WO2004018349A3 - Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe - Google Patents

Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe Download PDF

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Publication number
WO2004018349A3
WO2004018349A3 PCT/FR2003/050036 FR0350036W WO2004018349A3 WO 2004018349 A3 WO2004018349 A3 WO 2004018349A3 FR 0350036 W FR0350036 W FR 0350036W WO 2004018349 A3 WO2004018349 A3 WO 2004018349A3
Authority
WO
WIPO (PCT)
Prior art keywords
deformable area
microstructure
thickness
film
functionalised
Prior art date
Application number
PCT/FR2003/050036
Other languages
English (en)
Other versions
WO2004018349B1 (fr
WO2004018349A9 (fr
WO2004018349A2 (fr
Inventor
Christophe Bureau
Christophe Kergueris
Francois Perruchot
Original Assignee
Alchimer S A
Tronic S Microsystems
Christophe Bureau
Christophe Kergueris
Francois Perruchot
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alchimer S A, Tronic S Microsystems, Christophe Bureau, Christophe Kergueris, Francois Perruchot filed Critical Alchimer S A
Priority to JP2004530314A priority Critical patent/JP4473123B2/ja
Priority to AU2003276377A priority patent/AU2003276377A1/en
Priority to CA2496320A priority patent/CA2496320C/fr
Priority to US10/524,560 priority patent/US7196385B2/en
Priority to EP03792450A priority patent/EP1551754A2/fr
Publication of WO2004018349A2 publication Critical patent/WO2004018349A2/fr
Publication of WO2004018349A9 publication Critical patent/WO2004018349A9/fr
Publication of WO2004018349A3 publication Critical patent/WO2004018349A3/fr
Publication of WO2004018349B1 publication Critical patent/WO2004018349B1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0094—Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067 - B81B3/0091
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0214—Biosensors; Chemical sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/06—Bio-MEMS
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y10S977/733—Nanodiaphragm

Abstract

Microstructure électromécanique (1) comprenant une première partie appelée partie mécanique (102) réalisée dans un premier matériau conducteur de l'électricité, et qui comprend d'une part une zone déformable de manière élastique (104) ayant une valeur d'épaisseur et une surface exposée (2), et d'autre part un premier film organique (4) ayant une épaisseur, présent sur l'ensemble de la surface exposée (2) de la dite zone déformable (104), caractérisé en ce que l'épaisseur du premier film (4) est telle que la réponse élastique de la zone déformable (104) munie du premier film (4) ne change pas de plus de 5 % par rapport à la réponse de la zone déformable nue (104) ou en ce que l'épaisseur du premier film (4) est inférieure à dix fois l'épaisseur de la zone déformable (104). Application à la fabrication de microstructures électromécaniques.
PCT/FR2003/050036 2002-08-26 2003-08-25 Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe WO2004018349A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004530314A JP4473123B2 (ja) 2002-08-26 2003-08-25 薄層の局所的な堆積によって機能化された表面を備えた微細構造及びその製造方法
AU2003276377A AU2003276377A1 (en) 2002-08-26 2003-08-25 Microstructure comprising a surface which is functionalised through the localised deposit of a thin layer and production method thereof
CA2496320A CA2496320C (fr) 2002-08-26 2003-08-25 Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe
US10/524,560 US7196385B2 (en) 2002-08-26 2003-08-25 Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereof
EP03792450A EP1551754A2 (fr) 2002-08-26 2003-08-25 MICROSTRUCTURE A SURFACE FONCTIONNALISEE PAR DEPOT LOCALISE D'UNE COUCHE MINCE ET PROCEDE DE FABRICATION ASSOCIE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0210571A FR2843742B1 (fr) 2002-08-26 2002-08-26 Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe
FR02/10571 2002-08-26

Publications (4)

Publication Number Publication Date
WO2004018349A2 WO2004018349A2 (fr) 2004-03-04
WO2004018349A9 WO2004018349A9 (fr) 2004-06-03
WO2004018349A3 true WO2004018349A3 (fr) 2005-01-20
WO2004018349B1 WO2004018349B1 (fr) 2005-03-24

Family

ID=31198306

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2003/050036 WO2004018349A2 (fr) 2002-08-26 2003-08-25 Microstructure a surface fonctionnalisee par depot localise d'une couche mince et procede de fabrication associe

Country Status (7)

Country Link
US (1) US7196385B2 (fr)
EP (1) EP1551754A2 (fr)
JP (1) JP4473123B2 (fr)
AU (1) AU2003276377A1 (fr)
CA (1) CA2496320C (fr)
FR (1) FR2843742B1 (fr)
WO (1) WO2004018349A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9434608B2 (en) 2006-01-20 2016-09-06 Sitime Corporation Wafer encapsulated microelectromechanical structure

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878552B2 (ja) * 2004-04-20 2012-02-15 独立行政法人理化学研究所 素子、これを用いた薄膜トランジスタおよびセンサ、ならびに素子の製造方法
US7311009B2 (en) * 2004-11-17 2007-12-25 Lawrence Livermore National Security, Llc Microelectromechanical systems contact stress sensor
US8109149B2 (en) 2004-11-17 2012-02-07 Lawrence Livermore National Security, Llc Contact stress sensor
US7820026B2 (en) 2005-04-13 2010-10-26 Applied Materials, Inc. Method to deposit organic grafted film on barrier layer
JP2009526112A (ja) * 2006-02-10 2009-07-16 ユニベルシテ・ド・リエージュ 強力な接着性のナノ構造化ポリマーコーティングを形成すると共に制御する電気グラフト法
WO2007126854A2 (fr) * 2006-03-28 2007-11-08 Alfred E. Mann Institute For Biomedical Engineering At The University Of Southern California capteur tactile biomimétique
US8181540B2 (en) * 2006-03-28 2012-05-22 University Of Southern California Measurement of sliding friction-induced vibrations for biomimetic tactile sensing
TWI384095B (zh) * 2007-01-29 2013-02-01 Applied Materials Inc 晶圓電化學處理設備及其方法
US7842173B2 (en) * 2007-01-29 2010-11-30 Semitool, Inc. Apparatus and methods for electrochemical processing of microfeature wafers
US8272278B2 (en) 2007-03-28 2012-09-25 University Of Southern California Enhancements to improve the function of a biomimetic tactile sensor
US8647535B2 (en) 2011-01-07 2014-02-11 International Business Machines Corporation Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
US10192850B1 (en) 2016-09-19 2019-01-29 Sitime Corporation Bonding process with inhibited oxide formation
US11276822B2 (en) * 2017-06-02 2022-03-15 Simon Fraser University Method of patterned deposition employing pressurized fluids and thermal gradients
CN114042339A (zh) * 2021-12-03 2022-02-15 南京航空航天大学 一种微米镍颗粒负载的油水分离网膜及其制备方法和应用

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EP0241294A1 (fr) * 1986-04-10 1987-10-14 Sumitomo Electric Industries Limited Sonde pour un cathéter
US4722348A (en) * 1985-09-17 1988-02-02 Sentron V.O.F. Catheter tip pressure transducer
US5067491A (en) * 1989-12-08 1991-11-26 Becton, Dickinson And Company Barrier coating on blood contacting devices
US5512374A (en) * 1994-05-09 1996-04-30 Texas Instruments Incorporated PFPE coatings for micro-mechanical devices
US5567297A (en) * 1994-01-20 1996-10-22 Recherche et Developement du Groupe Cockerill Sambre en abrege: "RD-CS" Process for depositing by electropolymerization on organic film onto an electrically conductive surface
US6331163B1 (en) * 1998-01-08 2001-12-18 Microsense Cardiovascular Systems (1196) Ltd. Protective coating for bodily sensor

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JP3663938B2 (ja) 1997-10-24 2005-06-22 セイコーエプソン株式会社 フリップチップ実装方法
FR2771551B1 (fr) 1997-11-21 2000-01-28 Ela Medical Sa Composant microelectromecanique, tel que microcapteur ou microactionneur, reportable sur un substrat de circuit hybride
FR2791471B1 (fr) 1999-03-22 2002-01-25 Gemplus Card Int Procede de fabrication de puces de circuits integres

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722348A (en) * 1985-09-17 1988-02-02 Sentron V.O.F. Catheter tip pressure transducer
EP0241294A1 (fr) * 1986-04-10 1987-10-14 Sumitomo Electric Industries Limited Sonde pour un cathéter
US5067491A (en) * 1989-12-08 1991-11-26 Becton, Dickinson And Company Barrier coating on blood contacting devices
US5567297A (en) * 1994-01-20 1996-10-22 Recherche et Developement du Groupe Cockerill Sambre en abrege: "RD-CS" Process for depositing by electropolymerization on organic film onto an electrically conductive surface
US5512374A (en) * 1994-05-09 1996-04-30 Texas Instruments Incorporated PFPE coatings for micro-mechanical devices
US6331163B1 (en) * 1998-01-08 2001-12-18 Microsense Cardiovascular Systems (1196) Ltd. Protective coating for bodily sensor

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Title
CUI X ET AL: "Electrochemical deposition and characterization of conducting polymer polypyrrole/PSS on multichannel neural probes", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 93, no. 1, 25 August 2001 (2001-08-25), pages 8 - 18, XP004255500, ISSN: 0924-4247 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9434608B2 (en) 2006-01-20 2016-09-06 Sitime Corporation Wafer encapsulated microelectromechanical structure
US9440845B2 (en) 2006-01-20 2016-09-13 Sitime Corporation Encapsulated microelectromechanical structure

Also Published As

Publication number Publication date
CA2496320C (fr) 2012-10-30
CA2496320A1 (fr) 2004-03-04
AU2003276377A1 (en) 2004-03-11
WO2004018349B1 (fr) 2005-03-24
US20050253206A1 (en) 2005-11-17
WO2004018349A9 (fr) 2004-06-03
WO2004018349A2 (fr) 2004-03-04
JP2005536365A (ja) 2005-12-02
FR2843742B1 (fr) 2005-10-14
AU2003276377A8 (en) 2004-03-11
US7196385B2 (en) 2007-03-27
FR2843742A1 (fr) 2004-02-27
EP1551754A2 (fr) 2005-07-13
JP4473123B2 (ja) 2010-06-02

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