WO2003030597A3 - Machine and installation for tracing on a support - Google Patents

Machine and installation for tracing on a support Download PDF

Info

Publication number
WO2003030597A3
WO2003030597A3 PCT/FR2002/003388 FR0203388W WO03030597A3 WO 2003030597 A3 WO2003030597 A3 WO 2003030597A3 FR 0203388 W FR0203388 W FR 0203388W WO 03030597 A3 WO03030597 A3 WO 03030597A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
tracing
installation
machine
laser beam
Prior art date
Application number
PCT/FR2002/003388
Other languages
French (fr)
Other versions
WO2003030597A2 (en
Inventor
Regis Nouet
Original Assignee
Automa Tech Sa
Regis Nouet
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automa Tech Sa, Regis Nouet filed Critical Automa Tech Sa
Priority to AU2002347294A priority Critical patent/AU2002347294A1/en
Publication of WO2003030597A2 publication Critical patent/WO2003030597A2/en
Publication of WO2003030597A3 publication Critical patent/WO2003030597A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Abstract

The support is coated with a thin layer consisting of a mixture containing a compound capable of absorbing the energy produced by the impact of said laser beam for wavelengths ranging between 400 and 650 nm. The machine comprises: an assembly for supporting and moving said support, a laser radiation source whereof the wavelength ranges between 400 and 650 nm, deflecting means for sweeping across at least part of the surface of said support, and means for modulating said laser beam in accordance with the pattern to be produced on said support.
PCT/FR2002/003388 2001-10-04 2002-10-04 Machine and installation for tracing on a support WO2003030597A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002347294A AU2002347294A1 (en) 2001-10-04 2002-10-04 Machine and installation for tracing on a support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0112743A FR2830719A1 (en) 2001-10-04 2001-10-04 COMPOSITION FOR MAKING PRINTED CIRCUITS AND MACHINE AND INSTALLATION USING THE SAME
FR01/12743 2001-10-04

Publications (2)

Publication Number Publication Date
WO2003030597A2 WO2003030597A2 (en) 2003-04-10
WO2003030597A3 true WO2003030597A3 (en) 2004-02-26

Family

ID=8867901

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2002/003388 WO2003030597A2 (en) 2001-10-04 2002-10-04 Machine and installation for tracing on a support

Country Status (3)

Country Link
AU (1) AU2002347294A1 (en)
FR (1) FR2830719A1 (en)
WO (1) WO2003030597A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050196710A1 (en) * 2004-03-04 2005-09-08 Semiconductor Energy Laboratory Co., Ltd. Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials
US5353705A (en) * 1992-07-20 1994-10-11 Presstek, Inc. Lithographic printing members having secondary ablation layers for use with laser-discharge imaging apparatus
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
EP1098557A1 (en) * 1999-11-05 2001-05-09 Automa-Tech Laser exposure device for plates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4020762A (en) * 1974-01-17 1977-05-03 Scott Paper Company Laser imaging a lanographic printing plate
US4809022A (en) * 1983-06-27 1989-02-28 Optical Disc Corporation Direct read after write optical storage medium
WO1995007152A1 (en) * 1993-09-08 1995-03-16 Uvtech Systems, Inc. Surface processing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials
US5353705A (en) * 1992-07-20 1994-10-11 Presstek, Inc. Lithographic printing members having secondary ablation layers for use with laser-discharge imaging apparatus
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
EP1098557A1 (en) * 1999-11-05 2001-05-09 Automa-Tech Laser exposure device for plates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ILLYEFALVI-VITEZ Z ET AL: "RECENT ADVANCEMENTS IN MCM-L IMAGING AND VIA GENERATION BY LASER DIRECT WRITING", 1998 PROCEEDINGS OF THE 48TH. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 1998. SEATTLE, WA, MAY 25 - 28, 1998, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY: IEEE, US, 25 May 1998 (1998-05-25), pages 144 - 150, XP000803609, ISBN: 0-7803-4527-4 *

Also Published As

Publication number Publication date
WO2003030597A2 (en) 2003-04-10
AU2002347294A1 (en) 2003-04-14
FR2830719A1 (en) 2003-04-11

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