WO2003047872A1 - Method and materials for transferring a material onto a plasma treated surface according to a pattern - Google Patents
Method and materials for transferring a material onto a plasma treated surface according to a pattern Download PDFInfo
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- WO2003047872A1 WO2003047872A1 PCT/US2002/033209 US0233209W WO03047872A1 WO 2003047872 A1 WO2003047872 A1 WO 2003047872A1 US 0233209 W US0233209 W US 0233209W WO 03047872 A1 WO03047872 A1 WO 03047872A1
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- WIPO (PCT)
- Prior art keywords
- layer
- roughening
- receptor
- fransfer
- plasma
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/02—Dye diffusion thermal transfer printing (D2T2)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/114—Poly-phenylenevinylene; Derivatives thereof
Definitions
- Pattern-wise thermal transfer of materials from donor sheets to receptor substrates has been proposed for a wide variety of applications.
- materials can be selectively thermally transferred to form elements useful in electronic displays and other devices.
- selective thermal transfer of color filters, black matrix, spacers, polarizers, conductive layers, transistors, phosphors, and organic electroluminescent materials have all been proposed.
- the present invention is directed to materials and methods for the selective thermal patterning of a transfer element on a receptor substrate and to article and devices made using these materials and methods.
- One embodiment is a method of transferring a transfer element of a donor sheet to a receptor.
- the method includes forming an organic layer on a receptor substrate and forming a transfer element on a donor sheet, where the exposed surface of the transfer element is also an organic material. Either the surface of the organic layer on the receptor substrate or the exposed surface of the transfer element (or both) is roughened using a plasma treatment.
- the transfer element of the donor sheet is then selectively thermally transferred to the surface of the organic layer.
- the plasma treatment does not substantially chemically modify any treated surface or, alternatively, partial oxidation of the plasma-treated surface is the only chemical modification.
- chemical modification may be desirable to reduce the receptiveness of a portion of the receptor to transfer.
- Suitable plasma treatments include, for example, RF plasmas of O 2 , argon, and nitrogen or combinations thereof.
- Another embodiment is a method of transferring a transfer element of a donor sheet to a receptor.
- the method includes forming an organic charge transfer layer on a receptor substrate; roughening a surface of the charge transfer layer using a plasma treatment; and selectively thermally transferring a transfer element of a donor sheet to the surface of the charge transfer layer after roughemng the surface.
- the transfer element preferably has at least one light emitting layer.
- the surface of the transfer layer of the donor sheet can be roughened using a plasma treatment.
- Yet another embodiment is a method of making an electroluminescent device.
- the method includes forming an electrode on a receptor substrate; forming an organic charge transfer layer over the electrode; roughening a surface of the charge transfer layer using a plasma treatment; and selectively thermally transferring a transfer element of a donor sheet to the surface of the charge transfer layer after roughening the surface.
- the transfer element preferably has at least one light emitting layer.
- the surface of the transfer layer of the donor sheet can be roughened using a plasma treatment.
- Figure 1 is a schematic side view of an organic electroluminescent display construction
- Figure 2 is a schematic side view of a donor sheet for transferring materials according to the present invention
- Figure 3 is a schematic side view of an organic electroluminescent display according to the present invention.
- Figure 4A is a schematic side view of a first embodiment of an organic electroluminescent device
- Figure 4B is a schematic side view of a second embodiment of an organic electroluminescent device
- Figure 4C is a schematic side view of a third embodiment of an organic electroluminescent device
- Figure 4D is a schematic side view of a fourth embodiment of an organic electroluminescent device.
- the present invention contemplates materials and methods for the selective thermal patterning of a transfer element on a receptor substrate. These materials and methods can be used to form articles and devices such as, for example, electroluminescent devices.
- the methods and materials include the plasma treatment of a surface of an organic material (for example, a polymeric material) to improve thermal patterning.
- the methods and materials can be used to form, for example, devices such as organic electronic devices and displays that include electrically active organic materials including organic electroluminescent (OEL) devices.
- Electroluminescent and other devices and articles can include, for example, color filters, black matrix, spacers, polarizers, conductive layers, transistors, phosphors, and organic electroluminescent materials that are partially or completely transferred or otherwise formed by thermal patterning.
- the donor can be exposed to imaging radiation through the donor substrate, through the receptor, or both.
- the radiation can include one or more wavelengths, including visible light, infrared radiation, or ultraviolet radiation, for example from a laser, lamp, or other radiation source.
- Other selective heating methods can also be employed, such as using a thermal print head or using a thermal hot stamp (e.g., a patterned thermal hot stamp such as a heated silicone stamp that has a relief pattern that can be used to selectively heat a donor).
- Thermal print heads or other heating elements may be particularly suited for making lower resolution patterns of material or for patterning elements whose placement need not be precisely controlled. Plasma treatment of the receptor or transfer layer surface can be used to facilitate this type of transfer.
- Material from the transfer layer can be selectively transferred to a receptor in this manner to imagewise form patterns of the transferred material on the receptor.
- thermal transfer using light from, for example, a lamp or laser, to patternwise expose the donor can be advantageous because of the accuracy and precision that can often be achieved.
- the size and shape of the transferred pattern (e.g., a line, circle, square, or other shape) can be controlled by, for example, selecting the size of the light beam, the exposure pattern of the light beam, the duration of directed beam contact with the donor sheet, or the materials of the donor sheet.
- the transferred pattern can also be controlled by irradiating the donor element through a mask.
- Transfer layers can also be transferred from donor sheets without selectively transferring the transfer layer.
- a transfer layer can be formed on a donor substrate that, in essence, acts as a temporary liner that can be released after the transfer layer is contacted to a receptor substrate, typically with the application of heat or pressure.
- lamination transfer can be used to transfer the entire transfer layer, or a large portion thereof, to the receptor.
- Plasma treatment of the receptor or transfer layer surface can be used to facilitate this type of transfer.
- the surface of the receptor that is to receive the transferred portions of the transfer layer can be subjected to a plasma treatment.
- plasma treatment of the surface of the receptor it will be recognized that the surface of the transfer layer that is to make contact with the receptor could be plasma treated in addition to or instead of the surface of the receptor.
- Plasma treatment of the receptor surface is illustrated as an example which can be readily adapted to plasma treatment of the surface of the transfer layer.
- Plasma treatment can improve the accuracy and quality of the transfer. For example, transfer uniformity or edge roughness may be improved over transfer methods that do not utilize plasma treatment.
- the plasma treatment roughens the surface of the receptor and, more preferably, the roughening is performed without substantially chemically modifying the surface or with only partially oxidizing the surface.
- any oxidation of the surface is not substantially more than the oxidation that would be achieved by exposure to the environment during normal processing and storage of the receptor.
- Plasma treatment can be performed using a variety of different plasmas.
- an RF plasma formed with a noble gas such as argon
- nitrogen (N 2 ) or combinations thereof can typically be used to roughen a surface without substantially chemically modifying or only partially oxidizing the surface, as illustrated, for example, in the Examples below.
- Other useful plasmas include, for example, ECR (Electron Cyclotron Resonance) plasma, corona discharge or DC discharge plasma.
- the plasma can have a power in the range of 20 to 200 W/cm 2 with a gas pressure in the range of 125 to 750 mTorr (about 16 to 100 Pa) and gas flow rates in the range of 20 to 500 seem. Different power, gas pressure, and gas flow rates can be used, as desired and as needed to obtain desired effects for a particular plasma generating device.
- the exposure time can be in the range of, for example, 5 to 30 seconds (e.g., in the range of 10 to 30 seconds), however longer exposure times (for example, up to 1 minute or up to five or ten minutes or more) can be used, if desired.
- Chemical modification can be accomplished by, for example, exposure to a fluorine-containing plasma, such as a CF 4 plasma, which results in the addition of fluorine to the surface or exposure to a silicon-containing plasma such as a tetramethylsilane (TMS) plasma which, depending on the conditions, can add, for example, silicon oxide, silicon hydroxide, silicon carbide, silicon hydride or silane groups to the surface.
- a fluorine-containing plasma such as a CF 4 plasma
- a silicon-containing plasma such as a tetramethylsilane (TMS) plasma
- TMS tetramethylsilane
- a CF 4 plasma can be used to selectively modify a surface of a receptor such that the modified surface is resistant to receiving a portion of the transfer layer.
- This can be used in conjunction with, for example, an argon, O 2 , or N 2 plasma treatment to define a desired pattern of receptive (argon, O , or N 2 plasma treated) regions and non-receptive (CF 4 plasma treated) regions on the surface of a receptor.
- the plasma treatment results in improvement, retention, or only slight degradation in one or more, and more preferably all, important operational parameters of the device or article to be formed while achieving more accurate and higher quality transfer. For example, for electroluminescent devices operational voltage, brightness, and efficiency are important operational parameters.
- the desired brightness of the electroluminescent sample depends on the envisioned application. If the material were targeted toward an active matrix display application for instance, a brightness of approximately 200 Cd/m 2 may be desired for commercial applications.
- the operational voltage is that voltage which needs to be applied to the electroluminescent device in order to achieve the specified brightness. Low operational voltages, commonly from about 5 to about 20N or less, are desired.
- a receptor surface that is plasma-treated is typically made of an organic material, as is the surface of the material that is to be transferred from the transfer layer and into contact with the receptor surface.
- Suitable organic materials include polymeric materials.
- both the surface of the receptor and the transfer layer can be made of organic materials and, in some embodiments, both are made of polymeric materials.
- the receptor can include a receptor substrate and one or more additional layers disposed on the substrate.
- the receptor substrate can be any item suitable for a particular application including, but not limited to, glass, transparent films, reflective films, metals, semiconductors, ceramic materials, and plastics.
- receptor substrates can be any type of substrate or display element suitable for display applications.
- Receptor substrates suitable for use in displays such as liquid crystal displays or emissive displays include rigid or flexible substrates that are substantially transmissive to visible light.
- suitable rigid receptors include glass and rigid plastic that is coated or patterned with indium tin oxide or is circuitized with low temperature poly-silicon (LTPS) or other transistor structures, including organic transistors.
- Opaque substrates can also be used, including in embodiments where the light to be generated by an organic electroluminescent device formed on the receptor substrate is not meant to be transmitted through the substrate to a viewer or optical device.
- Suitable flexible substrates include substantially clear and transmissive polymer films, reflective films, transflective films, polarizing films, multilayer optical films, and the like.
- Flexible subsfrates can also be coated or patterned with electrode materials or transistors, for example transistor arrays formed directly on the flexible subsfrate or transferred to the flexible substrate after being formed on a temporary carrier substrate.
- Suitable polymer substrates include polyester resins (e.g., polyethylene terephthalate, polyethylene naphthalate), polycarbonate resins, polyolefin resins, polyvinyl resins (e.g., polyvinyl chloride, polyvinylidene chloride, polyvinyl acetals, etc.), cellulose ester bases (e.g., cellulose triacetate, cellulose acetate), and other conventional polymeric films used as supports.
- polyester resins e.g., polyethylene terephthalate, polyethylene naphthalate
- polycarbonate resins e.g., polyolefin resins
- polyvinyl resins e.g., polyvinyl chloride, polyvinylidene chloride, polyvinyl acetals, etc.
- cellulose ester bases e.g., cellulose triacetate, cellulose acetate
- the receptor substrate is typically covered by one or more layers which provide an organic surface (for example, a polymeric surface) for plasma treatment.
- Receptor substrates can be covered by or pre-patterned with any one or more of the following: electrodes, transistors, capacitors, insulator ribs, spacers, color filters, black matrix, planarization layers, hole transport layers, electron transport layers, and other elements useful for electronic displays or other devices.
- these additional layers are functional layers for the device or article to be formed.
- the mode of thermal mass transfer can vary depending on the type of selective heating employed, the type of irradiation if used to expose the donor, the type of materials and properties of an optional light-to-heat conversion (LTHC) layer, the type of materials in the fransfer layer, the overall construction of the donor, the type of receptor substrate, and the like.
- transfer generally occurs via one or more mechanisms, one or more of which may be emphasized or de-emphasized during selective transfer depending on imaging conditions, donor constructions, and so forth.
- Another mechanism of thermal transfer includes ablative transfer whereby localized heating can be used to ablate portions of the transfer layer off the donor element, thereby directing ablated material toward the receptor.
- Yet another mechanism of thermal transfer includes sublimation whereby material dispersed in the transfer layer can be sublimated by heat generated in the donor element. A portion of the sublimated material can condense on the receptor.
- the present invention contemplates transfer modes that include one or more of these and other mechanisms whereby selective heating of a donor sheet can be used to cause the transfer of materials from a transfer layer to receptor surface.
- Plasma treatment of the receptor or fransfer layer surface can be used to facilitate fransfer using any of the described mechanisms or combinations thereof.
- a variety of radiation-emitting sources can be used to heat donor sheets.
- high-powered light sources e.g., xenon flash lamps and lasers
- infrared, visible, and ultraviolet lasers are particularly useful.
- Suitable lasers include, for example, high power (> 100 mW) single mode laser diodes, fiber-coupled laser diodes, and diode- pumped solid state lasers (e.g., Nd:YAG and Nd:YLF).
- Laser exposure dwell times can vary widely from, for example, a few hundredths of microseconds to tens of microseconds or more, and laser fluences can be in the range from, for example, about 0.01 to about 5 J/cm 2 or more.
- Other radiation sources and irradiation conditions can be suitable based on, among other things, the donor element construction, the transfer layer material, the mode of thermal mass transfer, and other such factors.
- the transfer layer typically, selected portions of the transfer layer are transferred to the receptor without transferring significant portions of the other layers of the donor sheet, such as the optional interlayer or LTHC layer.
- the presence of the optional interlayer may eliminate or reduce the transfer of material from an LTHC layer to the receptor or reduce distortion in the transferred portion of the transfer layer.
- the adhesion of the optional interlayer to the LTHC layer is greater than the adhesion of the interlayer to the transfer layer.
- the interlayer can be transmissive, reflective, or abso ⁇ tive to imaging radiation, and can be used to attenuate or otherwise control the level of imaging radiation transmitted through the donor or to manage temperatures in the donor, for example to reduce thermal or radiation-based damage to the transfer layer during imaging. Multiple interlayers can be present.
- a laser can be rastered or otherwise moved across the large donor sheet, the laser being selectively operated to illuminate portions of the donor sheet according to a desired pattern.
- the laser may be stationary and the donor sheet or receptor subsfrate moved beneath the laser.
- three different donors that each have a transfer layer comprising a light emitter capable of emitting a different color can be used to form RGB sub-pixel OEL devices for a full color polarized light emitting electronic display.
- a conductive or semiconductive polymer can be patterned via thermal transfer from one donor, followed by selective thermal transfer of emissive layers from one or more other donors to form a plurality of OEL devices in a display. Plasma freatment of the receptor or fransfer layer surface can be used to facilitate any of these transfer processes.
- Materials from separate donor sheets can be transferred adjacent to other materials on a receptor to form adjacent devices, portions of adjacent devices, or different portions of the same device.
- materials from separate donor sheets can be transferred directly on top of, or in partial overlying registration with, other layers or materials previously patterned onto the receptor by thermal transfer or some other method (e.g., photolithography, deposition through a shadow mask, etc.). Plasma freatment of the receptor or transfer layer surface can be used to facilitate any of these fransfer processes.
- a variety of other combinations of two or more donor sheets can be used to form a device, each donor sheet forming one or more portions of the device. It will be understood that other portions of these devices, or other devices on the receptor, may be formed in whole or in part by any suitable process including photolithographic processes, ink jet processes, and various other printing or mask-based processes, whether conventionally used or newly developed.
- a donor sheet 200 can include a donor substrate 210, an optional underlayer 212, an optional light-to-heat conversion (LTHC) layer 214, an optional interlayer 216, and a fransfer layer 218.
- LTHC light-to-heat conversion
- the donor subsfrate 210 can be a polymer film or any other suitable, preferably transparent, subsfrate.
- One suitable type of polymer film is a polyester film, for example, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) films.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- the donor substrate in at least some instances, is flat so that uniform coatings can be formed thereon.
- the donor substrate is also typically selected from materials that remain stable despite heating of one or more layers of the donor.
- an underlayer between the substrate and an LTHC layer can be used to insulate the subsfrate from heat generated in the LTHC layer during imaging.
- the typical thickness of the donor substrate ranges from 0.025 to 0.15 mm, preferably 0.05 to 0.1 mm, although thicker or thinner donor substrates can be used.
- the materials used to form the donor substrate and an optional adjacent underlayer can be selected to improve adhesion between the donor substrate and the underlayer, to control heat transport between the subsfrate and the underlayer, to control imaging radiation transport to the LTHC layer, to reduce imaging defects and the like.
- An optional priming layer can be used to increase uniformity during the coating of subsequent layers onto the substrate or increase the bonding strength between the donor substrate and adjacent layers or both, if desired.
- An optional underlayer 212 may be coated or otherwise disposed between a donor substrate and the LTHC layer, for example to control heat flow between the subsfrate and the LTHC layer during imaging or to provide mechanical stability to the donor element for storage, handling, donor processing, or imaging. Examples of suitable underlayers and methods of providing underlayers are disclosed in U.S. Patent No. 6,284,425, inco ⁇ orated herein by reference.
- the underlayer can include materials that impart desired mechanical or thermal properties to the donor element.
- the underlayer can include materials that exhibit a low specific heat x density or low thermal conductivity relative to the donor subsfrate.
- Such an underlayer may be used to increase heat flow to the fransfer layer, for example to improve the imaging sensitivity of the donor.
- the underlayer can also include materials for their mechanical properties or for adhesion between the subsfrate and the LTHC.
- an underlayer that improves adhesion between the subsfrate and the LTHC layer can result in less distortion in the transferred image, if desired.
- an underlayer can be used that reduces or eliminates delamination or separation of the LTHC layer, for example, that might otherwise occur during imaging of the donor media. This can reduce the amount of physical distortion exhibited by transferred portions of the fransfer layer.
- Separation during imaging can also provide a channel for the release of gases that may be generated by heating of the LTHC layer during imaging. Providing such a channel can lead to fewer imaging defects.
- the underlayer may be substantially transparent at the imaging wavelength, or can be at least partially abso ⁇ tive or reflective of imaging radiation. Attenuation or reflection of imaging radiation by the underlayer can be used to control heat generation during imaging.
- an LTHC layer 214 can be included in donor sheets of the present invention to couple irradiation energy into the donor sheet.
- the LTHC layer preferably includes a radiation absorber that absorbs incident radiation (e.g., laser light) and converts at least a portion of the incident radiation into heat to enable transfer of the transfer layer from the donor sheet to the receptor.
- Radiation absorber material can be uniformly disposed throughout the LTHC layer or can be non-homogeneously distributed.
- non-homogeneous LTHC layers can be used to confrol temperature profiles in donor elements. This can give rise to donor sheets that have improved transfer properties (e.g., better fidelity between the intended transfer patterns and actual transfer patterns).
- Metallic and metal compound films may be formed by techniques, such as, for example, sputtering and evaporative deposition.
- Particulate coatings may be formed using a binder and any suitable dry or wet coating techniques.
- LTHC layers can also be formed by combining two or more LTHC layers containing similar or dissimilar materials.
- an LTHC layer can be formed by vapor depositing a thin layer of black aluminum over a coating that contains carbon black disposed in a binder.
- Dyes suitable for use as radiation absorbers in a LTHC layer can be present in particulate form, dissolved in a binder material, or at least partially dispersed in a binder material.
- the particle size can be, at least in some instances, about 10 ⁇ m or less, and may be about 1 ⁇ m or less.
- Suitable dyes include those dyes that absorb in the IR region of the spectrum.
- a specific dye can be chosen based on factors such as, solubility in, and compatibility with, a specific binder or coating solvent, as well as the wavelength range of abso ⁇ tion.
- Inorganic pigments can also be used, including, for example, oxides and sulfides of metals such as aluminum, bismuth, tin, indium, zinc, titanium, chromium, molybdenum, tungsten, cobalt, iridium, nickel, palladium, platinum, copper, silver, gold, zirconium, iron, lead, and tellurium.
- metals such as aluminum, bismuth, tin, indium, zinc, titanium, chromium, molybdenum, tungsten, cobalt, iridium, nickel, palladium, platinum, copper, silver, gold, zirconium, iron, lead, and tellurium.
- Metal borides, carbides, nitrides, carbonitrides, bronze-structured oxides, and oxides structurally related to the bronze family e.g., WO 2 9 ) may also be used.
- Metal radiation absorbers may be used, either in the form of particles, as described for instance in U.S. Pat. No. 4,252,671, or as films, as disclosed in U.S. Pat. No. 5,256,506.
- Suitable metals include, for example, aluminum, bismuth, tin, indium, tellurium and zinc.
- Suitable binders for use in the LTHC layer include film-forming polymers, such as, for example, phenolic resins (e.g., novolak and resole resins), polyvinyl butyral resins, polyvinyl acetates, polyvinyl acetals, polyvinylidene chlorides, polyacrylates, cellulosic ethers and esters, nifrocelluloses, and polycarbonates.
- Suitable binders can include monomers, oligomers, or polymers that have been, or can be, polymerized or crosslinked. Additives such as photoinitiators can also be included to facilitate crosslinking of the LTHC binder.
- the binder is primarily formed using a coating of crosslinkable monomers or oligomers with optional polymer.
- thermoplastic resin that has a solubility parameter in the range of 9 to 13 (cal/cm ) , preferably, 9.5 to 12 (cal/cm ) , is chosen for the binder.
- suitable thermoplastic resins include polyacrylics, styrene-acrylic polymers and resins, and polyvinyl butyral.
- Conventional coating aids, such as surfactants and dispersing agents, can be added to facilitate the coating process.
- the LTHC layer can be coated onto the donor subsfrate using a variety of coating methods known in the art.
- a polymeric or organic LTHC layer can be coated, in at least some instances, to a thickness of 0.05 ⁇ m to 20 ⁇ m, preferably, 0.5 ⁇ m to 10 ⁇ m, and, more preferably, 1 ⁇ m to 7 ⁇ m.
- An inorganic LTHC layer can be coated, in at least some instances, to a thickness in the range of 0.0005 to 10 ⁇ m, and preferably, 0.001 to 1 ⁇ m.
- an optional interlayer 216 can be disposed between the LTHC layer 214 and fransfer layer 218.
- the interlayer can be used, for example, to minimize damage and contamination of the transferred portion of the transfer layer and may also reduce distortion in the transferred portion of the fransfer layer.
- the interlayer can also influence the adhesion of the fransfer layer to the rest of the donor sheet.
- the interlayer has high thermal resistance.
- the interlayer does not distort or chemically decompose under the imaging conditions, particularly to an extent that renders the transferred image non- functional.
- the interlayer typically remains in contact with the LTHC layer during the transfer process and is not substantially fransferred with the fransfer layer.
- thermoplastic materials include, for example, polyacrylates, polymethacrylates, polystyrenes, polyurethanes, polysulfones, polyesters, and polyimides. These thermoplastic organic materials can be applied via conventional coating techniques (for example, solvent coating, spray coating, or extrusion coating).
- the glass transition temperature (T g ) of thermoplastic materials suitable for use in the interlayer is 25 °C or greater, preferably 50 °C or greater.
- the interlayer includes a thermoplastic material that has a T g greater than any temperature attained in the fransfer layer during imaging.
- the interlayer can be either transmissive, absorbing, reflective, or some combination thereof, at the imaging radiation wavelength.
- a thermal transfer layer 218 is included in donor sheet 200.
- Transfer layer 218 can include any suitable material or materials, disposed in one or more layers, alone or in combination with other materials. Transfer layer 218 is capable of being selectively transferred as a unit or in portions by any suitable transfer mechanism when the donor element is exposed to direct heating or to imaging radiation that can be absorbed by light-to-heat converter material and converted into heat.
- the transfer layer can then be selectively thermally transferred from the donor element to a proximately located receptor substrate.
- There can be, if desired, more than one fransfer layer so that a multilayer construction is transferred using a single donor sheet.
- the exposed surface of the transfer layer is optionally plasma treated to facilitate adhesion of the transferred portion of the transfer layer to the receptor.
- Organic electroluminescent (OEL) displays and devices are examples of articles that can be formed using thermal fransfer as described herein. OEL displays and devices are further described to illustrate how articles can be made by thermal fransfer. It will be recognized that a variety of different articles can be made using the techniques and materials described herein including the use of plasma treatment to facilitate fransfer.
- OEL displays and devices include an organic (including organometallic) emissive material.
- the emissive material can include a small molecule (SM) emitter, a SM doped polymer, a light emitting polymer (LEP), a doped LEP, a blended LEP, or another organic emissive material whether provided alone or in combination with any other organic or inorganic materials that are functional or non-functional in the OEL display or devices
- SM small molecule
- LEP light emitting polymer
- Figure 1 illustrates an OEL display or device
- device layer 110 includes one or more OEL devices that emit light through the subsfrate toward a viewer position 140.
- the viewer position 140 is used generically to indicate an intended destination for the emitted light whether it be an actual human observer, a screen, an optical component, an electronic device, or the like.
- device layer 110 is positioned between subsfrate 120 and the viewer position 140.
- the device configuration shown in Figure 1 may be used when substrate 120 is transmissive to light emitted by device layer 110 and when a transparent conductive electrode is disposed in the device between the emissive layer of the device and the substrate.
- the inverted configuration may be used when substrate 120 does or does not transmit the light emitted by the device layer and the electrode disposed between the subsfrate and the light emitting layer of the device does not fransmit the light emitted by the device.
- Device layer 110 can include one or more OEL devices arranged in any suitable manner.
- device layer 110 in lamp applications (e.g., backlights for liquid crystal display (LCD) modules), device layer 110 can constitute a single OEL device that spans an entire intended backlight area.
- device layer 110 in other lamp applications, can constitute a plurality of closely spaced devices that can be contemporaneously activated. For example, relatively small and closely spaced red, green, and blue light emitters can be patterned between common electrodes so that device layer 110 appears to emit white light when the emitters are activated. Other arrangements for backlight applications are also contemplated.
- device layer 110 can include a plurality of independently addressable OEL devices that emit the same or different colors.
- Each device can represent a separate pixel or a separate sub-pixel of a pixilated display (e.g., high resolution display), a separate segment or sub-segment of a segmented display (e.g., low information content display), or a separate icon, portion of an icon, or lamp for an icon (e.g., indicator applications).
- an OEL device includes a thin layer, or layers, of one or more suitable organic materials sandwiched between a cathode and an anode.
- photoluminescent materials can be present in the electroluminescent or other layers in OEL devices, for example, to convert the color of light emitted by the electroluminescent material to another color.
- These and other such layers and materials can be used to alter or tune the electronic properties and behavior of the layered OEL device, for example to achieve a desired current/voltage response, a desired device efficiency, a desired color, a desired brightness, and the like.
- the anode 252 and cathode 254 are typically formed using conducting materials such as metals, alloys, metallic compounds, metal oxides, conductive ceramics, conductive dispersions, and conductive polymers, including, for example, gold, platinum, palladium, aluminum, calcium, titanium, titanium nitride, indium tin oxide (ITO), fluorine tin oxide (FTO), and polyaniline.
- the anode 252 and the cathode 254 can be single layers of conducting materials or they can include multiple layers.
- an anode or a cathode may include a layer of aluminum and a layer of gold, a layer of calcium and a layer of aluminum, a layer of aluminum and a layer of lithium fluoride, or a metal layer and a conductive organic layer.
- the hole transport layer 258 facilitates the injection of holes from the anode into the device and their migration towards the recombination zone.
- the hole transport layer 258 can further act as a barrier for the passage of electrons to the anode 252.
- the electron transport layer 260 facilitates the injection of electrons and their migration towards the recombination zone.
- the electron transport layer 260 can further act as a barrier for the passage of holes to the cathode 254, if desired.
- the electron transport layer 260 can be formed using the organometallic compound tris(8- hydroxyquinolato) aluminum (Alq3).
- electron transport materials include l,3-bis[5-(4-(l,l-dimethylethyl)phenyl)-l,3,4-oxadiazol-2-yl]benzene, 2- (biphenyl-4-yl)-5 -(4-( 1 , 1 -dimethylethyl)phenyl)- 1 ,3 ,4-oxadiazole (tBuPBD) and other compounds described in CH. Chen, et al., Macromol. Svmp. 125, 1 (1997) and J.N. Grazulevicius, P. Sfrohriegl, "Charge-Transporting Polymers and Molecular Glasses", Handbook of Advanced Electronic and Photonic Materials and Devices.
- Each configuration also includes a light emitting layer 256 that includes one or more light emitting polymers (LEP) or other light emitting molecules (e.g., small molecule (SM) light emitting compounds).
- LEP light emitting polymers
- SM small molecule
- a variety of light emitting materials including LEP and SM light emitters can be used. Examples of classes of suitable LEP materials include poly(phenylenevinylene)s (PPNs), poly-para-phenylenes (PPPs), polyfluorenes (PFs), other LEP materials now known or later developed, and co-polymers or blends thereof.
- Suitable LEPs can also be molecularly doped, dispersed with fluorescent dyes or other PL materials, blended with active or non-active materials, dispersed with active or non-active materials, and the like.
- suitable LEP materials are described in Kraft, et al., Aneew. Chem. Int. Ed.. 37, 402-428 (1998); U.S. Patent Nos. 5,621,131; 5,708,130; 5,728,801; 5,840,217; 5,869,350; 5,900,327; 5,929,194; 6,132,641; and 6,169,163; and PCT Patent Application Publication No. 99/40655, all of which are inco ⁇ orated herein by reference.
- SM materials are generally non-polymer organic or organometallic molecular materials that can be used in OEL displays and devices as emitter materials, charge transport materials, as dopants in emitter layers (e.g., to control the emitted color) or charge transport layers, and the like.
- Commonly used SM materials include metal chelate compounds, such as tris(8-hydroxyquinoline) aluminum (Alq3), and N,N'-bis(3- methylphenyl)-N,N'-diphenylbenzidine (TPD).
- metal chelate compounds such as tris(8-hydroxyquinoline) aluminum (Alq3), and N,N'-bis(3- methylphenyl)-N,N'-diphenylbenzidine (TPD).
- Other SM materials are disclosed in, for example, CH. Chen, et al., Macromol. Symp. 125, 1 (1997), Japanese Laid Open Patent Application 2000-195673, U.S. Patents Nos.
- Subsfrate 120 can be any subsfrate suitable for OEL device and display applications.
- subsfrate 120 can comprise glass, clear plastic, or other suitable material(s) that are substantially transparent to visible light.
- Substrate 120 can also be opaque to visible light, for example stainless steel, crystalline silicon, poly-silicon, or the like. Because some materials in OEL devices can be particularly susceptible to damage due to exposure to oxygen or water, subsfrate 120 preferably provides an adequate environmental barrier, or is supplied with one or more layers, coatings, or laminates that provide an adequate environmental barrier.
- Subsfrate 120 can also include any number of devices or components suitable in OEL devices and displays such as transistor arrays and other electronic devices; color filters, polarizers, wave plates, diffusers, and other optical devices; insulators, barrier ribs, black matrix, mask work and other such components; and the like.
- one or more electrodes will be coated, deposited, patterned, or otherwise disposed on subsfrate 120 before forming the remaining layer or layers of the OEL device or devices of the device layer 110.
- the electrode or electrodes that are disposed between the substrate 120 and the emissive material(s) are preferably substantially transparent to light, for example transparent conductive electrodes such as indium tin oxide (ITO) or any of a number of other transparent conductive oxides.
- Element 130 can be any element or combination of elements suitable for use with
- element 130 can be an LCD module when device 100 is a backlight.
- One or more polarizers or other elements can be provided between the LCD module and the backlight device 100, for instance an absorbing or reflective clean-up polarizer.
- element 130 can include one or more of polarizers, wave plates, touch panels, antireflective coatings, anti-smudge coatings, projection screens, brightness enhancement films, or other optical components, coatings, user interface devices, or the like.
- transparent conductive anode pads can be provided in a two-dimensional pattern on the substrate and associated with addressing electronics such as one or more transistors, capacitors, etc., such as are suitable for making active matrix displays.
- addressing electronics such as one or more transistors, capacitors, etc.
- Other layers, including the light emitting layer(s) can then be coated or deposited as a single layer or can be patterned (e.g., parallel stripes, two-dimensional pattern commensurate with the anodes, etc.) over the anodes or electronic devices. Any other suitable construction is also contemplated by the present invention.
- display 300 can be a multiple color display. As such, it may be desirable to position optional polarizer 330 between the light emitting devices and a viewer, for example to enhance the contrast of the display.
- each of the devices 310 emits light.
- Applications include white or single color large area single pixel lamps, for example where an emissive material is provided by thermal stamp fransfer, lamination transfer, resistive head thermal printing, or the like; white or single color large area single electrode pair lamps that have a large number of closely spaced emissive layers patterned by laser induced thermal fransfer; and tunable color multiple electrode large area lamps.
- Low resolution OEL displays can include emissive layers. Constructions can include bare or circuitized substrates, anodes, cathodes, hole transport layers, elecfron transport layers, hole injection layers, elecfron injection layers, emissive layers, color changing layers, and other layers and materials suitable in OEL devices. Constructions can also include polarizers, diffiisers, light guides, lenses, light confrol films, brightness enhancement films, and the like.
- ITO Indium tin oxide
- PDOT poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate
- B ITO/PDOT treated with an oxygen-containing plasma
- C ITO/PDOT treated with an argon-containing plasma
- D ITO/PDOT treated with a plasma containing tefrafluoromethane
- E ITO PDOT treated with a plasma containing teframethylsilane (TMS) and argon.
- ITO Indium tin oxide coated glass
- Deconex 12NS Bode Chemie AG, Zuchwil, Switzerland
- the subsfrates were then placed in a Plasma Science plasma treater (Model PS 500 available from AST Inc., Billerica, MA) for surface treatment under the following conditions:
- the O 2 plasma-treated receptor was made using the PDOT coated substrate prepared as described for receptor surface (A) and placed into the Plasma Science plasma treater for surface freatment under the following conditions:
- the CF plasma-treated receptor was made using the PDOT coated subsfrate prepared as described for receptor surface (A) and placed into the Plasma Science plasma treater for surface freatment under the following conditions: Time: 15s
- TMS plasma-treated receptor was made using the PDOT coated subsfrate prepared as described for receptor surface (A) and placed into the Plasma Science plasma treater for surface treatment under the following conditions:
- the receptor surfaces were characterized using X-ray Photoelecfron Specfroscopy (XPS, also known as Elecfron Specfroscopy for Chemical Analysis (ESCA)) and Atomic Force Microscopy (AFM). Receptors of types (A), (B) and (C) were analyzed by XPS using a Surface Science
- Receptors of types (A), (D) and (E) were analyzed by XPS using an ESCA system with a non-monochromated Al X-ray source. The photoemission was detected at a 30° take-off angle with respect to the receptor surface. In the case of receptor (D), a degree of fluorination and trace amounts of silicon were detected on the surface. In the case of receptor (E), silicon was detected but sulfur was not suggesting that the PDOT film is covered with a silicon-containing overlayer, which is thicker then the sampling depth of
- Receptors of types (B) and (C) were characterized using Atomic Force Microscopy (AFM), and receptors of type (A) were also characterized by AFM for comparison.
- AFM Atomic Force Microscopy
- the surfaces of the receptors from type (B) and (C) were roughened compared to surfaces of receptors from type (A).
- Example 2 Preparation of a Donor Sheet without a Transfer Layer
- Transfer layers were formed on the donor sheets of Example 2 using blends of the Solutions of Example 3 according to Table V. To obtain the blends, the above described solutions were mixed at the appropriate ratios and the resulting blend solutions were sti ⁇ ed for 20 min at room temperature.
- the fransfer layers were disposed on the donor sheets by spinning (Headway Research spincoater) at about 2000-2500 ⁇ m for 30 s to yield a film thickness of approximately 100 nm.
- Donor sheets as prepared in Examples 4-6 were brought into contact with receptor subsfrates as prepared in Example 1.
- the donors were imaged using two single- mode Nd:YAG lasers. Scanning was performed using a system of linear galvanometers, with the combined laser beams focused onto the image plane using an f-theta scan lens as part of a near-telecentric configuration.
- the laser energy density was 0.4 to 0.8 J/cm 2 .
- the laser spot size, measured at the 1/e 2 intensity, was 30 micrometers by 350 micrometers.
- the linear laser spot velocity was adjustable between 10 and 30 meters per second, measured at the image plane.
- the laser spot was dithered pe ⁇ endicular to the major displacement direction with about a 100 ⁇ m amplitude.
- the fransfer layers were transfe ⁇ ed as lines onto the receptor substrates, and the intended width of the lines was about 100 ⁇ m.
Abstract
Description
Claims
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- 2002-10-17 CN CNA028240693A patent/CN1599669A/en active Pending
- 2002-10-17 KR KR1020047008478A patent/KR20050037502A/en not_active Application Discontinuation
- 2002-10-17 AU AU2002335842A patent/AU2002335842A1/en not_active Abandoned
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JP2012043805A (en) * | 2003-11-18 | 2012-03-01 | Samsung Mobile Display Co Ltd | Electroluminescent device, and method for manufacturing electroluminescent device including color conversion element |
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Also Published As
Publication number | Publication date |
---|---|
TW200303152A (en) | 2003-08-16 |
JP2005512277A (en) | 2005-04-28 |
CN1599669A (en) | 2005-03-23 |
US20030124265A1 (en) | 2003-07-03 |
EP1453683A1 (en) | 2004-09-08 |
AU2002335842A1 (en) | 2003-06-17 |
KR20050037502A (en) | 2005-04-22 |
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