WO2003026370A1 - Surface mounting package - Google Patents
Surface mounting package Download PDFInfo
- Publication number
- WO2003026370A1 WO2003026370A1 PCT/JP2002/009389 JP0209389W WO03026370A1 WO 2003026370 A1 WO2003026370 A1 WO 2003026370A1 JP 0209389 W JP0209389 W JP 0209389W WO 03026370 A1 WO03026370 A1 WO 03026370A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- surface mounting
- mounting package
- base
- metal base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Definitions
- the present invention relates to a surface mounting package for an electronic part component, and in particular, to a structure in which a metal lead is adhered to a metal base by an insulating material and exposed to the outside.
- a surface mounting package to be a housing contains an electronic part component such as a piece of quartz, a piezoelectric device or the like.
- Examples of such a surface mounting package typically include four types of structures each having a base and a cap, as will be described below with Conventional Examples 1 to 4.
- Conventional Example 1 A surface mounting package of Conventional Example 1 is formed, as shown in Figs. 10 and 12, by first connecting a metal lead 6 for lead-out to a circular metal base 5 by a high-melting glass 7 which is an insulating adhesive (e.g.
- cyhndrical cap 8 shown in Fig. 11 therewith such that an opening end 8e is coupled around metal base 5 for seahng.
- cyhndrical cap 8 has legs 9 for holding its position, connected by welding or the like to an outer periphery of the cyhndrical portion.
- Cyhndrical cap 8 in such a package is made of metal for preventing entry of external electromagnetic wave that interferes with the function of a quartz resonator and the like.
- Conventional Example 2 A surface mounting package of Conventional Example 2 is shown in
- Fig. 14 The package is formed by combining a box-shaped ceramic base 9 with a platy ceramic cap 10 for covering a box opening 9a. Only an insulator is used as a material for the package. If there is no concern about entry of electromagnetic wave, the package may be made of an insulator alone as in Conventional Example 2, not using a metal material as in Conventional Example 1.
- Conventional Example 3 A surface mounting package of Conventional Example 3 is shown in
- the package is formed by combining ceramic base 9 and a translucent glass cap 11 that serves as a top plate to cover a ceramic base opening 9a, and seahng the package with low-melting glass 31.
- the package uses a glass cap, so that oscillation frequency after sealing can easily be adjusted by laser trimming.
- a surface mounting package of Conventional Example 4 is shown in Fig. 16.
- the package is formed by combining ceramic base 9 with a metal cap 12.
- a metal thin film 14 (e.g. silver brazing filler metal) is formed on an upper surface at the opening side of a spacer 13 forming sidewalls of ceramic base 9.
- Metal thin film 14 and metal cap 12 are connected together by seam welding or electron-beam welding.
- the surface mounting package according to Conventional Example 1 needs to ensure insulation between metal lead 6 and metal base 5 by providing an insulating material around metal lead 6, which increases the outer diameter of the package by a distance required for insulation, and thus adversely affects thinning of the package.
- each of the surface mounting packages according to Conventional Examples 2 to 4 has a hmit on thinning of the package, since it is difficult to reduce a bottom-plate thickness 15 of the base due to constraints in the composition and characteristics of ceramic base 9 used as a base material. Excessive reduction in the dimension would adversely affect the air tightness, moisture resistance and strength of the package.
- an object of the present invention is to provide a surface mounting package that allows further reduction in the thickness.
- a surface mounting package according to the present invention employs a metal base in place of the combination of an insulating ceramic base and a cap.
- a metal lead for lead-out is provided at the bottom of the metal base having a surface to be attached to a mounting board.
- the metal lead is configured to have a lower surface coplanar with a lower surface of the metal base.
- Fig. 1 is a plan view of a thin metal package as a surface mounting package in the first embodiment of the present invention
- Fig. 2 is a section view taken along line II-II in Fig. 1 in the direction of the arrow;
- Fig. 3 is a section view taken along hne III-III in Fig. 1 in the direction of the arrow;
- Fig. 4 is a plan view of a thin metal package as a surface mounting package in the second embodiment of the present invention
- Fig. 5 is a section view taken along hne V-V in Fig. 4 in the direction of the arrow;
- Fig. 6 is a section view taken along hne VI -VI in Fig. 4 in the direction of the arrow;
- Fig. 7 is a plan view of a thin metal package as a surface mounting package in the third embodiment of the present invention.
- Fig. 8 is a section view taken along hne VIII-VIII in Fig. 7 in the direction of the arrow;
- Fig. 9 is a section view taken along hne IX-IX in Fig. 7 in the direction of the arrow;
- Fig. 10 is a section view showing the metal package in Conventional
- Fig. 11 is a section view taken along the direction of axis of a cyhndrical cap for the metal package in Conventional Example 1 of the surface mounting package;
- Fig. 12 is a section view taken along hne XII-XII in Fig. 10 in the direction of the arrow;
- Fig. 13 is a section view taken along hne XIII-XIII in Fig. 11 in the direction of the arrow;
- Fig. 14 is a section view of the ceramic package in Conventional Example 2 of the surface mounting package;
- Fig. 15 is a section view of the ceramic package in Conventional Example 3 of the surface mounting package; and Fig. 16 is a section view showing the package in Conventional
- Example 4 formed by combining a metal cap with a ceramic base.
- the surface mounting package includes an assembled base 4 in which a metal base 1 and a metal lead 2 are adhered together by an insulating material 3, and a metal cap 30 illustrated by a chain double-dashed hne.
- Metal base 1 constituting assembled base 4 forms a metal cavity structure (i.e. a structure in which a part of a metal box is cut out) as shown in Fig. 1, and has a base bottom portion 16 provided with a through hole 160.
- Metal lead 2 is of a quadrangular prism with an inner surface 2i and an outer surface 2o of the six surfaces serving as an inner electrode and an outer electrode, respectively.
- Metal lead 2 is shaped to be accommodated to metal base 1 and is inserted into a position corresponding to through hole 160.
- the size and shape of through hole 160 in metal base 1 correspond to those of metal lead 2. It is noted that Figs. 2 and 3 are section views taken along lines II- II and III-III, respectively, in Fig. 1 in the direction of the arrows.
- a surface 2o which is to be the lower surface of metal lead 2 and the lower surface of base bottom portion 16 form a plane P used when the package is attached to a mounting board.
- Plane P may be flat when it is fixed by blazing to a flat printed board or the like, but is formed to be a curved plane when it is attached to a cyhndrical surface, to conform thereto.
- a gap space generated when metal lead 2 is inserted into metal base 1 is filled with e.g. borosilicate glass, which is high-melting glass, as an insulating material 3. Heat is apphed to weld the insulating material, to adhere metal lead 2 to metal base 1.
- Ag- based glass which is low-melting glass may be used as insulating material 3 for an electronic part component susceptible to high-temperature adhesion.
- a quartz piece is fixed to a pair of lead electrodes 2 on assembled base 4 configured as described above.
- Metal base 1 is covered and coupled with a metal cap 30 indicated by chain double-dashed fines in Figs. 2 and 3.
- borosilicate glass may be used in place of metal cap 30, in consideration of translucency.
- Metal base 1 constituting assembled base 4 forms a metal cavity structure (i.e. a structure in which a part of a metal box is cut out) as shown in Fig. 1, and has base bottom portion 16 provided with two through holes 161, 162 as shown in Fig. 5.
- Metal lead 2 is of a quadrangular prism, two of the six surfaces serving as an inner electrode and an outer electrode. Metal lead 2 is shaped to be accommodated to metal base 1 and inserted into a position corresponding to each of through holes 161, 162. The size and shape of each through hole 161, 162 in metal base 1 correspond to those of metal lead 2. It is noted that Figs. 5 and 6 are section views taken along hnes V- V and VI-VI, respectively, in Fig. 4 in the direction of the arrows.
- insulating material 3 of high-melting glass. Heat is apphed to weld the insulating material, to adhere metal lead 2 to metal base 1.
- insulating material 3 may not necessarily be made of a glass-based material. For instance, polyimide-based resin and the hke may also be used when the glass-based material is unacceptable due to the specification of an electronic part component.
- a piezoelectric device is fixed to a pair of lead electrodes 2 on assembled base 4 configured as described above.
- Metal base 1 is covered and coupled with metal cap 30 (not shown).
- an oscillator including a filter and a semiconductor device may also be employed as an electronic part component.
- Metal lead 2 is not hmited to a bar-shaped one with a rectangular section, but may have an approximately circular shape when the electronic part component uses small power and employs low current rating.
- metal cap 30 may be formed, for example, of an Fe-Co-Ni alloy.
- the third embodiment of a surface mounting package for a quartz resonator according to the present invention will be described with reference to Fig. 7.
- the surface mounting package includes assembled base 4 in which metal base 1 and metal lead 2 are adhered together by insulating material 3, and a metal cap (not shown).
- Metal base 1 constituting assembled base 4 forms a metal cavity structure (i.e. a structure in which a part of a metal box is cut out) as shown in Fig. 1, and has a base bottom portion 16 provided with one through hole 160.
- Metal lead 2 is of a quadrangular-prism-hke shape having a curved surface, two of the six surfaces serving as an inner electrode and an outer electrode.
- Metal lead 2 is shaped to be accommodated to metal base 1 and inserted into a position corresponding to through hole 160.
- the size and shape of through hole 160 in metal base 1 correspond to those of metal lead 2.
- Figs. 8 and 9 are section views taken along hnes VIII-VIII and IX-IX in Fig. 7, respectively, in the direction of the arrows.
- a gap space generated when metal lead 2 is inserted into metal base 1 is filled with borosilicate glass, which is high-melting glass, as insulating material 3. Heat is apphed to weld the insulating material, to adhere metal lead 2 to metal base 1.
- a piezoelectric device is fixed to a pair of lead electrodes 2 on assembled base 4 configured as described above.
- Metal base 1 is covered and coupled with a metal cap (not shown).
- Ag-based glass may also be used as insulating material 3 when an electronic part component desires no high-melting glass as an insulating material.
- the lower surface of metal lead 2 was coplanar with that of metal base 1 in the embodiments above, the lower surface of insulating material 3, instead of metal lead 2, may have the same plane as the lower surface of metal base 1.
- the lower surfaces of metal lead 2, insulating material 3 and metal base 1 may all be on the same plane.
- the surface mounting package according to the present invention ehminates the need for providing an insulating material around a metal lead an in a conventional package (Conventional Example 1), allowing the package to be made thinner and smaller.
- a base material from ceramic to metal By changing a base material from ceramic to metal, the air tightness, moisture resistance and strength- of the package can be secured even if the base bottom plate portion has a small thickness.
- the present invention may be apphcable to a surface mounting package used in surface mounting of an electronic part component such as a quartz resonator, a filter, an oscillator and the hke, and is useful in further thinning of the surface mounting package.
- an electronic part component such as a quartz resonator, a filter, an oscillator and the hke
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/486,849 US6977339B2 (en) | 2001-09-14 | 2002-09-12 | Surface mounting package |
KR10-2004-7003103A KR100537263B1 (en) | 2001-09-14 | 2002-09-12 | Surface mounting package |
EP02772850A EP1428418A1 (en) | 2001-09-14 | 2002-09-12 | Surface mounting package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-280654 | 2001-09-14 | ||
JP2001280654A JP2003086723A (en) | 2001-09-14 | 2001-09-14 | Thin metal package |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003026370A1 true WO2003026370A1 (en) | 2003-03-27 |
Family
ID=19104609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/009389 WO2003026370A1 (en) | 2001-09-14 | 2002-09-12 | Surface mounting package |
Country Status (6)
Country | Link |
---|---|
US (1) | US6977339B2 (en) |
EP (1) | EP1428418A1 (en) |
JP (1) | JP2003086723A (en) |
KR (1) | KR100537263B1 (en) |
CN (1) | CN1555667A (en) |
WO (1) | WO2003026370A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4668291B2 (en) * | 2008-04-16 | 2011-04-13 | 日本電波工業株式会社 | Crystal device for surface mounting |
JP4620752B2 (en) * | 2008-04-16 | 2011-01-26 | 日本電波工業株式会社 | Crystal device for surface mounting |
JP2009278612A (en) * | 2008-04-18 | 2009-11-26 | Nippon Dempa Kogyo Co Ltd | Crystal device for surface mounting |
CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
US9306491B2 (en) * | 2011-05-16 | 2016-04-05 | First Solar, Inc. | Electrical test apparatus for a photovoltaic component |
CN103875070B (en) * | 2011-09-30 | 2017-05-24 | 株式会社大真空 | Electronic component package, sealing member for electronic component package, and method for manufacturing sealing member for electronic component package |
JP6056259B2 (en) * | 2012-08-18 | 2017-01-11 | セイコーエプソン株式会社 | Electronic component manufacturing method, electronic device manufacturing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5235135A (en) * | 1992-02-14 | 1993-08-10 | Motorola, Inc. | Sealed electronic package providing in-situ metallization |
US5448452A (en) * | 1992-06-18 | 1995-09-05 | Nec Corporation | Circuit board for mounting a band-pass filter |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60210853A (en) * | 1984-03-06 | 1985-10-23 | Fujitsu Ltd | Semiconductor device |
US4614836A (en) * | 1984-03-19 | 1986-09-30 | Axia Incorporated | Ground connector for microelectronic circuit case |
US4649229A (en) * | 1985-08-12 | 1987-03-10 | Aegis, Inc. | All metal flat package for microcircuitry |
US4766479A (en) * | 1986-10-14 | 1988-08-23 | Hughes Aircraft Company | Low resistance electrical interconnection for synchronous rectifiers |
US4961106A (en) * | 1987-03-27 | 1990-10-02 | Olin Corporation | Metal packages having improved thermal dissipation |
US5223672A (en) * | 1990-06-11 | 1993-06-29 | Trw Inc. | Hermetically sealed aluminum package for hybrid microcircuits |
US5138114A (en) * | 1990-09-27 | 1992-08-11 | Texas Instruments Incorporated | Hybrid/microwave enclosures and method of making same |
FR2669254B1 (en) * | 1990-11-16 | 1995-01-06 | Egide Sa | METHOD OF BRAZING AN ELEMENT CROSS-SECTION TO A WALL, JUNCTION ASSEMBLY FOR IMPLEMENTING A HOUSING FOR AN ELECTRONIC COMPONENT. |
JP2855940B2 (en) * | 1992-02-27 | 1999-02-10 | 日本電気株式会社 | Semiconductor device |
TW238419B (en) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
US5365108A (en) * | 1992-11-19 | 1994-11-15 | Sundstrand Corporation | Metal matrix composite semiconductor power switch assembly |
US5880403A (en) * | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
AU2231795A (en) * | 1994-04-14 | 1995-11-10 | Olin Corporation | Electronic package having improved wire bonding capability |
JP4058172B2 (en) * | 1997-12-02 | 2008-03-05 | 株式会社住友金属エレクトロデバイス | Optical semiconductor element storage package |
US6400015B1 (en) * | 2000-03-31 | 2002-06-04 | Intel Corporation | Method of creating shielded structures to protect semiconductor devices |
JP4494587B2 (en) * | 2000-05-11 | 2010-06-30 | 古河電気工業株式会社 | Optical semiconductor device package and optical semiconductor device module using the package |
-
2001
- 2001-09-14 JP JP2001280654A patent/JP2003086723A/en not_active Withdrawn
-
2002
- 2002-09-12 EP EP02772850A patent/EP1428418A1/en not_active Withdrawn
- 2002-09-12 WO PCT/JP2002/009389 patent/WO2003026370A1/en not_active Application Discontinuation
- 2002-09-12 US US10/486,849 patent/US6977339B2/en not_active Expired - Fee Related
- 2002-09-12 KR KR10-2004-7003103A patent/KR100537263B1/en not_active IP Right Cessation
- 2002-09-12 CN CNA028179072A patent/CN1555667A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5235135A (en) * | 1992-02-14 | 1993-08-10 | Motorola, Inc. | Sealed electronic package providing in-situ metallization |
US5448452A (en) * | 1992-06-18 | 1995-09-05 | Nec Corporation | Circuit board for mounting a band-pass filter |
Also Published As
Publication number | Publication date |
---|---|
CN1555667A (en) | 2004-12-15 |
US20040173371A1 (en) | 2004-09-09 |
KR100537263B1 (en) | 2005-12-19 |
EP1428418A1 (en) | 2004-06-16 |
US6977339B2 (en) | 2005-12-20 |
KR20040036926A (en) | 2004-05-03 |
JP2003086723A (en) | 2003-03-20 |
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