WO2003021643A3 - Semiconductor material handling system - Google Patents

Semiconductor material handling system Download PDF

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Publication number
WO2003021643A3
WO2003021643A3 PCT/US2002/027769 US0227769W WO03021643A3 WO 2003021643 A3 WO2003021643 A3 WO 2003021643A3 US 0227769 W US0227769 W US 0227769W WO 03021643 A3 WO03021643 A3 WO 03021643A3
Authority
WO
WIPO (PCT)
Prior art keywords
efem
processing tool
mount
components
semiconductor material
Prior art date
Application number
PCT/US2002/027769
Other languages
French (fr)
Other versions
WO2003021643A2 (en
Inventor
Anthony C Bonora
Richard H Gould
Roger G Hine
Michael Krolak
Jerry A Speasl
Original Assignee
Asyst Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies filed Critical Asyst Technologies
Priority to DE10297169T priority Critical patent/DE10297169T5/en
Priority to CNB028204883A priority patent/CN1327477C/en
Priority to JP2003525891A priority patent/JP4309264B2/en
Priority to KR1020047003085A priority patent/KR100800612B1/en
Publication of WO2003021643A2 publication Critical patent/WO2003021643A2/en
Publication of WO2003021643A3 publication Critical patent/WO2003021643A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Abstract

The semiconductor material handling system is an EFEM that may either mount to the front end of a processing tool or be integrated into the processing tool. The EFEM is built from a unified frame that the EFEM components, such as a wafer engine and a SMIF pod advance plate, may mount to. The frame serves as a common mounting structure that the EFEM components may use as a reference for alignment purposes. Since the EFEM components do not have to align with respect to the position of each other, the calibration, if any is required, is greatly simplified. The EFEM also has a reduced footprint, allowing the EFEM to mount to the front end of a processing tool and not extend to the fab floor. Thus, space is freed up between the EFEM and the fab floor. By way of example only, this space may be used as a maintenance access area to the processing tool without having to first remove the EFEM.
PCT/US2002/027769 2001-08-31 2002-08-30 Semiconductor material handling system WO2003021643A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10297169T DE10297169T5 (en) 2001-08-31 2002-08-30 Handling system for semiconductor material
CNB028204883A CN1327477C (en) 2001-08-31 2002-08-30 Semiconductor material handling system
JP2003525891A JP4309264B2 (en) 2001-08-31 2002-08-30 Semiconductor material handling equipment
KR1020047003085A KR100800612B1 (en) 2001-08-31 2002-08-30 Semiconductor material handling system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,092 US7217076B2 (en) 2001-08-31 2002-03-01 Semiconductor material handling system
US10/087,092 2002-03-01

Publications (2)

Publication Number Publication Date
WO2003021643A2 WO2003021643A2 (en) 2003-03-13
WO2003021643A3 true WO2003021643A3 (en) 2003-08-07

Family

ID=26776585

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/027769 WO2003021643A2 (en) 2001-08-31 2002-08-30 Semiconductor material handling system

Country Status (6)

Country Link
US (1) US7217076B2 (en)
JP (1) JP4309264B2 (en)
KR (1) KR100800612B1 (en)
CN (1) CN1327477C (en)
DE (1) DE10297169T5 (en)
WO (1) WO2003021643A2 (en)

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US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
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US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7357256B2 (en) * 2005-03-31 2008-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer pod with working sheet holder
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
ITBO20060244A1 (en) * 2006-04-05 2007-10-06 Ima Spa SYSTEM AND METHOD TO TRANSFER AND MOVE ELEMENTS OF AN AUTOMATIC PACKAGING MACHINE.
ITBO20060245A1 (en) * 2006-04-05 2007-10-06 Ima Spa SYSTEM TO TRANSFER AND MOVE ELEMENTS OF A MACHINE OPERATOR.
KR100818044B1 (en) * 2006-05-04 2008-03-31 위순임 Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same
JP4606388B2 (en) * 2006-06-12 2011-01-05 川崎重工業株式会社 Transfer system unit for substrate transfer equipment
DE102006029003A1 (en) * 2006-06-24 2008-01-03 Vistec Semiconductor Systems Gmbh Wafer e.g. semiconductor wafer, handling device, has tool rack with tool component, base rack and robot for moving wafers, and robot mounted on coupling rack that is mounted directly on base rack independently of tool rack
JP2008032335A (en) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp Mini-environment device, inspection device, manufacturing device, and space cleaning method
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8920097B2 (en) * 2006-11-02 2014-12-30 Globalfoundries Singapore Pte. Ltd. Wafer handling system for a loadlock
KR100847888B1 (en) * 2006-12-12 2008-07-23 세메스 주식회사 Apparatus for fabricating semiconductor device
US8500382B2 (en) * 2007-05-22 2013-08-06 Axcelis Technologies Inc. Airflow management for particle abatement in semiconductor manufacturing equipment
WO2009014647A1 (en) * 2007-07-20 2009-01-29 Applied Materials, Inc. Dual-mode robot systems and methods for electronic device manufacturing
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5168329B2 (en) * 2010-08-31 2013-03-21 Ｔｄｋ株式会社 Load port device
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US9184078B2 (en) * 2011-05-07 2015-11-10 Brooks Automation, Inc. Narrow width loadport mechanism for cleanroom material transfer systems
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US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
WO2014088414A1 (en) * 2012-12-03 2014-06-12 Asm Ip Holding B.V. Modular vertical furnace processing system
CN104375293B (en) * 2014-11-20 2017-05-17 武汉精测电子技术股份有限公司 Automatic LCD screen detecting cabinet based on machine vision
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Also Published As

Publication number Publication date
CN1572013A (en) 2005-01-26
CN1327477C (en) 2007-07-18
JP4309264B2 (en) 2009-08-05
DE10297169T5 (en) 2004-07-29
KR100800612B1 (en) 2008-02-05
US20030044261A1 (en) 2003-03-06
WO2003021643A2 (en) 2003-03-13
KR20040040447A (en) 2004-05-12
US7217076B2 (en) 2007-05-15
JP2005508570A (en) 2005-03-31

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