WO2003050035A3 - Adhesiveless microfluidic device fabrication - Google Patents

Adhesiveless microfluidic device fabrication Download PDF

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Publication number
WO2003050035A3
WO2003050035A3 PCT/US2002/039152 US0239152W WO03050035A3 WO 2003050035 A3 WO2003050035 A3 WO 2003050035A3 US 0239152 W US0239152 W US 0239152W WO 03050035 A3 WO03050035 A3 WO 03050035A3
Authority
WO
WIPO (PCT)
Prior art keywords
microfluidic device
channel
channel surface
stencil
adhesiveless
Prior art date
Application number
PCT/US2002/039152
Other languages
French (fr)
Other versions
WO2003050035A2 (en
Inventor
Joseph F Covington
Steven E Hobbs
Jeffrey A Koehler
Paren P Patel
Marci Pezzuto
Mark S Scheib
Original Assignee
Nanostream Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanostream Inc filed Critical Nanostream Inc
Priority to AU2002351291A priority Critical patent/AU2002351291A1/en
Priority to EP02786939A priority patent/EP1453758A2/en
Publication of WO2003050035A2 publication Critical patent/WO2003050035A2/en
Publication of WO2003050035A3 publication Critical patent/WO2003050035A3/en

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    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502738Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by integrated valves
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    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/91216Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods enabling contactless temperature measurements, e.g. using a pyrometer
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    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
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    • GPHYSICS
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    • G01N30/02Column chromatography
    • G01N30/60Construction of the column
    • G01N30/6095Micromachined or nanomachined, e.g. micro- or nanosize
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0402Cleaning, repairing, or assembling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/206Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/2224Structure of body of device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/598With repair, tapping, assembly, or disassembly means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Abstract

A method for fabricating a microfluidic device where first and second substantially flat platens are provided. Multiple substantially planar, substantially metal-free, adhesiveless polymer device layers, including at least one stencil layer defining a microfluidic channel penetrating through the entire thickness of the stencil such that the channel is bounded laterally by a stencil layer, and bounded from above and below by surrounding device layers to define an upper channel surface and a lower channel surface are provided. The device layers are stacked between the first platen and the second platen and controllably heated according to a heating profile adapted to form a substantially sealed adhesiveless microfluidic device wherein each upper channel surface remains distinct from its corresponding lower channel surface. The resulting microfluidic device has high inter-layer bond strength while preserving the integrity of the channel(s) defined in the stencil layer(s).
PCT/US2002/039152 2001-12-06 2002-12-06 Adhesiveless microfluidic device fabrication WO2003050035A2 (en)

Priority Applications (2)

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AU2002351291A AU2002351291A1 (en) 2001-12-06 2002-12-06 Adhesiveless microfluidic device fabrication
EP02786939A EP1453758A2 (en) 2001-12-06 2002-12-06 Adhesiveless microfluidic device fabrication

Applications Claiming Priority (4)

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US33828601P 2001-12-06 2001-12-06
US60/338,286 2001-12-06
US39395302P 2002-07-02 2002-07-02
US60/393,953 2002-07-02

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WO2003050035A3 true WO2003050035A3 (en) 2004-02-19

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EP (1) EP1453758A2 (en)
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WO (1) WO2003050035A2 (en)

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