WO2003054630A2 - Device and method for modifying the surface of a workpiece using photonic radiation - Google Patents
Device and method for modifying the surface of a workpiece using photonic radiation Download PDFInfo
- Publication number
- WO2003054630A2 WO2003054630A2 PCT/AT2002/000354 AT0200354W WO03054630A2 WO 2003054630 A2 WO2003054630 A2 WO 2003054630A2 AT 0200354 W AT0200354 W AT 0200354W WO 03054630 A2 WO03054630 A2 WO 03054630A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lens elements
- individual lens
- radiation
- carrier
- individual
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
Definitions
- the invention relates to a device for modifying a workpiece surface with the aid of photon radiation, in particular laser radiation, with a radiation source and a mask device for the radiation.
- the invention relates to a method for modifying a workpiece surface with the aid of photon radiation, in particular laser radiation, which is directed onto the workpiece surface via a mask device.
- micro- or nanostructuring The processing of materials in the um range and nm range, often called “micro- or nanostructuring", is becoming increasingly important in technology, with so-called optical lithography in particular becoming an interesting area of application in the course of miniaturization in microelectronics is.
- laser beam technology is also being used more and more frequently here, since it is less expensive in terms of apparatus and money to implement than electron and ion beam techniques.
- Laser beam technology also offers further advantages, such as, in particular, the type of structuring of the workpiece surface, based on the properties of the laser radiation itself.
- a lens array with a plurality of individual lens elements is used as the lens system, this lens system, however, being separate from the actual mask structure.
- this lens system to process the respective workpiece surface directly, but rather to produce a mask for a standard multi-step process for structuring, which is only to be carried out afterwards, with low-intensity radiation being used for the exposure of the photoresist layer in the mask production ⁇ etching steps and rinsing steps necessary to obtain the mask required for the final workpiece modification.
- the masks produced in this way in a complex manner are also irreversible in nature.
- Certain periodic structures can be generated using photon beams, in particular laser beams, using interference effects.
- this requires a high level of technological effort, and these interference techniques can only be used to a limited extent.
- the degree of miniaturization is limited by the wavelength of the radiation used.
- the device according to the invention of the type mentioned at the outset is accordingly characterized in that the mask device is formed by individual lens elements which are attached to a carrier which is permeable to the radiation, preferably on its side facing the workpiece, the radiation being able to be bundled into partial beams by the individual lens elements ,
- the method according to the invention of the type mentioned at the outset is characterized in that the radiation is divided into partial beams with the aid of individual lens elements provided as a mask device and attached to the radiation-permeable carrier, which are bundled into individual focal points.
- a special mask device which can also be referred to as a lens device, and in which small bodies are applied as lens elements in a certain, orderly manner on a carrier which is transparent to the radiation, in particular with regard to the short focal distances - on the side of the carrier that faces the workpiece during operation.
- Each body forms a single lens element through which the respective part of the radiation impinging on the carrier is bundled into a partial beam with a single focal point.
- the invention is based on an effect that has been shown in studies on laser-assisted cleaning of workpiece surfaces, in which contamination on the surface of a workpiece was simulated by small beads, for example with a diameter of less than 100 nm
- the smaller the beads the more problematic the removal of the beads from the surface, and that these beads, when they are made of an optically transparent material, bundle the incident radiation in a comparable way to lens elements.
- the invention now uses this effect in a positive manner in that the focusing effect of the spheres or, in general, individual lens elements are used specifically for surface treatment.
- the individual lens elements are attached to the carrier in an array in accordance with the desired processing pattern.
- the carrier is preferably an optically plane-parallel plate which is transparent to photon radiation, for example made of normal glass, quartz glass, etc.
- the individual lens elements are preferably in a single layer, ie in a monolayer , applied.
- the individual lens elements are in particular small spheres, ellipsoids, that is to say quasi flattened spheres, small cylinders or the like, and they consist, for example, of normal glass, quartz glass or another material which is transparent to the photons, such as Si, CaF 2 , organic polymers, for example polystyrene, or also from organic materials or conglomerates such as bacteria or viruses etc.
- the entire arrangement is thus highly transparent.
- the arrangement acts like a combination of a large number of. more or less closely adjacent focusing lenses.
- the incident radiation passes through the carrier and is focused by the individual lens elements, the particular focus being somewhat outside the individual lens element, for example at a distance of approximately 20% of the radius in the case of spherical individual lens elements.
- the surface to be processed can be brought into direct contact with the single lens element matrix, which makes it particularly easy to implement . leads.
- the "mask device” only needs to be placed on the workpiece and irradiated from above. Of course, high-purity working conditions and surfaces are desirable.
- the spherical or ellipsoidal individual lens elements can be in a maximally dense packing, corresponding to a pattern in which the centers of adjacent, contacting individual lens elements form the corner points of equilateral triangles.
- the dimensions of the individual lens elements are in the order of magnitude of 100 nm or less up to a few ⁇ m, and the processing points on the substrate have dimensions in the nm to ⁇ m range.
- the individual lens elements normally adhere sufficiently to the support through natural adhesion.
- the liability of the individual lens elements can be increased by external forces, such as in particular by applying an electrical voltage between the carrier and the workpiece.
- the distance between the carrier and the individual lens elements from the workpiece or substrate can be fixed, wherein one or more spacers can be applied to the carrier.
- local material deposits can be provided as spacers by vapor deposition, in particular by vapor deposition of a thin local metal layer, or by attaching a thin film (plastic, metal).
- a three-point spacer with measurement and adjustability, based on piezoelectric transducer elements, is ideal for variable or adjustable adjustment of the distance, especially in the case of critical materials to be processed, such as plastic films.
- the present technique can also be of great advantage for surface modification by so-called laser-induced Forward transfer (LIFT - Laser Induced Forward Transfer) can be used.
- LIFT laser-induced Forward transfer
- This LIFT technique has already been described for an arrangement with a single lens, see Z. Kantor et al., "Deposition of micrometer-sized tungsten patterns by laser transferred technique" Appl. Phys. Lett. 64 (25), June 20, 1994, pages 3506-3508.
- the combination with the present multiple lens arrangement enables a very simple and highly localized multiple metallization of surfaces, which can be carried out in a normal laboratory atmosphere (without the use of chemicals and gases).
- a thin layer of material in particular an ultra-thin metal foil, is applied between the substrate to be processed and the carrier with the individual lens elements, it being possible for the foil to be applied to the substrate by means of magnetic or electrostatic force, depending on the metal used; the carrier with the individual lens elements can then be placed thereon, possibly with spacing using the spacers mentioned.
- the distance is chosen so that the individual lens elements focus the radiation in focal points within the thin metal foil or material layer in general.
- the smallest metal parts are transferred locally in the direction of the substrate, where they adhere.
- the film can simply be stripped off the substrate (workpiece).
- a laser radiation that is homogeneous over its cross section is also required if it strikes the individual lens elements on the outside of the carrier. Accordingly, it is advantageous if the radiation is homogenized in a manner known per se with the aid of a homogenizer, so that the radiation has an essentially constant intensity over the entire cross-section of the radiation beam.
- the workpiece When machining or generally modifying the workpiece surface, the workpiece can be moved relative to the carrier with the individual lens elements in the xy directions of its surface in a conventional manner in order to enable multiple lithography processing. Furthermore, depending on the processing to be carried out, it is also conceivable if some of the Individual lens elements can be hidden by shading with a mask provided in front of the wearer.
- FIG. 1 schematically shows a preferred device for carrying out nanostructuring machining of a workpiece surface with the aid of laser radiation
- FIG. 2 shows a schematic plan view of a lens array with spherical or ellipsoidal individual lens elements which are circular in plan view, as used in the arrangement from FIG. 1;
- FIG. 3 shows schematically in a view or sectional view the mode of operation of various individual lens elements with regard to the focusing of individual or partial beams caused by them, part of the substrate with local ablation being shown in section in FIG. 3a, and FIG. 3b contains a schematic representation showing the local ablation of the substrate in a top view of FIG. 3a;
- FIG. 4 shows an arrangement of a transparent plane-parallel plate with individual lens elements at a distance from a substrate, in an arrangement within a chamber which contains a predetermined gas atmosphere and which has an entry window for the laser radiation;
- FIG. 5 schematically shows a part of a device (without radiation source) for illustrating a so-called laser-induced material forward transfer
- FIG. 6 shows a view of the substrate with metallic deposits attached to it with the aid of a device according to FIG. 5, with a partially pulled-off metal foil;
- FIG. 7 is a top view of a portion of a substrate at approximately 5000X, illustrating local ablations on the substrate surface
- FIG. 8 shows an electron microscope image of a substrate surface in a magnification of approximately 23,000 times, to illustrate a deposited aluminum double structure.
- FIG. 1 illustrates a device for modifying the surface of a substrate or workpiece 1 with the aid of laser radiation (generally photon radiation) 2 from a radiation source 3, such as an excimer laser.
- the radiation emitted by the radiation source 3 can have an inhomogeneous intensity over its cross section (diameter D), as shown in a detailed drawing at 4 in FIG. 1, and in order to achieve a homogeneous radiation intensity for processing the surface of the substrate 1 a homogenizer 5 is provided which forms a component which is known per se and which, via reflections on its inner wall, leads to a homogeneous intensity distribution in the radiation beam 2, as shown in FIG. 1 in detail drawing 6 for the diameter D '.
- the diameter D ' can be equal to the radiation beam diameter D.
- the homogenized radiation strikes a single lens element carrier 7 in the form of a plane-parallel plate 8 made of glass, in particular quartz glass, which is transparent to the radiation.
- This plate 8 is provided on its side facing the substrate 1 with a plurality of individual lens elements 9 which adhere to the plate 8 by natural adhesion in an arrangement adapted to the respective processing of the surface 1 'of the substrate 1.
- a maximally dense arrangement of spherical or, in plan view, circular, ellipsoidal individual lens elements 9 is used, as can be seen from FIG. 2.
- These individual lens elements 9 lead to bundles.
- spacers 12 are provided on the carrier 7, by means of which the carrier 7, that is to say the plate 8, is supported on the substrate surface 1 ′.
- Such a precisely defined distance is advantageous if ultra-high miniaturization is desired or if structuring is to be carried out in a specific chemical atmosphere (cf. also FIG. 4 explained below).
- the depth of focus is equal to the distance of the individual lens elements 9 from the substrate 1.
- the spacers 12 can be easily by vapor deposition of thin local metal layers, but also by Sputter deposition, or with the help of piezoelectric ducks. In the latter case, apart from a measuring arrangement for determining the given distance, which is not illustrated in more detail in FIG. 1, a voltage source 13 for applying a voltage U P to the piezo element spacers 12 can also be used to set the respective optimal distance, in particular to achieve this an exact parallelism of the lens array and the substrate surface 1 '.
- the carrier 7 with the individual lens elements 9 can best be compared with a special mask device with which the radiation 2 is focused in large numbers - the focal points 11 - to more or less point-like locations.
- the individual lens elements 9 are in a single layer, in one. Monolayer, as shown schematically in Fig. 1, attached to the plate 8, to which they adhere as indicated by natural adhesive forces.
- the individual lens elements 9 are essentially transparent to the radiation 2 used, and, as already mentioned, they consist of glass, in particular quartz glass. In the case of spheres or ellipsoids, these small bodies have cross-sectional dimensions, i.e. a diameter d (see FIG. 2) on the order of 100 nm (or below) to a few ⁇ m.
- a mask 17, illustrated with dashed lines in FIG. 1, can be arranged in front of the plate 8.
- Glass beads such as are commercially available in solutions such as isopropanol can be used as individual lens elements 9. These beads are applied with a micropipette to the high-purity plane-parallel plate 8 in the form of drops.
- the 40% concentrate of 5 ⁇ m beads available as standard allows direct condensation of wide monolayers in the densest arrangement in the range of 0.1 to 0.3 ⁇ l. Modifications to the arrangements can be achieved by slightly tilting the surface when the droplet condenses.
- the production of densest monolayers over large areas has already been investigated specifically for the coating of substrates, cf. e.g. F. Burmeister et al., "Colloid monolayer lithography. A flexible approach for monostructuring of surfaces", Appl. Surface Science 144-145 (1999) 461-466. Any solvent residues are also highly transparent and do not interfere with the passage of radiation through the arrangement.
- Structuring distances can be varied by changing the bead diameter.
- Loose arrangements single, double and triple structures are achieved by spinning the solution.
- the adhesion of the beads can be influenced by external forces, e.g. by applying a (direct) voltage U between plate 8 and substrate 1.
- a voltage source 16 is shown in FIG. 1.
- the focusing effect can be in the range of the radiation wavelengths used and can therefore be very high.
- the focal plane then moves to a position within the sphere, cf. Fig. 3, left side .
- a plastic deformation to lens-like, thinner structures, as it sometimes occurs over longer periods of time, or the use of smaller spheres can put the focal plane (focal points 11) outwards again, cf. Fig. 3, right side.
- the distance to the medium to be structured must be set according to the application.
- the distance of the focus is generally only a fraction of the ball diameter; at 5 um Balls, for example, is approximately 1 ⁇ m.
- FIG. 3a shows in a detailed cross-sectional representation that the local ablations can lead to depressions with diameters in the order of a tenth of the diameter of the individual lens elements 9, small craters 18 which are formed within an elevation 19 obtained by the heating lie, cf. also Fig. 3b.
- FIG. 4 the arrangement of the plane-parallel plate 8 with the individual lens elements 9 in spherical shape, which is held at a correct distance from the substrate 1 with the surface __ 'by means of spacers 12, is shown in a closed chamber 20 which has a transparent entrance window 21 for has the radiation 2, in particular laser radiation, which strikes the plate 8 over a correspondingly large area, as also shown in FIG. 1, in order to then use the individual lens elements 9 in the bundled partial beams 10 to the individual focal points 11 to be divided.
- the high-resolution structuring process in turn occurs, which now takes place in a predetermined reactive gas phase, as indicated very schematically at 22 in FIG. 4.
- An evacuation outlet 23 and a gas inlet 24 are provided on the chamber 20 to bring about the corresponding gas atmosphere in the chamber 20, the outlet 23 with a vacuum pump (not shown in more detail) and the inlet 24 with a gas source (also not shown in more detail), of course, in each case a valve or the like - is connected.
- processing can also be carried out in a liquid instead of in a gas atmosphere; working in an inert environment, generally in a controlled atmosphere, is also conceivable.
- the surface 1 ′ of the substrate 1 can, however, not only be modified by such an ablation with the aid of the partial beams 10, but also in that material, in particular metal, is deposited on the surface of the substrate 1.
- Such a so-called LIFT technique is schematically illustrated in FIGS. 5 and 6, it being evident that, for example, an extremely thin metal foil 25 is attached to the surface 1 'of the substrate.
- the "mask device" with the plate 8 and the spherical ones is then located above it Individual lens elements 9, with the help of laser radiation 2, the smallest local areas of the metal foil 25 are now detached therefrom and deposited on the surface __ 'of the substrate 1.
- These smallest metal particle deposits are illustrated at 26 in FIG. 5; the remaining, corresponding holes 26 'having metal foil 25' is then simply stripped off, as illustrated in FIG. 6.
- the metal foil 25 can be attached to the substrate 1 magnetically or electrostatically.
- FIG. 7 shows the result of an experiment as a 5000-fold enlargement of a part of a substrate surface __ ', with depressions 18 having a diameter of approximately half a ⁇ m at intervals of approximately 5 ⁇ m, corresponding to a, made using the technique according to the invention Diameter of the spherical individual lens elements 9 of 5 microns can be seen.
- the metal to be transferred locally was in the form of a very thin film (25 in Fig. 5) applied to a quartz substrate 1: Two different methods were used: Magnetic metals (eg nickel): The film (adjacent) was applied exactly by magnetostatic forces (magnet holder).
- the metal foils were applied by electrostatic forces; e.g. an aluminum foil of 800 nm thickness was used and a voltage between the foil and the substrate of approximately 1 kV was applied; a laser pulse with a wavelength of 248 nm and an energy of 500 mJ was used as radiation; the individual lens elements were 0.8 ⁇ m spheres at the closest distance.
- FIG. 8 illustrates an electron microscope image of an Al double structure, produced with a double lens structure as such as single lens elements (0.8 ⁇ m spheres, directly adjoining one another).
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002361370A AU2002361370A1 (en) | 2001-12-21 | 2002-12-18 | Device and method for modifying the surface of a workpiece using photonic radiation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA2019/2001 | 2001-12-21 | ||
AT0201901A AT411755B (en) | 2001-12-21 | 2001-12-21 | DEVICE AND METHOD FOR MODIFYING A WORKPIECE SURFACE WITH THE AID OF PHOTON RADIATION |
Publications (3)
Publication Number | Publication Date |
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WO2003054630A2 true WO2003054630A2 (en) | 2003-07-03 |
WO2003054630A3 WO2003054630A3 (en) | 2003-11-06 |
WO2003054630A8 WO2003054630A8 (en) | 2004-01-15 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/AT2002/000354 WO2003054630A2 (en) | 2001-12-21 | 2002-12-18 | Device and method for modifying the surface of a workpiece using photonic radiation |
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AT (1) | AT411755B (en) |
AU (1) | AU2002361370A1 (en) |
WO (1) | WO2003054630A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3014177A1 (en) * | 2013-12-04 | 2015-06-05 | Commissariat Energie Atomique | SURFACE STRUCTURE FOR THERMAL SOLAR ABSORBERS AND METHOD FOR PRODUCING THE SAME. |
US9859247B2 (en) | 2012-11-09 | 2018-01-02 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method for bonding bare chip dies |
Citations (3)
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US5723264A (en) * | 1996-03-14 | 1998-03-03 | Eastman Kodak Company | Pattern transfer techniques for fabrication of lenslet arrays using specialized polyesters |
US6107011A (en) * | 1999-01-06 | 2000-08-22 | Creo Srl | Method of high resolution optical scanning utilizing primary and secondary masks |
US6133986A (en) * | 1996-02-28 | 2000-10-17 | Johnson; Kenneth C. | Microlens scanner for microlithography and wide-field confocal microscopy |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3321194B2 (en) * | 1992-02-10 | 2002-09-03 | 株式会社クラレ | Photo mask |
JP2000180605A (en) * | 1998-12-17 | 2000-06-30 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of refracting micro-lens and its device |
-
2001
- 2001-12-21 AT AT0201901A patent/AT411755B/en not_active IP Right Cessation
-
2002
- 2002-12-18 WO PCT/AT2002/000354 patent/WO2003054630A2/en not_active Application Discontinuation
- 2002-12-18 AU AU2002361370A patent/AU2002361370A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6133986A (en) * | 1996-02-28 | 2000-10-17 | Johnson; Kenneth C. | Microlens scanner for microlithography and wide-field confocal microscopy |
US5723264A (en) * | 1996-03-14 | 1998-03-03 | Eastman Kodak Company | Pattern transfer techniques for fabrication of lenslet arrays using specialized polyesters |
US6107011A (en) * | 1999-01-06 | 2000-08-22 | Creo Srl | Method of high resolution optical scanning utilizing primary and secondary masks |
Non-Patent Citations (5)
Title |
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"ULTRA-RESOLUTION IMAGE TRANSFER" IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, Bd. 34, Nr. 10A, 1. M{rz 1992 (1992-03-01), Seiten 158-162, XP000302260 ISSN: 0018-8689 * |
FOGARASSY E ET AL: "LASER-INDUCED FORWARD TRANSFER OF HIGH-TC YBACUO AND BISRCACUO SUPERCONDUCTING THIN FILMS" JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, Bd. 66, Nr. 1, 1. Juli 1989 (1989-07-01), Seiten 457-459, XP000030332 ISSN: 0021-8979 * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09, 13. Oktober 2000 (2000-10-13) & JP 2000 180605 A (NIPPON TELEGR &TELEPH CORP <NTT>), 30. Juni 2000 (2000-06-30) * |
VOLCKAERTS B ET AL: "Deep lithography with protons: a generic technology for the fabrication of refractive micro-optical modules" , PAGE(S) 103-104 XP010518558 das ganze Dokument * |
VOLKEL R ET AL: "Microlens Lithography and Smart Masks" MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, Bd. 35, Nr. 1, 1. Februar 1997 (1997-02-01), Seiten 513-516, XP004054112 ISSN: 0167-9317 in der Anmeldung erw{hnt * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859247B2 (en) | 2012-11-09 | 2018-01-02 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method for bonding bare chip dies |
FR3014177A1 (en) * | 2013-12-04 | 2015-06-05 | Commissariat Energie Atomique | SURFACE STRUCTURE FOR THERMAL SOLAR ABSORBERS AND METHOD FOR PRODUCING THE SAME. |
WO2015083051A1 (en) * | 2013-12-04 | 2015-06-11 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Surface structure for solar heat absorbers and method for the production thereof |
Also Published As
Publication number | Publication date |
---|---|
AT411755B (en) | 2004-05-25 |
AU2002361370A8 (en) | 2003-07-09 |
ATA20192001A (en) | 2003-10-15 |
WO2003054630A3 (en) | 2003-11-06 |
AU2002361370A1 (en) | 2003-07-09 |
WO2003054630A8 (en) | 2004-01-15 |
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