WO2003060447A8 - Temperature measurement and heat-treating methods and systems - Google Patents

Temperature measurement and heat-treating methods and systems

Info

Publication number
WO2003060447A8
WO2003060447A8 PCT/CA2002/001987 CA0201987W WO03060447A8 WO 2003060447 A8 WO2003060447 A8 WO 2003060447A8 CA 0201987 W CA0201987 W CA 0201987W WO 03060447 A8 WO03060447 A8 WO 03060447A8
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
device side
previous
response
identified
Prior art date
Application number
PCT/CA2002/001987
Other languages
French (fr)
Other versions
WO2003060447A1 (en
Inventor
David Malcolm Camm
Shawna Kervin
Marcel Edmond Lefrancois
Greg Stuart
Original Assignee
Vortek Ind Ltd
David Malcolm Camm
Shawna Kervin
Marcel Edmond Lefrancois
Greg Stuart
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vortek Ind Ltd, David Malcolm Camm, Shawna Kervin, Marcel Edmond Lefrancois, Greg Stuart filed Critical Vortek Ind Ltd
Priority to DE10297622.8T priority Critical patent/DE10297622B4/en
Priority to US10/497,447 priority patent/US7445382B2/en
Priority to JP2003560494A priority patent/JP2005515425A/en
Priority to AU2002350358A priority patent/AU2002350358A1/en
Priority to KR1020047010182A priority patent/KR101067901B1/en
Publication of WO2003060447A1 publication Critical patent/WO2003060447A1/en
Publication of WO2003060447A8 publication Critical patent/WO2003060447A8/en
Priority to US11/302,600 priority patent/US7616872B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Abstract

Temperature measurement and heat-treating methods and systems. One method includes measuring a present intensity of radiation thermally emitted from a first surface of a workpiece, and identifying a present temperature of the first surface in response to the present intensity and at least one previous thermal property of the first surface. Preferably, the workpiece includes a semiconductor wafer, and the first and second surfaces respectively include device and substrate sides thereof. The present temperature of the device side is preferably identified while the device side is being irradiated, e.g. by an irradiance flash having a duration less than a thermal conduction time of the wafer. The device side temperature may be identified in response to a previous device side temperature, which may be identified in response to a previous temperature of the substrate side unequal to the previous device side temperature, and a temperature history of the wafer.
PCT/CA2002/001987 2001-12-26 2002-12-23 Temperature measurement and heat-treating methods and systems WO2003060447A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE10297622.8T DE10297622B4 (en) 2001-12-26 2002-12-23 Temperature measurement and methods and systems for heat treatment
US10/497,447 US7445382B2 (en) 2001-12-26 2002-12-23 Temperature measurement and heat-treating methods and system
JP2003560494A JP2005515425A (en) 2001-12-26 2002-12-23 Temperature measurement and heat treatment method and system
AU2002350358A AU2002350358A1 (en) 2001-12-26 2002-12-23 Temperature measurement and heat-treating methods and systems
KR1020047010182A KR101067901B1 (en) 2001-12-26 2002-12-23 Temperature measurement and heat-treating methods and systems
US11/302,600 US7616872B2 (en) 2001-12-26 2005-12-14 Temperature measurement and heat-treating methods and systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34211501P 2001-12-26 2001-12-26
US60/342,115 2001-12-26

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10497447 A-371-Of-International 2002-12-23
US11/302,600 Continuation US7616872B2 (en) 2001-12-26 2005-12-14 Temperature measurement and heat-treating methods and systems

Publications (2)

Publication Number Publication Date
WO2003060447A1 WO2003060447A1 (en) 2003-07-24
WO2003060447A8 true WO2003060447A8 (en) 2003-12-04

Family

ID=23340390

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2002/001987 WO2003060447A1 (en) 2001-12-26 2002-12-23 Temperature measurement and heat-treating methods and systems

Country Status (7)

Country Link
US (2) US7445382B2 (en)
JP (3) JP2005515425A (en)
KR (2) KR101067902B1 (en)
CN (2) CN101324470B (en)
AU (1) AU2002350358A1 (en)
DE (1) DE10297622B4 (en)
WO (1) WO2003060447A1 (en)

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