WO2003083543A1 - Substrat support de puce a circuit integre, procede de fabrication de substrat support de puce a circuit integre, dispositif de communication optique et procede de fabrication de dispositif de communication optique - Google Patents

Substrat support de puce a circuit integre, procede de fabrication de substrat support de puce a circuit integre, dispositif de communication optique et procede de fabrication de dispositif de communication optique Download PDF

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Publication number
WO2003083543A1
WO2003083543A1 PCT/JP2003/003932 JP0303932W WO03083543A1 WO 2003083543 A1 WO2003083543 A1 WO 2003083543A1 JP 0303932 W JP0303932 W JP 0303932W WO 03083543 A1 WO03083543 A1 WO 03083543A1
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WO
WIPO (PCT)
Prior art keywords
mounting substrate
chip mounting
optical communication
communication device
manufacturing
Prior art date
Application number
PCT/JP2003/003932
Other languages
English (en)
French (fr)
Inventor
Motoo Asai
Hiroaki Kodama
Toyoaki Tanaka
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to EP03715572A priority Critical patent/EP1491927B1/en
Priority to US10/509,899 priority patent/US8076782B2/en
Publication of WO2003083543A1 publication Critical patent/WO2003083543A1/ja
Priority to US12/785,786 priority patent/US8120040B2/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
PCT/JP2003/003932 2002-04-01 2003-03-28 Substrat support de puce a circuit integre, procede de fabrication de substrat support de puce a circuit integre, dispositif de communication optique et procede de fabrication de dispositif de communication optique WO2003083543A1 (fr)

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US10/509,899 US8076782B2 (en) 2002-04-01 2003-03-28 Substrate for mounting IC chip
US12/785,786 US8120040B2 (en) 2002-04-01 2010-05-24 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication

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