammable gas sensor 10 before the sensor element 50 is mounted. It is explanatory drawing which shows a plane.

FIG. 5 is an explanatory diagram showing a cross-sectional shape of the contact combustion type combustible gas sensor 10 shown in FIG. 4 when cut along line 5-5.

FIG. 6 is an explanatory diagram showing the adhesive member 48.

FIG. 7 is an explanatory diagram showing a state in which the sensor element 50 is bonded to the bonding recess 41 and the signal line 57 is insulated.

FIG. 8 is an explanatory diagram showing a cross-sectional shape of the element case 40 shown in FIG. 7C taken along line 9-9.

FIG. 9 is an explanatory diagram showing a first modification.

FIG. 10 is an explanatory diagram showing a second modification.

FIG. 11 is an explanatory diagram showing a third modification.

FIG. 12 is an explanatory diagram showing a fourth modification.

FIG. 13 is an explanatory diagram showing a fifth modification.

FIG. 14 is an explanatory diagram showing a use state of the air flow meter 610 as the second embodiment.

FIG. 15 is a plan view of the air flow meter 6 10.

FIG. 16 is a front view of the air flow meter 6 10.

FIG. 17 is an explanatory diagram showing a cross-sectional shape taken along arrow 17--17 when the air flow shown in FIG. 16 is cut along the line 17-17.

FIG. 18 is an explanatory diagram showing the structure of the silicon microsensor 7 10 used in the air flow 6 10. BEST MODE FOR CARRYING OUT THE INVENTION In order to further clarify the configuration and operation of the present invention described above, embodiments of the present invention will be described below in the following order.

In the first embodiment (contact combustion type combustible gas sensor 10)

A— 1. Overall configuration of catalytic combustion type combustible gas sensor 10

A— 2. Configuration of sensor element 50

A— 3. Configuration of element case 40

A- 4. Gas detection mechanism

B. Manufacturing process of flammable gas sensor with contact combustion type 10

B— 1. Preparation of element case 40, circuit board 80, sensor element 50, and adhesive member 48

B- 2. Structure of Adhesive 48

B-3. Adhesion of sensor element 50 to element case 40

B— 4. Mold of signal line 5 7

B- 5. Connection with circuit board 80

B— 6. Effect

C. Variations

D. Second Example (Air From Night 6 10)

Use example of D-1 air flow meter 6 10

D—2 Configuration of the flowmeter

D- 3 Action and effect Example

A— 1. Contact combustion type combustible gas sensor 10 Overall configuration: FIG. 1 is an explanatory view showing a plane of a contact combustion type combustible gas sensor 10 according to an embodiment of the present invention. FIG. 2 is a diagram showing the contact combustion type combustible gas sensor 10 shown in FIG. It is explanatory drawing which shows the cross section when cut | disconnected along.

The catalytic combustion type combustible gas sensor 10 (hereinafter referred to as gas sensor 10) is a sensor that detects the concentration of combustible gas by utilizing the fact that the electric resistance changes with the combustion of combustible gas. For example, it is mounted on a fuel cell unit of an automobile and is used for the purpose of measuring hydrogen leakage.

The gas sensor 10 includes an element case 40 on which a semiconductor sensor element 50 is mounted, and a circuit board 80 connected to the element case 40. The gas sensor 10 thus configured detects the gas to be measured entering the region of the element case 40 where the sensor element 50 is mounted, as indicated by the thick arrow in FIG. An electric signal corresponding to the measured gas amount is output to the circuit board 80.

In addition, the above-mentioned element case 40 is attached to a synthetic resin mounting housing 20 having an inlet 20 a to an outlet 20 b of the gas to be measured, as shown by a two-dot chain line in FIG. Then, a gas sensor may be configured, and the gas sensor may be used by attaching the mounting housing 20 to a pipe or the like forming a flow path of the gas to be measured.

A-2. Configuration of sensor element 50:

FIG. 3 is an explanatory diagram schematically showing the sensor element 50. FIG. 3 (A) shows the bottom surface of the sensor element 50, and FIG. 3 (B) shows the cross-sectional shape of the sensor element 50 shown in FIG. 3 (A) when cut along the line 3B-13B. Represents. As shown in these figures, the sensor element 50 includes a silicon substrate 51, insulating thin films 52a and 52b, a detecting mechanism 53, and an insulating protective film 55.

The silicon substrate 51 is a silicon flat plate having a length of 3 mm and a width of 5 mm. An insulating thin film 52 a is formed on the upper layer of the silicon substrate 51. The surface of the insulating thin film 52a becomes the element surface 50A of the sensor element 50. On the element surface 50 A, a detection heater 53 a described later is provided. In the lower layer of the silicon substrate 51, an insulating thin film 52b is formed except for a portion corresponding to a void 51a described later. The front surface of the insulating thin film 52b becomes the back surface 50B of the sensor element 50. The back surface 50 B of the element is bonded to the bottom surface 41 B of the bonding recess 41 of the element case 40 described below via the bonding member 48. The insulating thin films 52a and 52b are made of an oxide film formed by oxidizing the silicon substrate 51, a silicon nitride film formed by CVD or the like, a nitride film, an oxynitride film, It is composed of one or more films such as a y film and a laminated film thereof.

The detection mechanism 53 includes a detection heater 53a and a catalyst film 53b located above the detection heater 53a. The detection heater 53 a is usually a conductor having a large positive temperature resistance coefficient such as Pt (white gold), Ni_Cr (nickel-chromium), Au (gold) and Cr (chromium). Is formed by The catalyst film 53b is a catalyst that promotes combustion of the gas to be measured, and its material can be appropriately selected depending on the target gas. For example, when applied to a flammable gas such as hydrogen gas, the catalyst may be a single layer film of a noble metal such as Pt (platinum) and Pd (palladium), or Pt (white gold) and Pd ( palladium) or the like can be used that is supported on AI ₂ 0 ₃ (alumina) or S ί 0 ₂ (silicon oxide). In order to improve the adhesion strength with the insulating protective film 55, Ti (titanium), Ta (tantalum), Mo (molybdenum), W (tungsten), Cr (chromium), and Nb (niobium) ) Or a metal oxide layer thereof can be provided as a lower layer.

The sensor element 50 has the diaphragm structure described above. That is, as shown in Fig. As described above, a part of the sensor element 50 is removed below the position where the detection mechanism 53 is provided so that the location where the detection mechanism 53 is provided has a thin shape, so that the truncated pyramid is formed. A void 51a having a shape is provided. A gap 51b having a predetermined volume is formed in the gap 51a. In this embodiment, the gap 51b has a volume of about 1 mm ³ , but the volume of the gap 51b can be appropriately determined by changing the shape of the gap 51a. The presence of such a gap 51b makes it possible to reduce the heat capacity of the detection mechanism 53 and to thermally insulate the detection mechanism 53 from the silicon substrate 51. Note that the insulating thin film 52b is not formed in the space 51a, and the silicon substrate 51 is exposed.

The insulating protective film 55 is made of the same material and forming method as the insulating thin films 52a and 52b, and is disposed so as to cover the wiring layer and the like between the detection heater 53a and the electrode 56. Is done. As a result, it is possible to prevent the wiring between the detection heater 53 a and the electrode 56 from being contaminated or damaged.

The electrode 56 is a lead-out portion of a wiring connected to the detection heater 53a. In this embodiment, four electrodes 56 are exposed on the element surface 50A via the contact holes (see FIG. 1). The material of the electrodes 56 can be AI (aluminum) or Au (gold). When Au (gold) is used, Ti (titanium), Ta (tantalum), Mo (molybdenum), and W (tungsten) are used to improve the adhesion strength with the insulating protective film 55. , Cr (chromium) and Nb (niobium) metal layers. These metal oxide layers can be provided below.

A— 3. Element case 40 configuration:

FIG. 4 is an explanatory view showing a plane of the contact combustion type combustible gas sensor 10 before the sensor element 50 is mounted. FIG. 5 is a diagram showing the contact combustion type combustible gas sensor 10 shown in FIG. FIG. 5 is an explanatory diagram showing a cross-sectional shape taken along line 5-5 of FIG. As shown in FIGS. 4 to 5, the resin-molded element case 40 is provided with an arrangement surface 4OA on which the sensor element 50 is arranged on the side where the gas to be measured flows. This arrangement surface 4OA is provided with a bonding recess 41 in which the sensor element 50 is housed. The back surface 50B of the sensor element 50 is bonded to the bottom surface 41B of the bonding recess 41 via the bonding member 48 (see FIG. 2). The configuration of the bonding member 48 will be described together with a later-described manufacturing process of the gas sensor 10.

A recess 42 having a predetermined depth is formed on the bottom surface of the bonding recess 41. The recess 42 is formed at a position substantially opposed to the gap 51 a of the sensor element 50 when the sensor element 50 is bonded to the bonding recess 41 (see FIG. 2). When the sensor element 50 is mounted in the bonding recess 41 with the recess 42 facing the gap 51b in the gap 51a in this manner, a detection mechanism is provided. Since the volume of air existing in a sealed state around a thin portion (hereinafter referred to as a thin film portion) increases, the pressure rise of the sealed air near the thin film portion is suppressed. Therefore, breakage of the thin film portion can be effectively prevented.

As shown in FIGS. 1 and 2, the opening area of the recess 42 on the bottom surface of the bonding recess 41 is based on the opening area of the void 51 a on the back surface 50 B of the sensor element 50. Are formed in a slightly smaller area, and the recesses 42 are included in the voids 51a on the element back surface 50B.

As shown in FIG. 2, when the sensor element 50 is bonded to the bonding recess 41, the element surface 50A of the sensor element 50 is substantially flush with the arrangement surface 40A of the element case 40. Has become.

The element case 40 has four conductive paths between the sensor element 50 and the circuit board 80. The leads 45 are buried. One end of each lead 45 is drawn out of the element case 40 and connected to the circuit board 80. The other end of each lead 45 is exposed on the arrangement surface 40A of the element case 40, and is formed as a terminal 45a. The terminal 45a is used for connection with each electrode 56 on the element surface 50A (see FIGS. 1 and 2).

As shown in FIGS. 1 and 2, the signal line 57 is molded with a filler 58b formed from a low-viscosity insulating resin material. Further, the arrangement surface 40 A of the element case 40 to the element surface 50 A of the sensor element 50 are divided into a part where the detection mechanism 53 is provided and a part where the signal line 57 is provided. A partitioning material 58a is provided.

The partition member 58a serves to prevent the filler 58b poured into the portion where the signal line 57 is provided from flowing into the portion where the detection mechanism 53 is provided. The filling material 58b is blocked by the partitioning material 58a when trying to flow into the portion where the detection mechanism 53 is provided. The partitioning member 58a can prevent the detection mechanism 53 from being damaged due to the outflow of the filler 58b to the detection mechanism 53. It should be noted that a resin such as epoxy or urethane may be used as a resin material of the filler 58b and the partitioning material 58a, and the viscosity may be adjusted by changing the degree of polymerization of these resins. The partition member 58a formed of a resin plate may be adhered to the arrangement surface 40A of the element case 40 or the element surface 50A of the sensor element 50.

A-4. Gas detection mechanism:

In the gas sensor 10 configured as described above, when the gas to be measured flows into the detection mechanism 53, the flammable gas such as hydrogen in the gas to be measured comes into contact with the catalyst film 53b and burns. The combustion heat generated by baking is transmitted to the detection heater 53a, so that the electric resistance value of the detection heater 53a using a material having a positive temperature coefficient of resistance increases. The increased electric resistance value is transmitted to the circuit board 80 through the electrodes 56, the signal lines 57, and the leads 45 in the form of electric signals. The circuit board 80 compares the received electric resistance value with a predetermined reference value of electric resistance, and measures the concentration of the flammable gas based on the difference between the two.

B. Manufacturing process of gas sensor 10:

Next, a process of manufacturing the gas sensor 10 in the present embodiment will be described. B-1. Preparation for element case 40, circuit board 80, sensor element 50, and adhesive member 48:

First, an element case 40, a circuit board 80, a sensor element 50, and an adhesive member 48 having the shapes shown in FIGS. 3 to 5 are prepared. The element case 40 can be manufactured by resin injection molding in which the leads 45 are inserted.

B— 2. Adhesive member 4 8 Configuration:

FIG. 6 shows the configuration of the prepared adhesive member 48. FIG. 6 (A) shows a flat surface of the adhesive member 48, and FIG. 6 (B) shows an arrow when the adhesive member 48 shown in FIG. 6 (A) is cut along the line 7B-7B. It shows a sectional view.

The adhesive member 48 is a sheet-like member in which both front and back surfaces are adhesive surfaces, and each adhesive surface has thermosetting properties. The planar shape (sticking area) of the adhesive member 48 can be freely determined by cutting the base sheet into an appropriate shape. In the present embodiment, as shown in FIG. 6 (A), an adhesive member 48 having a bonding area substantially equal to the bottom surface 41 B of the bonding concave portion 41 is employed.

At the approximate center of the adhesive member 48, a gap at the back 50B of the sensor element 50 is provided. A hole 48p is formed by cutting the sheet of the area of the portion 51a in a hollow shape.

In the present embodiment, when the sensor element 50 is completely bonded to the bonding recess 41, the bonding member 48 is formed such that the element surface 5OA of the sensor element 50 and the arrangement surface 4OA of the element case 40 are arranged. It has a thickness d1 that realizes a substantially flush state (see FIG. 2). Specifically, when mounting the sensor element 50 with a thickness of 400 tm in the bonding recess 41 with a depth of 500, an adhesive member 48 with a sheet thickness of 100 tmm was adopted. I have. The bonding member 48 may be appropriately selected from those having a sheet thickness of 10 Atm or more and have a suitable thickness. In the future, if an adhesive member that realizes reliable adhesion of the sensor element 50 to the adhesive concave portion 41 with a sheet thickness of 10 or less appears, such an adhesive member may be employed. It is. Epoxy, polyimide, or the like can be used as a material of the adhesive member 48 described above.

B-3. Adhesion of sensor element 50 to element case 40:

FIG. 7 is an explanatory diagram showing a state in which the sensor element 50 is bonded to the bonding recess 41 and the signal line 57 is insulated. FIG. 7 schematically shows a cross section of a main part corresponding to FIG. After each member is prepared as described above, as shown in FIG. 7 (A), the sensor element 50 is mounted on the bottom surface 41 B of the bonding recess 41 of the element case 40 via the bonding member 48. Attach. Specifically, first, after laying the adhesive member 48 on the bottom surface 41B, the element back surface 50B of the appropriately heated sensor element 50 is placed on the laid adhesive member 48, The sensor element 50 is crimped from the element surface 50 A direction. That is, the residual heat radiated from the sensor element 50 is transmitted to the front and back surfaces of the adhesive member 48, so that the thermosetting adhesive on the front and back surfaces of the adhesive member 48 becomes tacky. By pressure bonding in such an adhesive state, the back surface of the sensor element 50 is placed on the bottom surface 41B. 50 B is glued. When the sensor element 50 is completely bonded to the bonding recess 41, as shown in FIG. 7 (B), the element surface 50A of the sensor element 50 and the arrangement surface 40A of the element case 40 are provided. And become almost the same plane. Note that the procedure for bonding the sensor element 50 to the element case 40 is as follows: after bonding the bonding member 48 to the element surface 5OA of the sensor element 50, the sensor element 50 is bonded to the bonding recess 41. It can be changed to a procedure in which the sensor element 50 is placed on the bottom surface 41B and the sensor element 50 is crimped from the element surface 50A direction. Further, since the bonding member 48 has a hole 48p corresponding to the area of the gap 51a or the recess 42, the element back surface 50B near the outer periphery of the gap 51a is formed. A certain gap outer peripheral back surface 50 Bg (the portion shown by hatching in FIG. 6 (A)) is adhered to the adhesive member 48 over the entire surface. As a result, the space 51b in the space 51a is sealed. Therefore, the outside air (indicated by the white arrow in FIG. 6A) sneaking from the element surface 50 A side of the sensor element 50 is prevented from entering the void 51 b and the recess 42. You.

By bonding the sensor element 50 using the bonding member 48 having the hole 48p formed as described above, the space 51b in the space 51a is formed through the hole 48p. Suitable communication with the recesses 42 (see FIG. 2) prevents the adhesive member 48 from blocking the recesses 42 and the adhesive member 48 from entering the recesses 42. Is done. Also, since the adhesive member 48 is sheet-shaped, unnecessary adhesive flows into the voids 51a and the recesses 42 and solidifies, and the air in the voids 51a and the recesses 42 is aired. There is no such thing as volume reduction. Therefore, it is possible to sufficiently secure the favorable breakage prevention characteristics of the sensor element 50 having the diaphragm structure.

B— 4. Mold of signal line 5 7:

Next, the signal line 57 is molded with an insulating resin material. Specifically, first, the sensor A partition member 58a is erected in the form of a vertical wall by applying a high-viscosity insulating resin material on the element surface 50A of the element 50 and on the arrangement surface 40A of the element case 40. The partition member 58a is formed of a high-viscosity (15 OPa-s or more) insulating resin material that rises when placed on the upper surface of the sensor element 50. Subsequently, the signal line 57 is covered with a filler 58b by pouring a low-viscosity insulating resin material from above the signal line 57. In the present embodiment, a resin material having a low viscosity (less than 150 Pa's, preferably less than 15 Pa ■ s) is used as the filler 58 b. It flows into the back of signal line 57. As a result, the signal line 57 is brought into close contact with the filler 58 and covered. The condition after such coating is shown in FIG. 7 (C). FIG. 8 shows a cross-sectional shape of the element case 40 shown in FIG. 7 (C) taken along the line 9-9. As shown in FIG. 8, after the sensor element 50 is bonded to the bonding recess 41, the element surface 50A of the sensor element 50 and the arrangement surface 40A of the element case 40 are substantially flush. It becomes. Therefore, when a partition member 58a is provided across the element surface 5OA and the arrangement surface 4OA between different components such as the sensor element 50 and the element case 40, the element surface 50A and the arrangement surface 4 There is no gap between the element surface 50A and the partition member 58a or between the arrangement surface 4OA and the partition member 58a due to the step difference from 0A. Therefore, the filler 58b is effectively prevented from flowing out of such a gap in the direction of the detection mechanism 53, and the filler 58b that is going to the detection mechanism 53 is a partitioning material 58a. Is completely blocked by.

B-5. Connection with circuit board 80:

Next, one end of each lead 45 of the element case 40 is soldered to the circuit board 80, thereby connecting the terminal 45 a of each lead 45 to the circuit board 80. Thereby, the gas sensor 10 is completed. B— 6. Action and effect:

As described above, in the gas sensor 10 of the above embodiment, the sensor element 50 is bonded to the element case 40 by the interposition between the bottom surface 41 B of the bonding recess 41 and the element back surface 50 B. This is realized by the sheet-like adhesive member 48 provided. Therefore, the positional relationship between the element case 40 and the sensor element 50 after the bonding can be freely adjusted by changing the planar shape, the thickness, and the like of the bonding member 48 in the manufacturing stage. For example, by changing the thickness of the adhesive member 48, the position of the element surface 50A of the sensor element 50 can be strictly controlled. By obtaining the desired positional relationship in this way, it becomes easier to ensure the basic performance of the silicon microsensor after manufacturing. For example, as in the above embodiment, when the height relationship between the element surface 50 A of the sensor element 50 and the arrangement surface 4 OA of the element case 40 is substantially flush, the gas to be measured is This prevents turbulent flow from hitting the step between the surface 5 OA and the arrangement surface 40 A of the element case 40, ensuring a smooth flow of the gas to be measured and improving the accuracy of gas concentration detection. be able to. Further, as in the above embodiment, when a partition member 58 a for molding the signal line 57 is provided between the element surface 50 A of the sensor element 50 and the arrangement surface 40 A of the element case 40. The filler 58b flows out of the gap between the element surface 50A and the arrangement surface 4OA of the element case 40 and the partitioning material 58a, and the filler 58b adheres to the detection mechanism 53. Is effectively prevented. Accordingly, it is possible to prevent the occurrence of problems such as detection failure by the detection mechanism 53 and breakage of the detection mechanism 53 itself. C The gas sensor 10 of the above-described embodiment is, for example, capable of detecting hydrogen in the fuel cell unit. It can be applied to sensors that detect leakage. That is, in the fuel cell unit, hydrogen and air (oxygen) are supplied to the hydrogen electrode and the air electrode, respectively, and electricity is generated by causing a chemical reaction between the hydrogen and air (oxygen). Battery unit It can be used as a sensor for detecting that hydrogen is mixed in a high-humidity part (a water introduction part for guiding water to the electrolyte of the fuel cell) in the vessel.

C. Variations:

Modifications of the gas sensor 10 of the above embodiment will be described with reference to FIGS. 9 to 13. FIG. The gas sensors 110, 210, 310, 410 shown in FIGS. 9 to 13 are sensor elements 550 which are substantially common to the gas sensor 10 and the sensor element 50 in the above embodiment. Is provided. In FIG. 9 to FIG. 13, the tens place of the reference numerals of the common parts are represented by the same numerals or alphabets as the reference signs used in the above embodiment. FIG. 9 is an explanatory diagram showing a first modification. FIG. 9 shows a cross section corresponding to FIG. 7 (C). As shown in FIG. 9, a gas sensor 110 according to a first modification has an electrode 156 on the element back surface 1508 side of the sensor element 150 and is electrically connected to the electrode 156. The terminal 144 a of each lead 144 is provided so as to be exposed on the bottom surface 141 B of the bonding recess 144 of the element case 140. When such a sensor element 150 is bonded to the bonding concave portion 141, a sheet-like bonding member 148 having anisotropic conductivity (in this example, a bonding material having conductivity only in the thickness direction). Member) is used. In this case, by bonding the sensor element 150 to the bonding recessed part 141, the electrode 156 of the sensor element 150 and each terminal 144a of the element case 140 are bonded to each other. Conducted through 1 4 8. Therefore, in the manufacturing stage, the process of connecting the electrode 156 of the sensor element 150 to the terminals 145a of the element case 140 and the signal between the electrode 156 and the terminal 145a This eliminates the need for a wire molding step, thereby increasing manufacturing efficiency.

In the above embodiment, the partitioning material 5 8 is formed so as to surround the periphery of the four signal lines 57. However, the partitioning material 58a is not limited to such a shape, but may be provided in another shape to prevent the inflow of the filler 58b into the detection mechanism 53 side. It is good. For example, as in a gas sensor 210 as a second modified example shown in FIG. 10, a rod-shaped partition member 258a provided at a position that separates the signal line 57 area and the detection mechanism 53 area is used as an element. It is also possible to mount and fix to the inner peripheral wall of the case 40 facing the same, and to provide the partition member 258a using the wall of the element case 40. FIG. 10 shows a plane corresponding to FIG.

In the above embodiment, the recess 42 is formed at a position facing the gap 51a, but the configuration may be such that the recess 42 is not formed. Such a configuration example is shown in FIG. 11 as a third modification. FIG. 11 shows a cross section of the gas sensor 310 corresponding to FIG. 7 (C).

It is also possible to form a space communicating with the gap 51 a in a mode other than the recess 42. Such a configuration example is shown in FIG. 12 as a fourth modification. FIG. 12 shows a cross section corresponding to FIG. 7 (C). As shown in FIG. 12, in the gas sensor 410 according to the fourth modification, the thickness of the adhesive member 448 is made larger than the thickness d1 of the above-described embodiment, so that the element back surface 50 B A gap 448 b is formed between the bottom of the bonding recess 441 and the bonding recess 441. In this way, the gap 51b in the gap 51a can be formed without forming a recess in the bonding recess 441, which faces the gap 51a of the sensor element 50 at the manufacturing stage. A communication gap 4 4 8b is provided to increase the air volume. Therefore, it is possible to secure the property of preventing the thin film portion from being damaged while further improving the production efficiency. When a recess is formed in the bonding recess 441 together with the gap 4448b, the air space is further expanded by communicating with both the gap 4448b and the recess. Therefore, the above-described breakage prevention characteristics can be further improved. In the above embodiment, the gap 51b is provided by forming the gap 51a on the back surface 50B of the sensor element 50.However, the gap 51b may be provided in other forms. is there. For example, as shown in FIG. 13 showing a sensor element 550 as a fourth modification, a void 551b may be provided by forming a through hole in a side surface of the sensor element 50. FIG. 13 shows a cross section corresponding to FIG. 3 (B). In the above-described embodiment or modified example, the case where the step of molding the signal line 57 is unnecessary or the case where the flow of the filler 58b into the detection mechanism 53 is prevented by other means (for example, In the case where the inner wall of the bonding recess 41 and the outer surface of the sensor element 50 are in close contact with each other, or when molding is performed using a filler that does not flow, At the time of bonding to the bonding recess 41, the element surface 50A and the arrangement surface 40A may not be substantially flush. In such a case, the adjustment of the height of the sensor element 50 and the adjustment of the area where the sensor element 50 is bonded to the bonding recess 41 are flexibly changed according to the thickness of the bonding member 48. Can be.

The present invention is not limited to the above embodiment, and can be implemented in various modes without departing from the scope of the invention. For example, the sheet-shaped adhesive member 48 may be formed of a combination of two or more members. Further, in the above embodiment, the present invention is applied to the gas sensor 10 for detecting the concentration of flammable gas.However, the present invention is not limited to this. Exhaust gas) can also be applied. Further, the present invention can be applied to a flow rate sensor, an acceleration sensor, and the like.

D. Second Example (Air From Night 610):

Usage example of D-1 air flow meter 6 10 Next, as a second embodiment of the present invention, an air flow meter will be described as a sensor for measuring a gas flow rate. FIG. 14 is a schematic diagram schematically showing an intake system of an internal combustion engine using this air flow system 6 10. As shown in the figure, the intake system of the internal combustion engine 600 is provided with an air cleaner 632 _{; an} intake pipe 6330 and a surge tank 637 from the upstream, and the intake pipe 630 is made of silicon. An air flow meter using a micro sensor is provided, and a throttle valve for adjusting the intake air amount is provided. A fuel injection valve 6400 is provided at an intake port where the intake pipe 6300 is connected to the internal combustion engine 600. In addition, the internal combustion engine 600 has a spark plug 645 that forms a spark in the cylinder when a high voltage is applied from the internal combustion engine 640, and a rotation that detects the rotation speed of the internal combustion engine 600. A number sensor 650 and an EFI controller 620 that receives signals from these sensors and drives a fuel injection valve 640, an idler 640, and the like are also provided.

The EFI controller 620 receives the signal from the air flow meter 610, calculates the intake air amount Q, and, based on this and the rotational speed N of the internal combustion engine 600, is required for the internal combustion engine 600. The fuel injection amount V is calculated. The EFI controller 620 opens the fuel injection valve 640 for a time corresponding to the fuel injection amount V, thereby injecting the fuel pumped to the fuel delivery pipe 638 into the intake port. I do. The injected fuel is sucked into a cylinder (combustion chamber) of the internal combustion engine 600 while mixing with intake air sucked through an intake pipe in a suction stroke in which a piston (not shown) descends. At the end of the compression stroke due to the rise, the spark is formed by the spark formed in the spark plug 645. The piston is pushed down by the explosive combustion generated by spark ignition, and the combustion energy of the fuel is taken out as kinetic energy through a crankshaft (not shown). Used for the purpose.

In such control of the internal combustion engine 600, if the mixing ratio of fuel and intake air is properly maintained, for example, if gasoline is used as fuel to maintain a stoichiometric value (air-fuel ratio of 14.7), the intake air amount Q is precisely adjusted. It is necessary to perform detection with high responsiveness. The air flow meter 6 10 used in the present embodiment is configured as a silicon micro sensor, and realizes high detection accuracy and responsiveness. Hereinafter, the configuration of the air flow meter 610 as the second embodiment will be described.

D— 2 Air Frome

FIGS. 15 and 16 show the outer shape of the air flow meter 600 as the second embodiment. FIG. 15 is a plan view of the air flow 6110, and FIG. 16 is a front view thereof. As shown in FIGS. 14 to 16, the air flow meter 6 10 has the detection section 6 12 disposed in the intake pipe 6 30 and the air flow meter 6 10 mounted on the intake pipe 6 30. And a connector 618 for making an electrical connection with the EFI controller 620. The detecting portion 6 12 is a portion protruding into the flow of the intake air from the intake pipe 6 30, and an opening 700 is provided in front of the front end portion thereof as shown in FIG. 16. . The opening 700 penetrates to the back of the detection unit 6 12. When the air flow unit 6 10 is attached with the detection unit 6 12 inserted into the intake pipe 6 A part of the intake air flowing through the pipe 630 passes through the opening 700.

FIG. 17 shows a cross section of the opening 700. As shown in the figure, the opening 700 has a shape having a large opening cross-sectional area at the entrance and the smallest opening cross-sectional area at the center. Due to such a shape, the intake air flowing through the intake pipe 630 flows into and out of the opening 700 smoothly. Intake pipe 6 3 Since there is a good proportional relationship between the total amount of intake air flowing through the inside of the cylinder and the amount of air flowing through the opening of the air flower, the air passes through the opening. By measuring the amount of air flowing through the intake pipe 630, the amount of intake air finally flowing into the internal combustion engine 600 can be detected.

A silicon microsensor 7100 is formed at the center of the opening 7100 of the air flow 6110. FIG. 18 is an enlarged view of the structure of the silicon microsensor 710. The basic shape of the silicon microsensor 7100 is the same as that of the first embodiment. That is, in the silicon microsensor 7100, a silicon substrate 720 is bonded and fixed to the bonding concave portion 735 provided in the case 715 via a sheet-shaped bonding member 740. Structure. The surface of the silicon substrate 720 is polished with extremely high precision and has a so-called mirror finish. On the surface of the silicon substrate 720, an insulating thin film 727 of silicon oxide is formed. An air gap 730 is formed on the substantially central rear surface of the silicon substrate 720, and the portion where the detection mechanism is formed is thin. In the thin portion, a heater 725 is formed at the center, and an upstream sensor 721 and a downstream sensor 722 are formed on both sides thereof. Each of the sensors 725 and 721 is a thin film of platinum or the like formed by a method such as sputtering. The heater 725 and both sensors 721, 722 are formed inside the insulating thin film 727 corresponding to the thin portion. The insulating thin film 727 can be formed by a thin film other than the oxide film.

In the second embodiment, the silicon microsensor 710 of the air flow unit 610 has a depth H1 of the bonding concave portion 735, the thickness d1 of the sheet-shaped bonding member 740, and the silicon microsensor 710. The sum is equal to the sum of the thickness of the substrate 720 and the thickness D 1 (H 1 = d 1 + D 1). For this reason, the adhesive member 740 is placed at the bottom of the adhesive recess 735, and the silicon base is placed here. When the plate 720 is fitted and the silicon substrate 720 is bonded to the bonding recess 735 by the bonding member 740, the surface of the silicon substrate 720 and the surface of the case 7 15 are substantially flush. In the present embodiment, the dimensional tolerance of each part was controlled so that the difference in height between the two was less than ± 0.3 mm. There is a height difference (step) between the surface of the case 7 15 and the surface of the silicon substrate 720, and when the step is larger than a predetermined value, a vortex that cannot be overlooked in the air flowing through the opening 700, It may affect the accuracy of air volume detection described later. In the present embodiment, since the step is set to ± 0.3 mm or less, the flow of the air passing through the opening 700 is kept in an orderly laminar flow, and the required detection accuracy as the air flow meter 610 can be obtained.

The step between the surface of the case 7 15 and the surface of the silicon substrate 720 can be set to ± 0.2 mm or less, more preferably 0.1 mm or less, by strictly controlling the dimensional tolerance. It is possible. The plus sign indicates a case where the silicon substrate 720 on which the detection mechanism is formed is higher, and the minus sign indicates a case where it is lower. It is preferable that the silicon substrate 720 be projected so that the above difference is controlled in the range of 0.05 to 0.3 mm. Needless to say, a range of 0.05 to 0.2 mm or a range of 0.05 to 0.1 mm is also preferable in terms of maintaining high detection accuracy. The remaining configuration of the airframe 610, such as wiring from the terminal of the connector 618 to the electrode of the silicon substrate 720, is basically performed in the same manner as in the first embodiment. Therefore, the description is omitted.

D-3 Action and effect:

The method of detecting the amount of intake air by the silicon microsensor 710 whose structure is simply described above will be briefly described. A constant current is applied to the heater 725 provided at the center of the thin portion of the silicon substrate 720, and a constant amount of heat is appear. The heat generated in the heat sink 725 is transmitted to the surroundings through the air present in the opening 700, and raises the temperature of the two sensors 721 and 722 on both sides. The sensors 72 1 and 72 2 are made of a material having a high temperature coefficient of resistance such as platinum. The resistance of the sensor is basically determined by the specific resistance, the length and the cross-sectional area of the sensor. The temperature coefficient of resistance of a material such as platinum is known. Therefore, by measuring the resistance values of both sensors 721, 722, the temperature can be known. The two sensors 72 1 and 72 2 are made of the same material, have the same length, and have the same cross-sectional area so that their resistance values are equal at the same temperature. In addition, the distance from the heater 72 5 to the upstream sensor 72 1 is equal to the distance from the downstream sensor 72 2. Therefore, if the amount of air passing through the opening 700 is zero, the temperature rises of both sensors are equal and the resistance values are basically equal.

On the other hand, when the air flowing into the internal combustion engine 600 from the operation of the internal combustion engine 600 flows through the intake pipe 630 and a part of the air passes through the opening 700, heat is generated by energization. The heat transfer from 725 acts to increase the temperature rise of the downstream sensor 722 by the air flowing through the opening 700 and to suppress the temperature rise of the upstream sensor 721. The degree is proportional to the amount of air flowing through the opening 700. Therefore, for example, the upstream sensor 721 and the downstream sensor 722 are connected so as to be arranged at opposing positions of a Wheatstone bridge composed of four resistors, and the other two resistors are connected. If it is placed in a position that is not affected by the heat transfer from the heat sink 725, the change in resistance due to the temperature change between the upstream sensor 721 and the downstream sensor 722 will be transferred to the heater bridge. More accurate detection is possible. In the air flow meter 610 of the present embodiment, the amount of air flowing through the opening 700 and thus the amount of air flowing through the intake pipe 630 are measured by such a structure. In the air flow meter 610 using the silicon microsensor 710 of the second embodiment described above, the portion where the heater 725 and both sensors 721, 722 are formed is made thin. Therefore, when the flow rate of the air flowing through the opening 700 changes and the state of heat transfer from the heater 72 changes, the temperatures of both sensors 72 1 and 72 2 also change immediately. Therefore, high responsiveness can be realized in detecting the air amount. Also, since the silicon substrate 720 is housed and bonded in the bonding recess 735 by using a sheet-like bonding member 740, the silicon substrate 722 with respect to the height of the case 715 is provided. The surface height can be controlled with high precision, and by making the two almost the same level, the flow of air flowing through the opening 700 will not be disturbed, and the air volume detection accuracy Can be kept high.

In the above embodiments, the resin case-molded element case 40 and the case 715 are described as the “case” in the claims, but the present invention is not limited thereto. Ceramic substrate made of light, aluminum nitride, glass ceramic, etc., or resin such as epoxy resin, polyimide resin, BT resin, PPE resin, or composite material of these resins with fibers such as glass fiber or polyester fiber Also, a substrate made of a resin composite material in which a fluororesin having a three-dimensional network structure is impregnated with an epoxy resin or the like is included. Further, a substrate formed by combining a ceramic substrate with these resins and composite materials is also included.

Claims

The scope of the claims

1. A method of mounting a silicon microsensor in which a sensor element with a detection mechanism is housed in a case on a silicon substrate.

A sheet-like adhesive member whose thickness is adjusted in advance is arranged on the bottom surface of the concave portion, and the sensor element is fitted into the concave portion, and is fixed to the bottom surface by the adhesive member.

How to mount a silicon microsensor.

2. A method for mounting a silicon microsensor in which a sensor element having a detection mechanism is housed in a case on a silicon substrate.

How to mount a silicon microsensor.

3. The method for mounting a silicon microsensor according to claim 1 or 2,

The recess capable of housing the sensor element is formed at a predetermined depth on an arrangement surface that is a surface of the case on the side where the sensor element is arranged, The pre-adjusted thickness of the sheet-shaped adhesive member is such that the element surface of the sensor element and the arrangement surface of the case are substantially flush after the sensor element is fitted into the recess and adhered and fixed. Dimensions

How to mount a silicon microsensor.

4. A method for mounting the silicon microsensor according to any one of claims 1 to 3, wherein

The sensor element is provided with a void portion by removing a part of the sensor element so that the portion where the detection mechanism is arranged has a thin shape,

The sheet-shaped adhesive member has an opening having a shape corresponding to the opening of the gap at a position corresponding to the gap of the sensor element.

How to mount a silicon microsensor.

5. The method for mounting a silicon microsensor according to claim 1, wherein the sheet-like adhesive member is a member containing a thermosetting adhesive as a component.

6. The mounting method of the silicon microsensor according to 5, wherein the heated sensor element is fitted into the concave portion and pressure-bonded to realize bonding and fixing to the bottom surface by the bonding member.

7. (A) a step of preparing a detection mechanism on the surface of the silicon substrate;

(D) a step of preparing a sheet-like adhesive member;

(E) the bottom surface of the recess and the surface of the sensor element opposite to the element surface Adhering the sensor element to the concave portion with the adhesive member interposed between the element and the back surface of the element;

A method for manufacturing a silicon microsensor comprising:

8. The method for manufacturing a silicon microsensor according to claim 7, wherein, in the step (E), when the sensor element is bonded to the recess, an element surface of the sensor element and an arrangement surface of the case. And almost the same,

(F) after the sensor element is bonded to the concave portion, between the element surface of the sensor element bonded to the concave portion and the arrangement surface of the case, and between the sensor element and the case. Attaching a signal line to be electrically connected;

(G) a step of providing a partitioning material on the element surface or the arrangement surface of the case to partition a portion where the signal line is mounted and a portion where the detection mechanism is disposed;

(H) a step of molding a portion to which the signal line is attached with a filler material.

9. The method for manufacturing a silicon microsensor according to claim 7 or 8, wherein

The case includes a terminal exposed on a bottom surface of the concave portion,

The sensor element includes an electrode connected to the detection mechanism on a side facing the exposed terminal of the case,

The adhesive member prepared in the step (D) is a sheet-like member having conductivity only in the direction of the terminal and the electrode.

A method for manufacturing a silicon microsensor.

10. A sensor element having a detection mechanism on a silicon substrate,

A case in which a recess for housing the sensor element is formed, An adhesive member laid on the bottom surface of the concave portion and bonding the concave portion and the sensor element,

The adhesive member is a sheet-like member

Silicon micro sensor.

1 1. The recess for accommodating the sensor element is formed at a predetermined depth on an arrangement surface that is a surface of the case on a side where the sensor element is arranged,

The silicon microsensor according to claim 10, wherein an element surface of the sensor element and the arrangement surface of the case are substantially flush.

12. On the back surface of the sensor element, a void is provided so that the portion where the detection mechanism is disposed has a thin wall shape.

The adhesive member has an opening having a shape corresponding to the opening of the gap at a position corresponding to the gap of the sensor element.

The silicon microsensor according to claim 10 or 11.

13. The silicon microsensor according to claim 12, wherein a recess having a predetermined volume of an internal space is provided at a position corresponding to the opening of the adhesive member on a bottom surface of the recess of the case. .

14. The pre-adjusted thickness of the sheet-like adhesive member is a dimension such that a gap having a predetermined volume is provided in the opening between the bottom surface of the concave portion and the back surface of the sensor element. 12. The silicon microsensor according to 12 or 13.

15. The silicon microsensor according to any one of claims 10 to 14, wherein

The case includes a terminal that is exposed at a location where the adhesive member exists on a bottom surface of the concave portion, The sensor element includes an electrode connected to the detection mechanism on a side facing the exposed terminal of the case,

The adhesive member is a sheet-like member having conductivity only in a direction between the terminal and the electrode.

Silicon micro sensor.