WO2004006271A1 - High thermal conductivity insulating member and its manufacturing method, electromagnetic coil, and electromagnetic device - Google Patents

Abstract

A tape- or sheet-shaped high thermal conductivity insulating member, its manufacturing method, an electromagnetic coil comprising the high thermal conductivity insulating member, and an electromagnetic device such as a power generator having the electromagnetic coil. It is necessary to improve the cooling performance of an electromagnetic coil of an electric device so as to enhance the efficiency and to reduce the size and manufacturing cost. For the enhancement, it has been tried to increase the thermal conductivity of a tape- or sheet-shaped insulating member of the electromagnetic coil. However, there have been problems that the thermal conductivity of conventional insulating members has been insufficient, and only special resin components can be used. To solve the above problems, according to the invention, the tape- or sheet-shaped insulating member is made of a material such that first particles having a thermal conductivity of 1 to 300 W/mK and second particles having a thermal conductivity of 0.5 to 300 W/mK are dispersed in a resin base.

Description

 Specification

High thermal conductive insulating member, method of manufacturing the same, electromagnetic coil and electromagnetic equipment

Technical field

 The present invention relates to a tape-shaped or sheet-shaped high heat conductive insulating member used for an electromagnetic coil of an electromagnetic device such as a generator, a motor, and a transformer, and a method for manufacturing the same. The present invention relates to an electromagnetic coil and an electromagnetic device manufactured using the same.

Background art

 In order to increase the efficiency, reduce the size, and reduce the cost of electromagnetic equipment, it is necessary to improve the cooling performance of electromagnetic coils. One of the measures to improve the cooling performance of electromagnetic coils is to increase the thermal conductivity of electrically insulating tapes and sheet members used around the electromagnetic coils.

 Conventional electrical insulating materials have a thermal conductivity of about 3 to 37 W / mK. Japanese Unexamined Patent Publication No. Hei 11-171498 discloses that a matrix resin is used to increase the amount of filler for the purpose of increasing the thermal conductivity of an electrical insulating material. It is disclosed that the composition of the component is changed. However, the electrical insulating material of this prior document does not have a sufficient thermal conductivity, and the usable resin is limited to only special components.

Japanese Patent Application Laid-Open No. 2002-933257 discloses, as an electrical insulating material used for an electromagnetic coil, a high-thermal-conductivity my-force base sheet having a backing material containing an inorganic powder. Have been. However, the electrical insulating material of this prior document is used for a backing material. Since the material with high thermal conductivity does not show sufficient thermal conductivity, the thermal conductivity is not enough for the insulation layer of the electromagnetic coil.

 Japanese Patent Application Laid-Open No. H11-13232-162 discloses that in order to improve the thermal conductivity of an insulating layer, a crystalline epoxy resin is used for the resin of the insulating layer. It is disclosed to improve However, the crystalline epoxy resin of this prior art is in a solid state at room temperature, and is difficult to handle.

 Japanese Patent Application Laid-Open No. H10-1743433 discloses an electromagnetic coil in which a heat conductive sheet is alternately wound around a winding conductor in order to improve the thermal conductivity of an insulating layer. However, it is difficult to obtain a high thermal conductivity in the electromagnetic coil of this prior document because the heat flow is insulated by the my layer.

 As described above, the conventional electric insulating material causes problems such as insufficient heat conductivity and a troublesome, time-consuming and costly manufacturing process.

Disclosure of the invention

 SUMMARY OF THE INVENTION An object of the present invention is to provide a highly versatile high heat conductive insulating member which has high thermal conductivity without being restricted by the components of the resin, can be easily manufactured, and has high versatility and a method for manufacturing the same. Another object of the present invention is to provide an electromagnetic coil and an electromagnetic device using such a high heat conductive insulating member.

The high thermal conductive insulating member according to the present invention includes: a resin substrate; first particles dispersed in the resin substrate and having a thermal conductivity of lWZmK or more and 30 OW / mK or less; No. 3 having a thermal conductivity of 0.5 WZm K or more and 30 O WZm K or less dispersed in the resin base material And characterized in that:

 By combining the high thermal conductive insulating member of the present invention with a conventional My tape for a wound conductor (Cu coil), it has both excellent heat dissipation characteristics (cooling ability) and insulating properties. Supplied electromagnetic coil. Of course, the highly heat conductive insulating member of the present invention may be used alone.

 The high heat conductive insulating member according to the present invention is a tape-shaped or sheet-shaped high heat conductive insulating member having a my-force layer and a backing material layer, wherein the backing material layer comprises: a resin base; First particles having a thermal conductivity of lWZm K or more and 30 OW / mK or less dispersed in the material; and 0.5 WZmK or more 30 OW / m dispersed in the resin base material. And a second particle having a thermal conductivity of K or less, and.

 The high thermal conductive insulating member according to the present invention is a tape- or sheet-like high thermal conductive insulating member having a my power layer and a backing material layer, wherein the my power layer has a myica scales force. , Ranaru my capeno ヽ. (Mica paper) and second particles having a thermal conductivity of 0.5 WZm K or more and 30 O WZm K or less dispersed in the paper I do.

The reason why the lower limit of the thermal conductivity L of the first particles is set to IW / mK is that a desired heat radiation characteristic cannot be obtained with a thermal conductivity λ lower than this. The reason for setting the upper limit of the thermal conductivity λ of the first particles to 300 WZm K or less is that the thermal conductivity exceeds this; when metal powder or carbon nanotubes having I are filled, the electrical conductivity σ becomes excessively large. This is because the insulation of the member is impaired. The reason for setting the lower limit of the thermal conductivity of the second particles to 0.5 WZm K is that desired thermal radiation characteristics cannot be obtained with a thermal conductivity λ lower than 0.5 WZm K. The reason for setting the upper limit of the thermal conductivity λ of the second particles to 30 OO WZm K or less is substantially the same as the reason for the first particles. However, if the condition that the volume content of the second particles is 33.3 Vo 1% or less is satisfied (see FIG. 30), metals such as gold, copper, and iron are used as the second particles. And carbon can be limitedly filled. If this condition is satisfied, there is no possibility that the insulating properties of the member will be impaired.

 In the present invention, the diameter of the second particles is preferably smaller than the diameter of the first particles, and more preferably 0.15 times or less the diameter of the first particles. Is most preferred. The reason is that when the particle size ratio of the second particles to the first particles approaches 0.15, the thermal conductivity decreases as shown in FIG.

 It is preferable that the diameter of the first particles is in the range of 0.05 μηι to 以下 μππι (50 nm to L 05 nm). If the diameter of the first particles is less than 0.05 μππ, it is difficult to uniformly disperse the particles in the layer, and there is a possibility that the electric breakdown strength of the electric insulation is reduced. On the other hand, if the diameter of the first particles exceeds 100 // m, the flatness of the tape member and the sheet member is impaired, and the thickness tends to be uneven. .

It is preferable that the diameter of the second particles is at least 0.15 times or less of the diameter of the my flakes. This is also because the thermal conductivity L decreases when the particle size ratio of the my flakes to the second particles approaches 0.15. The first particles are boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, and carbon-like. It is composed of one or more selected from the group consisting of diamond, silicon carbide, layered silicate clay minerals, and my strength. This is because particles of these materials show a thermal conductivity of 1 WZ m K or more and 30 OW / m K or less in a normal state.

 The second particles are boron nitride, carbon, aluminum nitride aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond. It is composed of one or more selected from the group consisting of carbonaceous carbon, carbonaceous diamond, silicon carbide, gold, copper, iron, layered silicate clay minerals, and myricite. In particular, it is most preferred that the second particles comprise either carbon or aluminum oxide. Carbon particles such as carbon black are suitable for improving the thermal conductivity; L of the member of the present invention. Also, aluminum oxide

-Palm particles are suitable not only for improving the thermal conductivity; I of the member of the present invention, but also for not impairing the insulation of the member.

 The content of the second particles in the backing material layer is preferably 0.5 Vo 1% or more, and most preferably 1 Vo 1% or more. This is because when the content of the second particles is increased, the thermal conductivity is improved. In particular, when 1 Vo 1% or more of the second particles is contained, the thermal conductivity I of the member is remarkably improved as shown in FIGS.

The content of the second particles is based on the sum of the second particles and the resin. It is preferable that the pressure be 33.3 vol% or less, and more preferably 23 V o 1% or less. This is because if the content of the second particles is excessive, the electrical conductivity σ becomes excessive. In particular, when the content of the second particles exceeds 33.3 vol%, as shown in FIG. 30, the electric conductivity σ becomes excessive, and the insulating property of the member deteriorates.

 The backing material layer may be provided on both sides of the My backing layer, and the My backing layer may be provided on both sides of the backing layer (see Fig. 15).

 The backing material layer may be wider than the my backing layer, and the my backing layer may be wider than the backing layer (see Fig. 18).

 The total thickness of the high thermal conductive insulating member should be 0.2 to 0.6 mm for tape and 0.2 to 0.8 mm for sheet. Thickness of my force layer and backing material The ratio is preferably in the range of 6: 4 to 4: 6, and more preferably in the range of 11: 9 to 9:11.

The method for manufacturing a high thermal conductive insulating member according to the present invention is a method for manufacturing a tape-shaped or sheet-shaped high thermal conductive insulating member having a my-force layer and a backing material layer, comprising: (a) 1 W / The first particles having a thermal conductivity of not less than m K and 30 O WZm K and the second particles having a thermal conductivity of not less than 0.5 W / m K and not more than 30 O WZm K and the resin solution (B) impregnating the impregnated material with the kneaded material, and (c) heating and curing the kneaded material impregnated in the impregnated material, thereby obtaining a backing material layer , (d) The backing material layer is laminated and adhered to mica paper, and (e) the backing material layer and the mica paper which are laminated and adhered are pressed from above and below with a ronor press (roller press). In addition, it is shaped into a tape or sheet.

 The impregnated body may be either glass cloth or resin film. When fabricating the backing material layer using glass cloth, follow step B1 (steps S1 to S3) shown in FIG. When fabricating a backing material layer using a resin film, follow step B2 (steps S11 and S12) shown in FIG. It is preferable to use the hot roll press method for the roll press. Generally, a single press is a single press only once, but a multi-stage press in which two or three presses are repeated may be used.

 The method for manufacturing a high thermal conductive insulating member according to the present invention is a method for manufacturing a tape-shaped or sheet-shaped high thermal conductive insulating member having a my force layer and a backing material layer, wherein (i) 0. A second particle having a thermal conductivity of 5 W / m K or more and 300 W_ / m K or less, mica scales and a solvent are mixed and stirred at a predetermined ratio, and (ii) the mixing and stirring The material is filtered through a predetermined filter and dried to obtain a mica paper. (Iii) The mica paper is bonded to a backing material layer and adhered.

(iv) Forming the mica paper and the backing material layer adhered and bonded into a tape or a sheet by applying pressure using a roll press (upper and lower surfaces). Use water or various alcohols as the above solvent. It is especially preferable to use water. In the case of producing mica paper using water, the steps S21 to S2 shown in FIG.

Follow 3. Since the my scales have a high aspect ratio, they are easily agglomerated and hardened, and even after the solvent is volatilized, the shape thereof is maintained and the highly thermally conductive particles are well retained. When a small amount of binder resin is added, the shape retention and particle retention are further improved.

 The electromagnetic coil according to the present invention is characterized in that the wound conductor is insulated and coated using the above-mentioned tape-like high heat conductive insulating member.

 An electromagnetic device according to the present invention includes the above-described electromagnetic coil.

 As used herein, the term “tape” refers to an elongated band-shaped member that is wound around a portion that requires insulating coating.

 As used herein, the term “sheet” refers to a member that is not only wound around a portion that requires insulating coating but has a predetermined spread that covers the portion. The insulation sheet is used, for example, to insulate the connection portion where the electromagnetic coils are braided.

As used herein, the term “my power” refers to one that includes not only natural my power produced from the natural world but also artificially produced industrial power. Although there are two types of my power, firing my power and non-firing my power, in the present invention, it is preferable to use firing my power. This is because the firing force at firing at a predetermined temperature makes the shape more scaly and increases electrical insulation. In the present specification, “mica paper” refers to a mixture of myca scales and a solvent (7-alcohols), which is mixed and agitated in the manner of papermaking. A thin film or foil obtained by filtering and drying. By cutting such a mica paper into a predetermined size, a my power tape or a mycash can be obtained.

 In this specification, “carbon” refers to a carbon-based material having a structure in which layers formed by π bonds are bonded by an intermolecular force, such as carbon black and contact black. Black, channel black, lonor black, disk black, thermo black, gas black, furnace black, oil furnace black, naphthalene black It is a generic term that includes black, anthracene black, acetylene black, ayumanore black, vegetable black, ketjen black (Ketjen B lack), and graphite.

 As used herein, the term "artificial diamond" refers to an industrially produced diamond excluding natural diamonds produced from the natural world, and carbon atoms are formed by sp 3 bonds. A structure that is bonded to each other and crystallized.

 In the present specification, “diamond-like carbon” refers to a carbon-based material relatively close to carbon as defined above, whose main part is carbon, and a part of which is the diamond as defined above. This includes organizations.

As used herein, the term “carbon-like diamond” refers to a carbon-based material relatively close to the diamond defined above. A mixture of carbon and diamond structure as defined above.

 As used herein, the term “binder resin” refers to a filler used to hold and fix highly thermally conductive particles in a backing material layer or a force layer. Although the component of the resin is not specified in the member of the present invention, in general, any one of epoxy resin, polypropylene resin, and silicone resin (including silicone rubber) is used.

BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a process diagram showing a method for manufacturing a highly thermally conductive insulating member according to an embodiment of the present invention.

 FIG. 2 is a schematic cross-sectional view showing a high heat conductive insulating member according to the first embodiment of the present invention.

 Fig. 3 is a characteristic diagram showing the effect of carbon black addition on the thermal conductivity of insulating tape containing boron nitride.

 Fig. 4 is a characteristic diagram showing the effect of carbon black on the thermal conductivity of insulating tape.

 Figure 5 is a schematic cross-sectional view of an electromagnetic coil.

 Figure 6 is an enlarged view showing the first and second particles.

 Fig. 7 is a characteristic diagram showing the relationship between the particle size ratio l og (d2 / d l) and the thermal conductivity; I.

 Figure 8 is a characteristic diagram showing the relationship between the amount of aluminum oxide filling and the thermal conductivity of epoxy resin.

 FIG. 9 is a process chart showing a manufacturing method according to another embodiment.

Figure 10 shows a cross section of the backing material (resin-impregnated glass cloth). Pattern diagram.

 Fig. 11 is a schematic cross-sectional view showing another backing material (resin-impregnated glass cloth).

 FIG. 12 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 13 is a process chart showing a manufacturing method of another embodiment.

 FIG. 14 is a schematic cross-sectional view showing a high heat conductive insulating member according to another embodiment.

 FIG. 15 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 16 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 17 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 18 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment. -Fig. 19 is an equivalent circuit diagram conceptually showing the heat conduction characteristics of the main insulating layer of the high thermal conductive insulating member.

 FIG. 20 is a schematic cross-sectional view showing another high thermal conductive insulating member. Fig. 21 is an equivalent circuit diagram conceptually showing the heat conduction characteristics of the main insulating layer of another high thermal conductive insulating member.

 FIG. 22 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

FIG. 23 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment. FIG. 24 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 25 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 26 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 27 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 28 is a bar graph showing the effect of the present invention.

 Figure 29 is a characteristic diagram showing the effect of carbon black addition on the thermal conductivity of insulating tape containing boron nitride.

 FIG. 30 is a characteristic diagram showing the results of examining the effects of the carbon particle content on the thermal conductivity λ and the electrical conductivity a.

 FIG. 31 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

 FIG. 32 is a process chart showing a manufacturing method of another embodiment.

 FIG. 33 is a schematic cross-sectional view showing a high heat conductive insulating member of another embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, various preferred embodiments of the present invention will be described with reference to the accompanying drawings.

 (First Embodiment)

 The first embodiment of the present invention will be described with reference to FIGS.

First, with reference to FIG. Will be described.

 300 cc of water was mixed with 2.826 g of my scales, and the mixture was stirred (process K1). In this case, a slight amount of epoxy resin may be added as a binder.

 The above stirred mixture is passed through, for example, a 0.5 mm × 0.5 mm grid grid in the manner of papermaking to prepare a raw sheet (step 2). The green sheet was heated to a predetermined temperature and dried to obtain mica paper 1 (step K3).

 In the backing material production process B1 of the present embodiment, first, a binder resin, boron nitride particles, and carbon black particles are prepared in a mass ratio of 24.7: 74.2: 1.1. And kneaded (step S 1). In this embodiment, Asahi Samaru (trade name) manufactured by Asahi Carbon Co., Ltd. was used for the carbon black. The average particle size of the carbon black was 90 μm. The shape of the carbon black particles was spherical. Further, in this embodiment, HP-1C AW (product model number) manufactured by Mizushima Alloy Iron Co., Ltd. was used as the hydrogen nitride, and the particle size distribution was 14 to 18 / im, and the average particle size was 14 to 18 / im. Used 16 / im. Boron nitride had a hexagonal crystal structure and a scale-like shape. It should be noted that HP—6 (product model number) manufactured by Mizushima Alloy Iron Co., Ltd. may be used as the boron nitride.

The above kneaded material was applied to a glass cloth having a thickness of 0.333 mm (step S2). The coating amount per unit area of the kneaded material was 400 g / m 2. The coated material was cured by heating to a temperature of 120 ° C., whereby a backing material 2 was obtained (step S 3). The mica paper 1 and the backing material 2 are bonded together with an adhesive (step S4). The adhesive was applied to either the mica paper 1 or the backing material 2, and both were superposed and hot roll pressed. An epoxy resin was used as the adhesive. In the hot roll press, the adhesive, the mica paper 1 and the backing material 2 are cured by heating to a temperature of 150 ° C., thereby obtaining a my-force sheet (process S5). . Since the processes of steps S4 and S5 are performed continuously, the mica sheet is wide and long. Such a my-power sheet was cut into a width of 35 mm to obtain a my-power tape 10 shown in FIG. 2 (step S6). Boron nitride particles with thermal conductivity of 1 W / mK or more (first particles) and carbon black particles with thermal conductivity of 0.5 W, mK or more in material layer 2 (first particles) (Second particles) are both dispersed in the resin 4. '

 In the following description, a laser flash method was used to evaluate and measure the thermal conductivity of the tape member (or the small seam member). In the present embodiment, as a thermal conductivity measuring device, Tc300-: ^ 〇 manufactured by Vacuum Riko Co., Ltd. was used. Specifically, the thermal conductivity λ was evaluated by irradiating one side of a sample having a thickness of l mm with a pulsed laser beam and measuring the temperature rise on the opposite side (back side).

In addition, a laser analysis type particle size distribution analyzer was used for particle size measurement. In the present embodiment, LMS-24 of Seisin Corporation was used as the particle size measuring instrument. The measured particle size is the average particle size. In Fig. 3, the horizontal axis shows the volume ratio of carbon black (Vo 1%), and the vertical axis shows the thermal conductivity λ (W / m) when the carbon black is dispersed in epoxy resin. FIG. 9 is a characteristic diagram showing the dependence of the thermal conductivity on the power-bon black filling amount with respect to K). For the carbon black, particles with a thermal conductivity of 1 W / mK and an average particle size of 90 nm were used. For boron nitride, particles having a thermal conductivity of 60 WZ m K and an average particle diameter of 16 μm were used. The characteristic line A in the figure plots the results when the carbon black filling volume was changed to 0%, 0.5%, 1%, 2%, and 5% by volume, and plots the plotted values. It is the connection between the plot and.

 As is clear from the characteristic line A, it can be seen that a heat conductive sheet having a high thermal conductivity can be obtained by adding a small amount of carbon black to the epoxy resin. The heat conductive sheet 2 is used as a backing material and laminated with a mica paper 1 manufactured by slicing my strength flakes to form a mica sheet through a slit. In this case, the my power sheet-1 and the heat conductive sheet 2 (backing material) were bonded together using a bisphenol A type epoxy resin adhesive. ) Has a high thermal conductivity in the backing material layer, so it can achieve a higher thermal conductivity than the My Force tape containing only boron nitride (conventional product). '

Table 1 shows the thermal conductivity index and composition of the My power tape manufactured with the thickness ratio of My power layer 1 and heat conductive sheet 2 set to 1: 1. Here, the “thermal conductivity index” refers to a unitless relative value calculated using Comparative Example 1 as a reference value 1. Comparative Example 1 Comparative Example 2 Example 1

 Boron nitride 0 6 0 6 0

 Carbon bra 0 0 5

 Check

 Resin 1 0 0 4 0 3 5

 Thermal conductivity index 1 1.8 1.9 3 In Comparative Examples 1 and 2, the tapes using polyethylene terephthalate as the backing material and the tape using only boron nitride as the backing material were pD / This

 The tape filled with boron nitride (Comparative Example 1) showed a thermal conductivity λ that was 1.8 times that of the tape not filled (Comparative Example 2). The tape (Example 1) to which chromium was added exhibited thermal conductivity as high as 1.93 times.

 In Fig. 4, the horizontal axis shows the volume ratio of carbon black (Vο 1%), and the vertical axis shows the thermal conductivity index of the force tape. FIG. 9 is a characteristic diagram showing the dependence of the thermal conductivity of a My tape on the carbon black filling rate as a meter. Here, the “thermal conductivity index” refers to a unitless relative value calculated using Comparative Example 2 shown in Table 2 as a reference value 1.

As is clear from the characteristic line Β, it can be seen that the thermal conductivity of the My power tape is increased by adding the carbon black. In particular, when the carbon black filling amount is 1 Vο1 ° / ₀ or more, a thermal conductivity index of about 2.5% can be obtained. Therefore, the thermal conductivity I of My force tape is Conductivity increases in proportion to.

 By adding a carbon black to the composite of boron nitride and resin in this way, a sheet with high thermal conductivity can be obtained, and this sheet is used as a backing material. By using the tape, it was possible to produce a My tape having a high thermal conductivity.

 Next, a method of manufacturing the coil will be described with reference to FIG. 5. A my-strength tape 10 is wound to a predetermined thickness on the outer periphery of a winding conductor 5 (bar coil) having a rectangular cross section. Further, a release tape (not shown) was wound. A semi-cylindrical rubber contact jig (not shown) was pressed against each of the four surfaces of the roll. At this time, an iron plate (not shown) with a thickness of 2 mm was inserted between the jig and the wound body. In addition, a heat-shrinkable tube (not shown) was wound around the contact jig three times in a 2/3 overlap. The diameter of the heat-shrinkable tube was about 50 mm. This wound body was immersed in an epoxy resin liquid, and impregnated with the epoxy resin in a vacuum atmosphere. After impregnation with the resin, the wound body was placed in a heating furnace, and the epoxy resin was cured under heating conditions of holding at 150 ° C. for 24 hours. The heat-shrinkable tube, patch jig, iron plate, and release tape were removed to obtain an electromagnetic coil.

In the electromagnetic coil manufactured in this way, since the My force tape 10 has a high thermal conductivity, the insulating layer 6 having a high thermal conductivity is formed as a result. Such an electromagnetic coil is excellent in cooling performance and can increase the current flowing through the winding conductor 5, so that the efficiency is high. If the efficiency is the same, the cross-sectional area of the wound conductor 5 can be reduced, so that the electromagnetic coil is small. Become As a result, the manufacturing cost of the electromagnetic coil is reduced. Incidentally, by using an electromagnetic coil having the insulating layer 6 in a 300 MW class generator, the thermal conductivity of the main insulation can be reduced from the conventional 0.22 W / mK to 1 WZm. It was about K. The temperature rise of the electromagnetic coil was reduced from 70 K to 4 OK. This makes it possible to increase the density of the current flowing through the electromagnetic coil and reduce the amount of copper used. This made it possible to increase the current density flowing through the electromagnetic coil and reduce the amount of copper used by about 30%.

 In this embodiment, a tape member having a high thermal conductivity can be obtained easily and easily, and the tape member is wound around a coil conductor to be insulated and coated, thereby achieving high heat conductivity. Electromagnetic coils and electromagnetic equipment can be made small and inexpensive to manufacture.

 In the above, boron nitride particles and carbon black particles were used as materials for forming the high thermal conductive backing material. It is thought that the reason for achieving high thermal conductivity can be achieved by replacing the resin layer with carbon black. That is, high thermal conductivity can be obtained by the main filler having high thermal conductivity and the carbon particles filling the gaps.

 In this case, it is necessary to highly fill the main filler (first particles) having high thermal conductivity in order to achieve high thermal conductivity, and thus the main filler (first particles) is required. It is important for the second particles, for example, carbon black particles, to enter the gap filled with fine particles.

Therefore, as shown in Fig. 6, the main heat-conductive filler is densely packed. In order to put the second filler (second particles) 8 in the filler (first particles) 7, high thermal conductivity is obtained by limiting the particle size d 2 of the second filler 8. And high thermal conductivity can be realized.

 Fig. 7 shows the logarithm of the particle size ratio (d2Zd1) between the first particle and the second particle on the horizontal axis, and the thermal conductivity; I on the vertical axis. FIG. 3 is a characteristic diagram showing a change in thermal conductivity λ with respect to a particle diameter ratio of the particles of FIG. As is apparent from this figure, the thermal conductivity increases in a range where the particle size ratio of the second particles to the first particles is smaller than around 0.1 times.

 Fig. 8 is a plot of the relationship between the aluminum oxide particles in epoxy resin and the volumetric content (vol%) of the epoxy resin on the horizontal axis, and the thermal conductivity λ on the vertical axis. FIG. In this case, an anoreminium oxide particle having an average particle size of 70 nm was filled in the epoxy resin instead of the carbon black particle having an average particle size of 90 nm. As is clear from this figure, the thermal conductivity was increased as the filling amount of the aluminum oxide particles was increased. In particular, the material to which aluminum oxide particles were added at 2 V o 1% obtained a thermal conductivity; L exceeding 7 WZmK. It has been found that high thermal conductivity can be obtained by using this as a backing material. In addition, aluminum oxide particles have a higher electrical resistance than carbon black particles, and thus provide a tape with excellent insulation performance.

Aluminum oxide is a spherical particle having an average particle size of 70 nm. In the present embodiment, NanoTekA 1203_HT (product model number) manufactured by C Kasei Co., Ltd. was used as the aluminum oxide particles. In the present embodiment, boron nitride was used as the first particle, but aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, artificial diamond, and diamond as alternative materials. C-like carbon or silicon carbide may be used. -With these substitute materials, the same effect as in the present embodiment can be obtained.

 Further, in this embodiment, car pump black and aluminum oxide were used as the second particles, but boron nitride, carbon dioxide, aluminum nitride, magnesium oxide, magnesium oxide, It is also possible to use silicon nitride, artificial diamond, diamond-like carbon silicon carbide, gold, copper, iron, layered silicate clay minerals, and My power. The same effect as in the present embodiment can be obtained by these substitute materials.

 (Second embodiment)

 Next, a second embodiment will be described with reference to FIGS. 9 to 11.

In the member of the present embodiment, high thermal conductive particles are filled like the my force layer. Glass cloth 25 was used as the backing material. 2.83 g of my force scales and 0.125 g of alumina particles were mixed in 300 cc of water and stirred (step S21). In this example, NanoTekA 1203-HT (commercial model number) manufactured by CSI Kasei Co., Ltd. was used for the alumina particles. The average particle size of the alumina particles was 70 m. The shape of the alumina particles was spherical. The calcined mai scale was used for the mai scales, and the average particle size of the mai scales was 15 ^ m. The above stirred mixture was filtered through a 0.5 mm × 0.5 mm grid grid in a papermaking manner to produce a raw sheet (step S22). The raw sheet was heated to 120 ° C. and dried to obtain mica paper (step S23).

 This mica paper was bonded to glass cross 25 using an adhesive (step S24). Epoxy resin was used as the adhesive. In the hot roll press, the adhesive, the mica paper 1 and the backing material 2 were cured by heating to a temperature of 150 ° C., thereby obtaining a my-force sheet (process S25). ). Since these processes S24 and S25 are performed continuously, the my strength sheet is wide and long. Such a mica sheet was cut into a width of 35 mm to obtain a my strength tape 11A shown in FIG. 10 (step S26).

 FIG. 10 is a cross-sectional view of a my force tape 11A in which any one of the high thermal conductive particles obtained in the above-described embodiment is dispersed and arranged in glass cloth. When a film or tape member is made by impregnating a resin into the glass cross 25, a highly heat conductive tape (film) is produced by incorporating the highly heat conductive particles 26. can do. Furthermore, by using the tape made in this way as a material for the self-powered tape, a self-powered tape having high thermal conductivity can be obtained.

FIG. 11 is a cross-sectional view showing a tape 11B in which a plurality of tapes of the above embodiment are stacked. By using a material having high thermal conductivity for the resin component of the laminated member, a laminated member having high thermal conductivity can be manufactured. (Third embodiment)

 The third embodiment will be described with reference to FIGS. In the My force tape 1OA of the present embodiment, the first particles having a thermal conductivity of 0.5 W nom K or more were filled and dispersed in the My force layer 9. In the present embodiment, the my-force layer 11 was manufactured by an ordinary method, and a thermal conductive sheet 9 having a high thermal conductivity was used as a backing material. In this case, the my-force layer 11 has a lower thermal conductivity than the backing material layer 9, so that the my-force layer 11 acts as a thermal barrier.

 Here, when forming mica paper, alumina particles having an average particle diameter of 70 nm were mixed with mica paper.Specifically, mica paper and alumina particles were stirred in distilled water. Then, it was applied on a cloth having a mesh of 0.05 μππι, and dried to form a my-force sheet. The my-force sheet itself has a thermal conductivity of about 0.6 W / mK, but if the my-force layer 11 made of mica paper alone is impregnated with resin, the thermal conductivity will be about 0.6 W / mK.

It became 2 2 WZm K.

 On the other hand, the thermal conductivity of the my layer filled with alumina particles is 0

35 W / mK, because the impregnated resin intervenes between the layers of mylon, which scattered the phonon necessary for heat conduction and shortened the average free process of phonon. Inferred.

 As in the above embodiment, the main insulating layer having high thermal conductivity was formed by forming the electromagnetic coil using the tape of the present embodiment.

By filling and dispersing the second particles 3 in the my power layer 9 in such a my power tape 1 OA, a high thermal conductivity is obtained. The tape member can be obtained easily and easily. Further, by winding the self-powered tape 1 OA around the wire conductor 5 and insulatingly coating the same, it is possible to reduce the size and cost of the highly thermally conductive electromagnetic coil and electromagnetic device.

 (Fourth embodiment)

 A fourth embodiment in which a film (substitute material for glass cross) is used for the backing material layer will be described with reference to FIGS. This embodiment is substantially the same as the first embodiment except for the backing material production process B2. Therefore, in the present embodiment, the description of the mica paper producing steps K 1 to K 3 and the mica force tape producing steps S 4 to S 6 will be omitted.

 In the backing material production process # 2 of the present embodiment, 0.13 g of binder resin, 2.83 g of boron nitride particles, and 0.125 g of alumina particles were kneaded (step S11). . The kneaded material was press-cured at a temperature of 150 ° C. using a hot roll press machine, thereby obtaining a backing material (step S12).

 (Fifth embodiment)

 The fifth embodiment will be described with reference to FIG. The member 10 B of the present embodiment is a combination of the backing material layer 2 of the first embodiment and the my-force layer 9 of the third embodiment described above. In addition, the thermal conductivity of the my force tape 10B is further increased, and the heat radiation property is improved. It is estimated that the thermal conductivity of 10 mm of my force tape of this embodiment is about 0.66 W / m 2.

(Sixth embodiment) The sixth embodiment will be described with reference to FIG. In the my-force tape 10 C of the present embodiment, the high-thermal-conductivity backing material layer 2 filled with the first particles and the second particles was attached to both surfaces of the my-force layer 1.

 According to the present embodiment, by using a material having high thermal conductivity on both sides of the backing material layer 2, the thermal conductivity of the my force tape 10C itself can be improved. By winding this force tape 1 OC on the wire conductor 5, an electromagnetic force S having excellent heat radiation characteristics can be obtained.

( _Seventh embodiment)

 The seventh embodiment will be described with reference to FIG. In the present embodiment, the width of the tape is shifted by using a myka tape 10 composed of a low thermal conductive layer (my power layer) 13 and a high thermal conductive layer (high thermal conductive backing material layer) 12 on one side thereof. 7 shows a cross section of the main insulating layer when the tape is wound around the surface of the wound conductor 5 while being shifted by half (W / 2) of the tape width W. This main insulating layer is arranged such that the low thermal conductive layer 13 is always sandwiched between the high thermal conductive layer 12 and the high thermal conductive layer 12. In the insulating layer 6 using this configuration 10D, it is difficult to obtain high thermal conductivity because the thermal conductivity of the low thermal conductive layer 13 is low.

 (Eighth embodiment)

 The eighth embodiment will be described with reference to FIG.

In the present embodiment, the width of the tape is shifted by half (W / 2) of the tape width W by using a self-powered tape 10 C having the low thermal conductive layer 13 and the high thermal conductive layer 12 formed on both sides thereof. The coil conductor surface 2 shows a cross section of the main insulating layer when wound around. In this configuration 10E, the heat conducting paths are formed in the main insulating layer while the backing materials having high thermal conductivity are continuously connected to each other. Therefore, by forming the high thermal conductive layer 12 on both surfaces of the low thermal conductive layer 13, it is possible to obtain a high thermal conductivity.

 By using the mica paper manufactured in this way and the backing material shown in the first embodiment, a my power tape having a high thermal conductivity was obtained.

 By having the first particles having a thermal conductivity of lW / mK or more on both sides of the low thermal conductive layer (my force layer), the thermal conductivity is high and the production is easy. It is possible to easily obtain an electromagnetic coil and an electromagnetic device having high thermal conductivity.

 In the above description, the low-thermal-conductivity layer is used as the my power layer, and a layer with a relatively low thermal conductivity is sandwiched between the high-thermal-conductivity layers. High thermal conductivity can also be obtained by sandwiching between the my layers. In other words, by forming a my layer containing the second particles having a thermal conductivity of 0.5 WZ m K or more on both sides of the backing material layer, a high heat conductivity is obtained and high heat is easily manufactured. Conducted electromagnetic coils and electromagnetic devices can be obtained.

 (Ninth embodiment)

 The ninth embodiment will be described with reference to FIG.

In the My force tape 10F of the present embodiment, the backing material layer 2 having high thermal conductivity is configured to be wider than the My force layer 1. That is, the width W 2 of the backing material layer 2 is It was bigger.

 In the following description, an equivalent circuit as shown in FIGS. 19 and 21 is considered when calculating the thermal conductivity of the main insulating layer.

 When forming the main insulating layer, a layer having a high thermal conductivity and a relatively low thermal conductive layer are combined to form the main insulating layer. The reason that a low thermal conductivity exists is that the main insulating layer is originally formed to obtain electrical insulation, and the high thermal conductive material using the filler used in the present invention is an insulating rupture. Due to the risk of degrading the characteristics. Depending on the device, it is necessary to form a layer that is thermally conductive but has high dielectric breakdown characteristics.

 As shown in Fig. 3, a configuration with high thermal conductivity was realized by using a high thermal conductor for the backing material. As shown in Fig. 19, the equivalent circuit of such a configuration has the thermal conductivity 14 of the low thermal conductive layer and the thermal conductivity 15 of the high thermal conductive layer, and the my power layer has a thermal conductivity. Since it acts as a barrier, when it is formed into a coil shape, it is difficult to conduct heat through the my layer. -Therefore, as shown in Fig. 18, high thermal conductivity can be obtained by making the high thermal conductive backing layer 2 wider than the my force layer 1.

FIG. 20 shows a cross section of the main insulating layer when the high thermal conductive layer 12 is wider than the low thermal conductive layer 13. It is considered that high thermal conductivity can be obtained because the high thermal conductive layer 12 is connected through the coil main insulating layer. As shown in Fig. 21, the equivalent circuit of this configuration has a high thermal conductivity because the thermal conductivity 16 of the wide part bypasses the thermal conductivity 14 of the low-thermal-conductivity layer. rate Can be obtained.

 Table 2 shows that the thermal conductivity of the My layer is 0.22 W / mK and the thermal conductivity of the backing material layer is 4 W / mK. The difference in the thermal conductivity index when the width of the material layer is increased is shown. The tape in which the backing material layer 2 of high thermal conductivity was wide was used as the sample of Example 2, and the tape in which the My force layer 1 and the backing material layer 2 had the same width was used as the sample of Comparative Example 3. Here, the “thermal conductivity index” is a unitless relative value when Comparative Example 3 is set to the reference value 1.

Table 2

As is evident from Table 2, it was recognized that the sample of Example 2 exhibited a higher thermal conductivity index than the sample of Comparative Example 3.

 By using the force tape of the present embodiment, it is possible to obtain an electromagnetic coil and an electromagnetic device having high thermal conductivity and high thermal conductivity which are easy to manufacture.

 (Embodiment 10)

 The tenth embodiment will be described with reference to FIGS.

In the configuration 10H of the present embodiment, one of the two force tapes (the tape 10 is illustrated in the figure) described in the above embodiment is used as an electromagnetic coil, and the upper and lower surfaces thereof are inverted. , And between tapes The winding width is shifted by half of the tape width W (WZ 2) and wound alternately.

 In the configuration 10H, when the main insulating layer is formed by winding a tape member in which the low thermal conductive layer 13 and the high thermal conductive layer 12 are bonded to a conductor, a layer having a low thermal conductivity always exists between the high thermal conductive layers. The heat transfer is blocked by the layer with low thermal conductivity because it is trapped.

 Therefore, as shown in a configuration 101 shown in FIG. 23, two tapes in which the low thermal conductive layer 13 and the high thermal conductive layer 12 are bonded to each other are used, and the upper and lower surfaces thereof are inverted, and the space between the tapes is changed. The winding width is shifted by half the tape width W (W / 2). Since the connection of the high thermal conductive layers in FIG. 22 is formed through the main insulating layer, high thermal conductivity can be obtained.

 For example, the high thermal conductive material having a thermal conductivity of 4 W / m K described in the first embodiment is used for the backing material. When My force is used as the low thermal conductive layer, 0.22 WZm K is obtained. When two tapes on which these are pasted together are wound around the conductor in the same direction to form a main insulation layer, the cross section is as shown in Fig. 23, and the heat conduction at this time is When the two tapes are wound alternately using two tapes with their upper and lower surfaces reversed, and the gap between the tapes is shifted by half (W / 2) of the tape width W, as shown in Figure 22 As shown, the thermal conductivity at this time was 1.2 times.

 This is probably because the high thermal conductive layer formed a continuous thermal conductive path through the main insulating layer.

In this way, in the configuration 10 I, two tapes of the above embodiment are used, and the upper and lower surfaces thereof are opposite and the deviation width between the tapes is used. Are alternately wound while being shifted by a half of the tape width W (WZ 2), thereby obtaining an electromagnetic coil and an electromagnetic device having high thermal conductivity and high thermal conductivity which are easy to manufacture. Can be done.

 The key point in this method is how to continuously form a heat conduction path in the main insulating layer.

 In the above-described method, two tapes in which the low thermal conductive layer 13 and the high thermal conductive layer 12 are bonded are used, and the upper and lower surfaces thereof are reversed, and the deviation width between the tapes is set to half of the tape width W (W / 2) The windings were alternately wound alternately, but as shown in Fig. 23, two tapes were bonded together with the low thermal conductive layers facing each other to form a single tape. It can be realized either by winding it around a conductor or by winding it so that it has the cross section of the main insulating layer shown in Fig. 24. A tape formed by applying boron nitride to the glass layer and applying the tape to both sides of the my layer, using a tape applied to the glass cloth, thereby winding the tape in a predetermined manner. It is possible to form a main insulating layer.

 Further, the high thermal conductive layer 12 can be formed separately from the My force tape. That is, as shown in FIG. 25, the tape 13 of the above-described embodiment was used as a self-powered tape, and this was alternately used with the high thermal conductive tape 16 having a thermal conductivity of 1 W / mK or more. The main insulation layer is formed by winding.

The cross section of the main insulating layer formed in this way is as shown in FIG. In this case, as a thermal conductive tape with a thermal conductivity of lW / mK or more, an isop Use a tape containing 4 V o 1% of aluminum oxide in a propylene-based elastomer.

 A comparison of the thermal conductivity between the sample using the heat conduction sheet and the sample not using the heat conduction sheet showed that the former was about 1.25 times that of the latter.

 (First Embodiment)

 The eleventh embodiment will be described with reference to FIG. In the configuration 10L of the present embodiment, in the electromagnetic coil described in the above embodiment, the shifting width between the tapes when winding the my force tape is made smaller than WZ2.

 FIG. 16 is a cross section of the main insulating layer when it is wound with a shift of WZ2. The high heat conductive layer forms a heat conductive path continuously up to the second layer.

 On the other hand, Fig. 26 shows the cross section of the main insulating layer (3 WZ 4 overlap winding) wound at a quarter of the tape width W (WZ 4). A heat conduction path is formed continuously up to the eyes. If a long continuous path is formed in the thickness direction of the main insulating layer, a portion having low thermal conductivity such as an impregnating resin is not formed, so that a higher thermal conductivity can be obtained.

Table 3 shows the thermal conductivities of the coil sample (Example 3) and the coil sample (Example 4) with W2 as the shift width between the tapes when winding the My force tape. Shown in comparison. The thermal conductivity index in this table is a unitless relative value calculated using the thermal conductivity of the sample of Example 3 as the reference value 1. Table 3

As is clear from the table, the thermal conductivity of Example 4 (W / 4 offset width) was 1.1 times that of Example 3 (W / 2). The cooling capacity of the electromagnetic device is further improved, and the electromagnetic device can be further miniaturized.

 The electromagnetic devices include rotating machines, generators, and transformers. An electric motor as a rotating machine is illustrated in US Pat. No. 4,760,296. The document also shows a transformer. A generator as a rotating machine is illustrated in U.S. Pat. No. 6,452,294 B1.

 (First and Second Embodiments)

 The 12th embodiment will be described with reference to FIGS. 27 and 28. FIG.

 In the member 21 of the present embodiment, the composite material including the first particles 22 and the resin 21 and the second particles 23 are compounded. The first particles 22 are materials having a thermal conductivity of at least lWZmK or more. The second particles 23 are materials having a different kind or a different particle diameter from the first particles 22.

 Boron nitride was used as the first particles 22. Carbon black was used as the second particle 23. Epoxy resin 21 was used as resin 21.

In order to evaluate the thermal conductivity of such a member 21, The thermal conductivity, I, of the two samples thus prepared was measured by the laser flash method. The first sample had no carbon black 23 and consisted only of boron nitride 22 and epoxy resin 1. The boron nitride particles 22 have a thermal conductivity of about 60 W / mK alone and an average particle diameter of 16 μιη. After dispersing by volume%, for example, it is press-cured by a hot press machine to a thickness of 1.5 mm. In this example, only one hot press was used to press-harden the sample, but a multi-stage hot press two or three times may be used. .

 When the thermal conductivity of the first sample without carbon black thus obtained was measured, it was 3.22 W / m /, as shown in Fig. 28. .

 On the other hand, the second sample was composed of carbon black 23, boron nitride 22 and epoxy resin 21. Carbon black (Asahi Thermal (trade name) manufactured by Asahi Carbon Co., Ltd.) 5 Vo 1% against 60 Vo 1% boron nitride having an average particle size of 16 μπι by volume ratio using a stirrer The mixture was stirred for 2 minutes and dispersed in epoxy resin 21 as a filler.

 When the thermal conductivity of the second sample having a carbon black thus obtained was measured, it was 6.2 WmK as shown in Fig. 28.

This is because the carbon black 23 particles enter the epoxy resin component of the boron nitride 22-filled material, and the boron nitride 2 It is thought that this was because it existed to complement the thermal conductivity between the two.

 As is evident from the above description, the thermal conductivity can be improved about twice by adding only a small amount of carbon black 23 as compared to the sample consisting of boron nitride alone. Was.

 Further, in the present embodiment, the epoxy resin 22 is used as a surface treatment agent for improving the binding property, for example, a binder resin (coupling agent). However, the present invention is not limited to this. Since it can be used for any resin, such as a resin of the system type, a highly heat-conductive member having high versatility and high heat conductivity is provided irrespective of the components of the resin.

 Further, in the present embodiment, silicon nitride particles are used as the first particles 22, but instead of aluminum nitride, aluminum oxide, aluminum oxide, magnesium oxide, silicon nitride, silicon oxide, and the like. L W / m K or more selected from chromium, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, layered silicate clay mineral, and my strength The ceramics of the above may be used.

In addition, carbon black particles are used as the second particles 23.However, the present invention is not limited to this. For example, boron nitride particles having different particle diameters, for example, having an average particle diameter of 3 μm are used. Is also good. Further, as the second particles 23, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, Carbon diamond, silicon carbide, gold, copper, iron, layered silicate clay One or two or more selected from the group of minerals and my strength may be used.

 (Third Embodiment)

 The thirteenth embodiment will be described with reference to FIG. In the member of the present embodiment, the second particles 23 have a thermal conductivity of at least 0.5 W / mK or more. The reason that the thermal conductivity I was able to be greatly improved by the member 21 of the above embodiment is that the gap formed when the first particles 22 were filled was determined by the second particles 23. It is inferred that this was because the hole was filled. According to this inference, it is preferable to use, as the second particles 23, those having a higher thermal conductivity λ than the resin 21.

 For example, the thermal conductivity of aluminum nitride (A1Ν); I is 10 OW / mK. Therefore, the thermal conductivity of the member 21 can be improved by adding the anode nitride particles as the second particles 23 to the composite material composed of boron nitride and resin. It will be further improved.

 (First to Fourteenth Embodiment)

 The fourteenth embodiment will be described with reference to FIGS. 27 and 29.

In the member of this embodiment, boron nitride was used as the first particles 22, and epoxy resin was used as the binder resin 21. Furthermore, carbon black (Asahi Thermal (trade name) manufactured by Asahi Carbon Co., Ltd.) is used as the second particles 23, and the carbon black content is 0.5 Vo1. %, So that the thermal conductivity is further improved. It became clear what to do. In Fig. 29, the horizontal axis shows the volume content of carbon black (V o 1%) with respect to the volume excluding boron nitride, and the vertical axis shows the thermal conductivity I (W / m K). The result of having investigated the thermal conductivity of the member of this embodiment is shown. In the figure, the characteristic line Ε indicates the change in the thermal conductivity; I.

 As is evident from FIG. 29, a remarkable increase in thermal conductivity more than twice that of the sample containing no carbon black particles in the region of 1 Vο 1% or more was observed. confirmed. Here, this increase in thermal conductivity was achieved by performing composite filling of silicon nitride particles and carbon black particles regardless of the type of binder resin.

 (Fifteenth Embodiment)

 The fifteenth embodiment will be described with reference to FIGS. 30 and 31.

 In the member 20% of the present embodiment, the content of the carbon black particles 24 is set to 33.3 vol% or less with respect to the total of the resin 21 and the carbon black particles 24. did.

 In such a member 20A, the carbon black particles 24 have high conductivity, so when used as an electrical insulating material, an increase in electrical conductivity affects the performance of the product. It is preferable to give

In FIG. 30, the horizontal axis shows the volume content of carbon particles (V o 1%) with respect to the total volume of resin and carbon particles, and the vertical axis on the left side shows the thermal conductivity; (W / m K). With the electrical conductivity σ (S Zm) plotted on the vertical axis on the right, It is a characteristic diagram shown. In the figure, the characteristic line F shows the change of the thermal conductivity; I, and the characteristic line G shows the change of the electric conductivity σ. The unit of the electrical conductivity σ is the siemens (S = Ω-1) per length (m).

 As can be seen from this drawing, when 33.3 Vo 1% or more is added, the region becomes a region where the electric resistivity is low and stable. This is considered to be because the carbon particles form an infinite cluster in the sample, and a so-called percolation phenomenon has occurred.This phenomenon has been performed by the present inventors so far. Research has revealed this.

 The formation of an infinite cluster means that the carbon black is connected through the sample, and does not sandwich the resin layer as shown in Figure 31. As a result, the insulation performance is extremely unfavorable. This phenomenon is determined by the physical dispersion state regardless of the type of binder resin.

 Therefore, in this embodiment, the sample is adjusted so that the content of the carbon black particles is 33.3 Vo 1% or less based on the total of the epoxy resin 21 and the carbon black particles. Accordingly, a highly heat-conductive member having high versatility, high heat conductivity, and insulating properties is obtained regardless of the components of the epoxy resin 21 (the 16th embodiment).

 The sixteenth embodiment will be described with reference to FIG.

In the member of the present embodiment, aluminum nitride particles (particle size of less than 1 micron to nanometer) as the second particles 24 are the first particles. The particles were made smaller than the boron nitride particles (particle size: 1 micron to 100 micron).

Aluminum nitride has a purity of 3 N and a molecular weight of 41.0. In the examples, ALI04 PB (product model number) manufactured by Kojundo Chemical Co., Ltd. was used for aluminum nitride. Other This _c which the aluminum nitride two © arm Ru can also this using TACHYON the trade Co. case, aluminum nitride Yuumu particles 2 4, the Ri epoxy resin 2 1 lumps of boron nitride particles 2 2 form By filling, high thermal conductivity is considered to be exhibited. However, if the particle diameter of the aluminum nitride particles 24 becomes larger than that of the boron nitride particles 22, the heat conduction path that contributes to the thermal conductivity λ formed by the boron nitride particles 22 is cut off. This leads to a decrease in the thermal conductivity λ.

 Therefore, in the present embodiment, by making the particle size of the aluminum nitride particles 24 smaller than the particle size of the boron nitride particles 22, regardless of the components of the binder-resin, general-purpose A high thermal conductive member having high heat conductivity and high thermal conductivity was used.

 (Seventeenth Embodiment)

 The 17th embodiment will be described with reference to the flowchart of FIG.

In the raw material charging step S31, when the boron nitride particles 22 and the carbon black particles 23 are charged into a molding machine (not shown), a coupling agent (binder resin) described later is simultaneously charged. In the stirring / drying step S32, the raw materials and the like obtained in the raw material charging step S31 are stirred and dried. In the kneading step S33, the epoxy main agent of the two-liquid mixing type is poured into the raw material in a state of agitation and drying, and kneaded with the raw material.

 In the kneading step S3 · 4, the epoxy main agent in the kneaded state kneaded in the kneading step S33 is further kneaded with a curing agent as an epoxy auxiliary agent.

 In the hot press hardening step S35, thereafter, hardening is performed by a hot press. Finally, the product obtaining step S36 takes out the product obtained in the hot press hardening step S35.

 For example, as an example, for example, a carbon black particle (available from Asahi Riki Ibon Co., Ltd .; ) Was stirred for 2 minutes with a stirrer, and the silane coupling agent A189 (manufactured by Nippon Tunica) dissolved in ethanol at 1 ° / 。. 3 g of the solution was added in three portions, and stirring was continued. After that, the filler was air-dried for 24 hours and subjected to a cutting treatment. The filler is dispersed in epoxy resin, and the total volume ratio of boron nitride and carbon black is 65 V o 1. /. Thus, a sheet material was prepared by press hardening to a thickness of 1.5 mm by a hot press.

The thermal conductivity of the plate member thus obtained was measured to be 6.8 WZmK. As a result, the thermal conductivity λ was increased by about 0.5 W / mK compared to the conventional case where no coupling agent was used. This is thought to be due to the fact that the bonding force between the fillers became stronger via the resin, which promoted the transmission of phonon. available. As described above, by simultaneously supplying the coupling agent when the raw materials are supplied, a high thermal conductive member having a high thermal conductivity can be obtained.

 It is clear that not only silane coupling agents but also zirconium-titanium coupling agents have the same effect. In this embodiment, it is conceivable to perform the cutting treatment through an epoxy resin. However, the surface of the filler is modified with a carboxyl group or a hydroxyl group and directly reacted with each other by modifying each other. Increasing the bonding force also has a sufficient effect.

 (Eighteenth Embodiment)

 The eighteenth embodiment will be described with reference to FIG. In the present embodiment, the member of the above embodiment is used to form a tape or a film. The member of this embodiment exhibits high thermal conductivity due to the physical dispersion state of the filler, and is extremely versatile.

 For example, a pellet of polyethylene 27, boron nitride particles 22 and carpump particles 23 are kneaded, and this is placed between two pressing plates 28, which is then hot-pressed ( By heating and pressurizing (not shown), a tape with a high thermal conductivity becomes a finolem.

 Here, the material used for the film is not limited to polyethylene, but may be any of various thermoplastic resins, thermosetting resins, and elastomers.

If an isoprene-based elastomer is used as the elastomer, for example, this is more elastic than a thermoplastic resin or a thermosetting resin. Due to its high modulus, the resulting film products have excellent flexibility.

 In this case, as the first particles, boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond One or more kinds of particles selected from the group consisting of diamond-like carbon, carbon-like diamond, silicon carbide, layered silicate clay minerals, and mylite can be used. The second particles include boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond-like. One or more types of particles selected from the group consisting of carbon, diamond, silicon carbide, gold, copper, iron, layered silicate clay minerals, and myric can be used. .

 (Ninth Embodiment)

 The nineteenth embodiment will be described. A cast resin, a cast resin in transformer; a winding conductor 5 to be used is covered with any one of the insulating members of the above embodiment. The structure of the cast resin transformer is described, for example, in U.S. Pat. No. 4,760,296.

In the cast resin, a mixture of 40 Vo 1% boron nitride and 1 Vo 1% carbon black was used as the casting resin for the epoxy-based thermosetting resin. . As a result, the thermal conductivity of the insulating layer 6 could be increased by about 1.5 times. This improves the cooling efficiency of the electromagnetic coil and allows it to flow through the coil. The current density could be increased by about 20%. In addition, the coil dimensions could be reduced. As a result, it has become possible to manufacture a miniaturized cast resin transformer. Industrial applicability

 ADVANTAGE OF THE INVENTION According to this invention, the thermal conductivity (lambda) is high and the high heat conductive insulating member excellent in the heat dissipation characteristic is provided. Further, according to the present invention, there is provided a method for producing a highly thermally conductive insulating member having high versatility and easy production. Further, according to the present invention, there is provided a small electromagnetic coil and an electromagnetic device having excellent heat radiation characteristics.

Claims

The scope of the claims

 1. A resin base material, first particles having a thermal conductivity of 1 WZm K or more and 30 O WZm K or less dispersed in the resin base material, and the first particles dispersed in the resin base material A highly thermally conductive insulating member characterized by comprising: a second particle having a thermal conductivity of at least S WZm K and at most 300 W / m K;

 2. In a tape-shaped or sheet-shaped highly thermally conductive insulating member having a force layer and a backing material layer, the backing material layer comprises a resin base material and 1 WZm K dispersed in the resin base material. A first particle having a thermal conductivity of at least 30 OW / mK or less, and a first particle having a thermal conductivity of at least 0.5 W / mK and at most 30 OWZmK dispersed in the resin base material. A highly heat-conductive insulating member, characterized in that the member comprises:

 3. In a tape- or sheet-like high heat conductive insulating member having a my-force layer and a backing material layer, the my-force layer is a mica scales force. (Mica paper) and second particles having a thermal conductivity of at least 0.5 WZ mK and at most 30 OW / mK dispersed in the mica paper, Insulating member.

 4. The insulating member according to claim 1,

 The diameter of the second particles is smaller than the diameter of the first particles.

5. The insulating member according to claim 1,

 The diameter of the second particles is 0.15 times or less of the diameter of the first particles.

6. The insulating member according to claim 3, The diameter of the second particles is at least 0.15 times the diameter of the my flakes.

 7. The insulating member according to claim 1,

 The first particles include boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond-like force. It is composed of one or more members selected from the group consisting of monocarbon, carbon-like diamond, silicon carbide, layered silicate clay mineral, and myric.

 8. The insulating member according to claim 1,

 The second particles are made of either carbon or aluminum oxide.

 9. The insulating member according to claim 3,

 The second particles include boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, and diamond. It is composed of one or more selected from the group consisting of mond-like carbon, carbon-like diamond, silicon carbide, gold, copper, iron, layered silicate clay minerals, and mylite.

 10. The insulating member according to claim 3,

 The second particles are made of either carbon or aluminum oxide.

 1 1. The insulating member according to claim 1,

The content of the second particles in the backing material layer is 0.5 Vo 1% or more.

1 2. The insulating member according to claim 1,

 The content of the second particles is 33.3 Vo 1% or less with respect to the total of the second particles and the resin.

 13. The insulating member according to claim 2,

 The backing material layer is provided on both sides of the my strength layer,

14 4. The insulating member according to claim 3,

 The my force layer is provided on both sides of the backing material layer,

15 5. The insulating member according to claim 2,

 The my force layer is composed of a mica paper (mica scales) force, and 0.5 WZm K or more and 300 WZm K dispersed in the my capeno. Including a second particle with the following thermal conductivity:

 1 6. The insulating member according to claim 3,

 The backing material layer includes: a resin substrate; first particles having a thermal conductivity of lW / mK or more and 30 OW / mK or less dispersed in the resin substrate; And second particles having a thermal conductivity of not less than 0.5 W / m K and not more than 30 O WZm K dispersed therein.

 17. The insulating member according to claim 2,

 The backing material layer is wider than the my strength layer.

18. The insulating member according to claim 3,

 The my strength layer is wider than the backing material layer.

19. A method for producing a tape-shaped or sheet-shaped highly thermally conductive insulating member having a my force layer and a backing material layer,

(a) l WZm K to 30 OW / m K The first particles are kneaded at a predetermined ratio with the second particles having a thermal conductivity of 5 W / mK or more and 30 OW / mK or less and a resin solution. (B) Impregnation of the kneaded material Impregnate the body,

 (c) heating and curing the kneaded material impregnated in the impregnated body, thereby obtaining a backing material layer,

 (d) 刖 d The backing material layer is stuck on mica paper and

 (e) The backing material layer and the my-strength paper which have been stuck together are formed into a tape or sheet by applying pressure with a roll press on the upper and lower surfaces. Manufacturing method of a high heat conductive insulating member.

 20. The method according to claim 19, wherein

 The impregnated body is glass cloth or resin film.

 21. A method for producing a tape-like or sheet-like high thermal conductive insulating member having a my force layer and a backing material layer, comprising:

 (i) A second particle having a thermal conductivity of 0.5 W / mK or more and 300 WZmK or less, my scales (mica scales), and a solvent are mixed and stirred at a predetermined ratio,

 (ii) filtering the mixed and stirred mixture with a predetermined filter, and drying the mixture to obtain mica paper;

(iii) The mica paper is adhered to the backing material layer and adhered. (iv) The adhered and adhered mica paper backing material layer is pressurized by a roll press. And shaped into a tape or sheet. Manufacturing method of a high heat conductive insulating member.

 22. An electromagnetic coil having the winding conductor insulated and covered with the insulating member according to claim 2.

 23. An electromagnetic coil having the winding conductor insulated by using the insulating member according to claim 3.

 24. Two insulating members according to claim 2 are wound alternately around the winding conductor with the upper and lower surfaces thereof being opposite to each other, and the displacement between the insulating members being shifted by a predetermined width. Electromagnetic coil.

 25. A method of using two insulating members according to claim 3, wherein the upper and lower surfaces are alternately wound around the winding conductor with the upper and lower surfaces thereof being opposite to each other and the shift width between the tapes being shifted by a predetermined width. Electromagnetic coil.

 26. The electromagnetic coil according to claim 24, wherein a shift width between the tapes when winding the insulating member mica tape is smaller than 1/2 of the tape width W. Il.

 27. The electromagnetic coil according to claim 25, wherein a shift width between the tapes when winding the mica tape is smaller than 1/2 of a tape width W.

 28. An electromagnetic coil, wherein two insulating members according to claim 2 are used and their upper and lower surfaces are bonded to each other and wound around a wound conductor.

 29. An electromagnetic coil, characterized in that two insulating members according to claim 3 are used and their upper and lower surfaces are bonded and wound around a wound conductor.

30. An electromagnetic device comprising the electromagnetic coil according to claim 22.

31. An electromagnetic device comprising the electromagnetic coil according to claim 23.