WO2003063140A1 - Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga) - Google Patents
Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga) Download PDFInfo
- Publication number
- WO2003063140A1 WO2003063140A1 PCT/CN2002/000042 CN0200042W WO03063140A1 WO 2003063140 A1 WO2003063140 A1 WO 2003063140A1 CN 0200042 W CN0200042 W CN 0200042W WO 03063140 A1 WO03063140 A1 WO 03063140A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- head
- adhesive
- suspension
- hga
- acp
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000002265 prevention Effects 0.000 title abstract description 5
- 239000000725 suspension Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 230000004888 barrier function Effects 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 7
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000007669 thermal treatment Methods 0.000 claims 4
- 238000013036 cure process Methods 0.000 claims 2
- 238000005728 strengthening Methods 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
Definitions
- the present invention relates to magnetic hard disk drives. More specifically, the present invention relates to a system and method for securement of a hard drive magnetic head to a head-gimbal assembly (HGA) to prevent electrostatic discharge (ESD) by the magnetic head.
- HGA head-gimbal assembly
- ESD electrostatic discharge
- FIG. 1 provides an illustration of a typical drive arm configuration as used in the art.
- a magnetic head 108 is utilized to read from and write to a magnetic hard disk.106.
- Voice-coil motors (VCM) 102 are used for controlling a hard drive's arm 104 motion across the magnetic hard disk 106.
- FIG 2 provides an illustration of a head gimbal assembly (HGA) 204 and slider 202 as used in the art.
- a slider 202 (containing a read/write magnetic head; not shown) is utilized for mamtaining a prescribed flying height above the disk surface 106 (See Figure 1).
- ESD electrostatic discharge
- MR magnetoresistive
- Electrically-conductive adhesives are used in the art to bond head to suspension, allowing static charge to be discharged from the head 202 to the suspension (HGA) 204.
- electrostatic current traveling from head to suspension through electrically-conductive adhesive may experience a resistance of greater than 1000 ohms at a one-volt potential, which is too large to meet giant magnetoresistive (GMR) heads' requirements for ESD prevention.
- GMR giant magnetoresistive
- Figure 3a-b illustrates a system for securing a head 302 to a suspension 304
- conductive isotropic adhesives 307 such as silver paste, contain conductive particles 311 (e.g., silver), which provide a pathway for electrostatic discharge from the head 302 to ground (suspension 304 / HGA).
- electrostatic (electrical) resistance is large for current passing through a typical isotropic adhesive 316 from head 312 to suspension 314 due to the distribution of conductive particles 320,322 within the head 312 and the isotropic adhesive 316.
- the head/slider 312 is typically made of A1 2 0 3 319 and TiC 320 (together known as ALTIC).
- TiC 320 is electrically conductive, but A1 2 0 3 319 is not.
- Silver epoxy, a typical isotropic conductive adhesive 316, is made of a binder resin 321 and silver powder 322.
- Silver powder 322 is electrically conductive, but binder resin is not. The internal distribution of these electrically conductive subparticles 320,322 causes the resistance problem.
- each TiC particle 320 terminating at the head 302/adhesive 306 interface has a low probability of being in physical contact with a particle of silver powder in the adhesive 306. Further, between each particle of silver 322 there is a this film of binder resin 321, which inhibits electrical current flow. Because of the small size of the silver particles 322, it can take several particles 322 to form an electrostatic discharge path, and thus, for each path there are several points in which the current must cross (highly resistive) binder resin 321, increasing the overall resistance across the isotropic adhesive.
- Figure 1 provides an illustration of a typical drive arm configuration as used, in the art.
- FIG. 2 provides an illustration of a head gimbal assembly (HGA) and slider as used in the art.
- HGA head gimbal assembly
- Figure 3a-b illustrates a system for securing a head to a suspension with an electrically conductive isotropic adhesive as is used in the art.
- Figure 4a-b provides an illustration describing the attachment of a magnetic head to a suspension with electrically conductive anisotropic conductive paste (ACP) under principles of the present invention.
- ACP electrically conductive anisotropic conductive paste
- Figure 5a-b illustrates ACP attachment of magnetic head to suspension with and without a suspension barrier under principles of the present invention.
- Figure 6a-b illustrates the 'dual cure' process for ACP under principles of the present invention.
- Figure 4a-b provides an illustration describing the attachment of a magnetic head 402 to a suspension (HGA) 404 with electrically conductive anisotropic conductive paste (ACP) 401 under principles of the present invention.
- a magnetic head 402 is secured to the suspension 404 by Ultraviolet ACP (ACP) 401.
- ACP Ultraviolet ACP
- a suspension barrier 409 is utilized to maintain proper directional orientation while the ACP is curing. The barrier 409 prevents the head 402 from tilting, etc. in relation to the suspension 404 while the adhesive 410 is still soft.
- the conductive particles 405 are made of a polymer coated in gold. In an alternative embodiment, the particles 405 are made of a metal, such as nickel, etc., coated in gold. In one embodiment, the adhesive material in which the particles are suspended is Acrylate. In an alternative embodiment, the adhesive material is epoxy resin. The conductive particles 405 are large enough for each particle 405 to touch the head 402 and the suspension 404 simultaneously. Thus, the particles 405 must be at least as large in diameter as the depth of the tongue barrier 409. (See figure 4a). Because each conductive path through the ACP 406 is just through a single particle 405, resistance is greatly reduced.
- Figure 5a-b illustrates ACP attachment of magnetic head 502 to suspension 504 with and without a suspension barrier 504 under principles of the present invention.
- ACP 501 with large conductive particles 503 is utilized with a suspension barrier 509.
- the conductive particles 503 are larger than the suspension barrier 509 in depth (to enable particle 503 contact with head 502 and suspension 504 simultaneously).
- a suspension barrier 509 is not utilized. Because a suspension barrier is 15 to 25 micrometers (urn) in depth, without a suspension barrier, the conductive particles 513 can be smaller than this when a barrier is not utilized (reduced bondline gap).
- Figure 6a-b illustrates the 'dual cure' process for ACP 608 under principles of the present invention.
- ultraviolet (UV) light 609 is directed upon the ACP 608 to cure the exposed surface of the ACP material 608. This is done to provide a preliminary cure, affixing the head 602 to the suspension 604, to maintain directional orientation of the head 602.
- a (non-conductive) UV adhesive (not shown), such as UV acrylate or UV epoxy, is utilized additionally for pre-tacking (to shorten the fixture time).
- a thermal cure via a heater 611).
- the ACP is fully cured, bringing its bond to full strength.
Abstract
A system and method for the prevention of electrostatic discharge (ESD) by a hard drive magnetic head is disclosed. The magnetic head is secured to a head-gimbal assembly (HGA) by anisotropic conductive paste (ACP) to provide an improved electrostatic discharge path.
Description
METHOD AND APPARATUS FOR THE PREVENTION OF ELECTROSTATIC DISCHARGE (ESD)
BY A HARD DRIVE MAGNETIC HEAD INVOLVING THE UTILIZATION OF ANISOTROPIC
CONDUCTIVE PASTE (ACP) IN THE SECUREMENT TO A HEAD-GΓMBAL ASSEMBLY (HGA)
Field of The Invention
The present invention relates to magnetic hard disk drives. More specifically, the present invention relates to a system and method for securement of a hard drive magnetic head to a head-gimbal assembly (HGA) to prevent electrostatic discharge (ESD) by the magnetic head. Background Information
Figure 1 provides an illustration of a typical drive arm configuration as used in the art. A magnetic head 108 is utilized to read from and write to a magnetic hard disk.106. Voice-coil motors (VCM) 102 are used for controlling a hard drive's arm 104 motion across the magnetic hard disk 106.
Figure 2 provides an illustration of a head gimbal assembly (HGA) 204 and slider 202 as used in the art. Typically, a slider 202 (containing a read/write magnetic head; not shown) is utilized for mamtaining a prescribed flying height above the disk surface 106 (See Figure 1). During flight over the disk, electrostatic charge accumulates on a head's surface. If the charge is not removed, an electrostatic discharge (ESD) may occur, damaging the magnetoresistive (MR) element. Electrically-conductive adhesives are used in the art to bond head to suspension, allowing static charge to be discharged from the head 202 to the suspension (HGA) 204. As the size of slider/head elements reduces to provide for increasing areal density, the energy necessary, to cause damage by an ESD reduces, causing the likelihood for ESD to increase and rendering current methods of ESD prevention obsolete. For example, electrostatic current traveling from head to suspension through electrically-conductive adhesive may experience a resistance of greater than 1000
ohms at a one-volt potential, which is too large to meet giant magnetoresistive (GMR) heads' requirements for ESD prevention.
Figure 3a-b illustrates a system for securing a head 302 to a suspension 304
(HGA) with an electrically conductive isotropic adhesive 307 as is used in the art. As seen in figure 3 a, conductive isotropic adhesives 307, such as silver paste, contain conductive particles 311 (e.g., silver), which provide a pathway for electrostatic discharge from the head 302 to ground (suspension 304 / HGA).
As shown in Figure 3b, electrostatic (electrical) resistance is large for current passing through a typical isotropic adhesive 316 from head 312 to suspension 314 due to the distribution of conductive particles 320,322 within the head 312 and the isotropic adhesive 316. The head/slider 312 is typically made of A1203 319 and TiC 320 (together known as ALTIC). TiC 320 is electrically conductive, but A1203 319 is not. Silver epoxy, a typical isotropic conductive adhesive 316, is made of a binder resin 321 and silver powder 322. Silver powder 322 is electrically conductive, but binder resin is not. The internal distribution of these electrically conductive subparticles 320,322 causes the resistance problem. Although many TiC 320 particles may line up to provide an electrically conductive path toward the suspension 304, each TiC particle 320 terminating at the head 302/adhesive 306 interface has a low probability of being in physical contact with a particle of silver powder in the adhesive 306. Further, between each particle of silver 322 there is a this film of binder resin 321, which inhibits electrical current flow. Because of the small size of the silver particles 322, it can take several particles 322 to form an electrostatic discharge path, and thus, for each path there are several points in which the current must cross (highly resistive) binder resin 321, increasing the overall resistance across the isotropic adhesive.
It is therefore desirable to decrease head-to-suspension adhesive resistance to prevent electrostatic discharge (ESD) by the magnetic head as well as providing additional benefits.
Brief Description Of The Drawings
Figure 1 provides an illustration of a typical drive arm configuration as used, in the art.
Figure 2 provides an illustration of a head gimbal assembly (HGA) and slider as used in the art.
Figure 3a-b illustrates a system for securing a head to a suspension with an electrically conductive isotropic adhesive as is used in the art.
Figure 4a-b provides an illustration describing the attachment of a magnetic head to a suspension with electrically conductive anisotropic conductive paste (ACP) under principles of the present invention.
Figure 5a-b illustrates ACP attachment of magnetic head to suspension with and without a suspension barrier under principles of the present invention.
Figure 6a-b illustrates the 'dual cure' process for ACP under principles of the present invention.
Detailed Description
Figure 4a-b provides an illustration describing the attachment of a magnetic head 402 to a suspension (HGA) 404 with electrically conductive anisotropic conductive paste (ACP) 401 under principles of the present invention. As is shown in figure 4a, in one embodiment a magnetic head 402 is secured to the suspension 404 by Ultraviolet ACP (ACP) 401. In an embodiment, a suspension barrier 409 is utilized to maintain proper directional orientation while the ACP is curing. The barrier 409 prevents the head 402 from tilting, etc. in relation to the suspension 404 while the adhesive 410 is still soft. As is shown in figure 4b, in an embodiment the conductive particles 405 of the
ACP 406 are much larger than the silver particles. In one embodiment, the conductive particles 405 are made of a polymer coated in gold. In an alternative embodiment, the particles 405 are made of a metal, such as nickel, etc., coated in gold. In one embodiment, the adhesive material in which the particles are suspended is Acrylate. In an alternative embodiment, the adhesive material is epoxy resin. The conductive particles 405 are large enough for each particle 405 to touch the head 402 and the suspension 404 simultaneously. Thus, the particles 405 must be at least as large in diameter as the depth of the tongue barrier 409. (See figure 4a). Because each conductive path through the ACP 406 is just through a single particle 405, resistance is greatly reduced.
Figure 5a-b illustrates ACP attachment of magnetic head 502 to suspension 504 with and without a suspension barrier 504 under principles of the present invention. In an embodiment, ACP 501 with large conductive particles 503 is utilized with a suspension barrier 509. As stated, in an embodiment the conductive particles 503 are larger than the suspension barrier 509 in depth (to enable particle 503 contact with head 502 and suspension 504 simultaneously).
As seen in figure 5b, in an alternative embodiment a suspension barrier 509 is not utilized. Because a suspension barrier is 15 to 25 micrometers (urn) in depth, without a suspension barrier, the conductive particles 513 can be smaller than this when a barrier is not utilized (reduced bondline gap).
Figure 6a-b illustrates the 'dual cure' process for ACP 608 under principles of the present invention. As seen in figure 6a, in one embodiment, ultraviolet (UV) light 609 is directed upon the ACP 608 to cure the exposed surface of the ACP material 608. This is done to provide a preliminary cure, affixing the head 602 to the suspension 604, to maintain directional orientation of the head 602. In an alternate embodiment, a (non-conductive) UV adhesive (not shown), such as UV acrylate or UV epoxy, is utilized additionally for pre-tacking (to shorten the fixture time). As seen in figure 6b, in an embodiment the UV process is followed by a thermal cure (via a heater 611). In this, the ACP is fully cured, bringing its bond to full strength. Although several embodiments are specifically illustrated and described herein, it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention.
Claims
1. A head system, comprising: a head element coupled to a suspension element by an electrically conductive adhesive to prevent damage by electrostatic discharge (ESD) with said head element, wherein said adhesive is an anisotropic conductive paste (ACP).
2. The system of claim 1, wherein said head element is a hard drive magnetic head.
3 . The system of claim 1, wherein said suspension element is a head-gimbal assembly (HGA).
4. The system of claim 3, wherein said suspension element is an HGA suspension tongue.
5. The system of claim 1, wherein said adhesive is a dual cure paste adhesive.
6. The system of claim 5, wherein a process for curing said adhesive includes ultraviolet (UV) treatment and thermal treatment.
7. The system of claim 6, wherein said UV treatment partially cures said adhesive to affix the head element to the suspension element in a proper location and with a proper directional orientation.
8. The system of claim 7, wherein said thermal treatment completes the adhesive cure process by strengthening said adhesive.
9. The system of claim 8, further comprising a barrier interposed between said head element and said suspension element.
10. The system of claim 9, wherein said barrier aids in sustaining said proper directional orientation of the head element with respect to the suspension element during the adhesive curing process.
11. A method for head attachment, comprising: coupling a head element to a suspension element by an anisotropic conductive paste (ACP) to prevent damage by electrostatic discharge (ESD) with a head element.
12. The method of claim 11, wherein said head element is a hard drive magnetic head.
13 . The method of claim 12, wherein said suspension element is a head-gimbal assembly (HGA).
14. The method of claim 13, wherein said suspension element is an HGA suspension tongue.
15. The method of claim 11, wherein said adhesive is a dual cure paste adhesive.
16. The method of claim 15, wherein a process for curing said adhesive includes ultraviolet (UV) treatment and thermal treatment.
17. The method of claim 16, wherein said UV treatment cures an exposed area of said adhesive to affix the head element to the suspension element in a proper location and with a proper directional orientation.
18. The method of claim 17, wherein said thermal treatment completes the adhesive cure process by strengthening said adhesive.
19. The method of claim 18, further comprising interposing a barrier between said head element and said suspension element.
20. The method of claim 19, wherein said barrier aids in sustaining said proper directional orientation of the head element with respect to the suspension element during the adhesive curing process.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02807218.9A CN1241174C (en) | 2002-01-26 | 2002-01-26 | Method and apparatus for preventing electrostatic discharge by stabilizing hard disk drive magnetic head containing anisotropic conducting paste to magnetic head-gimbal assembly |
| PCT/CN2002/000042 WO2003063140A1 (en) | 2002-01-26 | 2002-01-26 | Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga) |
| US10/206,248 US8159790B2 (en) | 2002-01-26 | 2002-07-26 | Method and apparatus for the prevention of electrostatic discharge (ESD) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (ACP) in the securement to a head-gimbal assembly (HGA) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2002/000042 WO2003063140A1 (en) | 2002-01-26 | 2002-01-26 | Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003063140A1 true WO2003063140A1 (en) | 2003-07-31 |
Family
ID=27587801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2002/000042 WO2003063140A1 (en) | 2002-01-26 | 2002-01-26 | Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga) |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8159790B2 (en) |
| CN (1) | CN1241174C (en) |
| WO (1) | WO2003063140A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351345A (en) * | 2000-06-12 | 2001-12-21 | Alps Electric Co Ltd | Magnetic head device, and magnetic recording and/or reproducing device with the same loaded thereon |
| US6942824B1 (en) | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| CN100375152C (en) * | 2002-10-15 | 2008-03-12 | 新科实业有限公司 | Conducting adhesive for magnetic head assembly |
| JP2008103008A (en) * | 2006-10-18 | 2008-05-01 | Fujitsu Ltd | Method for manufacturing head assembly |
| JP2010146628A (en) * | 2008-12-18 | 2010-07-01 | Hitachi Global Storage Technologies Netherlands Bv | Method and apparatus for manufacturing head-gimbal assembly |
| US8797693B1 (en) | 2013-08-26 | 2014-08-05 | HGST Netherlands B.V. | Implementing enhanced ESD prevention for hard disk drives using spin-torque oscillator (STO) |
| US9508371B2 (en) * | 2014-05-06 | 2016-11-29 | Seagate Technology Llc | Slider and/or hard disc including coating, and optionally one or more additives that can dissipate electrical charge |
| US9449623B2 (en) | 2014-06-03 | 2016-09-20 | HGST Netherlands B.V. | Reducing ion migration in a hard disk drive microactuator flexure assembly |
| US11224131B2 (en) * | 2018-04-04 | 2022-01-11 | Lenovo (Singapore) Pte. Ltd. | Systems and methods for surface mounting cable connections |
| US10720179B1 (en) * | 2019-04-03 | 2020-07-21 | Western Digital Technologies, Inc. | Hard disk drive head assembly with tilt-preventing standoff formed on flexure cover beneath slider |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5654850A (en) * | 1993-05-18 | 1997-08-05 | Applied Magnetics Corp. | Carbon overcoat with electrically conductive adhesive layer for magnetic head sliders |
| US6034851A (en) * | 1998-04-07 | 2000-03-07 | Read-Rite Corporation | Shorting bar and test clip for protecting magnetic heads from damage caused by electrostatic discharge during manufacture |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5903413A (en) * | 1995-06-01 | 1999-05-11 | International Business Machines Corporation | Fan and fold head lead termination structure using flex cable with edge termination pads |
| JP3296187B2 (en) * | 1996-04-15 | 2002-06-24 | ティーディーケイ株式会社 | Magnetic head slider support mechanism and head gimbal assembly using the support mechanism |
| US5877919A (en) * | 1996-06-07 | 1999-03-02 | Western Digital Corporation | Method and apparatus for a low-profile head-suspension attachment for a disk drive |
| US5734523A (en) * | 1996-07-24 | 1998-03-31 | Pemstar, Inc. | Conductive film connectors for use on head assemblies in drives |
| US6245175B1 (en) * | 1996-08-08 | 2001-06-12 | Nitto Denko Corporation | Anisotropic conductive film and production method thereof |
| US5959806A (en) * | 1997-06-12 | 1999-09-28 | Read-Rite Corporation | Adaptive loading/unloading suspension |
| US20010048573A1 (en) * | 1997-12-17 | 2001-12-06 | Tdk Corporation | Magnetic head device and method of manufacturing same |
| US6282063B1 (en) * | 1998-06-09 | 2001-08-28 | Magnecomp Corp. | Flexure-slider bonding system |
| US6125014A (en) * | 1998-06-26 | 2000-09-26 | Read-Rite Corporation | Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider |
| US6154343A (en) * | 1998-12-18 | 2000-11-28 | Magnecomp Corp. | Suspension manufacturing method and product |
| US6278585B1 (en) * | 1999-04-19 | 2001-08-21 | International Business Machines Corporation | Transducer suspension termination system |
| JP2001143409A (en) * | 1999-11-17 | 2001-05-25 | Tdk Corp | Magnetic head assembly and manufacturing method therefor, and wiring method for magnetic head assembly |
| US20020020491A1 (en) * | 2000-04-04 | 2002-02-21 | Price David M. | High speed flip chip assembly process |
| US20020140096A1 (en) * | 2001-03-30 | 2002-10-03 | Siemens Dematic Electronics Assembly Systems, Inc. | Method and structure for ex-situ polymer stud grid array contact formation |
| US7115986B2 (en) * | 2001-05-02 | 2006-10-03 | Micron Technology, Inc. | Flexible ball grid array chip scale packages |
| JP4710205B2 (en) * | 2001-09-06 | 2011-06-29 | ソニー株式会社 | Flip chip mounting method |
| US7258819B2 (en) * | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
-
2002
- 2002-01-26 WO PCT/CN2002/000042 patent/WO2003063140A1/en active Application Filing
- 2002-01-26 CN CN02807218.9A patent/CN1241174C/en not_active Expired - Lifetime
- 2002-07-26 US US10/206,248 patent/US8159790B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5654850A (en) * | 1993-05-18 | 1997-08-05 | Applied Magnetics Corp. | Carbon overcoat with electrically conductive adhesive layer for magnetic head sliders |
| US6034851A (en) * | 1998-04-07 | 2000-03-07 | Read-Rite Corporation | Shorting bar and test clip for protecting magnetic heads from damage caused by electrostatic discharge during manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1524262A (en) | 2004-08-25 |
| US8159790B2 (en) | 2012-04-17 |
| US20030142444A1 (en) | 2003-07-31 |
| CN1241174C (en) | 2006-02-08 |
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