WO2003076694A3 - Methods and apparatuses for analyzing solder plating solutions - Google Patents

Methods and apparatuses for analyzing solder plating solutions Download PDF

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Publication number
WO2003076694A3
WO2003076694A3 PCT/US2003/005568 US0305568W WO03076694A3 WO 2003076694 A3 WO2003076694 A3 WO 2003076694A3 US 0305568 W US0305568 W US 0305568W WO 03076694 A3 WO03076694 A3 WO 03076694A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
solder plating
plating solutions
apparatuses
analyzing
Prior art date
Application number
PCT/US2003/005568
Other languages
French (fr)
Other versions
WO2003076694A2 (en
Inventor
Peter M Robertson
Mackenzie E King
Monica K Hilgarth
Cory Schomburg
Yurij Tolmachev
Uwe Schoenrogge
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/315,629 external-priority patent/US6913686B2/en
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Priority to AU2003219869A priority Critical patent/AU2003219869A1/en
Publication of WO2003076694A2 publication Critical patent/WO2003076694A2/en
Publication of WO2003076694A3 publication Critical patent/WO2003076694A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N31/00—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods
    • G01N31/16—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods using titration
    • G01N31/162—Determining the equivalent point by means of a discontinuity
    • G01N31/164—Determining the equivalent point by means of a discontinuity by electrical or electrochemical means

Abstract

The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis.
PCT/US2003/005568 2002-03-08 2003-02-24 Methods and apparatuses for analyzing solder plating solutions WO2003076694A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003219869A AU2003219869A1 (en) 2002-03-08 2003-02-24 Methods and apparatuses for analyzing solder plating solutions

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US36274102P 2002-03-08 2002-03-08
US60/362,741 2002-03-08
US10/315,629 2002-12-10
US10/315,629 US6913686B2 (en) 2002-12-10 2002-12-10 Methods for analyzing solder plating solutions

Publications (2)

Publication Number Publication Date
WO2003076694A2 WO2003076694A2 (en) 2003-09-18
WO2003076694A3 true WO2003076694A3 (en) 2004-09-30

Family

ID=27807710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/005568 WO2003076694A2 (en) 2002-03-08 2003-02-24 Methods and apparatuses for analyzing solder plating solutions

Country Status (3)

Country Link
AU (1) AU2003219869A1 (en)
TW (1) TW200306418A (en)
WO (1) WO2003076694A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102323316A (en) * 2011-08-16 2012-01-18 浙江大学 High-temperature high-pressure calibration device and calibration method of pH electrode

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2909179B1 (en) * 2006-11-29 2009-01-16 Commissariat Energie Atomique METHOD FOR MEASURING THE GLOBAL COMPLEXING POWER OF A SOLUTION COMPRISING MULTIPLE COMPLEXING CHEMICALS
CN101923055A (en) * 2010-07-04 2010-12-22 肖才斌 Portable functional color comparator
CN111766277B (en) * 2020-06-09 2022-06-28 安徽大学 Distinguish metal ion Fe3+And Cu2+Method (2)
CN112098393A (en) * 2020-09-14 2020-12-18 中国工程物理研究院机械制造工艺研究所 Method for measuring multiple elements of HR-1 direct-reading spectrum of hydrogen-resistant steel pipe
CN114486972B (en) * 2022-02-16 2022-11-11 云南惠铜新材料科技有限公司 Method for quickly measuring copper foil electroplating solution
CN116183534A (en) * 2022-11-30 2023-05-30 盐城吉瓦新材料科技有限公司 Detection method of electroplating solution brightening agent
CN116337805B (en) * 2023-05-22 2023-07-21 成都博瑞科传科技有限公司 Method and sensor for detecting total phosphorus in water based on array spectrum and ion selection method

Citations (8)

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Publication number Priority date Publication date Assignee Title
JPS5655842A (en) * 1979-10-12 1981-05-16 Japan Spectroscopic Co Monitoring device for concentrating of mixed acid by laser raman spectroscopy
JPS5885140A (en) * 1981-11-16 1983-05-21 Nec Corp Measuring method for brightener density in plating solution
US4696721A (en) * 1985-12-27 1987-09-29 Kabushiki Kaisha Toshiba Electroforming method and electroforming apparatus
US4812210A (en) * 1987-10-16 1989-03-14 The United States Department Of Energy Measuring surfactant concentration in plating solutions
US5286358A (en) * 1991-08-01 1994-02-15 The Foxboro Company Method of analyzing the complexing power of a pickling liquor
US5324400A (en) * 1992-12-04 1994-06-28 Hughes Aircraft Company Electrode preconditioning method for a plating bath monitoring process
JPH06255610A (en) * 1993-02-26 1994-09-13 Tokyo Autom Mach Works Ltd Binding machine and bale-packing apparatus and binding method
GB2327126A (en) * 1997-07-10 1999-01-13 Atotech Deutschland Gmbh Monitoring surfactant/polyelectrolyte concentration in electroplating bath by zeta potential measurement

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655842A (en) * 1979-10-12 1981-05-16 Japan Spectroscopic Co Monitoring device for concentrating of mixed acid by laser raman spectroscopy
JPS5885140A (en) * 1981-11-16 1983-05-21 Nec Corp Measuring method for brightener density in plating solution
US4696721A (en) * 1985-12-27 1987-09-29 Kabushiki Kaisha Toshiba Electroforming method and electroforming apparatus
US4812210A (en) * 1987-10-16 1989-03-14 The United States Department Of Energy Measuring surfactant concentration in plating solutions
US5286358A (en) * 1991-08-01 1994-02-15 The Foxboro Company Method of analyzing the complexing power of a pickling liquor
US5324400A (en) * 1992-12-04 1994-06-28 Hughes Aircraft Company Electrode preconditioning method for a plating bath monitoring process
JPH06255610A (en) * 1993-02-26 1994-09-13 Tokyo Autom Mach Works Ltd Binding machine and bale-packing apparatus and binding method
GB2327126A (en) * 1997-07-10 1999-01-13 Atotech Deutschland Gmbh Monitoring surfactant/polyelectrolyte concentration in electroplating bath by zeta potential measurement

Non-Patent Citations (15)

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Title
CAILIAO BAOHU, vol. 35, no. 3, 2002, pages 49 - 50 *
CHROMATOGRAPHY NEWSLETTER, vol. 9, no. 1, 1981, pages 10 - 12 *
DATABASE CAPLUS [online] ADAMOVA N.A. ET AL: "Determination of some surfactants by alternating current polarography", XP002976656, accession no. STN Database accession no. 1986:226718 *
DATABASE CAPLUS [online] MILLER R.L.: "LC methods development employing spectroscopy: analysis of electroplating solutions", XP002976658, accession no. STN Database accession no. 1981:508107 *
DATABASE CAPLUS [online] TSINGARELLI R.D. ET AL: "Solid-phase electrodes selective to lead and cadmium ions", XP002976655, accession no. STN Database accession no. 1986:417263 *
DATABASE CAPLUS [online] WEISHENG Y.: "Solder mask protective technology in production of multilayer printed circuit boards", XP002976657, accession no. STN Database accession no. 2003:45687 *
HALMEKOSKI J.: "Quantitative spectrophotometric determination of catechol, hydroquinone and resorcinol in aqueous solutions", J. SUOMEN KEMISTILEHTI, vol. 32, 1959, pages 274 - 276, XP002976700 *
HORKANS J.: "Polagraphic methods of monitoring addition agent in the electroplatig of Sn-Pb solders", IBM J. RES. DEVELOP, vol. 42, no. 5, September 1998 (1998-09-01), pages 621 - 628, XP002976683 *
IZVESTIYA AKADEMII NAUK MOLDAVSKOI SSR, BIOLOGICHESKIE I KHIMICHESKIE NAUKI, vol. 1, 1986, pages 73 - 76 *
KONISHI ET AL: "Control of lead-tin fluoroborate plating bath and analysis of the deposit", KINZOKU HYOMEN GIJUTSU, vol. 17, no. 9, 1966, pages 343 - 350, XP002976671 *
KONISHI ET AL: "Lead-tin alloy bath control", METAL FINISHING, September 1996 (1996-09-01), pages 66 - 74 *
SCHOLZ E.: "Analysis of fluoroborate baths and other fluoroborate solutions", GALVANOTECHNIK, vol. 66, no. 10, 1975, pages 811 - 819, XP002976664 *
SHIPULO ET AL: "Potentiometric titration in analysis of electroplating baths", ZAVODSKAYA LABORATORIYA, vol. 57, no. 10, 1991, pages 15 - 17, XP002976684 *
SKOOG D.A.: "Principles of Instrumental Analysis, 3rd edition", 1985, pages: 627 - 633, XP002981923 *
ZHURNAL ANALITICHESKOI KHIMII, vol. 41, no. 3, 1986, pages 449 - 452 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102323316A (en) * 2011-08-16 2012-01-18 浙江大学 High-temperature high-pressure calibration device and calibration method of pH electrode

Also Published As

Publication number Publication date
TW200306418A (en) 2003-11-16
AU2003219869A1 (en) 2003-09-22
WO2003076694A2 (en) 2003-09-18
AU2003219869A8 (en) 2003-09-22

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