WO2003069734A1 - Intermediate board - Google Patents

Intermediate board Download PDF

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Publication number
WO2003069734A1
WO2003069734A1 PCT/EP2003/001445 EP0301445W WO03069734A1 WO 2003069734 A1 WO2003069734 A1 WO 2003069734A1 EP 0301445 W EP0301445 W EP 0301445W WO 03069734 A1 WO03069734 A1 WO 03069734A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
support
contact
make contact
electronic equipment
Prior art date
Application number
PCT/EP2003/001445
Other languages
French (fr)
Inventor
Håkan BYGDÖ
Original Assignee
Sony Ericsson Mobile Communications Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP02445025A external-priority patent/EP1337007A1/en
Application filed by Sony Ericsson Mobile Communications Ab filed Critical Sony Ericsson Mobile Communications Ab
Priority to AU2003208848A priority Critical patent/AU2003208848A1/en
Publication of WO2003069734A1 publication Critical patent/WO2003069734A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present invention relates to an intermediate board and more particularly to a device adapting the footprint of a component to a contact arrangement of a main printed circuit board to which the component is to be connected.
  • the component may be a memory circuit to be connected to an electronic equipment for use in a mobile telephone and similar.
  • the invention also relates to methods for testing components by means of the device and developing and adapting circuit boards for use with different components.
  • US A 5,109,596 describes a contact arrangement for the connection of contact points of a circuit board to the electrical contact points of a test device.
  • This includes an adapter board having a plurality of metal contact points arranged on each side thereof. At least one side of the adapter board and at least one cushionlike plug is made from an electrically conductive springy elastomer.
  • US A 5,399,982 describes an adapter for electrical connection between test points on a circuit board and contacts on the basic printed circuit board.
  • the adapter has a flexible foil that carries a footprint on one side and a different footprint on the other side.
  • the contact points are electrically interconnected on both sides of the adapter foil by plated-through holes.
  • the layout of contact arrangements has to be customized to one specific circuit with a specific footprint or contact arrangement.
  • it is desired to be able to test circuits with different footprints, e.g. from different providers.
  • it may be desired to switch to another circuit having another footprint. This may be for many reasons, e.g. it is desired to switch to a circuit having better capacity, or the original circuit provider has changed the circuit or it is desired to switch circuit for business related reasons.
  • the present invention solves e.g. the above-mentioned problems by providing a device for interconnecting a component-carrying support and a component.
  • a device for interconnecting a component-carrying support and a component characterised in that the device on one side is adapted to make contact with the component and on the other side is adapted to make contact with the support.
  • a component suitable for connection to a component-carrying support characterised in that the component is secured to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support.
  • the component may comprise a memory circuit.
  • an electronic equipment comprising at least one component-carrying support and at least one component, characterised in that the component is secured to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support.
  • the electronic equipment may be comprised in a mobile telephone or in a test device for testing components.
  • a component-carrying support characterised in that the component-carrying support is provided with a contact arrangement enabling connection with a range of components having different contact arrangements by means of a device, said device on one side being adapted to make contact with a respective component and on the other side being adapted to make contact with the support.
  • the component-carrying support may be a circuit board prepared for connection of memory circuits having different capacities and contact arrangements.
  • a method of testing a component suitable for connection to a component-carrying support characterised by the steps of: connecting the component to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support; connecting the device to the support; and running a test with the component thus connected to the support.
  • a method of adaptation of a component to a component-carrying support charac- terised by the steps of: connecting the component to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support in accordance with their respective contact arrangements; and connecting the device to the support.
  • a method of adaptation of a component-carrying support to a second component having a different contact arrangement than a first component characterised by the steps of: connecting the second component to a device, said device on one side being adapted to make contact with the second component and on the other side being adapted to make contact with the support in accordance with their respective contact arrangements; and connecting the device to the support.
  • the component-carrying support may be provided with a contact arrangement enabling connection with a range of components having different contact arrangements.
  • the second component may comprise more than one circuit.
  • the invention provides several advantages.
  • the main circuit board does not have to be re-designed in order to connect a component having a different footprint from which it was originally designed for. This facilitates testing different components. It is also easy to switch components during the normal production of the product or when products need repair or upgrading.
  • fig. 1 is a schematic cross-sectional view of a circuit board having a component mounted thereon without using an intermediate board according to the present invention
  • fig. 2 is a schematic cross-sectional view showing the connection of a component to a circuit board through an intermediate board according to the present invention
  • fig. 3 is a detail view of an exemplifying intermediate board.
  • the present invention may be used e.g. in a mobile telephone, or other electronic device, comprising electronic equipment including a printed circuit board having mounted thereon various circuits.
  • One circuit may e.g. be a memory circuit.
  • the main board is a component- carrying support or structure including electrical connections and conducting surfaces as is conventional in the printed circuit board technology.
  • a component can be any electric circuit or device connected to the main board, e.g. memory circuits or other integrated circuits or discrete components.
  • the footprint of a component refers to the layout or arrangement of contacting points or surfaces arranged for contacting e.g. a circuit board.
  • the actual terminals may be contact surfaces or protruding pads or pins.
  • fig. 1 is shown the initial arrangement of a component 1 and main board 2.
  • the component has a fixed contact arrangement 11.
  • the main board forms part of an electronic equipment to be fitted in a product by a manufacturer.
  • the com- ponents 1 are often supplied by a subcontractor.
  • each subcontractor may have different models of the component performing the same or a similar function, but all these components do not generally have the same footprint but may vary.
  • the manufacturer of the product wants to test different components he has to design and build a main board with a specific layout of the contact arrangement customized for each component to be tested.
  • the present invention solves this problem by providing an intermediate board that acts as an adapter between a component and a main board.
  • the intermediate board 3 is placed between the component 1 and the main board 2.
  • the intermediate board 3 is attached by soldering to the component 1' and the main board 2, respectively, in a suitable order.
  • the component 1' has a different contact arrangement 11' from the original component 1.
  • the intermediate board 3 acts to translate the footprint 11' so that it fits with the contact arrangement 12 of the original main board 2.
  • Fig. 3 shows a detail view of the intermediate board 3.
  • One side A has a contact arrangement fitting with the component 1', while the opposite side B has a contact arrangement fitting with the main board 2.
  • the intermediate board comprises layers of conducting and isolating materials with connections between conducting surfaces on the opposite sides A and B.
  • the intermediate board may be produced by means of conventional technology.
  • the manufacturer instead of having to produce a customized main board for each component footprint the manufacturer only needs to produce an intermediate board for each specific component.
  • the size of the intermediate board is adapted to the component and is of course much smaller than the whole main board. Only part of the main board is shown in the drawings.
  • the manufacturer of the complete product decides to select one of the components tested. Then he will probably customize a main board to the selected component. However, it is also possible to keep the original main board and to use the component with the intermediate board permanently in the finished product.
  • the intermediate board only adds a certain height to the component, e.g. less than one millimetre, which has to be taken into account when designing the housing covering the equipment.
  • the provider of the component may also wish to add the intermediate board directly in this own factory so that the component is delivered with the intermediate board attached to the component permanently, e.g. by soldering. In this way the provider of the component may sell the same component but with different footprints adapted to different main boards.
  • the intermediate board may also be used to up-grade a product. For instance memory circuits with larger capacity may be used to replace the original circuit in a mobile telephone by means of the intermediate board. Moreover, since newer memory circuits tend to be smaller in dimensions than older ones it may be possible to fit in two new memory circuits replacing one old by means of an intermediate board having the required contact arrangement.
  • the intermediate board may also be used in electronic equipment comprised in a test device for testing components.
  • a specific intermediate board is designed and used for each component to be tested (except components compatible directly with the test device).
  • the term electronic equipment includes e.g. portable radio communication equipment.
  • portable radio communication equipment includes all equipment such as mobile telephones, pagers, communicators, electronic organizers, smart phones and the like.

Abstract

The invention relates to an intermediate board and more particularly to a device adapting the footprint of a component to a contact arrangement of a support, e.g. a printed circuit board to which the component is to be connected. The device (3) is on one side adapted to make contact with the component (1') and on the other side adapted to make contact with the support (2). The component (1') may be a memory circuit to be connected to an electronic equipment for use in a mobile telephone and similar. The invention also relates to methods for testing components by means of the device and developing and adapting circuit boards for use with different components.

Description

INTERMEDIATE BOARD
Field of the invention
The present invention relates to an intermediate board and more particularly to a device adapting the footprint of a component to a contact arrangement of a main printed circuit board to which the component is to be connected. The component may be a memory circuit to be connected to an electronic equipment for use in a mobile telephone and similar. The invention also relates to methods for testing components by means of the device and developing and adapting circuit boards for use with different components.
State of the art
It is previously known to use adapter boards in test devices.
US A 5,109,596 describes a contact arrangement for the connection of contact points of a circuit board to the electrical contact points of a test device. This includes an adapter board having a plurality of metal contact points arranged on each side thereof. At least one side of the adapter board and at least one cushionlike plug is made from an electrically conductive springy elastomer.
US A 5,399,982 describes an adapter for electrical connection between test points on a circuit board and contacts on the basic printed circuit board. The adapter has a flexible foil that carries a footprint on one side and a different footprint on the other side. The contact points are electrically interconnected on both sides of the adapter foil by plated-through holes.
These documents do not relate to the connection of components to a main board incorporated in general electronic equipment, but only in test devices. The documents mainly relate to perfecting the electric contact between a circuit to be tested and the test device, accommodating varying heights and lateral displacements.
Summary of the invention
In equipment using a main circuit board for connecting circuits the layout of contact arrangements has to be customized to one specific circuit with a specific footprint or contact arrangement. In the early development phase and during prototype testing, it is desired to be able to test circuits with different footprints, e.g. from different providers. Also, when a product is finished using a circuit with a specific footprint, it may be desired to switch to another circuit having another footprint. This may be for many reasons, e.g. it is desired to switch to a circuit having better capacity, or the original circuit provider has changed the circuit or it is desired to switch circuit for business related reasons. The present invention solves e.g. the above-mentioned problems by providing a device for interconnecting a component-carrying support and a component.
In accordance with one aspect of the invention, there is provided a device for interconnecting a component-carrying support and a component, characterised in that the device on one side is adapted to make contact with the component and on the other side is adapted to make contact with the support.
In accordance with a further aspect of the invention, there is provided a component suitable for connection to a component-carrying support, characterised in that the component is secured to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support.
The component may comprise a memory circuit.
In accordance with a further aspect of the invention, there is provided an electronic equipment comprising at least one component-carrying support and at least one component, characterised in that the component is secured to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support.
The electronic equipment may be comprised in a mobile telephone or in a test device for testing components.
In accordance with a further aspect of the invention, there is provided a component-carrying support, characterised in that the component-carrying support is provided with a contact arrangement enabling connection with a range of components having different contact arrangements by means of a device, said device on one side being adapted to make contact with a respective component and on the other side being adapted to make contact with the support.
The component-carrying support may be a circuit board prepared for connection of memory circuits having different capacities and contact arrangements. In accordance with a further aspect of the invention, there is provided a method of testing a component suitable for connection to a component-carrying support, characterised by the steps of: connecting the component to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support; connecting the device to the support; and running a test with the component thus connected to the support.
In accordance with a further aspect of the invention, there is provided a method of adaptation of a component to a component-carrying support, charac- terised by the steps of: connecting the component to a device, said device on one side being adapted to make contact with the component and on the other side being adapted to make contact with the support in accordance with their respective contact arrangements; and connecting the device to the support.
In accordance with a further aspect of the invention, there is provided a method of adaptation of a component-carrying support to a second component having a different contact arrangement than a first component, characterised by the steps of: connecting the second component to a device, said device on one side being adapted to make contact with the second component and on the other side being adapted to make contact with the support in accordance with their respective contact arrangements; and connecting the device to the support.
The component-carrying support may be provided with a contact arrangement enabling connection with a range of components having different contact arrangements.
The second component may comprise more than one circuit. The invention provides several advantages. The main circuit board does not have to be re-designed in order to connect a component having a different footprint from which it was originally designed for. This facilitates testing different components. It is also easy to switch components during the normal production of the product or when products need repair or upgrading.
Brief description of the drawings
The invention will be described in detail below with reference to the accompanying drawings, in which: fig. 1 is a schematic cross-sectional view of a circuit board having a component mounted thereon without using an intermediate board according to the present invention, fig. 2 is a schematic cross-sectional view showing the connection of a component to a circuit board through an intermediate board according to the present invention, and fig. 3 is a detail view of an exemplifying intermediate board.
Detailed description of preferred embodiments
The present invention may be used e.g. in a mobile telephone, or other electronic device, comprising electronic equipment including a printed circuit board having mounted thereon various circuits. One circuit may e.g. be a memory circuit.
The following terms are used in the application and should have the following meanings and equivalents thereof. The main board is a component- carrying support or structure including electrical connections and conducting surfaces as is conventional in the printed circuit board technology. A component can be any electric circuit or device connected to the main board, e.g. memory circuits or other integrated circuits or discrete components. The footprint of a component refers to the layout or arrangement of contacting points or surfaces arranged for contacting e.g. a circuit board. The actual terminals may be contact surfaces or protruding pads or pins.
In fig. 1 is shown the initial arrangement of a component 1 and main board 2. The component has a fixed contact arrangement 11. When designing the board 2 it is provided with corresponding contact arrangement 12. The main board forms part of an electronic equipment to be fitted in a product by a manufacturer. The com- ponents 1 are often supplied by a subcontractor. During the development of the product there may be a lot of subcontractors to choose from and also each subcontractor may have different models of the component performing the same or a similar function, but all these components do not generally have the same footprint but may vary. Thus, if the manufacturer of the product wants to test different components he has to design and build a main board with a specific layout of the contact arrangement customized for each component to be tested.
The present invention solves this problem by providing an intermediate board that acts as an adapter between a component and a main board. As is shown in fig. 2, the intermediate board 3 is placed between the component 1 and the main board 2. The intermediate board 3 is attached by soldering to the component 1' and the main board 2, respectively, in a suitable order. The component 1' has a different contact arrangement 11' from the original component 1. The intermediate board 3 acts to translate the footprint 11' so that it fits with the contact arrangement 12 of the original main board 2. Fig. 3 shows a detail view of the intermediate board 3. One side A has a contact arrangement fitting with the component 1', while the opposite side B has a contact arrangement fitting with the main board 2. The intermediate board comprises layers of conducting and isolating materials with connections between conducting surfaces on the opposite sides A and B. The intermediate board may be produced by means of conventional technology.
Thus, instead of having to produce a customized main board for each component footprint the manufacturer only needs to produce an intermediate board for each specific component. The size of the intermediate board is adapted to the component and is of course much smaller than the whole main board. Only part of the main board is shown in the drawings.
When the testing is done, the manufacturer of the complete product decides to select one of the components tested. Then he will probably customize a main board to the selected component. However, it is also possible to keep the original main board and to use the component with the intermediate board permanently in the finished product. The intermediate board only adds a certain height to the component, e.g. less than one millimetre, which has to be taken into account when designing the housing covering the equipment.
The provider of the component may also wish to add the intermediate board directly in this own factory so that the component is delivered with the intermediate board attached to the component permanently, e.g. by soldering. In this way the provider of the component may sell the same component but with different footprints adapted to different main boards.
It may be that the manufacturer of the product wants to change to another component later. This may be because the agreement with the original provider of the component has ceased, a new model of the component with better capacity has arrived on the market or for various other reasons. In this case, the production of the product needs only be changed in as much as a specific intermediate board is produced which fits the new component to the original main board. The intermediate board may also be used to up-grade a product. For instance memory circuits with larger capacity may be used to replace the original circuit in a mobile telephone by means of the intermediate board. Moreover, since newer memory circuits tend to be smaller in dimensions than older ones it may be possible to fit in two new memory circuits replacing one old by means of an intermediate board having the required contact arrangement.
Already when designing the original main board this may be designed with electric connections for addressing a memory circuit that in fact is not yet in the market. By means of a customized intermediate board only those connections are used initially that are needed for the memory circuit available at the moment. When new models of the memory circuit arrive the main board is already prepared and the new memory circuits are connected to the main board by means of another intermediate board so that all the required connections are used.
The intermediate board may also be used in electronic equipment comprised in a test device for testing components. A specific intermediate board is designed and used for each component to be tested (except components compatible directly with the test device).
It will be appreciated that the invention is useful for adapting circuit boards of electronic equipment to various components and in many applications. The term electronic equipment includes e.g. portable radio communication equipment. The term portable radio communication equipment includes all equipment such as mobile telephones, pagers, communicators, electronic organizers, smart phones and the like.

Claims

1. Device for interconnecting a component-carrying support (2) and a component (V), characterised in that the device (3) on one side (A) is adapted to make contact with the component (V) and on the other side (B) is adapted to make contact with the support (2).
2. Device according to claim 1, characterised in that the device (3) on one side (A) is provided with a contact arrangement to make contact with the component (V) and on the other side is provided with a contact arrangement (B) to make contact with the support (2).
3. Device for interconnecting a component-carrying support and a component, characterised in that it includes means for translating a contact arrangement (I T) of the component (1') to a contact arrangement (12) of the support (2).
4. Component suitable for connection to a component-carrying support, characterised in that the component (1') is secured to a device (3), said device (3) on one side (A) being adapted to make contact with the component (V) and on the other side (B) being adapted to make contact with the support (2).
5. Component according to claim 4, characterised in that the component (V) is secured by soldering to the device (2).
6. Component according to claim 4 or 5, characterised in that it comprises a memory circuit.
7. Electronic equipment comprising at least one component-carrying support (2) and at least one component (1'), characterised in that the component (V) is secured to a device (3), said device (3) on one side (A) being adapted to make contact with the component (V) and on the other side (B) being adapted to make contact with the support (2).
8. Electronic equipment according to claim 7, characterised in that the component-carrying support (2) is a circuit board.
9. Electronic equipment according to claim 8, characterised in that the component (T) comprises a memory circuit.
10. Electronic equipment according to any of claims 7 to 9, characterised in that electronic equipment is comprised in a mobile telephone.
11. Electronic equipment according to any of claims 7 to 9, characterised in that electronic equipment is comprised in a test device for testing components.
12. Component-carrying support, characterised in that the component-carrying support (2) is provided with a contact arrangement (12) enabling connection with a range of components having different contact arrangements by means of a device, said device (3) on one side (A) being adapted to make contact with a respective component (V) and on the other side (B) being adapted to make contact with the support (2).
13. Component-carrying support according to claim 12, characterised in that the component-carrying support (2) is a circuit board prepared for connection of memory circuits having different capacities and contact arrangements.
14. Method of testing a component suitable for connection to a component-carrying support, characterised by the steps of: connecting the component (1') to a device (3), said device (3) on one side (A) being adapted to make contact with the component (1') and on the other side (B) being adapted to make contact with the support (2); connecting the device (3) to the support (2); and running a test with the component (1') thus connected to the support (2).
15. Method of adaptation of a component to a component-carrying support, characterised by the steps of: connecting the component (1') to a device (3), said device (3) on one side (A) being adapted to make contact with the component (1') and on the other side (B) being adapted to make contact with the support (2) in accordance with their respective contact arrangements (I T, 12); and connecting the device (3) to the support (2).
16. Method of adaptation of a component-carrying support to a second component having a different contact arrangement than a first component, characterised by the steps of: connecting the second component (1') to a device (3), said (3) device on one side being adapted to make contact with the second component (1') and on the other side being adapted to make contact with the support (2) in accordance with their respective contact arrangements (12, 11'); and connecting the device (3) to the support (2).
17. Method of adaptation according to claim 15 or 16, characterised in that the component-carrying support (2) is provided with a contact arrangement (12) enabling connection with a range of components (V) having different contact arrangements (11').
18. Method of adaptation according to claim 16 or 17, characterised in that the second component has better performance than the first component.
19. Method of adaptation according to claim 16, 17 or 18, characterised in that the second component comprises more than one circuit.
PCT/EP2003/001445 2002-02-18 2003-02-13 Intermediate board WO2003069734A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003208848A AU2003208848A1 (en) 2002-02-18 2003-02-13 Intermediate board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02445025.6 2002-02-18
EP02445025A EP1337007A1 (en) 2002-02-18 2002-02-18 Intermediate board
US36225802P 2002-03-06 2002-03-06
US60/362,258 2002-03-06

Publications (1)

Publication Number Publication Date
WO2003069734A1 true WO2003069734A1 (en) 2003-08-21

Family

ID=27736069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/001445 WO2003069734A1 (en) 2002-02-18 2003-02-13 Intermediate board

Country Status (2)

Country Link
AU (1) AU2003208848A1 (en)
WO (1) WO2003069734A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061191A (en) * 1990-12-21 1991-10-29 Amp Incorporated Canted coil spring interposing connector
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US5583749A (en) * 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
US6290507B1 (en) * 1997-10-30 2001-09-18 Intercon Systems, Inc. Interposer assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US5061191A (en) * 1990-12-21 1991-10-29 Amp Incorporated Canted coil spring interposing connector
US5583749A (en) * 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
US6290507B1 (en) * 1997-10-30 2001-09-18 Intercon Systems, Inc. Interposer assembly

Also Published As

Publication number Publication date
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