WO2003072614A3 - Thiol compound, photopolymerization initiator composition and photosensitive composition - Google Patents

Thiol compound, photopolymerization initiator composition and photosensitive composition Download PDF

Info

Publication number
WO2003072614A3
WO2003072614A3 PCT/JP2003/002219 JP0302219W WO03072614A3 WO 2003072614 A3 WO2003072614 A3 WO 2003072614A3 JP 0302219 W JP0302219 W JP 0302219W WO 03072614 A3 WO03072614 A3 WO 03072614A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
photopolymerization initiator
thiol compound
photosensitive composition
photosensitive
Prior art date
Application number
PCT/JP2003/002219
Other languages
French (fr)
Other versions
WO2003072614A2 (en
Inventor
Tsuyoshi Katoh
Hirotoshi Kamata
Mina Onishi
Original Assignee
Showa Denko Kk
Tsuyoshi Katoh
Hirotoshi Kamata
Mina Onishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Tsuyoshi Katoh, Hirotoshi Kamata, Mina Onishi filed Critical Showa Denko Kk
Priority to AU2003224454A priority Critical patent/AU2003224454A1/en
Priority to KR1020047013107A priority patent/KR100976995B1/en
Priority to US10/505,778 priority patent/US7341828B2/en
Priority to EP03720880.8A priority patent/EP1478668B1/en
Publication of WO2003072614A2 publication Critical patent/WO2003072614A2/en
Publication of WO2003072614A3 publication Critical patent/WO2003072614A3/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C323/00Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
    • C07C323/50Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton
    • C07C323/51Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
    • C07C323/52Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F3/00Colour separation; Correction of tonal value
    • G03F3/10Checking the colour or tonal value of separation negatives or positives
    • G03F3/106Checking the colour or tonal value of separation negatives or positives using non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, other than silicon containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/117Free radical
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/122Sulfur compound containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/127Spectral sensitizer containing

Abstract

A photopolymerization initiator composition containing a thiol compound having a mercapto group-containing group that has at least one substituent on the carbon atoms on carbon atom(s) at the α- and/or β- position with respect to the mercapto group and a photopolymerization initiator; a photosensitive composition containing the composition; and a novel thiol compound for use in these compositions. The photosensitive composition containing the photopolymerizazion initiator composition of the present invention has high sensitivity and excellent storage stability and enables reduction in cost due by increasing productivity.
PCT/JP2003/002219 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition WO2003072614A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003224454A AU2003224454A1 (en) 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition
KR1020047013107A KR100976995B1 (en) 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition
US10/505,778 US7341828B2 (en) 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition
EP03720880.8A EP1478668B1 (en) 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002052515 2002-02-28
JP2002-052515 2002-02-28
JP2002257766 2002-09-03
JP2002-257766 2002-09-03
US40826802P 2002-09-06 2002-09-06
US60/408,268 2002-09-06

Publications (2)

Publication Number Publication Date
WO2003072614A2 WO2003072614A2 (en) 2003-09-04
WO2003072614A3 true WO2003072614A3 (en) 2004-04-22

Family

ID=33100322

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/002219 WO2003072614A2 (en) 2002-02-28 2003-02-27 Thiol compound, photopolymerization initiator composition and photosensitive composition

Country Status (7)

Country Link
US (1) US7341828B2 (en)
EP (1) EP1478668B1 (en)
JP (1) JP4902608B2 (en)
KR (1) KR100976995B1 (en)
CN (1) CN100523008C (en)
AU (1) AU2003224454A1 (en)
WO (1) WO2003072614A2 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4393051B2 (en) * 2002-10-15 2010-01-06 昭和電工株式会社 Hexaarylbiimidazole compound and photopolymerization initiator composition containing the same
JP4378163B2 (en) * 2003-12-16 2009-12-02 東洋インキ製造株式会社 Blue coloring composition for color filter and color filter
WO2006046733A1 (en) * 2004-10-26 2006-05-04 Showa Denko K.K Thiol compound, and photosensitive composition and black matrix resist composition using the compound
WO2006048445A1 (en) * 2004-11-05 2006-05-11 Agfa Graphics Nv Photopolymerizable composition
WO2006048443A2 (en) * 2004-11-05 2006-05-11 Agfa Graphics Nv Photopolymerizable composition
JP4315892B2 (en) * 2004-11-25 2009-08-19 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
JP2006220790A (en) * 2005-02-09 2006-08-24 Taiyo Ink Mfg Ltd Photosensitive resin composition for display panel, its hardened material, and spacer for display panel
KR100741295B1 (en) * 2005-05-03 2007-07-20 주식회사 동진쎄미켐 Photosensitive resin composition
ATE554126T1 (en) * 2006-01-26 2012-05-15 Showa Denko Kk CURABLE COMPOSITION CONTAINING A THIOLEN COMPOUND
EP2030989A4 (en) * 2006-06-13 2011-08-31 Showa Denko Kk Polymerization accelerator, curable composition, cured product and method for producing thiol compound
WO2008059670A1 (en) * 2006-11-15 2008-05-22 Taiyo Ink Mfg. Co., Ltd. Photocurable/thermosetting resin composition, cured object, and printed wiring board
US8053167B2 (en) * 2006-11-21 2011-11-08 Showa Denko K.K. Curable compositions containing hydroxythiol compound, and cured products thereof
WO2008070737A1 (en) * 2006-12-05 2008-06-12 University Of Southern Mississippi Benzophenone/thioxanthone derivatives and their use in photopolymerizable compositions
CN101542392B (en) * 2007-03-29 2013-08-14 太阳控股株式会社 Photocurable resin composition, dry film, cured product, and printed wiring board
JP4601009B2 (en) * 2007-03-30 2010-12-22 富士フイルム株式会社 Ink set for inkjet recording and inkjet recording method
JP5043516B2 (en) * 2007-06-04 2012-10-10 太陽ホールディングス株式会社 Photocurable / thermosetting resin composition and printed wiring obtained using the same
US20090047531A1 (en) * 2007-08-17 2009-02-19 Ppg Industries Ohio, Inc. Packages having radiation-curable coatings
JP5653623B2 (en) * 2007-12-13 2015-01-14 昭和電工株式会社 Epoxy resin curing agent, method for producing the same, and epoxy resin composition
KR101027811B1 (en) * 2007-12-24 2011-04-07 한국생산기술연구원 A polycarbonate resin composition having a low coefficient of thermal expansion
JP5527965B2 (en) * 2008-02-22 2014-06-25 Jsr株式会社 Radiation-sensitive composition for green pixel formation, color filter, and color liquid crystal display element
KR100869383B1 (en) 2008-03-07 2008-11-19 한국생산기술연구원 Polycarbonate resin composition having low-cet and optical film for plastic substrate
JP5251329B2 (en) * 2008-07-22 2013-07-31 東洋インキScホールディングス株式会社 Blue coloring composition for color filter, color filter, and color display device
JP5277039B2 (en) * 2009-03-30 2013-08-28 富士フイルム株式会社 Planographic printing plate precursor and plate making method
JP5255504B2 (en) * 2009-03-31 2013-08-07 富士フイルム株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed circuit board
KR101400194B1 (en) * 2010-12-01 2014-05-27 제일모직 주식회사 Photosensitive resin composition for color filter, and color filter using the same
WO2012128318A1 (en) * 2011-03-23 2012-09-27 三菱化学株式会社 Colored resin composition, color filter, liquid crystal display device, organic el display device
JP6028455B2 (en) * 2012-08-24 2016-11-16 大日本印刷株式会社 Photosensitive composition for volume hologram recording, photosensitive substrate for volume hologram recording, and volume hologram recording body
KR20140083620A (en) 2012-12-26 2014-07-04 제일모직주식회사 Photosensitive resin composition for light blocking layer and light blocking layer using the same
KR101992867B1 (en) * 2013-03-29 2019-06-25 동우 화인켐 주식회사 Colored photosensitive resin composition
SG11201707013RA (en) * 2015-04-21 2017-10-30 Showa Denko Kk Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof
JP6690638B2 (en) * 2015-04-21 2020-04-28 昭和電工株式会社 Radical-polymerizable water-containing resin composition, method for curing the same, and method for producing radical-polymerizable water-containing resin composition
EP3564750B1 (en) 2015-08-21 2021-05-26 Samsung Electronics Co., Ltd. Photosensitive compositions, preparation methods thereof, and quantum dot polymer composite prepared therefrom
KR102024613B1 (en) 2016-03-07 2019-09-24 쇼와 덴코 가부시키가이샤 Active energy ray curable composition and its hardened | cured material
CN114907503B (en) * 2022-06-06 2023-05-16 北京航空航天大学 Photoinitiation system for aggregation state environment, photoinitiation polymeric material and application

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1118776B (en) * 1956-05-07 1961-12-07 Rohm & Haas Process for the preparation of sulfur-containing carboxylic acid esters
EP0900800A2 (en) * 1997-08-26 1999-03-10 Showa Denko Kabushiki Kaisha Stabilizer for organic borate salts and photosensitive composition containing the same
WO2001025302A1 (en) * 1999-10-06 2001-04-12 Essilor International Compagnie Generale D'optique Polymerisable compositions for making transparent polymer substrates, resulting polymer substrates and their uses in optics

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL113311C (en) * 1958-10-23 1900-01-01
US3144422A (en) * 1962-01-03 1964-08-11 Carlisle Chemical Works Polyolefins stabilized with pentaerythritol mercapto esters
US4020233A (en) * 1976-01-22 1977-04-26 W. R. Grace & Co. Heat activated ethylenically unsaturated-polythiol compositions
JPS57158230A (en) * 1981-03-26 1982-09-30 Sumitomo Bakelite Co Ltd Ultraviolet ray-curable resin composition
JPH01278551A (en) * 1988-05-02 1989-11-08 Nitto Kasei Co Ltd Gamma ray-resistant halogen-containing resin composition
JP2702153B2 (en) * 1988-06-08 1998-01-21 三井東圧化学株式会社 Pipe joint made of sulfur-containing urethane resin
JP2686635B2 (en) * 1989-02-03 1997-12-08 神東塗料株式会社 Cationic electrodeposition coating composition
US5350572A (en) * 1993-02-18 1994-09-27 Shiseido Co., Ltd. Permanent waving composition
US5631307A (en) * 1994-06-28 1997-05-20 Toyo Ink Manufacturing Co., Ltd. Photopolymerization initiator composition and photopolymerizable composition
WO1995035331A1 (en) * 1994-07-25 1995-12-28 Wan Jeffrey K S Dithio-containing anti-yellowing agents for pulp and paper
US6030495A (en) * 1994-07-25 2000-02-29 Queens's University At Kingston Method for increasing brightness in pulp paper and polymeric materials
CA2248616A1 (en) 1996-04-05 1997-10-16 Minnesota Mining And Manufacturing Company Visible light polymerizable composition
JP3882254B2 (en) 1997-03-12 2007-02-14 三菱化学株式会社 Photopolymerizable composition for color filter and color filter
EP1031579B1 (en) 1999-02-26 2005-07-27 Showa Denko Kabushiki Kaisha Photopolymerization initiator for color filter, photosensitive coloring composition, and color filter
EP1048706A1 (en) 1999-04-29 2000-11-02 Akzo Nobel N.V. Coating composition comprising an oxidatively drying polyunsaturated condensation product, a polythiol, and a photoinitiator
JP3640149B2 (en) * 1999-08-27 2005-04-20 東亞合成株式会社 Active energy ray-curable adhesive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1118776B (en) * 1956-05-07 1961-12-07 Rohm & Haas Process for the preparation of sulfur-containing carboxylic acid esters
EP0900800A2 (en) * 1997-08-26 1999-03-10 Showa Denko Kabushiki Kaisha Stabilizer for organic borate salts and photosensitive composition containing the same
WO2001025302A1 (en) * 1999-10-06 2001-04-12 Essilor International Compagnie Generale D'optique Polymerisable compositions for making transparent polymer substrates, resulting polymer substrates and their uses in optics

Also Published As

Publication number Publication date
US7341828B2 (en) 2008-03-11
KR100976995B1 (en) 2010-08-19
CN100523008C (en) 2009-08-05
JP4902608B2 (en) 2012-03-21
KR20040101237A (en) 2004-12-02
EP1478668A2 (en) 2004-11-24
AU2003224454A1 (en) 2003-09-09
US20050153231A1 (en) 2005-07-14
WO2003072614A2 (en) 2003-09-04
AU2003224454A8 (en) 2003-09-09
CN1656127A (en) 2005-08-17
JP2009035555A (en) 2009-02-19
EP1478668B1 (en) 2013-04-10

Similar Documents

Publication Publication Date Title
WO2003072614A3 (en) Thiol compound, photopolymerization initiator composition and photosensitive composition
EP1734032A4 (en) Calixresorcinarene compounds, photoresist base materials, and compositions thereof
WO2006048443A3 (en) Photopolymerizable composition
WO2006099357A3 (en) Polymerizable composition comprising low molecular weight organic component
WO2006105127A8 (en) Hydroxysteroid dehydrogenase inhibitors
MY132698A (en) Herbicidal composition
TW200709886A (en) Fluxing compositions
WO2006066109A3 (en) Hydroxysteroid dehydrogenase inhibitors
TW200639586A (en) Photoresist compositions comprising resin blends
WO2004101490A3 (en) Photoactive compounds
WO2008126890A1 (en) Hydrazide compound and harmful arthropod-controlling agent containing the same
WO2004091645A3 (en) Composition comprising rosmarinic acid, borneol and ginsenoside
WO2007007207A8 (en) Pharmaceutical compositions of 3, 5 -bis (arylidene) -4 -piperidones and analogues there of for modulating cell proliferation
EP1041101A3 (en) Curable composition
WO2005097787A3 (en) Novel benzothiazoles and the use thereof as medicaments
WO2004092100A8 (en) Indene derivatives as pharmaceutical agents
TWI266143B (en) Photosensitive resin compositions and photosensitive dry film using the same
BRPI0412226A (en) tack adhesive composition
BR9800066A (en) Method for improving loadability in a powder coating composition
WO2006116498A3 (en) Purified form of tanaproget
TWI263117B (en) Negative type photosensitive resin composition containing a phenol-biphenylene resin
EP1647860A8 (en) Adhesion improver for photosensitive resin composition and photosensitive resin composition containing same
WO2005080462A3 (en) Silane formulation for moisture-crosslinking hybrid adhesives and sealants
WO2009022540A1 (en) Compound and radiation-sensitive composition
WO2005061496A8 (en) Aminopyridine-derivatives as inductible no-synthase inhibitors

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003720880

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020047013107

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20038046660

Country of ref document: CN

Ref document number: 10505778

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2003720880

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020047013107

Country of ref document: KR