WO2003090281A3 - Single crystal silicon membranes for microelectromechanical applications - Google Patents

Single crystal silicon membranes for microelectromechanical applications Download PDF

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Publication number
WO2003090281A3
WO2003090281A3 PCT/US2003/011720 US0311720W WO03090281A3 WO 2003090281 A3 WO2003090281 A3 WO 2003090281A3 US 0311720 W US0311720 W US 0311720W WO 03090281 A3 WO03090281 A3 WO 03090281A3
Authority
WO
WIPO (PCT)
Prior art keywords
single crystal
substrate
crystal silicon
membrane layer
silicon membranes
Prior art date
Application number
PCT/US2003/011720
Other languages
French (fr)
Other versions
WO2003090281A2 (en
Inventor
Kevin S Jones
Mark E Law
Original Assignee
Univ Florida
Kevin S Jones
Mark E Law
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Florida, Kevin S Jones, Mark E Law filed Critical Univ Florida
Priority to AU2003221959A priority Critical patent/AU2003221959A1/en
Publication of WO2003090281A2 publication Critical patent/WO2003090281A2/en
Publication of WO2003090281A3 publication Critical patent/WO2003090281A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0116—Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities

Abstract

A method for forming a MEMS devices and related systems includes the steps of providing a single crystal substrate (320), etching a plurality of periodically placed holes (303) in the substrate, and annealing the substrate in a reducing ambient at a temperature its melting point. The holes coalesce into at least one cavity layer (318) and form at least one single crystal membrane layer (323) . The membrane layer provides a dislocation density of no more 106 disclocations/cm2. At least one MEMS structure including at least one movable portion is formed on the membrane layer. Microelectronic devices can also be formed on the single crystal substrate. The method can also be used to form MEMS devices having stacked membrane layers (323, 324).
PCT/US2003/011720 2002-04-15 2003-04-15 Single crystal silicon membranes for microelectromechanical applications WO2003090281A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003221959A AU2003221959A1 (en) 2002-04-15 2003-04-15 Single crystal silicon membranes for microelectromechanical applications

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37265102P 2002-04-15 2002-04-15
US60/372,651 2002-04-15

Publications (2)

Publication Number Publication Date
WO2003090281A2 WO2003090281A2 (en) 2003-10-30
WO2003090281A3 true WO2003090281A3 (en) 2004-01-08

Family

ID=29250887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/011720 WO2003090281A2 (en) 2002-04-15 2003-04-15 Single crystal silicon membranes for microelectromechanical applications

Country Status (2)

Country Link
AU (1) AU2003221959A1 (en)
WO (1) WO2003090281A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722686B1 (en) 2006-05-09 2007-05-30 주식회사 비에스이 Silicon condenser microphone having additional back chamber and sound hole in pcb
KR100722687B1 (en) 2006-05-09 2007-05-30 주식회사 비에스이 Directional silicon condenser microphone having additional back chamber
CN103935953B (en) 2014-04-25 2016-04-13 上海先进半导体制造股份有限公司 Composite cavity and forming method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672449A (en) * 1994-08-16 1997-09-30 Ims Ionen Mikrofabrikations Systeme Gmbh Silicon membrane and method of making same
US5963788A (en) * 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6128961A (en) * 1995-12-24 2000-10-10 Haronian; Dan Micro-electro-mechanics systems (MEMS)
US6355498B1 (en) * 2000-08-11 2002-03-12 Agere Systems Guartian Corp. Thin film resonators fabricated on membranes created by front side releasing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672449A (en) * 1994-08-16 1997-09-30 Ims Ionen Mikrofabrikations Systeme Gmbh Silicon membrane and method of making same
US5963788A (en) * 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6128961A (en) * 1995-12-24 2000-10-10 Haronian; Dan Micro-electro-mechanics systems (MEMS)
US6355498B1 (en) * 2000-08-11 2002-03-12 Agere Systems Guartian Corp. Thin film resonators fabricated on membranes created by front side releasing

Also Published As

Publication number Publication date
WO2003090281A2 (en) 2003-10-30
AU2003221959A1 (en) 2003-11-03

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