WO2003065630A3 - Apparatus and method for preventing digital media piracy - Google Patents

Apparatus and method for preventing digital media piracy Download PDF

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Publication number
WO2003065630A3
WO2003065630A3 PCT/SG2002/000234 SG0200234W WO03065630A3 WO 2003065630 A3 WO2003065630 A3 WO 2003065630A3 SG 0200234 W SG0200234 W SG 0200234W WO 03065630 A3 WO03065630 A3 WO 03065630A3
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WO
WIPO (PCT)
Prior art keywords
end user
setup
content
viewing
present
Prior art date
Application number
PCT/SG2002/000234
Other languages
French (fr)
Other versions
WO2003065630A2 (en
Inventor
Andrej Simec
Kristie Jones
Stephen Hogben
Derek Miller
Original Assignee
Anytime Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anytime Pte Ltd filed Critical Anytime Pte Ltd
Priority to KR10-2004-7011716A priority Critical patent/KR20040077905A/en
Publication of WO2003065630A2 publication Critical patent/WO2003065630A2/en
Publication of WO2003065630A3 publication Critical patent/WO2003065630A3/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/10Protecting distributed programs or content, e.g. vending or licensing of copyrighted material ; Digital rights management [DRM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/14Protection against unauthorised use of memory or access to memory
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    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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Abstract

The present invention is directed to a digital verification and protection ('DVP') system that can be implemented to protect against piracy or unauthorized reproduction of digital content that is delivered from a content provider (35) to an end user of the content (30). Specifically, the preferred embodiments of the present invention detects the configuration or setup (41) of the viewing or downloading equipment of the end user to determine whether the detected configuration or setup, including hardware and/or software setup, may be used by the end user to copy or pirate the digital content to be delivered to the end user. Additionally, the present invention may be used by the content provider to require a specific minimum viewing or downloading equipment setup, such as a minimum processor speed, as precondition to accessing or viewing the digital content being requested by the end user.
PCT/SG2002/000234 2002-01-29 2002-10-09 Apparatus and method for preventing digital media piracy WO2003065630A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR10-2004-7011716A KR20040077905A (en) 2002-01-29 2002-10-09 Apparatus and method for preventing digital media piracy

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35307602P 2002-01-29 2002-01-29
US60/353,076 2002-01-29
US10/210,610 2002-07-31
US10/210,610 US20040010717A1 (en) 2002-01-29 2002-07-31 Apparatus and method for preventing digital media piracy

Publications (2)

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WO2003065630A2 WO2003065630A2 (en) 2003-08-07
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Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7124303B2 (en) * 2001-06-06 2006-10-17 Sony Corporation Elementary stream partial encryption
US7350082B2 (en) * 2001-06-06 2008-03-25 Sony Corporation Upgrading of encryption
US7895616B2 (en) * 2001-06-06 2011-02-22 Sony Corporation Reconstitution of program streams split across multiple packet identifiers
US7823174B2 (en) * 2002-01-02 2010-10-26 Sony Corporation Macro-block based content replacement by PID mapping
US7292691B2 (en) * 2002-01-02 2007-11-06 Sony Corporation Progressive video refresh slice detection
US7292690B2 (en) * 2002-01-02 2007-11-06 Sony Corporation Video scene change detection
US7765567B2 (en) * 2002-01-02 2010-07-27 Sony Corporation Content replacement by PID mapping
US7242773B2 (en) * 2002-09-09 2007-07-10 Sony Corporation Multiple partial encryption using retuning
US7233669B2 (en) * 2002-01-02 2007-06-19 Sony Corporation Selective encryption to enable multiple decryption keys
US7376233B2 (en) * 2002-01-02 2008-05-20 Sony Corporation Video slice and active region based multiple partial encryption
US7215770B2 (en) * 2002-01-02 2007-05-08 Sony Corporation System and method for partially encrypted multimedia stream
US7155012B2 (en) * 2002-01-02 2006-12-26 Sony Corporation Slice mask and moat pattern partial encryption
US7302059B2 (en) * 2002-01-02 2007-11-27 Sony Corporation Star pattern partial encryption
US7530084B2 (en) * 2002-05-28 2009-05-05 Sony Corporation Method and apparatus for synchronizing dynamic graphics
US20090180025A1 (en) * 2002-05-28 2009-07-16 Sony Corporation Method and apparatus for overlaying graphics on video
RS113904A (en) * 2002-06-28 2007-02-05 Idenix (Cayman) Limited 2'-c-methyl-3'-o-l-valine ester ribofuranosyl cytidine for treatment of flaviviridae infections
US8818896B2 (en) * 2002-09-09 2014-08-26 Sony Corporation Selective encryption with coverage encryption
US7409702B2 (en) * 2003-03-20 2008-08-05 Sony Corporation Auxiliary program association table
US7292692B2 (en) * 2003-03-25 2007-11-06 Sony Corporation Content scrambling with minimal impact on legacy devices
US20040267880A1 (en) * 2003-06-30 2004-12-30 Kestutis Patiejunas System and method for delivery of media content
US20050036067A1 (en) * 2003-08-05 2005-02-17 Ryal Kim Annon Variable perspective view of video images
US20050066357A1 (en) * 2003-09-22 2005-03-24 Ryal Kim Annon Modifying content rating
US7418512B2 (en) 2003-10-23 2008-08-26 Microsoft Corporation Securely identifying an executable to a trust-determining entity
US20050097597A1 (en) * 2003-10-31 2005-05-05 Pedlow Leo M.Jr. Hybrid storage of video on demand content
US7343013B2 (en) * 2003-12-16 2008-03-11 Sony Corporation Composite session-based encryption of video on demand content
US20050097596A1 (en) * 2003-10-31 2005-05-05 Pedlow Leo M.Jr. Re-encrypted delivery of video-on-demand content
US7346163B2 (en) * 2003-10-31 2008-03-18 Sony Corporation Dynamic composition of pre-encrypted video on demand content
US7853980B2 (en) 2003-10-31 2010-12-14 Sony Corporation Bi-directional indices for trick mode video-on-demand
US7263187B2 (en) * 2003-10-31 2007-08-28 Sony Corporation Batch mode session-based encryption of video on demand content
US20050102702A1 (en) * 2003-11-12 2005-05-12 Candelore Brant L. Cablecard with content manipulation
US20050169473A1 (en) * 2004-02-03 2005-08-04 Candelore Brant L. Multiple selective encryption with DRM
US20050235357A1 (en) * 2004-04-19 2005-10-20 Securemedia International Preventing cloning of high value software using embedded hardware and software functionality
US20060242406A1 (en) * 2005-04-22 2006-10-26 Microsoft Corporation Protected computing environment
US7584502B2 (en) * 2004-05-03 2009-09-01 Microsoft Corporation Policy engine and methods and systems for protecting data
EP1774424B1 (en) * 2004-07-14 2011-11-02 Qualcomm Incorporated A method and apparatus for delivering keys
US20060041510A1 (en) * 2004-08-19 2006-02-23 Securemedia International Method for a secure system of content distribution for DVD applications
US20060051061A1 (en) * 2004-09-09 2006-03-09 Anandpura Atul M System and method for securely transmitting data to a multimedia device
US10477151B2 (en) 2004-10-18 2019-11-12 Inside Secure Method and apparatus for supporting multiple broadcasters independently using a single conditional access system
EP1813107B1 (en) 2004-10-18 2015-03-18 Syphermedia International, Inc. Method and apparatus for supporting multiple broadcasters independently using a single conditional access system
US8156049B2 (en) * 2004-11-04 2012-04-10 International Business Machines Corporation Universal DRM support for devices
US7895617B2 (en) * 2004-12-15 2011-02-22 Sony Corporation Content substitution editor
US8041190B2 (en) 2004-12-15 2011-10-18 Sony Corporation System and method for the creation, synchronization and delivery of alternate content
US7716243B2 (en) 2005-02-25 2010-05-11 Microsoft Corporation Provisions for validating content using a content registration authority
US9363481B2 (en) * 2005-04-22 2016-06-07 Microsoft Technology Licensing, Llc Protected media pipeline
US9436804B2 (en) * 2005-04-22 2016-09-06 Microsoft Technology Licensing, Llc Establishing a unique session key using a hardware functionality scan
US7770229B2 (en) * 2005-05-11 2010-08-03 Yahoo! Inc. System and method for the propagation of DRM protected content
WO2007000772A1 (en) * 2005-06-28 2007-01-04 Hewlett - Packard Development Company L.P. Access control method and apparatus
US8185921B2 (en) 2006-02-28 2012-05-22 Sony Corporation Parental control of displayed content using closed captioning
US7555464B2 (en) * 2006-03-01 2009-06-30 Sony Corporation Multiple DRM management
US7970138B2 (en) 2006-05-26 2011-06-28 Syphermedia International Method and apparatus for supporting broadcast efficiency and security enhancements
US20080008321A1 (en) * 2006-07-10 2008-01-10 Syphermedia International, Inc. Conditional access enhancements using an always-on satellite backchannel link
US20080080711A1 (en) * 2006-09-28 2008-04-03 Syphermedia International, Inc. Dual conditional access module architecture and method and apparatus for controlling same
US9277259B2 (en) 2006-10-13 2016-03-01 Syphermedia International, Inc. Method and apparatus for providing secure internet protocol media services
US8761393B2 (en) * 2006-10-13 2014-06-24 Syphermedia International, Inc. Method and apparatus for providing secure internet protocol media services
US8204979B2 (en) * 2007-01-31 2012-06-19 Hewlett-Packard Development Company, L.P. Adaptive client/server control protocol
US8300818B2 (en) * 2007-02-27 2012-10-30 Sony Corporation System and method for effectively protecting electronic content information
US20080320596A1 (en) * 2007-06-22 2008-12-25 Feng Chi Wang Distributed digital rights management system and methods for use therewith
KR101456489B1 (en) * 2007-07-23 2014-10-31 삼성전자주식회사 Method and apparatus for managing access privileges in a CLDC OSGi environment
US8515123B2 (en) * 2008-07-03 2013-08-20 Verimatrix, Inc. Efficient watermarking approaches of compressed media
KR101041279B1 (en) * 2008-11-10 2011-06-14 에스케이 텔레콤주식회사 System and Method for preventing illegal download of contents
US9275203B1 (en) 2014-02-03 2016-03-01 Purdue Research Foundation Methods, systems, and computer readable media for preventing software piracy and protecting digital documents using same
WO2018208997A1 (en) 2017-05-09 2018-11-15 Verimatrix, Inc. Systems and methods of preparing multiple video streams for assembly with digital watermarking

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6064739A (en) * 1996-09-30 2000-05-16 Intel Corporation System and method for copy-protecting distributed video content
US6202153B1 (en) * 1996-11-22 2001-03-13 Voltaire Advanced Data Security Ltd. Security switching device
US20010052077A1 (en) * 1999-01-26 2001-12-13 Infolio, Inc. Universal mobile ID system and method for digital rights management

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930473A (en) * 1993-06-24 1999-07-27 Teng; Peter Video application server for mediating live video services
US6202253B1 (en) * 1998-10-29 2001-03-20 Universal Friendly Technologies Llc Storm door cylinder lock
US7150045B2 (en) * 2000-12-14 2006-12-12 Widevine Technologies, Inc. Method and apparatus for protection of electronic media
US6865555B2 (en) * 2001-11-21 2005-03-08 Digeo, Inc. System and method for providing conditional access to digital content

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6064739A (en) * 1996-09-30 2000-05-16 Intel Corporation System and method for copy-protecting distributed video content
US6202153B1 (en) * 1996-11-22 2001-03-13 Voltaire Advanced Data Security Ltd. Security switching device
US20010052077A1 (en) * 1999-01-26 2001-12-13 Infolio, Inc. Universal mobile ID system and method for digital rights management

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