WO2003028060A1 - Sicherungsbauelement mit optischer anzeige - Google Patents
Sicherungsbauelement mit optischer anzeige Download PDFInfo
- Publication number
- WO2003028060A1 WO2003028060A1 PCT/DE2002/002907 DE0202907W WO03028060A1 WO 2003028060 A1 WO2003028060 A1 WO 2003028060A1 DE 0202907 W DE0202907 W DE 0202907W WO 03028060 A1 WO03028060 A1 WO 03028060A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fuse component
- led
- component according
- connection
- fuse
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/30—Means for indicating condition of fuse structurally associated with the fuse
- H01H85/32—Indicating lamp structurally associated with the protective device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H85/0415—Miniature fuses cartridge type
- H01H85/0417—Miniature fuses cartridge type with parallel side contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
- H02H3/02—Details
- H02H3/04—Details with warning or supervision in addition to disconnection, e.g. for indicating that protective apparatus has functioned
- H02H3/046—Signalling the blowing of a fuse
Definitions
- the invention relates to an electrical fuse component with an optical display according to the preamble of patent claim 1.
- Fuse components of this type generally have a fusible link which is dimensioned such that when a maximum current is exceeded, the fusible link melts and thus interrupts the flow of current.
- the fusible link is usually built into a housing, so that a defect in the fusible link is often difficult to detect from the outside. In addition, the detection of such a defect is usually made more difficult by the small dimensions of the fusible link.
- the bulb is freely accessible from the outside, so that there is a risk of damage from external influences.
- Additional protection by means of a covering, for example a potting compound requires additional effort, since it must be ensured that the potting compound is thermally and mechanically adapted to the glass bulb of the incandescent lamp. Furthermore, there must be sufficient adhesion between the glass bulb and the potting compound and the penetration of moisture into the fuse must be prevented.
- incandescent lamps are comparatively sensitive components, so that after prolonged installation, even in the non-illuminated state, the risk of a defect in the incandescent lamp, for example due to loss of vacuum in the glass bulb or tearing of the filament.
- a defect of the failure indicator in the case of a fuse although it rarely occurs, is particularly to be avoided since the user relies on the optical failure indicator and therefore it is very difficult to find a blown fuse with a defective failure indicator.
- the fuse component has a first and a second connection and this
- the fuse component contains at least one LED (light emitting diode) as an optical display, which is connected on the cathode side to the first connection and on the anode side to the second connection.
- An LED is to be understood both as a corresponding optoelectronic component, which in particular can have a housing or a mounting body, and preferably as an LED semiconductor chip.
- the LED is preferably connected in series with a current limiting resistor.
- LED has a very long service life and also has a high level of reliability. Large fluctuations in the ambient temperature can also be tolerated.
- fuses with LEDs can be manufactured very inexpensively, as will be explained in more detail below.
- two LEDs are each connected in parallel to the fusible link, the flow directions of the LEDs being opposite to one another. This has the advantage that a fuse failure is indicated irrespective of the polarity of the fuse, since in any case one of the two LEDs is polarized in the forward direction. Due to the symmetrical switching of the LEDs, the fuse component can be used like a conventional fuse, without having to pay attention to polarity.
- the contacts and the fusible link are preferably arranged on a lead frame or formed as parts of a lead frame.
- the LED is attached to the lead frame in a manner known per se. Technologies for the production of lead frames and for mounting LEDs on them are known and established. A fuse component according to the invention can thus be manufactured inexpensively using existing production systems.
- the lead frame particularly preferably has the basic shape of a yoke, the yoke legs forming the connections of the fuse component.
- the fusible link can be formed as part of the yoke beam or parallel to the yoke beam.
- the yoke beam is interrupted or in cross-section to the required dimensions of the
- the yoke-like shape corresponds essentially to the basic shape of a conventional motor vehicle fuse, so that the invention is compatible with these fuses.
- the lead frame has at least one chip connection area and at least one wire connection area, the LED in the form of an LED chip being mounted on the chip connection area and being electrically conductively connected to the wire connection area via a wire bridge. Chip connection area and wire connection area are arranged on the lead frame so that the LED is connected in parallel to the fusible link.
- Lead frames are usually used for contacting and as a carrier for LED chips. This lead frame advantageously also forms the fusible link, so that only a small number of individual components are required in the invention.
- the current limiting resistor can be formed on the wire connection area in the form of a thick-film resistor in a manner known per se.
- the fuse component including the LED, is preferably at least partially surrounded by a covering, preferably a molding compound. It is expedient for the envelope to be transparent to the light generated by the LED.
- Molding compositions suitable for the encapsulation of LED chips are known and highly optimized, so that encasing the fuse component does not involve any particular technical outlay.
- Reaction resins such as epoxy, acrylic or silicone resins or mixtures thereof are particularly suitable as molding compositions.
- Such a covering creates a compact fuse component that is well protected against harmful influences.
- Side surfaces of the envelope are preferably roughened or structured in order to increase the coupling out of light. This further improves the visibility of the optical display in the event of a defect. Roughening can be done mechanically, for example by sandblasting, or chemically, for example by etching.
- the color of the light emitted by the LED can also be used to identify the type of fuse, in particular the maximum current. This means that if the fuse component fails, it can be immediately recognized which replacement is required. Further features, advantages and expediencies of the invention are explained using four exemplary embodiments in conjunction with FIGS. 1 to 4.
- FIG. 1 shows a circuit diagram of a first exemplary embodiment of a fuse component according to the invention
- FIG. 2 shows a circuit diagram of a second exemplary embodiment of a fuse component according to the invention
- FIG. 3 shows a schematic perspective view of a third exemplary embodiment of a fuse component
- Figure 4 is a schematic perspective view of a fourth embodiment of a fuse component according to the invention.
- the circuit diagram of a fuse component according to the invention is shown in FIG.
- the circuit has a first connection 2 and a second connection 3, which are electrically conductively connected to one another via a fusible link 4.
- a series circuit comprising an LED 8 and a current limiting resistor 12 is connected in parallel with this fusible link 4.
- the LED 8 is short-circuited by the fusible link 4 and the LED 8 does not light up. After an interruption of the fusible link 4, at least part of the operating voltage between the connections 2 and 3 drops. If terminal 3 is at a higher potential than terminal 2, a current flows through it LED 8 and LED 8 light up. This indicates that the fusible link 4 is interrupted.
- the current limiting resistor 12 is dimensioned so that even when the full operating voltage drops, for example 12 V in a motor vehicle fuse, the current flowing between the terminals 2 and 3 remains limited to the nominal current of the LED 8. This nominal current is usually between 1 mA and 20 mA, the current limiting resistor 12 for a 12V motor vehicle fuse accordingly between 12k ⁇ and 600 ⁇ .
- FIG. 2 shows the circuit diagram of a further exemplary embodiment of the invention.
- two series circuits each with an LED 8a, b and a current limiting resistor 8a, b, are connected in parallel with the fusible link 4, the forward directions of the LEDs 8a, b being opposite to one another.
- the circuit is therefore independent of the polarity of the voltage present between the connections 2 and 3 with regard to the optical display.
- the fuse element formed in this way like conventional fuses, has no polarity, so that inadvertent installation with incorrect polarity is advantageously excluded.
- the exemplary embodiment of the invention shown in FIG. 3 has a yoke-shaped lead frame 1, the yoke legs 9 forming the connections 2 and 3 of the fuse component.
- the connections 2 and 3 are electrically conductively connected via a fusible link 4 which is formed separately from the yoke beam 5.
- the width of the fusible link 4 is selected in accordance with the maximum current provided so that the fusible link 4 melts as soon as a larger current than the intended maximum current flows through it.
- the yoke beam 5 is interrupted in the middle by a slit, so that there is no current between the beams 5 itself Connections 2 and 3 can flow.
- a chip connection area 6a, b and a wire connection area 7a, b are arranged on both sides of the interruption, the wire connection areas 7a, b being formed as thick-film resistors 12a, b for current limitation.
- An LED chip 8a, b is attached to each of the chip connection areas 6a, b.
- the LED chip 8a, b can, for example, be glued or soldered on by means of a conductive adhesive.
- a contact metallization to which a wire connection is soldered is formed on the top of the LED chips 8a, b.
- the wire connection establishes contact with the wire connection area 7a, b arranged on the opposite side of the interruption.
- FIG. 1 A further exemplary embodiment of a fuse component according to the invention is shown in FIG.
- the fuse component in turn contains a yoke-shaped lead frame 1, the yoke legs 9 forming the connections 2 and 3.
- the fusible link 4 is formed in the center as part of the yoke beam 5.
- a chip connection area 6a, b with an LED chip 8a, b fastened thereon and a wire connection area 7a, b, optionally again with a current limiting resistor (not shown), are arranged on both sides of the fusible link 4.
- the LED chips 8a, b are each connected to the wire connection region 7a, b on the opposite side of the fusible link 4 via a wire bridge, and are therefore connected in parallel to the fusible link 4 and antiparallel to one another.
- the lead frame 1 is also surrounded by a preferably radiation-transmissive covering 10.
- Established technologies in LED production can be used to advantage in the composition of the casing and the production of the component.
- the lead frame is preferably embedded in a radiation-permeable molding compound.
- a casting process, an injection molding process, an injection molding process or a pressing process can be used to embed the lead frame.
- Suitable molding materials are, for example, reaction resins such as epoxy resins, acrylic resins, silicone resins or mixtures of these resins.
- a flame retardant can also be added to the molding composition in order to reduce the risk of the molding composition igniting if the melting web melts. If necessary, it is advantageous to leave out the casing around the fusible link, so that when the fusible link heats up, the heat input into the casing is reduced and the risk of fire is also reduced.
- the molding composition can also contain phosphors which at least partially convert radiation of a first wavelength generated by the LED into radiation of a second wavelength. This allows the visual impression to be mixed-colored
- an inorganic phosphor pigment powder with phosphors with the general formula A 3 B S X 12 : M can be used in particular as an additive for the molding composition.
- These are, for example, doped with rare earths, in particular Ce
- AI can be at least partially replaced by Ga or In.
- the phosphors mentioned are to be understood as an example and not as a limitation of the general formula A 3 B 5 X 12 : M.
- the compounds SrS: Ce 3+ , Na, SrS: Ce 3+ , Cl, SrS: CeCl 3 , CaS: Ce 3+ and SrSe: Ce 3+ are also suitable as phosphors.
- host grids based on sulfide and oxysulfide as well as aluminates, borates, alkaline earth sulfides, thiogallates, or orthosilicates etc. with metal centers or organometallic phosphor systems that can be excited in the short-wave range can be used. Soluble and sparingly soluble organic dyes and phosphor mixtures can also be used.
- the casing 10 is further provided with a roughening 11 on the upper side. This roughening interferes with the total reflection of the light generated by the LEDs on this surface, so that the light decoupling is increased and, as a result, the visibility of the optical display is improved.
- a further possibility for increasing the outcoupling of light is to provide the surface of the covering at least partially with a structure such as, for example, a plurality of grooves, knobs, prisms, lenses or the like.
- the total reflection is also disturbed on the structured surface, thus improving the visibility of the display.
- the color of the emitted light can be used to characterize the fuse component, for example to identify the maximum current.
- red-emitting LEDs can be used for 10A automotive fuses and yellow LEDs for 6A automotive fuses. In the event of a fuse defect, the user is thus shown both the defect and the type of replacement fuse required.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50206152T DE50206152D1 (de) | 2001-08-31 | 2002-08-07 | Sicherungsbauelement mit optischer anzeige |
JP2003531494A JP4260012B2 (ja) | 2001-08-31 | 2002-08-07 | 光学表示装置を備えたヒューズ素子 |
EP02754495A EP1425771B1 (de) | 2001-08-31 | 2002-08-07 | Sicherungsbauelement mit optischer anzeige |
US10/488,378 US7570147B2 (en) | 2001-08-31 | 2002-08-07 | Fuse component comprising an optical indicator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10142654A DE10142654A1 (de) | 2001-08-31 | 2001-08-31 | Sicherungsbauelement mit optischer Anzeige |
DE10142654.2 | 2001-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003028060A1 true WO2003028060A1 (de) | 2003-04-03 |
Family
ID=7697225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002907 WO2003028060A1 (de) | 2001-08-31 | 2002-08-07 | Sicherungsbauelement mit optischer anzeige |
Country Status (5)
Country | Link |
---|---|
US (1) | US7570147B2 (de) |
EP (1) | EP1425771B1 (de) |
JP (1) | JP4260012B2 (de) |
DE (2) | DE10142654A1 (de) |
WO (1) | WO2003028060A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006033375A1 (en) * | 2004-09-22 | 2006-03-30 | Dow Corning Toray Co., Ltd. | Optical semiconductor device and method of manufacturing thereof |
FR2907597A1 (fr) * | 2006-10-20 | 2008-04-25 | Kun Song Xie | Fusible de securite avec indicateur de fusible saute. |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10238481B4 (de) * | 2002-08-22 | 2005-12-08 | Wieland Electric Gmbh | Sicherungseinsatzträger |
US20050062579A1 (en) * | 2003-09-23 | 2005-03-24 | Carrier Corporation | Resettable fuse with visual indicator |
US20060017540A1 (en) * | 2004-07-26 | 2006-01-26 | Smith Jerry L | Fuse blow-out dual LED indicator |
ATE410483T1 (de) * | 2005-05-26 | 2008-10-15 | Dow Corning | Verfahren und silikonverkapselungszusammensetzung zur formung kleiner formen |
EP1973963B1 (de) * | 2006-01-17 | 2013-06-19 | Dow Corning Corporation | Thermisch stabile transparente silikonharzzusammensetzungen und verfahren zu ihrer herstellung und verwendung |
JP2009525507A (ja) * | 2006-02-01 | 2009-07-09 | ダウ・コーニング・コーポレイション | 耐衝撃性光導波路およびその製造方法 |
US8258502B2 (en) * | 2006-02-24 | 2012-09-04 | Dow Corning Corporation | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
US20080111658A1 (en) * | 2006-11-13 | 2008-05-15 | Ming-Lin Yang | Safety power disconnection terminal apparatus with light indication |
US20090237198A1 (en) * | 2006-11-13 | 2009-09-24 | Photo-Top Technologies Co., Ltd. | Safety power disconnection terminal apparatus with light indication |
US7460004B1 (en) * | 2007-06-26 | 2008-12-02 | Photo-Top Technologies Co., Ltd. | Circuit protection device with cutout warning effect |
US7839258B2 (en) * | 2008-08-06 | 2010-11-23 | Wen-Tsung Cheng | Fuse assembly with a capability of indicating a fusing state by light |
US20100060408A1 (en) * | 2008-09-09 | 2010-03-11 | Wen-Tsung Cheng | Fuse module with indicating capability |
TWI398971B (zh) * | 2009-05-27 | 2013-06-11 | Everlight Electronics Co Ltd | 發光二極體封裝結構 |
DE102009047889A1 (de) * | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zum Anpassen einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips |
US8164411B2 (en) * | 2010-01-06 | 2012-04-24 | Wen-Tsung Cheng | Fuse structure with power disconnection light indicating function |
JP2011192972A (ja) * | 2010-02-18 | 2011-09-29 | Oki Semiconductor Co Ltd | 基板端子間電圧検知回路 |
US9099270B2 (en) | 2011-05-23 | 2015-08-04 | Tlz Creative Solutions Llc | Pole mounted fuse cutout indicator |
CN102693886A (zh) * | 2012-05-29 | 2012-09-26 | 河南省电力公司郑州供电公司 | 电源保险管安全使用监控装置 |
DE102012107525A1 (de) * | 2012-08-16 | 2014-02-20 | Phoenix Contact Gmbh & Co. Kg | Sicherungsausfallanzeige |
US8911264B2 (en) * | 2012-10-22 | 2014-12-16 | Cooper Technologies Company | Connector with integral fuse holder |
US20140118102A1 (en) * | 2012-10-29 | 2014-05-01 | Sean Iwasaki | Telecommunication surge protector system |
US9969323B2 (en) | 2013-11-21 | 2018-05-15 | Ford Global Technologies, Llc | Vehicle lighting system employing a light strip |
US9387802B2 (en) | 2013-11-21 | 2016-07-12 | Ford Global Technologies, Llc | Photoluminescent power distribution box |
US10192707B2 (en) * | 2016-05-23 | 2019-01-29 | Yue-Zhi Lin | Fuse assembly with replaceable casing |
CN109830764B (zh) * | 2017-11-23 | 2021-08-06 | 台达电子工业股份有限公司 | 具异常检测功能的电池模块与蓄电装置及其操作方法 |
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US6448897B1 (en) * | 2001-05-25 | 2002-09-10 | Glorytech Technology Co., Ltd | Fuse assembly having a warning or indicating device |
KR100456571B1 (ko) * | 2002-08-12 | 2004-11-10 | 현대자동차주식회사 | 자동차용 퓨즈의 단선 진단장치 |
-
2001
- 2001-08-31 DE DE10142654A patent/DE10142654A1/de not_active Withdrawn
-
2002
- 2002-08-07 EP EP02754495A patent/EP1425771B1/de not_active Expired - Lifetime
- 2002-08-07 US US10/488,378 patent/US7570147B2/en not_active Expired - Fee Related
- 2002-08-07 DE DE50206152T patent/DE50206152D1/de not_active Expired - Lifetime
- 2002-08-07 WO PCT/DE2002/002907 patent/WO2003028060A1/de active IP Right Grant
- 2002-08-07 JP JP2003531494A patent/JP4260012B2/ja not_active Expired - Fee Related
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US4511875A (en) * | 1982-03-19 | 1985-04-16 | S.O.C. Corporation | Micro-fuse assembly |
US4499447A (en) * | 1983-06-17 | 1985-02-12 | Guim Multi-Tech Corporation | Blade terminal fuses with integrity indicator |
EP1003194A1 (de) * | 1998-11-19 | 2000-05-24 | Jose Luis Diaz Mejia | Lichtemittierende Anzeigevorrichtung von durchgebrannten Sicherungen und ihren Ursachen in elekrischen Schaltungen von Kraftfahrzeugen |
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WO2006033375A1 (en) * | 2004-09-22 | 2006-03-30 | Dow Corning Toray Co., Ltd. | Optical semiconductor device and method of manufacturing thereof |
JP2006093354A (ja) * | 2004-09-22 | 2006-04-06 | Dow Corning Toray Co Ltd | 光半導体装置の製造方法および光半導体装置 |
US7651887B2 (en) | 2004-09-22 | 2010-01-26 | Dow Corning Toray Company, Ltd. | Optical semiconductor device and method of manufacturing thereof |
JP4676735B2 (ja) * | 2004-09-22 | 2011-04-27 | 東レ・ダウコーニング株式会社 | 光半導体装置の製造方法および光半導体装置 |
KR101166035B1 (ko) | 2004-09-22 | 2012-07-19 | 다우 코닝 도레이 캄파니 리미티드 | 광 반도체 디바이스 및 이의 제조방법 |
FR2907597A1 (fr) * | 2006-10-20 | 2008-04-25 | Kun Song Xie | Fusible de securite avec indicateur de fusible saute. |
Also Published As
Publication number | Publication date |
---|---|
US20040257191A1 (en) | 2004-12-23 |
EP1425771A1 (de) | 2004-06-09 |
US7570147B2 (en) | 2009-08-04 |
JP2005504416A (ja) | 2005-02-10 |
JP4260012B2 (ja) | 2009-04-30 |
DE10142654A1 (de) | 2003-04-03 |
DE50206152D1 (de) | 2006-05-11 |
EP1425771B1 (de) | 2006-03-22 |
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