WO2003103861A3 - Material recycling apparatus using laser stripping of coatings - Google Patents

Material recycling apparatus using laser stripping of coatings Download PDF

Info

Publication number
WO2003103861A3
WO2003103861A3 PCT/US2003/017732 US0317732W WO03103861A3 WO 2003103861 A3 WO2003103861 A3 WO 2003103861A3 US 0317732 W US0317732 W US 0317732W WO 03103861 A3 WO03103861 A3 WO 03103861A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
recyclable material
waste
absorptivity
coatings
Prior art date
Application number
PCT/US2003/017732
Other languages
French (fr)
Other versions
WO2003103861A9 (en
WO2003103861A8 (en
WO2003103861A2 (en
Inventor
Daniel E Hogan
Original Assignee
Matsushita Electric Ind Co Ltd
Daniel E Hogan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, Daniel E Hogan filed Critical Matsushita Electric Ind Co Ltd
Priority to AU2003243408A priority Critical patent/AU2003243408A1/en
Priority to JP2004510973A priority patent/JP2005528307A/en
Priority to EP03757349A priority patent/EP1545806A2/en
Publication of WO2003103861A2 publication Critical patent/WO2003103861A2/en
Publication of WO2003103861A3 publication Critical patent/WO2003103861A3/en
Publication of WO2003103861A9 publication Critical patent/WO2003103861A9/en
Publication of WO2003103861A8 publication Critical patent/WO2003103861A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K8/00—Cosmetics or similar toiletry preparations
    • A61K8/02—Cosmetics or similar toiletry preparations characterised by special physical form
    • A61K8/04—Dispersions; Emulsions
    • A61K8/046—Aerosols; Foams
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61Q—SPECIFIC USE OF COSMETICS OR SIMILAR TOILETRY PREPARATIONS
    • A61Q5/00—Preparations for care of the hair
    • A61Q5/06—Preparations for styling the hair, e.g. by temporary shaping or colouring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components

Abstract

An apparatus for recycling waste (100), which includes both recyclable material and non-recyclable material (104) coupled to the recyclable material. The apparatus includes a laser (200) to ablate the non-recyclable material (104) from the recyclable material (102), a detector (204) to detect the relative position of waste and the laser, a sensor (206) to determine the absorptivity of the non-recyclable material (104), positioning means (110, 214, 216) to move the laser (200) and/or the waste (100), and laser control circuitry to control the fluence of the laser source (200). The laser (200) emits light having a peak wavelength and the sensor (206) determines the absorptivity of the non-recyclable material (104) for light having a wavelength approximately equal to this peak wavelength. The positioning means (110, 214, 216) moves the laser and/or the waste (100) such that the laser light irradiates at least a portion of the waste (100), and the laser control circuitry controls the fluence of the laser light on the waste (100) based on the absorptivity of the non-recyclable material (104).
PCT/US2003/017732 2002-06-05 2003-06-05 Low cost material recycling apparatus using laser stripping of coatings such as paint and glue WO2003103861A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003243408A AU2003243408A1 (en) 2002-06-05 2003-06-05 Material recycling apparatus using laser stripping of coatings
JP2004510973A JP2005528307A (en) 2002-06-05 2003-06-05 Material recycling equipment using laser stripping of coatings
EP03757349A EP1545806A2 (en) 2002-06-05 2003-06-05 Low cost material recycling apparatus using laser stripping of coatings such as paint and glue

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38595002P 2002-06-05 2002-06-05
US60/385,590 2002-06-05

Publications (4)

Publication Number Publication Date
WO2003103861A2 WO2003103861A2 (en) 2003-12-18
WO2003103861A3 true WO2003103861A3 (en) 2004-02-26
WO2003103861A9 WO2003103861A9 (en) 2004-07-22
WO2003103861A8 WO2003103861A8 (en) 2005-01-06

Family

ID=33551169

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/017732 WO2003103861A2 (en) 2002-06-05 2003-06-05 Low cost material recycling apparatus using laser stripping of coatings such as paint and glue

Country Status (3)

Country Link
EP (1) EP1545806A2 (en)
JP (1) JP2005528307A (en)
WO (1) WO2003103861A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG175710A1 (en) * 2009-05-23 2011-12-29 Scott Anthony Wozny Hard drive destruction system
CN102059457A (en) * 2010-10-29 2011-05-18 深圳市大族激光科技股份有限公司 Laser paint-removing system and method
JP6139292B2 (en) * 2012-11-06 2017-05-31 株式会社東芝 Defect repair device and defect repair method
CN104526158B (en) * 2014-11-29 2016-05-04 宁波江东思犒技术服务有限公司 For the laser cleaner of annular magnetic steel
CN105030168B (en) * 2015-06-25 2017-11-10 武汉大学 Indoor cleaning outer glass robot and method based on femtosecond laser
CN105127150B (en) * 2015-08-14 2017-12-15 四川大学 A kind of laser cleaning system and its cleaning method based on robot control
CN106102986B (en) 2016-06-08 2018-06-12 大族激光科技产业集团股份有限公司 For the method and its device of cutting sapphire
WO2018014241A1 (en) * 2016-07-19 2018-01-25 乐国强 Waste processing apparatus for electronic products
US10363586B2 (en) 2017-01-03 2019-07-30 The Boeing Company Large-area selective ablation methods
US10744539B2 (en) 2017-10-27 2020-08-18 The Boeing Company Optimized-coverage selective laser ablation systems and methods
US20220023922A1 (en) * 2018-12-10 2022-01-27 Molekule Inc. System and method for coating removal
CN110976436A (en) * 2019-12-20 2020-04-10 苏州艾思兰光电有限公司 Laser cleaning equipment is tracked to distance
CN112371598A (en) * 2020-11-30 2021-02-19 东营大海科林光电有限公司 Photovoltaic bottom plate dust removal and rust removal device and use method thereof

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879836A (en) * 1973-01-15 1975-04-29 Control Data Corp Printed circuit card component removal method
US4855572A (en) * 1987-01-23 1989-08-08 Pace Incorporated Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
USRE33777E (en) * 1982-01-26 1991-12-24 Avco Corporation Laser removal of poor thermally-conductive materials
US5148969A (en) * 1991-11-27 1992-09-22 Digital Equipment Corporation Component reclamation apparatus and method
DE4138779A1 (en) * 1991-11-26 1993-07-29 Lcd Mikroelektronik Dr Hampel Contacting integrated circuit on flexible circuit board, glass or ceramic substrate - fixing IC using organic resin which contains highly conductive particles with irregular structure
WO1995000343A1 (en) * 1993-06-17 1995-01-05 Inversion Development Corporation Paper recycling apparatus using a laser beam
DE4330677A1 (en) * 1993-09-10 1995-03-16 Schenck Eng Gmbh Method and device for removing components from printed circuit boards having electrical and/or electronic components arranged on them
DE4424385A1 (en) * 1994-07-13 1996-01-18 Frank Neelen Recycling electronic circuit boards and components
US5669979A (en) * 1993-09-08 1997-09-23 Uvtech Systems, Inc. Photoreactive surface processing
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
US5782253A (en) * 1991-12-24 1998-07-21 Mcdonnell Douglas Corporation System for removing a coating from a substrate
DE19831914A1 (en) * 1998-07-16 2000-01-20 Laser & Med Tech Gmbh Cleaning and decoating of transparent workpieces involving removal of areas of cover layer by using single quality switched pulses
US6168910B1 (en) * 1996-12-11 2001-01-02 Nitto Denko Corporation Method for removing residue and method for production of printed board having hole
DE10027068C1 (en) * 2000-05-31 2002-02-21 Jet Laser Systeme Ges Fuer Obe Cleaning of a mold used to produce elastomer moldings, comprises passing a pulsed beam from a laser containing an erbium-doped crystal over its walls to loosen and evaporate adhered material
US20030019576A1 (en) * 2001-06-27 2003-01-30 Loctite Corporation Electronic component removal method through application of infrared radiation

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879836A (en) * 1973-01-15 1975-04-29 Control Data Corp Printed circuit card component removal method
USRE33777E (en) * 1982-01-26 1991-12-24 Avco Corporation Laser removal of poor thermally-conductive materials
US4855572A (en) * 1987-01-23 1989-08-08 Pace Incorporated Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
DE4138779A1 (en) * 1991-11-26 1993-07-29 Lcd Mikroelektronik Dr Hampel Contacting integrated circuit on flexible circuit board, glass or ceramic substrate - fixing IC using organic resin which contains highly conductive particles with irregular structure
US5148969A (en) * 1991-11-27 1992-09-22 Digital Equipment Corporation Component reclamation apparatus and method
US5782253A (en) * 1991-12-24 1998-07-21 Mcdonnell Douglas Corporation System for removing a coating from a substrate
WO1995000343A1 (en) * 1993-06-17 1995-01-05 Inversion Development Corporation Paper recycling apparatus using a laser beam
US5669979A (en) * 1993-09-08 1997-09-23 Uvtech Systems, Inc. Photoreactive surface processing
DE4330677A1 (en) * 1993-09-10 1995-03-16 Schenck Eng Gmbh Method and device for removing components from printed circuit boards having electrical and/or electronic components arranged on them
DE4424385A1 (en) * 1994-07-13 1996-01-18 Frank Neelen Recycling electronic circuit boards and components
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
US6168910B1 (en) * 1996-12-11 2001-01-02 Nitto Denko Corporation Method for removing residue and method for production of printed board having hole
DE19831914A1 (en) * 1998-07-16 2000-01-20 Laser & Med Tech Gmbh Cleaning and decoating of transparent workpieces involving removal of areas of cover layer by using single quality switched pulses
DE10027068C1 (en) * 2000-05-31 2002-02-21 Jet Laser Systeme Ges Fuer Obe Cleaning of a mold used to produce elastomer moldings, comprises passing a pulsed beam from a laser containing an erbium-doped crystal over its walls to loosen and evaporate adhered material
US20030019576A1 (en) * 2001-06-27 2003-01-30 Loctite Corporation Electronic component removal method through application of infrared radiation

Also Published As

Publication number Publication date
WO2003103861A9 (en) 2004-07-22
WO2003103861A8 (en) 2005-01-06
EP1545806A2 (en) 2005-06-29
WO2003103861A2 (en) 2003-12-18
JP2005528307A (en) 2005-09-22

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