WO2003029731A3 - Electroosmotic microchannel cooling system - Google Patents
Electroosmotic microchannel cooling system Download PDFInfo
- Publication number
- WO2003029731A3 WO2003029731A3 PCT/US2002/029405 US0229405W WO03029731A3 WO 2003029731 A3 WO2003029731 A3 WO 2003029731A3 US 0229405 W US0229405 W US 0229405W WO 03029731 A3 WO03029731 A3 WO 03029731A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling system
- microchannel cooling
- electroosmotic
- electroosmotic microchannel
- comprised
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
- F04B19/006—Micropumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/45169—Platinum (Pt) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7004468A KR20040048907A (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
CNB028188780A CN1306230C (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
EP02761685A EP1576320A4 (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
AU2002326931A AU2002326931A1 (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
JP2003532907A JP2005525691A (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32615101P | 2001-09-28 | 2001-09-28 | |
US60/326,151 | 2001-09-28 | ||
US10/053,859 US6942018B2 (en) | 2001-09-28 | 2002-01-19 | Electroosmotic microchannel cooling system |
US10/053,859 | 2002-01-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003029731A2 WO2003029731A2 (en) | 2003-04-10 |
WO2003029731A3 true WO2003029731A3 (en) | 2005-07-28 |
Family
ID=26732318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/029405 WO2003029731A2 (en) | 2001-09-28 | 2002-09-16 | Electroosmotic microchannel cooling system |
Country Status (8)
Country | Link |
---|---|
US (5) | US6942018B2 (en) |
EP (2) | EP1576320A4 (en) |
JP (4) | JP2005525691A (en) |
KR (1) | KR20040048907A (en) |
CN (1) | CN1306230C (en) |
AU (1) | AU2002326931A1 (en) |
TW (1) | TW560238B (en) |
WO (1) | WO2003029731A2 (en) |
Families Citing this family (481)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6917637B2 (en) * | 2001-10-12 | 2005-07-12 | Fuji Photo Film Co., Ltd. | Cooling device for laser diodes |
US6575971B2 (en) * | 2001-11-15 | 2003-06-10 | Quantum Cor, Inc. | Cardiac valve leaflet stapler device and methods thereof |
KR20050044865A (en) | 2002-05-08 | 2005-05-13 | 포세온 테크날러지 인코퍼레이티드 | High efficiency solid-state light source and methods of use and manufacture |
US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US7000691B1 (en) * | 2002-07-11 | 2006-02-21 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
US7235164B2 (en) | 2002-10-18 | 2007-06-26 | Eksigent Technologies, Llc | Electrokinetic pump having capacitive electrodes |
US7014835B2 (en) | 2002-08-15 | 2006-03-21 | Velocys, Inc. | Multi-stream microchannel device |
US6881039B2 (en) * | 2002-09-23 | 2005-04-19 | Cooligy, Inc. | Micro-fabricated electrokinetic pump |
US7511443B2 (en) * | 2002-09-26 | 2009-03-31 | Barrett Technology, Inc. | Ultra-compact, high-performance motor controller and method of using same |
DE10246540B4 (en) * | 2002-09-30 | 2012-03-15 | Rehm Thermal Systems Gmbh | Device for cleaning process gas of a reflow soldering machine |
US6888721B1 (en) * | 2002-10-18 | 2005-05-03 | Atec Corporation | Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes |
US7222058B2 (en) * | 2002-10-28 | 2007-05-22 | Fisher-Rosemount Systems, Inc. | Method of modeling and sizing a heat exchanger |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US20040112571A1 (en) * | 2002-11-01 | 2004-06-17 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US20050211418A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US6988535B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Channeled flat plate fin heat exchange system, device and method |
US20040250994A1 (en) * | 2002-11-05 | 2004-12-16 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US20060249279A1 (en) * | 2002-11-05 | 2006-11-09 | Lalit Chordia | Method and apparatus for electronics cooling |
US20060060333A1 (en) * | 2002-11-05 | 2006-03-23 | Lalit Chordia | Methods and apparatuses for electronics cooling |
KR100508682B1 (en) * | 2002-11-20 | 2005-08-17 | 삼성전자주식회사 | Stack chip package of heat emission type using dummy wire |
DE10255325B4 (en) * | 2002-11-27 | 2005-09-29 | Robert Bosch Gmbh | Apparatus and method for determining a boiling point of a liquid |
US7227257B2 (en) * | 2002-12-09 | 2007-06-05 | Intel Corporation | Cooling micro-channels |
US6981849B2 (en) * | 2002-12-18 | 2006-01-03 | Intel Corporation | Electro-osmotic pumps and micro-channels |
DE10302156A1 (en) * | 2003-01-21 | 2004-08-05 | Siemens Ag | Arrangement and method for diagnosing blockages in channels of a micro heat exchanger |
WO2005003668A2 (en) * | 2003-01-28 | 2005-01-13 | Advanced Ceramics Research, Inc. | Microchannel heat exchangers and methods of manufacturing the same |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7293423B2 (en) * | 2004-06-04 | 2007-11-13 | Cooligy Inc. | Method and apparatus for controlling freezing nucleation and propagation |
US7201012B2 (en) * | 2003-01-31 | 2007-04-10 | Cooligy, Inc. | Remedies to prevent cracking in a liquid system |
JP2004276224A (en) * | 2003-03-17 | 2004-10-07 | Toyo Technol Inc | Electro-osmotic pump filled with fiber |
US6861274B2 (en) * | 2003-03-28 | 2005-03-01 | Intel Corporation | Method of making a SDI electroosmotic pump using nanoporous dielectric frit |
US20040190253A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
WO2004090633A2 (en) * | 2003-04-10 | 2004-10-21 | Nikon Corporation | An electro-osmotic element for an immersion lithography apparatus |
JP2005005367A (en) * | 2003-06-10 | 2005-01-06 | Matsushita Electric Ind Co Ltd | Cooler of semiconductor element |
TW591984B (en) * | 2003-07-04 | 2004-06-11 | Sentelic Corp | Micro-circulating flow channel system and its manufacturing method |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US20050039888A1 (en) * | 2003-08-21 | 2005-02-24 | Pfahnl Andreas C. | Two-phase cooling apparatus and method for automatic test equipment |
US7723208B2 (en) * | 2003-09-24 | 2010-05-25 | Intel Corporation | Integrated re-combiner for electroosmotic pumps using porous frits |
US7274106B2 (en) * | 2003-09-24 | 2007-09-25 | Intel Corporation | Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
US6951243B2 (en) * | 2003-10-09 | 2005-10-04 | Sandia National Laboratories | Axially tapered and bilayer microchannels for evaporative coolling devices |
US7084495B2 (en) * | 2003-10-16 | 2006-08-01 | Intel Corporation | Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
US7224059B2 (en) * | 2003-10-21 | 2007-05-29 | Intel Corporation | Method and apparatus for thermo-electric cooling |
US7422910B2 (en) * | 2003-10-27 | 2008-09-09 | Velocys | Manifold designs, and flow control in multichannel microchannel devices |
WO2005043954A2 (en) * | 2003-10-31 | 2005-05-12 | Phoseon Technology, Inc. | Series wiring of highly reliable light sources |
EP1678442B8 (en) * | 2003-10-31 | 2013-06-26 | Phoseon Technology, Inc. | Led light module and manufacturing method |
US6992381B2 (en) * | 2003-10-31 | 2006-01-31 | Intel Corporation | Using external radiators with electroosmotic pumps for cooling integrated circuits |
US20050099775A1 (en) * | 2003-11-12 | 2005-05-12 | Himanshu Pokharna | Pumped liquid cooling for computer systems using liquid metal coolant |
US7269005B2 (en) * | 2003-11-21 | 2007-09-11 | Intel Corporation | Pumped loop cooling with remote heat exchanger and display cooling |
US7105382B2 (en) * | 2003-11-24 | 2006-09-12 | Intel Corporation | Self-aligned electrodes contained within the trenches of an electroosmotic pump |
US7123479B2 (en) * | 2003-12-08 | 2006-10-17 | Intel Corporation | Enhanced flow channel for component cooling in computer systems |
WO2005060593A2 (en) * | 2003-12-10 | 2005-07-07 | Purdue Research Foundation | Micropump for electronics cooling |
US7203064B2 (en) * | 2003-12-12 | 2007-04-10 | Intel Corporation | Heat exchanger with cooling channels having varying geometry |
JP2005191082A (en) * | 2003-12-24 | 2005-07-14 | Toyota Motor Corp | Cooling device for electrical equipment |
US8309112B2 (en) * | 2003-12-24 | 2012-11-13 | Advanced Cardiovascular Systems, Inc. | Coatings for implantable medical devices comprising hydrophilic substances and methods for fabricating the same |
US8333569B2 (en) * | 2003-12-30 | 2012-12-18 | Intel Corporation | Method and apparatus for two-phase start-up operation |
US20050141195A1 (en) * | 2003-12-31 | 2005-06-30 | Himanshu Pokharna | Folded fin microchannel heat exchanger |
US7104313B2 (en) * | 2003-12-31 | 2006-09-12 | Intel Corporation | Apparatus for using fluid laden with nanoparticles for application in electronic cooling |
US7115987B2 (en) * | 2003-12-31 | 2006-10-03 | Intel Corporation | Integrated stacked microchannel heat exchanger and heat spreader |
JP2005242941A (en) * | 2004-02-27 | 2005-09-08 | Hitachi Ltd | Processing member design program and service providing system using the same |
US20080102119A1 (en) * | 2006-11-01 | 2008-05-01 | Medtronic, Inc. | Osmotic pump apparatus and associated methods |
TWI257718B (en) * | 2004-03-18 | 2006-07-01 | Phoseon Technology Inc | Direct cooling of LEDs |
WO2005091392A1 (en) | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
US7265976B1 (en) | 2004-04-19 | 2007-09-04 | Isothermal Systems Research, Inc. | Microchannel thermal management system |
US8077305B2 (en) | 2004-04-19 | 2011-12-13 | Owen Mark D | Imaging semiconductor structures using solid state illumination |
US7559356B2 (en) * | 2004-04-19 | 2009-07-14 | Eksident Technologies, Inc. | Electrokinetic pump driven heat transfer system |
US8430156B2 (en) * | 2004-04-29 | 2013-04-30 | Hewlett-Packard Development Company, L.P. | Liquid loop with multiple pump assembly |
US20050262861A1 (en) * | 2004-05-25 | 2005-12-01 | Weber Richard M | Method and apparatus for controlling cooling with coolant at a subambient pressure |
US7212405B2 (en) * | 2004-05-27 | 2007-05-01 | Intel Corporation | Method and apparatus for providing distributed fluid flows in a thermal management arrangement |
US20050269691A1 (en) * | 2004-06-04 | 2005-12-08 | Cooligy, Inc. | Counter flow micro heat exchanger for optimal performance |
US7091604B2 (en) | 2004-06-04 | 2006-08-15 | Cabot Microelectronics Corporation | Three dimensional integrated circuits |
US20050274139A1 (en) * | 2004-06-14 | 2005-12-15 | Wyatt William G | Sub-ambient refrigerating cycle |
US7218519B2 (en) * | 2004-06-15 | 2007-05-15 | Intel Corporation | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels |
US7265979B2 (en) * | 2004-06-24 | 2007-09-04 | Intel Corporation | Cooling integrated circuits using a cold plate with two phase thin film evaporation |
CN1713376A (en) * | 2004-06-25 | 2005-12-28 | 鸿富锦精密工业(深圳)有限公司 | Liquid-cooled radiator |
US20050285261A1 (en) * | 2004-06-25 | 2005-12-29 | Prasher Ravi S | Thermal management arrangement with channels structurally adapted for varying heat flux areas |
US7458783B1 (en) | 2004-06-30 | 2008-12-02 | Intel Corporation | Method and apparatus for improved pumping medium for electro-osmotic pumps |
US7250327B2 (en) * | 2004-06-30 | 2007-07-31 | Intel Corporation | Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism |
US7396479B1 (en) | 2004-06-30 | 2008-07-08 | Intel Corporation | Method for manufacturing porous silicon |
US7190580B2 (en) * | 2004-07-01 | 2007-03-13 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
US7139172B2 (en) * | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
US8499367B2 (en) * | 2004-07-02 | 2013-08-06 | Createc Consulting, Llc | Cooling garment having phase change material in its extremity portions |
US20060064147A1 (en) * | 2004-07-02 | 2006-03-23 | Almqvist Hans O | Cooling garment having phase change material in its extremity portions |
CN100561602C (en) * | 2004-07-16 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | Heat aggregation element |
JP4305311B2 (en) * | 2004-07-16 | 2009-07-29 | ダイキン工業株式会社 | Micro shunt |
US7234514B2 (en) * | 2004-08-02 | 2007-06-26 | Asml Holding N.V. | Methods and systems for compact, micro-channel laminar heat exchanging |
US7799453B2 (en) * | 2004-08-04 | 2010-09-21 | The Board Of Trustees Of The Leland Stanford Junior University | Fuel cell with electroosmotic pump |
US7104078B2 (en) * | 2004-08-05 | 2006-09-12 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
US7392660B2 (en) * | 2004-08-05 | 2008-07-01 | Isothermal Systems Research, Inc. | Spray cooling system for narrow gap transverse evaporative spray cooling |
ITMI20041652A1 (en) * | 2004-08-13 | 2004-11-13 | Bosari Thermal Man S R L | HEAT EXCHANGER AND METHOD TO PRODUCE IT |
US7149085B2 (en) * | 2004-08-26 | 2006-12-12 | Intel Corporation | Electroosmotic pump apparatus that generates low amount of hydrogen gas |
US20060042785A1 (en) * | 2004-08-27 | 2006-03-02 | Cooligy, Inc. | Pumped fluid cooling system and method |
US7086247B2 (en) * | 2004-08-31 | 2006-08-08 | International Business Machines Corporation | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack |
WO2006065387A1 (en) | 2004-11-03 | 2006-06-22 | Velocys, Inc. | Partial boiling in mini and micro-channels |
AU2011203084B2 (en) * | 2004-11-03 | 2013-09-05 | Velocys, Inc. | Partial boiling in mini and micro-channels |
US8029186B2 (en) * | 2004-11-05 | 2011-10-04 | International Business Machines Corporation | Method for thermal characterization under non-uniform heat load |
US7204298B2 (en) * | 2004-11-24 | 2007-04-17 | Lucent Technologies Inc. | Techniques for microchannel cooling |
JP2006156711A (en) | 2004-11-30 | 2006-06-15 | Mitsubishi Electric Corp | Cooling system for power semiconductor module |
US20060118279A1 (en) * | 2004-12-07 | 2006-06-08 | Eric Stafford | Water cooling system for computer components |
US7274566B2 (en) * | 2004-12-09 | 2007-09-25 | International Business Machines Corporation | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths |
US7193316B2 (en) * | 2004-12-16 | 2007-03-20 | Intel Corporation | Integrated circuit coolant microchannel with movable portion |
JP4201762B2 (en) * | 2004-12-17 | 2008-12-24 | 富士通株式会社 | Electronics |
US20060131003A1 (en) * | 2004-12-20 | 2006-06-22 | Je-Young Chang | Apparatus and associated method for microelectronic cooling |
US7398818B2 (en) | 2004-12-28 | 2008-07-15 | California Institute Of Technology | Fluidic pump for heat management |
KR101288758B1 (en) * | 2004-12-30 | 2013-07-23 | 포세온 테크날러지 인코퍼레이티드 | Methods and systems relating to light sources for use in industrial processes |
US7117931B2 (en) * | 2004-12-31 | 2006-10-10 | Intel Corporation | Systems for low cost liquid cooling |
JP2006215882A (en) * | 2005-02-04 | 2006-08-17 | Hitachi Ltd | Disk array device and liquid cooling device |
US7254957B2 (en) * | 2005-02-15 | 2007-08-14 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
JP4218838B2 (en) * | 2005-02-17 | 2009-02-04 | 株式会社ソニー・コンピュータエンタテインメント | Power supply system, power supply apparatus, and electronic circuit driving method |
JP4381998B2 (en) * | 2005-02-24 | 2009-12-09 | 株式会社日立製作所 | Liquid cooling system |
US20060207752A1 (en) * | 2005-03-15 | 2006-09-21 | Inventec Corporation | Micro liquid cooling device |
WO2006100690A2 (en) * | 2005-03-22 | 2006-09-28 | Bharat Heavy Electricals Limited. | Selectively grooved cold plate for electronics cooling |
US20090136362A1 (en) * | 2005-03-30 | 2009-05-28 | Nano Fusion Technologies Inc. | Electroosmosis Pump and Liquid Feeding Device |
US7073569B1 (en) * | 2005-04-07 | 2006-07-11 | Delphi Technologies, Inc. | Cooling assembly with spirally wound fin |
US7641865B2 (en) * | 2005-04-08 | 2010-01-05 | Velocys | Flow control through plural, parallel connecting channels to/from a manifold |
US7652372B2 (en) | 2005-04-11 | 2010-01-26 | Intel Corporation | Microfluidic cooling of integrated circuits |
US8109324B2 (en) * | 2005-04-14 | 2012-02-07 | Illinois Institute Of Technology | Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling |
US7645368B2 (en) * | 2005-05-10 | 2010-01-12 | Intel Corporation | Orientation independent electroosmotic pump |
US7159404B2 (en) * | 2005-05-26 | 2007-01-09 | Country Pure Foods, Llc | System and method for storing a product in a thermally stabilized state |
US7418998B2 (en) * | 2005-06-30 | 2008-09-02 | Intel Corporation | Chamber sealing valve |
US20070027580A1 (en) * | 2005-07-14 | 2007-02-01 | Ligtenberg Chris A | Thermal control of an electronic device for adapting to ambient conditions |
US20070023291A1 (en) * | 2005-07-15 | 2007-02-01 | Sai Bhavaraju | Metal Trap |
US20070021734A1 (en) * | 2005-07-15 | 2007-01-25 | Sai Bhavaraju | Bioelectro-osmotic engine fluid delivery device |
KR100657965B1 (en) | 2005-08-10 | 2006-12-14 | 삼성전자주식회사 | A microfluidic device for electrochemically regulating the ph of a fluid therein and method for regulating the ph of a fluid in a microfuidic device using the same |
EP1920464A2 (en) * | 2005-08-30 | 2008-05-14 | California Institute of Technology | Method and apparatus for evaporative cooling within microfluidic systems |
US20070047203A1 (en) * | 2005-08-31 | 2007-03-01 | Wen-Han Chen | Integral liquid cooling computer housing |
TWM284950U (en) * | 2005-09-21 | 2006-01-01 | Yen Sun Technology Corp | Heat dissipating device for an electronic device |
TWM284949U (en) * | 2005-09-21 | 2006-01-01 | Yen Sun Technology Corp | Heat dissipating device for an electronic device |
JP2007098226A (en) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | Fluid device |
JP4196983B2 (en) * | 2005-10-07 | 2008-12-17 | セイコーエプソン株式会社 | COOLING DEVICE, PROJECTOR, AND COOLING METHOD |
CN100480609C (en) * | 2005-10-11 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Manufacturing method of thermotube |
US7228888B2 (en) * | 2005-10-13 | 2007-06-12 | International Business Machines Corporation | Rotatable liquid reservoir for computer cooling |
US7548421B2 (en) * | 2005-10-25 | 2009-06-16 | Hewlett-Packard Development Company, L.P. | Impingement cooling of components in an electronic system |
WO2007052377A1 (en) * | 2005-11-02 | 2007-05-10 | Niigata Tlo Corporation | Micropump and micro fluid chip |
ATE445240T1 (en) * | 2005-11-08 | 2009-10-15 | Byd Co Ltd | HEAT DISSIPATION DEVICE FOR A BATTERY PACK AND BATTERY PACK THEREFROM |
US20070114010A1 (en) * | 2005-11-09 | 2007-05-24 | Girish Upadhya | Liquid cooling for backlit displays |
EP1957794B1 (en) | 2005-11-23 | 2014-07-02 | Eksigent Technologies, LLC | Electrokinetic pump designs and drug delivery systems |
US20070119568A1 (en) * | 2005-11-30 | 2007-05-31 | Raytheon Company | System and method of enhanced boiling heat transfer using pin fins |
US20070119572A1 (en) * | 2005-11-30 | 2007-05-31 | Raytheon Company | System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements |
US7788073B2 (en) * | 2005-12-13 | 2010-08-31 | Linde Aktiengesellschaft | Processes for determining the strength of a plate-type exchanger, for producing a plate-type heat exchanger, and for producing a process engineering system |
DE102005060635A1 (en) | 2005-12-13 | 2007-06-14 | Siemens Ag | Control method for cooling a technical system |
EP1970080B1 (en) * | 2005-12-15 | 2013-11-06 | Laboratorios CAIR Espana, SL | Device for adjusting the temperature of a physiological fluid |
US7417858B2 (en) * | 2005-12-21 | 2008-08-26 | Sun Microsystems, Inc. | Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits |
US7310231B2 (en) * | 2005-12-21 | 2007-12-18 | Sun Microsystems, Inc. | Heat sink having magnet array for magneto-hydrodynamic hot spot cooling |
US7245495B2 (en) * | 2005-12-21 | 2007-07-17 | Sun Microsystems, Inc. | Feedback controlled magneto-hydrodynamic heat sink |
US7628198B2 (en) * | 2005-12-21 | 2009-12-08 | Sun Microsystems, Inc. | Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid |
US7614445B2 (en) * | 2005-12-21 | 2009-11-10 | Sun Microsystems, Inc. | Enhanced heat pipe cooling with MHD fluid flow |
US7642527B2 (en) * | 2005-12-30 | 2010-01-05 | Phoseon Technology, Inc. | Multi-attribute light effects for use in curing and other applications involving photoreactions and processing |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
US7289326B2 (en) * | 2006-02-02 | 2007-10-30 | Sun Microsystems, Inc. | Direct contact cooling liquid embedded package for a central processor unit |
EP1989935A4 (en) * | 2006-02-16 | 2012-07-04 | Cooligy Inc | Liquid cooling loops for server applications |
DE102006008033A1 (en) * | 2006-02-21 | 2007-09-06 | Siemens Ag Österreich | Heat sink with coolant flowing through the pipe |
TWI291752B (en) * | 2006-02-27 | 2007-12-21 | Siliconware Precision Industries Co Ltd | Semiconductor package with heat dissipating device and fabrication method thereof |
US7792420B2 (en) * | 2006-03-01 | 2010-09-07 | Nikon Corporation | Focus adjustment device, imaging device and focus adjustment method |
US20070209782A1 (en) * | 2006-03-08 | 2007-09-13 | Raytheon Company | System and method for cooling a server-based data center with sub-ambient cooling |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
WO2007120530A2 (en) * | 2006-03-30 | 2007-10-25 | Cooligy, Inc. | Integrated liquid to air conduction module |
US7870893B2 (en) * | 2006-04-06 | 2011-01-18 | Oracle America, Inc. | Multichannel cooling system with magnetohydrodynamic pump |
TWI403883B (en) * | 2006-04-11 | 2013-08-01 | Cooligy Inc | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20070285894A1 (en) * | 2006-04-25 | 2007-12-13 | Mehdi Hatamian | Heat sink |
US20070246106A1 (en) | 2006-04-25 | 2007-10-25 | Velocys Inc. | Flow Distribution Channels To Control Flow in Process Channels |
US7908874B2 (en) * | 2006-05-02 | 2011-03-22 | Raytheon Company | Method and apparatus for cooling electronics with a coolant at a subambient pressure |
US20070256825A1 (en) * | 2006-05-04 | 2007-11-08 | Conway Bruce R | Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
US8364320B2 (en) * | 2006-05-19 | 2013-01-29 | ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H. | Method for the highly precise regulation of load-variable heat sources or heat sinks, and device for controlling the temperature of a dynamic heat source, especially pump diodes for solid-state lasers |
WO2007144024A1 (en) * | 2006-06-15 | 2007-12-21 | Sebalis | Thermal exchange device |
US20080006396A1 (en) * | 2006-06-30 | 2008-01-10 | Girish Upadhya | Multi-stage staggered radiator for high performance liquid cooling applications |
US20080013278A1 (en) * | 2006-06-30 | 2008-01-17 | Fredric Landry | Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles |
KR100737162B1 (en) * | 2006-08-11 | 2007-07-06 | 동부일렉트로닉스 주식회사 | Semiconductor device and fabricating method thereof |
US8159825B1 (en) | 2006-08-25 | 2012-04-17 | Hypres Inc. | Method for fabrication of electrical contacts to superconducting circuits |
DE102006040187B4 (en) * | 2006-08-28 | 2009-12-10 | Airbus Deutschland Gmbh | Cooling system and cooling method for cooling components of power electronics |
US20080047688A1 (en) * | 2006-08-28 | 2008-02-28 | Airbus Deutschland Gmbh | Cooling System And Cooling Method For Cooling Components Of A Power Electronics |
US7672129B1 (en) | 2006-09-19 | 2010-03-02 | Sun Microsystems, Inc. | Intelligent microchannel cooling |
US8561673B2 (en) * | 2006-09-26 | 2013-10-22 | Olantra Fund X L.L.C. | Sealed self-contained fluidic cooling device |
JP4893195B2 (en) | 2006-09-27 | 2012-03-07 | カシオ計算機株式会社 | Liquid feeder connection structure, fuel cell type power generator and electronic device |
US7453690B2 (en) * | 2006-09-27 | 2008-11-18 | International Business Machines Corporation | Electronic component interconnection and assembly |
US7999375B2 (en) * | 2006-10-11 | 2011-08-16 | Formfactor, Inc. | Electronic device with integrated micromechanical contacts and cooling system |
US20080087456A1 (en) * | 2006-10-13 | 2008-04-17 | Onscreen Technologies, Inc. | Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor |
US20080093052A1 (en) * | 2006-10-20 | 2008-04-24 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
US8037927B2 (en) * | 2006-11-16 | 2011-10-18 | CUI Global, Inc. | Cooling device for an electronic component |
US8011421B2 (en) * | 2006-12-12 | 2011-09-06 | Honeywell International Inc. | System and method that dissipate heat from an electronic device |
US8067091B2 (en) | 2006-12-20 | 2011-11-29 | Graftech International Holdings Inc. | Dimensionally stable, leak-free graphite substrate |
CN200994225Y (en) * | 2006-12-29 | 2007-12-19 | 帛汉股份有限公司 | Circuit substrate structure |
US7969734B2 (en) * | 2007-01-03 | 2011-06-28 | General Electric Company | Unique cooling scheme for advanced thermal management of high flux electronics |
US8056615B2 (en) * | 2007-01-17 | 2011-11-15 | Hamilton Sundstrand Corporation | Evaporative compact high intensity cooler |
US7867592B2 (en) | 2007-01-30 | 2011-01-11 | Eksigent Technologies, Inc. | Methods, compositions and devices, including electroosmotic pumps, comprising coated porous surfaces |
US8030754B2 (en) * | 2007-01-31 | 2011-10-04 | Hewlett-Packard Development Company, L.P. | Chip cooling channels formed in wafer bonding gap |
JP2008191996A (en) * | 2007-02-06 | 2008-08-21 | Hitachi Ltd | Disk array device and electronic apparatus |
US8528628B2 (en) * | 2007-02-08 | 2013-09-10 | Olantra Fund X L.L.C. | Carbon-based apparatus for cooling of electronic devices |
JP4694514B2 (en) * | 2007-02-08 | 2011-06-08 | トヨタ自動車株式会社 | Semiconductor device cooling structure |
US8651172B2 (en) * | 2007-03-22 | 2014-02-18 | Raytheon Company | System and method for separating components of a fluid coolant for cooling a structure |
US20120267066A1 (en) * | 2007-03-27 | 2012-10-25 | Hun Chol Kim | Heat pipe, heat pipe system, and related method for long distance |
KR100865718B1 (en) * | 2007-03-27 | 2008-10-28 | 김훈철 | Heat Pipe for Long Distance |
US8734499B2 (en) * | 2007-03-29 | 2014-05-27 | Cardiac Pacemakers, Inc. | Systems and methods for thermal neuroinhibition |
US8950468B2 (en) * | 2007-05-11 | 2015-02-10 | The Boeing Company | Cooling system for aerospace vehicle components |
CA2686564C (en) | 2007-05-15 | 2018-04-17 | American Power Conversion Corporation | Methods and systems for managing facility power and cooling |
US7460369B1 (en) * | 2007-06-01 | 2008-12-02 | Advanced Micro Devices, Inc. | Counterflow microchannel cooler for integrated circuits |
JP4520487B2 (en) * | 2007-06-15 | 2010-08-04 | 株式会社日立製作所 | Cooling device for electronic equipment |
US20080310116A1 (en) * | 2007-06-15 | 2008-12-18 | O'connor Kurt F | Heatsink having an internal plenum |
US9656009B2 (en) | 2007-07-11 | 2017-05-23 | California Institute Of Technology | Cardiac assist system using helical arrangement of contractile bands and helically-twisting cardiac assist device |
CA2693059A1 (en) * | 2007-07-13 | 2009-01-22 | The Board Of Trustees Of The Leland Stanford Junior University | Method and apparatus using electric field for improved biological assays |
US7843695B2 (en) * | 2007-07-20 | 2010-11-30 | Honeywell International Inc. | Apparatus and method for thermal management using vapor chamber |
CN101360412B (en) * | 2007-08-03 | 2011-01-19 | 富准精密工业(深圳)有限公司 | Micro liquid cooling device and micro-liquid-drop generator adopted thereby |
TW200912621A (en) * | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9453691B2 (en) | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US7712325B2 (en) * | 2007-08-18 | 2010-05-11 | Leonid A Shapiro | Modular semi-conservative and self-scaling electronics cooling system |
US7885063B2 (en) * | 2007-08-20 | 2011-02-08 | Nvidia Corporation | Circuit board heat exchanger carrier system and method |
KR101387549B1 (en) * | 2007-09-03 | 2014-04-24 | 삼성전자주식회사 | Printed circuit board and method of manufacturing the printed circuit board, and memory module and method of manufacturing the memory module |
JP2010539701A (en) * | 2007-09-17 | 2010-12-16 | アナトリエヴィチ ポミトキン,ワディム | Heat spreader for heat pipe cooler and water cooler |
US7921655B2 (en) * | 2007-09-21 | 2011-04-12 | Raytheon Company | Topping cycle for a sub-ambient cooling system |
US8253076B2 (en) * | 2007-10-29 | 2012-08-28 | Smiths Medical Asd, Inc. | Respiratory system heater unit |
US8058724B2 (en) * | 2007-11-30 | 2011-11-15 | Ati Technologies Ulc | Holistic thermal management system for a semiconductor chip |
US20090139698A1 (en) * | 2007-12-03 | 2009-06-04 | Watronx, Inc. (Aka Onscreen Technologies, Inc.) | Carbon-based waterlock with attached heat-exchanger for cooling of electronic devices |
WO2009076134A1 (en) | 2007-12-11 | 2009-06-18 | Eksigent Technologies, Llc | Electrokinetic pump with fixed stroke volume |
US9157687B2 (en) * | 2007-12-28 | 2015-10-13 | Qcip Holdings, Llc | Heat pipes incorporating microchannel heat exchangers |
US7755186B2 (en) * | 2007-12-31 | 2010-07-13 | Intel Corporation | Cooling solutions for die-down integrated circuit packages |
WO2009094236A2 (en) * | 2008-01-11 | 2009-07-30 | California Institute Of Technology | Autonomous electrochemical actuation of microfluidic circuits |
GB0802450D0 (en) * | 2008-02-08 | 2008-03-19 | Osmotex As | Electro-osmotic pump |
US8173080B2 (en) * | 2008-02-14 | 2012-05-08 | Illumina, Inc. | Flow cells and manifolds having an electroosmotic pump |
US7934386B2 (en) * | 2008-02-25 | 2011-05-03 | Raytheon Company | System and method for cooling a heat generating structure |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US20090225514A1 (en) * | 2008-03-10 | 2009-09-10 | Adrian Correa | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US7883266B2 (en) * | 2008-03-24 | 2011-02-08 | International Business Machines Corporation | Method and apparatus for defect detection in a cold plate |
US7907409B2 (en) * | 2008-03-25 | 2011-03-15 | Raytheon Company | Systems and methods for cooling a computing component in a computing rack |
JP2009281721A (en) * | 2008-04-23 | 2009-12-03 | Hitachi Cable Ltd | Phase conversion cooler and mobile device |
CN102016483A (en) * | 2008-04-29 | 2011-04-13 | 开利公司 | Modular heat exchanger |
US20090290305A1 (en) * | 2008-05-20 | 2009-11-26 | Wei Yang | Entrainment heatsink using engine bleed air |
EP2131168A1 (en) * | 2008-06-04 | 2009-12-09 | Siemens Aktiengesellschaft | Method and device for detecting capacity changes in a fluid and turbine |
KR20100008868A (en) * | 2008-07-17 | 2010-01-27 | 삼성전자주식회사 | Head chip for ink jet type image forming apparatus |
TWM348267U (en) * | 2008-07-25 | 2009-01-01 | Micro Star Int Co Ltd | Heat conducting pipe and heat dissipation system using the same |
US7817422B2 (en) * | 2008-08-18 | 2010-10-19 | General Electric Company | Heat sink and cooling and packaging stack for press-packages |
US8120915B2 (en) * | 2008-08-18 | 2012-02-21 | General Electric Company | Integral heat sink with spiral manifolds |
US20100052157A1 (en) * | 2008-08-29 | 2010-03-04 | Micron Technology, Inc. | Channel for a semiconductor die and methods of formation |
JP5610679B2 (en) * | 2008-09-01 | 2014-10-22 | 栗田工業株式会社 | Liquid heater and liquid heating method |
AU2009298517B2 (en) | 2008-09-30 | 2015-09-24 | Forced Physics Llc | Method and apparatus for control of fluid temperature and flow |
CA2740222C (en) | 2008-11-26 | 2015-11-17 | Jonathan Posner | Electroosmotic pump with improved gas management |
US20100147492A1 (en) * | 2008-12-10 | 2010-06-17 | Ronald David Conry | IGBT cooling method |
JP2010161184A (en) * | 2009-01-08 | 2010-07-22 | Hitachi Ltd | Semiconductor device |
US10066977B2 (en) * | 2009-01-26 | 2018-09-04 | Canon U.S. Life Sciences, Inc. | Microfluidic flow monitoring |
DE102009000514A1 (en) | 2009-01-30 | 2010-08-26 | Robert Bosch Gmbh | Composite component and method for producing a composite component |
US8150668B2 (en) * | 2009-02-11 | 2012-04-03 | Livermore Software Technology Corporation | Thermal fluid-structure interaction simulation in finite element analysis |
US7898807B2 (en) * | 2009-03-09 | 2011-03-01 | General Electric Company | Methods for making millichannel substrate, and cooling device and apparatus using the substrate |
TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
WO2010124263A2 (en) * | 2009-04-24 | 2010-10-28 | Old Dominion University Research Foundation | Electroosmotic pump |
US8232637B2 (en) * | 2009-04-30 | 2012-07-31 | General Electric Company | Insulated metal substrates incorporating advanced cooling |
US8369090B2 (en) * | 2009-05-12 | 2013-02-05 | Iceotope Limited | Cooled electronic system |
JP5473403B2 (en) * | 2009-05-25 | 2014-04-16 | キヤノン株式会社 | Liquid drive device |
US20100304258A1 (en) * | 2009-05-26 | 2010-12-02 | Chan Alistair K | System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials |
US20100304259A1 (en) * | 2009-05-26 | 2010-12-02 | Searete Llc. A Limited Liability Corporation Of The State Of Delaware | Method of operating an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials during charge and discharge |
US9065159B2 (en) * | 2009-05-26 | 2015-06-23 | The Invention Science Fund I, Llc | System and method of altering temperature of an electrical energy storage device or an electrochemical energy generation device using microchannels |
US8802266B2 (en) * | 2009-05-26 | 2014-08-12 | The Invention Science Fund I, Llc | System for operating an electrical energy storage device or an electrochemical energy generation device using microchannels based on mobile device states and vehicle states |
US8715875B2 (en) * | 2009-05-26 | 2014-05-06 | The Invention Science Fund I, Llc | System and method of operating an electrical energy storage device or an electrochemical energy generation device using thermal conductivity materials based on mobile device states and vehicle states |
US8101293B2 (en) * | 2009-05-26 | 2012-01-24 | The Invention Science Fund I, Llc | System for altering temperature of an electrical energy storage device or an electrochemical energy generation device using high thermal conductivity materials based on states of the device |
US20100314093A1 (en) * | 2009-06-12 | 2010-12-16 | Gamal Refai-Ahmed | Variable heat exchanger |
US20100326627A1 (en) * | 2009-06-30 | 2010-12-30 | Schon Steven G | Microelectronics cooling system |
US9599407B2 (en) * | 2009-07-29 | 2017-03-21 | Tokitae Llc | System and structure for heating or sterilizing a liquid stream |
US9930898B2 (en) * | 2009-07-29 | 2018-04-03 | Tokitae Llc | Pasteurization system and method |
US8425965B2 (en) * | 2009-07-29 | 2013-04-23 | Tokitae Llc | Method for heating or sterilizing a liquid stream |
US20110024150A1 (en) * | 2009-07-31 | 2011-02-03 | General Electric Company | Cooling system and method for current carrying conductor |
JP5306134B2 (en) * | 2009-09-28 | 2013-10-02 | 京セラ株式会社 | Liquid feeding device |
US20110073292A1 (en) * | 2009-09-30 | 2011-03-31 | Madhav Datta | Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems |
US20110097215A1 (en) * | 2009-10-23 | 2011-04-28 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Flexible Solid-State Pump Constructed of Surface-Modified Glass Fiber Filters and Metal Mesh Electrodes |
EP2610014B1 (en) * | 2010-01-27 | 2018-01-03 | Heraeus Noblelight Fusion UV Inc. | Micro-channel-cooled high heat load light emitting device |
KR101813117B1 (en) | 2010-03-09 | 2017-12-29 | 보드 오브 리전츠 더 유니버시티 오브 텍사스 시스템 | Electro-osmotic pumps, systems, methods, and compositions |
TWI395355B (en) * | 2010-05-25 | 2013-05-01 | Ruei Jen Chen | Thermo-electric conversion module |
EP2577419A1 (en) | 2010-05-26 | 2013-04-10 | Tessera, Inc. | Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices |
EP2395549B1 (en) * | 2010-06-10 | 2014-06-25 | Imec | Device for cooling integrated circuits |
US8218320B2 (en) | 2010-06-29 | 2012-07-10 | General Electric Company | Heat sinks with C-shaped manifolds and millichannel cooling |
US9125655B2 (en) | 2010-07-16 | 2015-09-08 | California Institute Of Technology | Correction and optimization of wave reflection in blood vessels |
US8077460B1 (en) | 2010-07-19 | 2011-12-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same |
KR20130106770A (en) * | 2010-07-26 | 2013-09-30 | 하마마츠 포토닉스 가부시키가이샤 | Method for manufacturing semiconductor device |
IT1401386B1 (en) * | 2010-07-30 | 2013-07-18 | Eurotech S P A | LIQUID COOLING DEVICE FOR ELECTRONIC BOARDS, IN PARTICULAR FOR HIGH PERFORMANCE PROCESSING UNITS |
JP5889306B2 (en) * | 2010-08-23 | 2016-03-22 | ライフ テクノロジーズ コーポレーション | Temperature control method for chemical detection system |
US8199505B2 (en) | 2010-09-13 | 2012-06-12 | Toyota Motor Engineering & Manufacturing Norh America, Inc. | Jet impingement heat exchanger apparatuses and power electronics modules |
US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
KR101667251B1 (en) * | 2010-09-17 | 2016-10-18 | 대우조선해양 주식회사 | Cooling System for Ships Using Ballast Water |
US8353332B2 (en) | 2010-10-13 | 2013-01-15 | Reid Aarne H | Integrated electronics cooling device |
US8467168B2 (en) | 2010-11-11 | 2013-06-18 | Tessera, Inc. | Electronic system changeable to accommodate an EHD air mover or mechanical air mover |
US9417013B2 (en) | 2010-11-12 | 2016-08-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat transfer systems including heat conducting composite materials |
US8427832B2 (en) | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
JP5605438B2 (en) * | 2011-01-12 | 2014-10-15 | トヨタ自動車株式会社 | Cooler |
US8712598B2 (en) * | 2011-01-14 | 2014-04-29 | Microsoft Corporation | Adaptive flow for thermal cooling of devices |
US8391008B2 (en) | 2011-02-17 | 2013-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics modules and power electronics module assemblies |
US9099426B2 (en) * | 2011-02-23 | 2015-08-04 | University Of Maryland, College Park | Trench-assisted thermoelectric isothermalization of power switching chips |
US8482919B2 (en) | 2011-04-11 | 2013-07-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics card assemblies, power electronics modules, and power electronics devices |
EP2704759A4 (en) | 2011-05-05 | 2015-06-03 | Eksigent Technologies Llc | Gel coupling for electrokinetic delivery systems |
US8902591B2 (en) * | 2011-05-11 | 2014-12-02 | Microjet Technology Co., Ltd. | Heat dissipation device |
TWI438388B (en) * | 2011-05-20 | 2014-05-21 | Wistron Corp | Liquid cooling device |
US8844551B2 (en) | 2011-06-16 | 2014-09-30 | Hamilton Sundstrand Corporation | Leak detection logic for closed-volume system |
US20150192368A1 (en) * | 2011-06-27 | 2015-07-09 | Ebullient, Llc | Method of condensing vapor in two-phase flow within a cooling apparatus |
US9061382B2 (en) | 2011-07-25 | 2015-06-23 | International Business Machines Corporation | Heat sink structure with a vapor-permeable membrane for two-phase cooling |
US9069532B2 (en) | 2011-07-25 | 2015-06-30 | International Business Machines Corporation | Valve controlled, node-level vapor condensation for two-phase heat sink(s) |
US8564952B2 (en) | 2011-07-25 | 2013-10-22 | International Business Machines Corporation | Flow boiling heat sink structure with vapor venting and condensing |
US10006720B2 (en) | 2011-08-01 | 2018-06-26 | Teledyne Scientific & Imaging, Llc | System for using active and passive cooling for high power thermal management |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
CN102354906B (en) * | 2011-09-19 | 2013-04-24 | 重庆师范大学 | Expansion refrigeration system of high-power semiconductor laser |
US9069039B1 (en) * | 2011-09-30 | 2015-06-30 | Emc Corporation | Power measurement transducer |
KR101225704B1 (en) * | 2011-11-04 | 2013-01-23 | 잘만테크 주식회사 | Evaporator for the looped heat pipe system and method for manufacturing thereof |
US11092977B1 (en) | 2017-10-30 | 2021-08-17 | Zane Coleman | Fluid transfer component comprising a film with fluid channels |
KR101354814B1 (en) * | 2011-12-14 | 2014-01-27 | 삼성전기주식회사 | Semiconductor package |
US8603834B2 (en) * | 2011-12-15 | 2013-12-10 | General Electric Company | Actuation of valves using electroosmotic pump |
US20140367073A1 (en) * | 2011-12-20 | 2014-12-18 | Osmotex Ag | Liquid transport membrane |
CN104137105B (en) | 2011-12-22 | 2017-07-11 | 施耐德电气It公司 | Impact analysis on temporal event to the temperature in data center |
WO2013100913A1 (en) * | 2011-12-27 | 2013-07-04 | Intel Corporation | Transient thermal management systems for semiconductor devices |
US9303925B2 (en) | 2012-02-17 | 2016-04-05 | Hussmann Corporation | Microchannel suction line heat exchanger |
US8913383B1 (en) * | 2012-02-28 | 2014-12-16 | Heatmine LLC | Heat capture system for electrical components providing electromagnetic pulse protection |
US9179575B1 (en) * | 2012-03-13 | 2015-11-03 | Rockwell Collins, Inc. | MEMS based device for phase-change autonomous transport of heat (PATH) |
EP2848101B1 (en) | 2012-05-07 | 2019-04-10 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
US9189037B2 (en) | 2012-06-12 | 2015-11-17 | Globalfoundries Inc. | Optimizing heat transfer in 3-D chip-stacks |
KR101540146B1 (en) * | 2012-06-22 | 2015-07-28 | 삼성전기주식회사 | Heat dissipation system for power module |
US9139416B2 (en) * | 2012-08-01 | 2015-09-22 | University Of South Carolina | Microfluidic devices for the generation of nano-vapor bubbles and their methods of manufacture and use |
US9035452B2 (en) | 2012-08-07 | 2015-05-19 | General Electric Company | Electronic device cooling with autonomous fluid routing and method of assembly |
AU2012390299B2 (en) | 2012-09-21 | 2017-06-01 | Schneider Electric It Corporation | Method and apparatus for characterizing thermal transient performance |
US8848371B2 (en) * | 2012-10-01 | 2014-09-30 | Hamilton Sundstrand Corporation | Dielectrophoretic restriction to prevent vapor backflow |
BR112015007173B1 (en) * | 2012-10-01 | 2022-03-29 | Forced Physics Llc | Microchannel layers for air cooling and methods for cooling |
US9038407B2 (en) | 2012-10-03 | 2015-05-26 | Hamilton Sundstrand Corporation | Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
US9243726B2 (en) | 2012-10-03 | 2016-01-26 | Aarne H. Reid | Vacuum insulated structure with end fitting and method of making same |
US8867210B2 (en) | 2012-10-31 | 2014-10-21 | Deere & Company | Cooling apparatus for an electrical substrate |
US9709324B1 (en) * | 2012-11-09 | 2017-07-18 | Rockwell Collins, Inc. | Liquid cooling with parasitic phase-change pumps |
US9036353B2 (en) | 2012-11-26 | 2015-05-19 | Northrop Grumman Systems Corporation | Flexible thermal interface for electronics |
WO2014105014A1 (en) | 2012-12-27 | 2014-07-03 | Schneider Electric It Corporation | Systems and methods of visualizing airflow |
US8643173B1 (en) | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US8970114B2 (en) | 2013-02-01 | 2015-03-03 | Lam Research Corporation | Temperature controlled window of a plasma processing chamber component |
US9196935B2 (en) * | 2013-03-12 | 2015-11-24 | Gm Global Technology Operations, Llc | Micro-channel cooling fin design based on an equivalent temperature gradient |
US20140262161A1 (en) * | 2013-03-12 | 2014-09-18 | David Lind Weigand | Method and apparatus for dynamically cooling electronic devices |
JP5893213B2 (en) | 2013-04-02 | 2016-03-23 | 三菱電機株式会社 | Semiconductor device |
US9865907B2 (en) | 2013-04-23 | 2018-01-09 | Xiaodong Xiang | Cooling mechanism for batteries using L-V phase change materials |
KR101449293B1 (en) * | 2013-06-03 | 2014-10-08 | 현대자동차주식회사 | Cooling and heating cup holder |
US9307680B2 (en) | 2013-06-12 | 2016-04-05 | Deere & Company | Cooled electronic part enclosure |
US9706655B2 (en) * | 2013-07-09 | 2017-07-11 | Oleson Convergent Solutions Llc | Packaging for high power integrated circuits and infrared emitter arrays |
KR101609239B1 (en) | 2013-07-31 | 2016-04-05 | 주식회사 엘지화학 | Device for Heating the Battery Pack Using Phase Change Material and Temperature Control Apparatus for the Battery Pack Comprising the Same |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
WO2015033141A1 (en) * | 2013-09-04 | 2015-03-12 | Bae Systems Plc | Conduit system |
US20150068707A1 (en) * | 2013-09-09 | 2015-03-12 | Nec Corporation | Electronic component cooling apparatus |
US20150077937A1 (en) * | 2013-09-13 | 2015-03-19 | Alcatel Lucent | Apparatus for cooling board mounted optical modules |
KR101540442B1 (en) * | 2013-10-04 | 2015-07-30 | 삼성중공업 주식회사 | Wind power generator |
US10148155B2 (en) | 2013-12-04 | 2018-12-04 | Barrett Technology, Llc | Method and apparatus for connecting an ultracompact, high-performance motor controller to an ultracompact, high-performance brushless DC motor |
US20150195951A1 (en) * | 2014-01-06 | 2015-07-09 | Ge Aviation Systems Llc | Cooled electronic assembly and cooling device |
US9230879B2 (en) * | 2014-01-12 | 2016-01-05 | Gerald Ho Kim | Thermal management in electronic apparatus with phase-change material and silicon heat sink |
CN103776215B (en) * | 2014-02-14 | 2015-09-30 | 张高博 | A kind of circulation fluid system optimization method based on device side |
US9463918B2 (en) | 2014-02-20 | 2016-10-11 | Aarne H. Reid | Vacuum insulated articles and methods of making same |
US10042402B2 (en) * | 2014-04-07 | 2018-08-07 | Google Llc | Systems and methods for thermal management of a chassis-coupled modular mobile electronic device |
US9263366B2 (en) * | 2014-05-30 | 2016-02-16 | International Business Machines Corporation | Liquid cooling of semiconductor chips utilizing small scale structures |
US9320171B2 (en) | 2014-06-05 | 2016-04-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux |
JP6123741B2 (en) * | 2014-06-20 | 2017-05-10 | トヨタ自動車株式会社 | Cooler |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
CN104180554B (en) * | 2014-08-26 | 2016-03-23 | 四川新健康成生物股份有限公司 | A kind of energy-saving full-automatic Biochemical Analyzer reagent chamber refrigerating method |
JP6394267B2 (en) * | 2014-10-15 | 2018-09-26 | 富士通株式会社 | Cooling device and electronic equipment |
US10415903B2 (en) * | 2014-10-15 | 2019-09-17 | Hamilton Sundstrand Corporation | Prevention of cooling flow blockage |
US20160120059A1 (en) | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Two-phase cooling system |
FI126380B (en) * | 2014-10-27 | 2016-11-15 | Kone Corp | operating unit |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9504186B2 (en) * | 2014-11-14 | 2016-11-22 | Caterpillar Inc. | Heatpipe imbedded coldplate enhancing IGBT heat spreading |
US20160150678A1 (en) * | 2014-11-22 | 2016-05-26 | Gerald Ho Kim | Silicon Cooling Plate With An Integrated PCB |
US20170303431A1 (en) * | 2014-11-22 | 2017-10-19 | Gerald Ho Kim | Silicon Cooling Plate With An Integrated PCB |
CN104655042B (en) * | 2015-01-16 | 2017-05-24 | 大连理工大学 | Contact-type surface profile meter with function of realizing sample temperature change |
JP6095237B2 (en) * | 2015-01-26 | 2017-03-15 | 日立金属Mmcスーパーアロイ株式会社 | Ni-base alloy having excellent high-temperature creep characteristics and gas turbine member using this Ni-base alloy |
US9928317B2 (en) * | 2015-02-02 | 2018-03-27 | Mentor Graphics Corporation | Additive design of heat sinks |
US10175005B2 (en) * | 2015-03-30 | 2019-01-08 | Infinera Corporation | Low-cost nano-heat pipe |
US20160330866A1 (en) * | 2015-05-07 | 2016-11-10 | Cooler Master Technology Inc. | Liquid cooling system |
EP3179192A1 (en) * | 2015-12-10 | 2017-06-14 | Linde Aktiengesellschaft | Method for determining a state of a heat exchanger device |
WO2016188635A1 (en) * | 2015-05-28 | 2016-12-01 | Linde Aktiengesellschaft | Method for determining the state of a heat exchanger device |
WO2016196929A2 (en) * | 2015-06-04 | 2016-12-08 | Raytheon Company | Micro-hoses for integrated circuit and device level cooling |
CN104949544B (en) * | 2015-06-25 | 2017-08-01 | 北京建筑大学 | A kind of electric osmose formula total-heat exchanger |
CN104930779A (en) * | 2015-06-25 | 2015-09-23 | 福建德兴节能科技有限公司 | Low-energy-consumption circulating cooling water system used for removing backwater excess pressure and transformation method |
CN105116009B (en) * | 2015-08-11 | 2017-12-08 | 上海原动力通信科技有限公司 | One kind heating analogue means and heat pipe heat radiation device for detecting performance |
US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
JP6107905B2 (en) * | 2015-09-09 | 2017-04-05 | 株式会社富士通ゼネラル | Heat exchanger |
WO2017059382A1 (en) | 2015-09-30 | 2017-04-06 | Microfabrica Inc. | Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems |
US11003808B2 (en) * | 2015-09-30 | 2021-05-11 | Siemens Industry Software Inc. | Subtractive design for heat sink improvement |
US10065256B2 (en) | 2015-10-30 | 2018-09-04 | Concept Group Llc | Brazing systems and methods |
CN105299938B (en) * | 2015-11-06 | 2017-11-14 | 中国电子科技集团公司第二十九研究所 | A kind of compact refrigeration system based on micro-channel heat exchanger |
US10677536B2 (en) * | 2015-12-04 | 2020-06-09 | Teledyne Scientific & Imaging, Llc | Osmotic transport system for evaporative cooling |
US9847275B2 (en) | 2015-12-21 | 2017-12-19 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
US9941189B2 (en) | 2015-12-21 | 2018-04-10 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
US10096537B1 (en) | 2015-12-31 | 2018-10-09 | Microfabrica Inc. | Thermal management systems, methods for making, and methods for using |
TWI582924B (en) * | 2016-02-02 | 2017-05-11 | 宏碁股份有限公司 | Heat dissipation module and electronic device |
CA3052947C (en) * | 2016-02-07 | 2020-04-28 | Display Logic USA Inc. | Display device with optically clear fluid disposed between display panel and display cover |
CN109154641B (en) | 2016-03-04 | 2021-09-17 | 概念集团有限责任公司 | Vacuum insulation article with reflective material enhancement |
US10032694B2 (en) * | 2016-03-08 | 2018-07-24 | Toyota Motor Engineering & Manufacturing North America, Inc | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system |
US10674641B2 (en) * | 2016-04-04 | 2020-06-02 | Hamilton Sundstrand Corporation | Immersion cooling systems and methods |
CN108700918B (en) | 2016-04-06 | 2021-12-07 | 惠普发展公司,有限责任合伙企业 | Cover for an appliance |
US20170325327A1 (en) * | 2016-04-07 | 2017-11-09 | Massachusetts Institute Of Technology | Printed circuit board for high power components |
CN106016882B (en) * | 2016-07-14 | 2018-10-23 | 汪辉 | A kind of anti-drying automatic water-cooling cooling structure |
US10753228B2 (en) | 2016-08-11 | 2020-08-25 | General Electric Company | System for removing heat from turbomachinery components |
KR102478547B1 (en) | 2016-08-26 | 2022-12-16 | 이너테크 아이피 엘엘씨 | Cooling system and method using a flat tube heat exchanger with single-phase fluid and counterflow circuits |
US10018427B2 (en) * | 2016-09-08 | 2018-07-10 | Taiwan Microloops Corp. | Vapor chamber structure |
CN106328615B (en) * | 2016-09-22 | 2019-01-08 | 嘉兴学院 | It is a kind of for cooling down the aeroge electroosmotic pump of microelectronic chip |
US10058007B2 (en) * | 2016-09-26 | 2018-08-21 | Asia Vital Components Co., Ltd. | Water-cooling radiator unit and water-cooling module using same |
US10139168B2 (en) * | 2016-09-26 | 2018-11-27 | International Business Machines Corporation | Cold plate with radial expanding channels for two-phase cooling |
US9986661B2 (en) * | 2016-09-26 | 2018-05-29 | Asia Vital Components Co., Ltd. | Water cooling heat radiation device and module thereof |
US10004159B2 (en) * | 2016-09-26 | 2018-06-19 | Asia Vital Components Co., Ltd. | Water-cooling radiator unit and device thereof |
US10371461B2 (en) | 2016-10-11 | 2019-08-06 | International Business Machines Corporation | Multi-layered counterflow expanding microchannel cooling architecture and system thereof |
WO2018093773A1 (en) | 2016-11-15 | 2018-05-24 | Reid Aarne H | Multiply-insulated assemblies |
CN110770489B (en) | 2016-11-15 | 2022-03-01 | 概念集团有限责任公司 | Reinforced vacuum insulation article with microporous insulation |
US10076065B2 (en) * | 2017-01-04 | 2018-09-11 | Dell Products, Lp | Liquid cooling system with a displacement appendage for an information handling system |
CN108281401A (en) * | 2017-01-05 | 2018-07-13 | 研能科技股份有限公司 | Three-dimensional chip integrated circuit cooling system |
TWI650839B (en) * | 2017-01-05 | 2019-02-11 | 研能科技股份有限公司 | Three-dimensional wafer integrated circuit cooling system |
CN110024500B (en) * | 2017-02-03 | 2020-11-17 | 惠普发展公司,有限责任合伙企业 | Thermal management using steam and isolation chambers |
CN108419385A (en) * | 2017-02-10 | 2018-08-17 | 天津市松正电动汽车技术股份有限公司 | Controller for electric vehicle |
US10436521B2 (en) | 2017-02-10 | 2019-10-08 | Hamilton Sundstrand Corporation | Dual-mode thermal management loop |
US10119767B2 (en) | 2017-02-10 | 2018-11-06 | Hamilton Sundstrand Corporation | Two-phase thermal loop with membrane separation |
US10295271B2 (en) | 2017-02-10 | 2019-05-21 | Hamilton Sundstrand Corporation | Two-phase thermal loop with rotary separation |
US10915674B2 (en) * | 2017-03-14 | 2021-02-09 | International Business Machines Corporation | Autonomous development of two-phase cooling architecture |
FR3066355B1 (en) * | 2017-05-11 | 2020-02-07 | Mersen France Sb Sas | COOLING MODULE AND POWER CONVERTER COMPRISING SUCH A COOLING MODULE |
EP3655744A1 (en) * | 2017-07-19 | 2020-05-27 | Linde Aktiengesellschaft | Method for determining stress levels in a material of a process engineering apparatus |
WO2019018079A1 (en) | 2017-07-20 | 2019-01-24 | Massachusetts Institute Of Technology | Antagonistically driven differential for mechanical actuator |
CN107270980B (en) * | 2017-07-21 | 2019-08-23 | 西安交通大学 | The measurement method of gas-liquid two-phase annular flow thickness of liquid film and flow in a kind of vertical tube |
WO2019018943A1 (en) | 2017-07-28 | 2019-01-31 | Dana Canada Corporation | Ultra thin heat exchangers for thermal management |
US10850348B2 (en) | 2017-07-28 | 2020-12-01 | Dana Canada Corporation | Device and method for alignment of parts for laser welding |
TWI650520B (en) * | 2017-08-02 | 2019-02-11 | 萬在工業股份有限公司 | Phase change evaporator and phase change heat sink |
CN107591380B (en) * | 2017-08-03 | 2019-08-13 | 电子科技大学 | A kind of fluid channel radiator of integrated temperature sensor |
WO2019040885A1 (en) | 2017-08-25 | 2019-02-28 | Reid Aarne H | Multiple geometry and multiple material insulated components |
US20190069443A1 (en) * | 2017-08-31 | 2019-02-28 | Ling Long | Liquid-cooling termination structure having temperature sensing function |
TWI694563B (en) * | 2017-09-28 | 2020-05-21 | 雙鴻科技股份有限公司 | Liquid cooling system with dual loops |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US10881034B2 (en) * | 2017-11-21 | 2020-12-29 | Syracuse University | Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices |
US10356950B2 (en) * | 2017-12-18 | 2019-07-16 | Ge Aviation Systems, Llc | Avionics heat exchanger |
US10727160B2 (en) * | 2017-12-29 | 2020-07-28 | Intel Corporation | Thermal management component |
US10225955B1 (en) * | 2018-02-23 | 2019-03-05 | Microsoft Technology Licensing, Llc | Enclosure thermal short |
CN108509001B (en) * | 2018-04-02 | 2021-01-15 | 联想(北京)有限公司 | Electronic equipment and water-cooling server thereof |
US10969841B2 (en) * | 2018-04-13 | 2021-04-06 | Dell Products L.P. | Information handling system housing integrated vapor chamber |
US10431524B1 (en) * | 2018-04-23 | 2019-10-01 | Asia Vital Components Co., Ltd. | Water cooling module |
US11568098B2 (en) * | 2018-05-16 | 2023-01-31 | Autodesk, Inc | Designing convective cooling channels |
CN108882636B (en) * | 2018-06-29 | 2021-06-15 | 联想长风科技(北京)有限公司 | Electronic equipment |
US20210245098A1 (en) * | 2018-07-11 | 2021-08-12 | Lot Ces Co., Ltd. | Piping apparatus having harmful gas treatment device, design method therefor, and harmful gas treatment facility comprising same |
US10901161B2 (en) | 2018-09-14 | 2021-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Optical power transfer devices with an embedded active cooling chip |
US11948861B2 (en) | 2018-09-17 | 2024-04-02 | Agency For Science, Technology And Research | Liquid cooling module and method of forming the same |
US11177192B2 (en) * | 2018-09-27 | 2021-11-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device including heat dissipation structure and fabricating method of the same |
US10962298B2 (en) * | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
US10935325B2 (en) | 2018-09-28 | 2021-03-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
CN115790233A (en) * | 2018-10-05 | 2023-03-14 | 塞阿姆斯特朗有限公司 | Feed forward flow control for heat transfer systems |
CN113163979A (en) * | 2018-10-15 | 2021-07-23 | 里奇产品有限公司 | Food product dispenser with temperature control |
US10840167B2 (en) | 2018-11-19 | 2020-11-17 | Advanced Micro Devices, Inc. | Integrated heat spreader with configurable heat fins |
US11778779B2 (en) * | 2018-11-22 | 2023-10-03 | Denso Corporation | Electronic component cooling device |
CN109496115B (en) * | 2018-12-27 | 2024-02-09 | 南昌大学 | Microchannel heat exchanger with local self-adjustment function |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
KR102247484B1 (en) * | 2019-04-23 | 2021-05-03 | (주) 제이엔엠 메카텍 | Evaporator for Cooling Device for Cooling Semiconductor elements and Cooling Device Including the Same |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
JP2020183815A (en) * | 2019-04-26 | 2020-11-12 | トヨタ自動車株式会社 | Cooling system |
TWI699079B (en) * | 2019-04-29 | 2020-07-11 | 品法設計國際有限公司 | Liquid carrier with temperature control capability |
CN110208312B (en) * | 2019-05-29 | 2021-07-02 | 东北电力大学 | Method for predicting critical heat flux density of parallel small channels under electric field interference |
US10939592B2 (en) * | 2019-06-14 | 2021-03-02 | Intel Corporation | Liquid cooling system with sub atmospheric pressure coolant |
US11493687B1 (en) | 2019-07-02 | 2022-11-08 | Psiquantum, Corp. | Cryogenic microfluidic cooling for photonic integrated circuits |
CN110534488B (en) * | 2019-08-25 | 2020-11-13 | 大连理工大学 | Magnetic fluid pump device for IGBT heat dissipation and testing method |
CN110755699A (en) * | 2019-09-18 | 2020-02-07 | 浙江省北大信息技术高等研究院 | Implantable electroosmotic micropump device |
US10874037B1 (en) | 2019-09-23 | 2020-12-22 | Ford Global Technologies, Llc | Power-module assembly with cooling arrangement |
US11515233B2 (en) * | 2019-09-26 | 2022-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor component with cooling structure |
CN114556549A (en) | 2019-12-19 | 2022-05-27 | 东芝三菱电机产业系统株式会社 | Power conversion device and method for manufacturing same |
US11291143B2 (en) * | 2019-12-27 | 2022-03-29 | Baidu Usa Llc | Cooling design for electronics enclosure |
CN111141096A (en) * | 2020-01-20 | 2020-05-12 | 中国科学院上海光学精密机械研究所 | Integrated reflective active cooling device for optical grating |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US20210381921A1 (en) * | 2020-06-03 | 2021-12-09 | Becton, Dickinson And Company | Capillary-based pressure threshold sensor for liquids and methods and apparatuses using same |
CN112103252B (en) * | 2020-08-07 | 2022-12-09 | 西安电子科技大学 | Refrigeration type LTCC micro-system based on metal micro-channel and preparation method thereof |
CN112113995B (en) * | 2020-08-19 | 2024-01-23 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Low-pressure micro-channel gas-liquid two-phase flow heat dissipation test system and method |
CN114158232A (en) * | 2020-09-08 | 2022-03-08 | 英业达科技有限公司 | Heat sink and heat dissipation system |
US20220084740A1 (en) * | 2020-09-14 | 2022-03-17 | Intel Corporation | Embedded cooling channel in magnetics |
WO2022066318A1 (en) * | 2020-09-28 | 2022-03-31 | Lewis Tom Iii | Systems and methods for producing saturated oxygen water |
US11326836B1 (en) * | 2020-10-22 | 2022-05-10 | Asia Vital Components Co., Ltd. | Vapor/liquid condensation system |
US11356542B2 (en) * | 2020-11-11 | 2022-06-07 | Frore Systems Inc. | Mobile device having a high coefficient of thermal spreading |
CN112384040B (en) * | 2020-11-12 | 2022-05-24 | 中国电子科技集团公司第二十九研究所 | Skin heat exchange bypass control system and control method thereof |
RU2755608C1 (en) * | 2020-12-18 | 2021-09-17 | Федеральное государственное автономное образовательное учреждение высшего образования "Новосибирский национальный исследовательский государственный университет" (Новосибирский государственный университет, НГУ) | Method for cooling electronic equipment |
US11395438B1 (en) * | 2021-01-08 | 2022-07-19 | Baidu Usa Llc | Localized fluid acceleration in immersed environment |
US20220232739A1 (en) * | 2021-01-21 | 2022-07-21 | Nvidia Corporation | Intelligent cold plate system with active and passive features for a datacenter cooling system |
US11721608B2 (en) | 2021-02-02 | 2023-08-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies having vapor chambers with integrated pedestals |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
US20220401850A1 (en) * | 2021-06-21 | 2022-12-22 | Graeme Sidney Parris | Liquor distillation system and method thereof |
US20230091720A1 (en) * | 2021-09-23 | 2023-03-23 | Intel Corporation | Integrated, configurable micro heat pump and microchannels |
US11910578B2 (en) * | 2021-09-23 | 2024-02-20 | Contitech Techno-Chemie Gmbh | Vehicle electronics cooling systems and methods |
US20230200009A1 (en) * | 2021-12-22 | 2023-06-22 | Baidu Usa Llc | Two phase immersion system with local fluid accelerations |
WO2023148624A1 (en) * | 2022-02-04 | 2023-08-10 | Wieland Provides SRL | Improved microchannel evaporator |
CN114449875B (en) * | 2022-03-29 | 2022-12-02 | 黑龙江三联丰实通信技术服务有限公司 | Active heat dissipation device and method for 5G communication network base station |
CN114701100B (en) * | 2022-03-30 | 2023-06-02 | 贵州省工程复合材料中心有限公司 | Manufacturing method of injection mold suitable for intelligent manufacturing of precise deep cavity type product |
US20230422447A1 (en) * | 2022-06-25 | 2023-12-28 | EvansWerks, Inc. | Cooling system and methods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US6458259B1 (en) * | 1999-05-11 | 2002-10-01 | Caliper Technologies Corp. | Prevention of surface adsorption in microchannels by application of electric current during pressure-induced flow |
Family Cites Families (199)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1201578A (en) * | 1968-11-28 | 1970-08-12 | Dornier System Gmbh | Improvements in and relating to hydraulic actuating devices |
DE2102254B2 (en) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS |
DE2330722A1 (en) * | 1973-06-16 | 1975-01-16 | Nikolaus Laing | Hollow heat-equaliser panel condensate return - with drip spouts on inside of side facing open space |
US3923426A (en) | 1974-08-15 | 1975-12-02 | Alza Corp | Electroosmotic pump and fluid dispenser including same |
US4009423A (en) | 1975-07-02 | 1977-02-22 | Honeywell Information Systems, Inc. | Liquid cooled heat exchanger for electronic power supplies |
JPS568238Y2 (en) | 1976-02-14 | 1981-02-23 | ||
US4067237A (en) | 1976-08-10 | 1978-01-10 | Westinghouse Electric Corporation | Novel heat pipe combination |
DE2640000C2 (en) | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
US4312012A (en) | 1977-11-25 | 1982-01-19 | International Business Machines Corp. | Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant |
US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
US4365664A (en) * | 1980-10-20 | 1982-12-28 | Hughes Aircraft Company | Osmotically pumped heat pipe with passive mixing |
US4573067A (en) | 1981-03-02 | 1986-02-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits |
US4450472A (en) | 1981-03-02 | 1984-05-22 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels |
US4516632A (en) | 1982-08-31 | 1985-05-14 | The United States Of America As Represented By The United States Deparment Of Energy | Microchannel crossflow fluid heat exchanger and method for its fabrication |
US4638854A (en) | 1983-06-15 | 1987-01-27 | Noren Don W | Heat pipe assembly |
JPS6057956A (en) | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | Heat pipe type dissipator for semiconductor |
DE3334159A1 (en) | 1983-09-21 | 1985-04-04 | Sauer, Otto, 6800 Mannheim | MAGNETIC VALVE |
US4567505A (en) | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
US4561040A (en) | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
JPS61126771A (en) * | 1984-11-22 | 1986-06-14 | Toshiba Corp | Fuel cell |
US4593534A (en) * | 1985-02-21 | 1986-06-10 | Analytic Power Corporation | Electrochemically driven heat pump |
US4886514A (en) * | 1985-05-02 | 1989-12-12 | Ivac Corporation | Electrochemically driven drug dispenser |
US4697427A (en) | 1985-05-10 | 1987-10-06 | Sundstrand Corporation | Forced flow evaporator for unusual gravity conditions |
US4758926A (en) | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
US4868712A (en) | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US5016138A (en) | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US4829432A (en) | 1987-12-28 | 1989-05-09 | Eastman Kodak Company | Apparatus for shielding an electrical circuit from electromagnetic interference |
US4894709A (en) | 1988-03-09 | 1990-01-16 | Massachusetts Institute Of Technology | Forced-convection, liquid-cooled, microchannel heat sinks |
US4862708A (en) * | 1988-05-10 | 1989-09-05 | Hughes Aircraft Company | Osmotic thermal engine |
US4908112A (en) | 1988-06-16 | 1990-03-13 | E. I. Du Pont De Nemours & Co. | Silicon semiconductor wafer for analyzing micronic biological samples |
US4951740A (en) | 1988-06-27 | 1990-08-28 | Texas A & M University System | Bellows heat pipe for thermal control of electronic components |
US4938280A (en) | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
CA2002213C (en) | 1988-11-10 | 1999-03-30 | Iwona Turlik | High performance integrated circuit chip package and method of making same |
US4858093A (en) | 1988-12-12 | 1989-08-15 | Qualitron, Inc. | Integrated magnetic power converter |
US5021364A (en) * | 1989-10-31 | 1991-06-04 | The Board Of Trustees Of The Leland Stanford Junior University | Microcantilever with integral self-aligned sharp tetrahedral tip |
CH681168A5 (en) | 1989-11-10 | 1993-01-29 | Westonbridge Int Ltd | Micro-pump for medicinal dosing |
US5010292A (en) | 1989-12-12 | 1991-04-23 | North American Philips Corporation | Voltage regulator with reduced semiconductor power dissipation |
JPH03208365A (en) | 1990-01-10 | 1991-09-11 | Hitachi Ltd | Cooling mechanism for electronic device and usage thereof |
US4975825A (en) | 1990-01-16 | 1990-12-04 | Sundstrand Corporation | Stacked power converter |
US5083194A (en) | 1990-01-16 | 1992-01-21 | Cray Research, Inc. | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components |
US5229915A (en) | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
DE4006152A1 (en) | 1990-02-27 | 1991-08-29 | Fraunhofer Ges Forschung | MICROMINIATURIZED PUMP |
US5858188A (en) | 1990-02-28 | 1999-01-12 | Aclara Biosciences, Inc. | Acrylic microchannels and their use in electrophoretic applications |
US6054034A (en) * | 1990-02-28 | 2000-04-25 | Aclara Biosciences, Inc. | Acrylic microchannels and their use in electrophoretic applications |
US6176962B1 (en) * | 1990-02-28 | 2001-01-23 | Aclara Biosciences, Inc. | Methods for fabricating enclosed microchannel structures |
US5070040A (en) | 1990-03-09 | 1991-12-03 | University Of Colorado Foundation, Inc. | Method and apparatus for semiconductor circuit chip cooling |
US5096388A (en) | 1990-03-22 | 1992-03-17 | The Charles Stark Draper Laboratory, Inc. | Microfabricated pump |
US5203401A (en) | 1990-06-29 | 1993-04-20 | Digital Equipment Corporation | Wet micro-channel wafer chuck and cooling method |
US5057908A (en) | 1990-07-10 | 1991-10-15 | Iowa State University Research Foundation, Inc. | High power semiconductor device with integral heat sink |
US5420067A (en) | 1990-09-28 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Navy | Method of fabricatring sub-half-micron trenches and holes |
CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
JPH04196395A (en) | 1990-11-28 | 1992-07-16 | Hitachi Ltd | Electronic computer and cooling device thereof |
US5099910A (en) * | 1991-01-15 | 1992-03-31 | Massachusetts Institute Of Technology | Microchannel heat sink with alternating flow directions |
US5099311A (en) | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
IL97099A0 (en) * | 1991-01-30 | 1992-03-29 | Scient Innovations Ltd | Infusion pump with safety means controlling the electrolytic cell |
JPH06342990A (en) | 1991-02-04 | 1994-12-13 | Internatl Business Mach Corp <Ibm> | Integrated cooling system |
US5131859A (en) | 1991-03-08 | 1992-07-21 | Cray Research, Inc. | Quick disconnect system for circuit board modules |
US5131233A (en) | 1991-03-08 | 1992-07-21 | Cray Computer Corporation | Gas-liquid forced turbulence cooling |
JP2626326B2 (en) | 1991-07-31 | 1997-07-02 | 三菱電機株式会社 | Motor control unit |
US5263251A (en) | 1991-04-02 | 1993-11-23 | Microunity Systems Engineering | Method of fabricating a heat exchanger for solid-state electronic devices |
US5232047A (en) | 1991-04-02 | 1993-08-03 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
US5125451A (en) | 1991-04-02 | 1992-06-30 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
US5162974A (en) | 1991-04-15 | 1992-11-10 | Unisys Corporation | Heat sink assembly for cooling electronic components |
US5239200A (en) | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
US5199165A (en) | 1991-12-13 | 1993-04-06 | Hewlett-Packard Company | Heat pipe-electrical interconnect integration method for chip modules |
US5386720A (en) * | 1992-01-09 | 1995-02-07 | Olympus Optical Co., Ltd. | Integrated AFM sensor |
US5216580A (en) | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
US5218515A (en) | 1992-03-13 | 1993-06-08 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooling of face down bonded chips |
US5230564A (en) | 1992-03-20 | 1993-07-27 | Cray Research, Inc. | Temperature monitoring system for air-cooled electric components |
US5317805A (en) | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
JP3069819B2 (en) | 1992-05-28 | 2000-07-24 | 富士通株式会社 | Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink |
US5406807A (en) * | 1992-06-17 | 1995-04-18 | Hitachi, Ltd. | Apparatus for cooling semiconductor device and computer having the same |
US5311397A (en) | 1992-08-06 | 1994-05-10 | Logistics Management Inc. | Computer with modules readily replaceable by unskilled personnel |
US5520244A (en) * | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
US5453641A (en) * | 1992-12-16 | 1995-09-26 | Sdl, Inc. | Waste heat removal system |
US5339214A (en) | 1993-02-12 | 1994-08-16 | Intel Corporation | Multiple-fan microprocessor cooling through a finned heat pipe |
US5313099A (en) | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
US5436793A (en) | 1993-03-31 | 1995-07-25 | Ncr Corporation | Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member |
US5427174A (en) | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
JPH06343967A (en) * | 1993-06-07 | 1994-12-20 | Matsushita Electric Ind Co Ltd | Method and apparatus for sterilization in water treatment |
US5471850A (en) | 1993-07-09 | 1995-12-05 | Acurex Corporation | Refrigeration system and method for very large scale integrated circuits |
US5727618A (en) * | 1993-08-23 | 1998-03-17 | Sdl Inc | Modular microchannel heat exchanger |
US5704416A (en) | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
JPH07108273A (en) * | 1993-10-13 | 1995-04-25 | Matsushita Electric Ind Co Ltd | Method and apparatus for sterilizing circulating water channel |
US5514906A (en) | 1993-11-10 | 1996-05-07 | Fujitsu Limited | Apparatus for cooling semiconductor chips in multichip modules |
US5365749A (en) | 1993-12-23 | 1994-11-22 | Ncr Corporation | Computer component cooling system with local evaporation of refrigerant |
CH689836A5 (en) | 1994-01-14 | 1999-12-15 | Westonbridge Int Ltd | Micropump. |
US5461541A (en) | 1994-02-22 | 1995-10-24 | Dana Corporation | Enclosure for an electronic circuit module |
US5383340A (en) | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
US5565705A (en) | 1994-05-02 | 1996-10-15 | Motorola, Inc. | Electronic module for removing heat from a semiconductor die |
US5544412A (en) | 1994-05-24 | 1996-08-13 | Motorola, Inc. | Method for coupling a power lead to a bond pad in an electronic module |
JPH07335798A (en) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | Lsi cooling structure |
US5560423A (en) | 1994-07-28 | 1996-10-01 | Aavid Laboratories, Inc. | Flexible heat pipe for integrated circuit cooling apparatus |
US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
US5863671A (en) * | 1994-10-12 | 1999-01-26 | H Power Corporation | Plastic platelet fuel cells employing integrated fluid management |
US5641400A (en) | 1994-10-19 | 1997-06-24 | Hewlett-Packard Company | Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems |
US5508234A (en) | 1994-10-31 | 1996-04-16 | International Business Machines Corporation | Microcavity structures, fabrication processes, and applications thereof |
US5585069A (en) | 1994-11-10 | 1996-12-17 | David Sarnoff Research Center, Inc. | Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis |
US5513070A (en) | 1994-12-16 | 1996-04-30 | Intel Corporation | Dissipation of heat through keyboard using a heat pipe |
TW373308B (en) | 1995-02-24 | 1999-11-01 | Agere Systems Inc | Thin packaging of multi-chip modules with enhanced thermal/power management |
US5608262A (en) | 1995-02-24 | 1997-03-04 | Lucent Technologies Inc. | Packaging multi-chip modules without wire-bond interconnection |
US5621635A (en) | 1995-03-03 | 1997-04-15 | National Semiconductor Corporation | Integrated circuit packaged power supply |
US5598320A (en) | 1995-03-06 | 1997-01-28 | Ast Research, Inc. | Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices |
US6227809B1 (en) * | 1995-03-09 | 2001-05-08 | University Of Washington | Method for making micropumps |
US5506067A (en) * | 1995-04-04 | 1996-04-09 | Aer Energy Resources, Inc. | Rechargeable electrochemical cell and cell case therefor with vent for use in internal recombination of hydrogen and oxygen |
JPH08313541A (en) * | 1995-05-16 | 1996-11-29 | Olympus Optical Co Ltd | Cantilever for scanning probe microscope and its manufacture |
US5575929A (en) | 1995-06-05 | 1996-11-19 | The Regents Of The University Of California | Method for making circular tubular channels with two silicon wafers |
JPH09196504A (en) * | 1995-07-24 | 1997-07-31 | Mitsubishi Electric Corp | Water evaporation type cooling method by electrolytic reaction and its cooling device |
US6057149A (en) | 1995-09-15 | 2000-05-02 | The University Of Michigan | Microscale devices and reactions in microscale devices |
US5696405A (en) | 1995-10-13 | 1997-12-09 | Lucent Technologies Inc. | Microelectronic package with device cooling |
US5826646A (en) * | 1995-10-26 | 1998-10-27 | Heatcraft Inc. | Flat-tubed heat exchanger |
US5579827A (en) | 1995-11-13 | 1996-12-03 | Us Micro Lab, Inc. | Heat sink arrangement for central processing unit |
US5705018A (en) | 1995-12-13 | 1998-01-06 | Hartley; Frank T. | Micromachined peristaltic pump |
US5768906A (en) * | 1996-01-16 | 1998-06-23 | Borst, Inc. | Electrochemical heat exchanger |
US6010316A (en) * | 1996-01-16 | 2000-01-04 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic micropump |
US5703536A (en) | 1996-04-08 | 1997-12-30 | Harris Corporation | Liquid cooling system for high power solid state AM transmitter |
US5885470A (en) * | 1997-04-14 | 1999-03-23 | Caliper Technologies Corporation | Controlled fluid transport in microfabricated polymeric substrates |
US5907095A (en) * | 1996-06-17 | 1999-05-25 | Industrial Technology Research Institute | High-sensitivity strain probe |
US5779868A (en) | 1996-06-28 | 1998-07-14 | Caliper Technologies Corporation | Electropipettor and compensation means for electrophoretic bias |
US5800690A (en) | 1996-07-03 | 1998-09-01 | Caliper Technologies Corporation | Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces |
US5801442A (en) * | 1996-07-22 | 1998-09-01 | Northrop Grumman Corporation | Microchannel cooling of high power semiconductor devices |
US5763951A (en) | 1996-07-22 | 1998-06-09 | Northrop Grumman Corporation | Non-mechanical magnetic pump for liquid cooling |
WO1998003997A1 (en) * | 1996-07-22 | 1998-01-29 | Northrop Grumman Corporation | Closed loop liquid cooling within rf modules |
US5692558A (en) | 1996-07-22 | 1997-12-02 | Northrop Grumman Corporation | Microchannel cooling using aviation fuels for airborne electronics |
US5835345A (en) | 1996-10-02 | 1998-11-10 | Sdl, Inc. | Cooler for removing heat from a heated region |
DE19643717A1 (en) | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Liquid cooling device for a high-performance semiconductor module |
US5774779A (en) | 1996-11-06 | 1998-06-30 | Materials And Electrochemical Research (Mer) Corporation | Multi-channel structures and processes for making such structures |
US5870823A (en) | 1996-11-27 | 1999-02-16 | International Business Machines Corporation | Method of forming a multilayer electronic packaging substrate with integral cooling channels |
US5964092A (en) * | 1996-12-13 | 1999-10-12 | Nippon Sigmax, Co., Ltd. | Electronic cooling apparatus |
SE9700205D0 (en) | 1997-01-24 | 1997-01-24 | Peter Lindberg | Integrated microfluidic element |
CN2286429Y (en) * | 1997-03-04 | 1998-07-22 | 中国科学技术大学 | Porous core column electroosmosis pump |
US5964995A (en) * | 1997-04-04 | 1999-10-12 | Caliper Technologies Corp. | Methods and systems for enhanced fluid transport |
WO1998049548A1 (en) * | 1997-04-25 | 1998-11-05 | Caliper Technologies Corporation | Microfluidic devices incorporating improved channel geometries |
US6020209A (en) * | 1997-04-28 | 2000-02-01 | The United States Of America As Represented By The Secretary Of The Navy | Microcapillary-based flow-through immunosensor and displacement immunoassay using the same |
US5880524A (en) | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US6090251A (en) * | 1997-06-06 | 2000-07-18 | Caliper Technologies, Inc. | Microfabricated structures for facilitating fluid introduction into microfluidic devices |
US5942093A (en) | 1997-06-18 | 1999-08-24 | Sandia Corporation | Electro-osmotically driven liquid delivery method and apparatus |
US6277257B1 (en) | 1997-06-25 | 2001-08-21 | Sandia Corporation | Electrokinetic high pressure hydraulic system |
US6013164A (en) * | 1997-06-25 | 2000-01-11 | Sandia Corporation | Electokinetic high pressure hydraulic system |
US6019882A (en) * | 1997-06-25 | 2000-02-01 | Sandia Corporation | Electrokinetic high pressure hydraulic system |
US6001231A (en) * | 1997-07-15 | 1999-12-14 | Caliper Technologies Corp. | Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems |
US6034872A (en) * | 1997-07-16 | 2000-03-07 | International Business Machines Corporation | Cooling computer systems |
US5869894A (en) | 1997-07-18 | 1999-02-09 | Lucent Technologies Inc. | RF IC package |
US6191945B1 (en) * | 1997-07-30 | 2001-02-20 | Hewlett-Packard Company | Cold plate arrangement for cooling processor and companion voltage regulator |
US5901040A (en) | 1997-07-30 | 1999-05-04 | Hewlett-Packard Company | Heat sink and Faraday Cage assembly for a semiconductor module and a power converter |
US6907921B2 (en) * | 1998-06-18 | 2005-06-21 | 3M Innovative Properties Company | Microchanneled active fluid heat exchanger |
US6025208A (en) * | 1997-08-27 | 2000-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Method of making electrical elements on the sidewalls of micromechanical structures |
US5940240A (en) | 1997-08-29 | 1999-08-17 | Western Digital Corporation | Constant velocity servo linearity calibration method for MR head |
JP3353053B2 (en) * | 1997-09-18 | 2002-12-03 | ファナック株式会社 | Method of manufacturing cooling component for semiconductor and method of manufacturing cooling component for semiconductor laser |
US6012902A (en) * | 1997-09-25 | 2000-01-11 | Caliper Technologies Corp. | Micropump |
US5842787A (en) * | 1997-10-09 | 1998-12-01 | Caliper Technologies Corporation | Microfluidic systems incorporating varied channel dimensions |
US5836750A (en) | 1997-10-09 | 1998-11-17 | Honeywell Inc. | Electrostatically actuated mesopump having a plurality of elementary cells |
US6174675B1 (en) * | 1997-11-25 | 2001-01-16 | Caliper Technologies Corp. | Electrical current for controlling fluid parameters in microchannels |
US6052287A (en) * | 1997-12-09 | 2000-04-18 | Sandia Corporation | Silicon ball grid array chip carrier |
US6167910B1 (en) | 1998-01-20 | 2001-01-02 | Caliper Technologies Corp. | Multi-layer microfluidic devices |
US6100541A (en) | 1998-02-24 | 2000-08-08 | Caliper Technologies Corporation | Microfluidic devices and systems incorporating integrated optical elements |
US6223810B1 (en) * | 1998-03-31 | 2001-05-01 | International Business Machines | Extended air cooling with heat loop for dense or compact configurations of electronic components |
US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
US5940270A (en) | 1998-07-08 | 1999-08-17 | Puckett; John Christopher | Two-phase constant-pressure closed-loop water cooling system for a heat producing device |
US6167721B1 (en) * | 1998-07-14 | 2001-01-02 | Borst, Inc. | Electrochemical hydrogen pump and uses thereof for heat exchange applications |
US5965813A (en) | 1998-07-23 | 1999-10-12 | Industry Technology Research Institute | Integrated flow sensor |
US6572830B1 (en) * | 1998-10-09 | 2003-06-03 | Motorola, Inc. | Integrated multilayered microfludic devices and methods for making the same |
US6146103A (en) | 1998-10-09 | 2000-11-14 | The Regents Of The University Of California | Micromachined magnetohydrodynamic actuators and sensors |
US6148635A (en) * | 1998-10-19 | 2000-11-21 | The Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
US6201302B1 (en) * | 1998-12-31 | 2001-03-13 | Sampo Semiconductor Corporation | Semiconductor package having multi-dies |
JP3782912B2 (en) * | 1999-01-29 | 2006-06-07 | ヒューレット・パッカード・カンパニー | Cooling device and cooling method for processor and companion voltage regulator |
JP2000223645A (en) * | 1999-02-01 | 2000-08-11 | Mitsubishi Electric Corp | Semiconductor device |
US6204562B1 (en) * | 1999-02-11 | 2001-03-20 | United Microelectronics Corp. | Wafer-level chip scale package |
US6268660B1 (en) * | 1999-03-05 | 2001-07-31 | International Business Machines Corporation | Silicon packaging with through wafer interconnects |
US6034425A (en) * | 1999-03-17 | 2000-03-07 | Chipmos Technologies Inc. | Flat multiple-chip module micro ball grid array packaging |
US6215193B1 (en) * | 1999-04-21 | 2001-04-10 | Advanced Semiconductor Engineering, Inc. | Multichip modules and manufacturing method therefor |
WO2000079592A1 (en) * | 1999-06-17 | 2000-12-28 | Hitachi, Ltd. | Semiconductor device and electronic device |
US6287440B1 (en) | 1999-06-18 | 2001-09-11 | Sandia Corporation | Method for eliminating gas blocking in electrokinetic pumping systems |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6425440B1 (en) * | 1999-07-06 | 2002-07-30 | Borst, Inc. | Reciprocal heat exchanger |
US6457515B1 (en) * | 1999-08-06 | 2002-10-01 | The Ohio State University | Two-layered micro channel heat sink, devices and systems incorporating same |
JP3518434B2 (en) * | 1999-08-11 | 2004-04-12 | 株式会社日立製作所 | Multi-chip module cooling system |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
US6210986B1 (en) * | 1999-09-23 | 2001-04-03 | Sandia Corporation | Microfluidic channel fabrication method |
US6875619B2 (en) * | 1999-11-12 | 2005-04-05 | Motorola, Inc. | Microfluidic devices comprising biochannels |
US6408884B1 (en) * | 1999-12-15 | 2002-06-25 | University Of Washington | Magnetically actuated fluid handling devices for microfluidic applications |
US6415860B1 (en) * | 2000-02-09 | 2002-07-09 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Crossflow micro heat exchanger |
US6301109B1 (en) * | 2000-02-11 | 2001-10-09 | International Business Machines Corporation | Isothermal heat sink with cross-flow openings between channels |
US6337794B1 (en) * | 2000-02-11 | 2002-01-08 | International Business Machines Corporation | Isothermal heat sink with tiered cooling channels |
US6519955B2 (en) * | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
US6290909B1 (en) | 2000-04-13 | 2001-09-18 | Sandia Corporation | Sample injector for high pressure liquid chromatography |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
ATE267507T1 (en) * | 2000-09-29 | 2004-06-15 | Nanostream Inc | MICROFLUIDIC HEAT TRANSFER DEVICE |
US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
US6553771B2 (en) * | 2000-12-01 | 2003-04-29 | Borst Inc. | Electrochemical heat pump system |
JP2002188876A (en) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | Liquid cooling system and personal computer provided with the system |
US6939632B2 (en) * | 2001-08-06 | 2005-09-06 | Massachusetts Institute Of Technology | Thermally efficient micromachined device |
US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
US20030175947A1 (en) * | 2001-11-05 | 2003-09-18 | Liu Robin Hui | Enhanced mixing in microfluidic devices |
US6631077B2 (en) * | 2002-02-11 | 2003-10-07 | Thermal Corp. | Heat spreader with oscillating flow |
US6994151B2 (en) * | 2002-10-22 | 2006-02-07 | Cooligy, Inc. | Vapor escape microchannel heat exchanger |
US6981849B2 (en) * | 2002-12-18 | 2006-01-03 | Intel Corporation | Electro-osmotic pumps and micro-channels |
US7723208B2 (en) * | 2003-09-24 | 2010-05-25 | Intel Corporation | Integrated re-combiner for electroosmotic pumps using porous frits |
US6992381B2 (en) * | 2003-10-31 | 2006-01-31 | Intel Corporation | Using external radiators with electroosmotic pumps for cooling integrated circuits |
-
2002
- 2002-01-19 US US10/053,859 patent/US6942018B2/en not_active Expired - Fee Related
- 2002-09-16 CN CNB028188780A patent/CN1306230C/en not_active Expired - Fee Related
- 2002-09-16 EP EP02761685A patent/EP1576320A4/en not_active Withdrawn
- 2002-09-16 JP JP2003532907A patent/JP2005525691A/en not_active Ceased
- 2002-09-16 AU AU2002326931A patent/AU2002326931A1/en not_active Abandoned
- 2002-09-16 KR KR10-2004-7004468A patent/KR20040048907A/en not_active Application Discontinuation
- 2002-09-16 EP EP07006754A patent/EP1811257A1/en not_active Withdrawn
- 2002-09-16 WO PCT/US2002/029405 patent/WO2003029731A2/en active Application Filing
- 2002-09-20 TW TW091121633A patent/TW560238B/en not_active IP Right Cessation
-
2003
- 2003-03-10 US US10/385,086 patent/US7131486B2/en not_active Expired - Fee Related
- 2003-06-27 US US10/607,615 patent/US6991024B2/en not_active Expired - Fee Related
-
2004
- 2004-09-02 US US10/933,068 patent/US7185697B2/en not_active Expired - Fee Related
-
2005
- 2005-05-25 US US11/136,793 patent/US7334630B2/en not_active Expired - Fee Related
-
2007
- 2007-09-04 JP JP2007229590A patent/JP2008072109A/en active Pending
- 2007-09-04 JP JP2007229591A patent/JP2008042214A/en active Pending
-
2011
- 2011-02-25 JP JP2011040775A patent/JP2011101067A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US6458259B1 (en) * | 1999-05-11 | 2002-10-01 | Caliper Technologies Corp. | Prevention of surface adsorption in microchannels by application of electric current during pressure-induced flow |
Also Published As
Publication number | Publication date |
---|---|
US7131486B2 (en) | 2006-11-07 |
US20030062149A1 (en) | 2003-04-03 |
EP1576320A4 (en) | 2005-10-05 |
US7334630B2 (en) | 2008-02-26 |
CN1636124A (en) | 2005-07-06 |
WO2003029731A2 (en) | 2003-04-10 |
US20030164231A1 (en) | 2003-09-04 |
JP2008042214A (en) | 2008-02-21 |
TW560238B (en) | 2003-11-01 |
US6991024B2 (en) | 2006-01-31 |
US7185697B2 (en) | 2007-03-06 |
US20050205241A1 (en) | 2005-09-22 |
KR20040048907A (en) | 2004-06-10 |
AU2002326931A1 (en) | 2003-04-14 |
EP1811257A1 (en) | 2007-07-25 |
US20050098299A1 (en) | 2005-05-12 |
AU2002326931A8 (en) | 2005-11-17 |
JP2008072109A (en) | 2008-03-27 |
JP2005525691A (en) | 2005-08-25 |
JP2011101067A (en) | 2011-05-19 |
US20040089442A1 (en) | 2004-05-13 |
US6942018B2 (en) | 2005-09-13 |
EP1576320A2 (en) | 2005-09-21 |
CN1306230C (en) | 2007-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003029731A3 (en) | Electroosmotic microchannel cooling system | |
EP2267771A3 (en) | Method and apparatus for cooling electronic components | |
WO2000036892A8 (en) | Device for increasing heat transfer | |
AU2002356614A1 (en) | Heat exchanger | |
MXPA02012114A (en) | Microsystem process networks. | |
WO2001014080A8 (en) | Heat exchanger | |
EP1250954A3 (en) | Microchannel device, method for producing the microchannel device and use of the same | |
AU2002249897A1 (en) | Fluid heat exchanger | |
AU2002254700A1 (en) | Heat exchanger manufacturing system | |
AU2002350872A1 (en) | Heat exchanger | |
WO2003046462A3 (en) | Fluid heat exchanger assembly and pesronal cooling device | |
AU4687799A (en) | Micro-channel heat exchanger | |
AUPR286801A0 (en) | Heat exchanger | |
AU2002361330A1 (en) | Heat exchanger module fin | |
WO2003022579A3 (en) | Hot stamping cylinder | |
AU2002343014A1 (en) | Heat exchangers | |
EP0881440A3 (en) | Control of evaporator defrosting in an air-operated heat pump unit | |
AU2002320794A1 (en) | Heat exchanger | |
AU2002306139A1 (en) | Pin tube type heat exchanger and air conditioner and refrigerator using the same | |
AU2002349378A1 (en) | Compact plate heat exchanger | |
AU4283101A (en) | Cooling tube assembly and heat exchanger with the same | |
WO2002039241A3 (en) | Electrical component | |
AU2002334902A1 (en) | Fluid heat exchanger assembly | |
AU2002330973A1 (en) | Integrated micro combined heat and power system | |
GB0121981D0 (en) | A heat exchanger, an exhaust assembly and a method of mounting the heat exchanger in an exhaust assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VC VN YU ZA ZM |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2002761685 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003532907 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20028188780 Country of ref document: CN Ref document number: 1020047004468 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2002761685 Country of ref document: EP |