WO2003017211A2 - Chip card comprising an integrated fingerprint sensor - Google Patents

Chip card comprising an integrated fingerprint sensor Download PDF

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Publication number
WO2003017211A2
WO2003017211A2 PCT/DE2002/002757 DE0202757W WO03017211A2 WO 2003017211 A2 WO2003017211 A2 WO 2003017211A2 DE 0202757 W DE0202757 W DE 0202757W WO 03017211 A2 WO03017211 A2 WO 03017211A2
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WO
WIPO (PCT)
Prior art keywords
chip
card
card body
semiconductor chip
fingerprint sensor
Prior art date
Application number
PCT/DE2002/002757
Other languages
German (de)
French (fr)
Other versions
WO2003017211A3 (en
Inventor
Harald Gundlach
Boris Mayerhofer
Thomas SPÖTTL
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2003017211A2 publication Critical patent/WO2003017211A2/en
Publication of WO2003017211A3 publication Critical patent/WO2003017211A3/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Definitions

  • Chip card with integrated fingerprint sensor Chip card with integrated fingerprint sensor
  • the present invention relates to a chip card with an integrated fingerprint sensor, which is provided in particular for personal identification.
  • a semiconductor chip used in a chip card may only have dimensions that comply with the ISO standard for the chip cards (ISO / IEC 7810).
  • the chip card has to tolerate a certain degree of bending (according to ISO / IEC 10373-1) that the integrated chip survives intact.
  • silicon chips such as those used for fingerprint sensors, this sufficient resistance to bending cannot be guaranteed.
  • a fingerprint sensor in the form of a semiconductor device is e.g. B. integrated on a substrate made of silicon. If such semiconductor chips provided with a fingerprint sensor are bent, the substrate breaks. This will render the chips unusable.
  • the semiconductor chips are therefore installed in rigid housings, which, however, have such large dimensions that they cannot be installed in chip cards which comply with the ISO standard. Arrangements are described in WO 00/07420, WO 00/06023, WO 99/38112 and DE 199 21 231 which do not or only partially eliminate the difficulties stated.
  • the object of the present invention is to provide a chip card with an integrated fingerprint sensor which can be manufactured with sufficient break resistance within the dimensions of the ISO standard.
  • a semiconductor chip with a fingerprint sensor is at such a height, ie. H. Position, arranged within the card body according to ISO / IEC 7810, that the stress on the chip when the chip card is bent within the entire arrangement of card and chip is minimized in such a way that the sufficient break resistance at least for those according to the standard ISO / IEC 10373-1 required bending tests is achieved.
  • a recess is provided in the card body in ISO dimensions, in which the semiconductor chip, with or without its own housing, is attached. The depth of this cutout and thus the position of the semiconductor chip within the chip card is selected such that the semiconductor chip survives a bending of the card body that conforms to a test standard.
  • the position suitable for the semiconductor chip within the card body can be determined by calculation or experiment in a manner known per se. It should only be taken into account here that, according to the invention, the cutout is present on one side of the card body, so that, in the usual exemplary embodiments of the chip card, the surface of the semiconductor chip facing the outside is somewhat recessed relative to the top of the chip card.
  • the semiconductor chip is buried in the card body. In particular a portion of the card body, which is usually made of a plastic material, can also be surmounted over the edge regions of the semiconductor chip. Such an arrangement can be produced if the card body is produced as a laminate by arranging several layer parts one above the other and pressing them together.
  • the semiconductor chip with the fingerprint sensor is preferably installed in a floating manner, which means that the semiconductor chip is not rigidly connected to the card body with its underside facing the card body and with its edges.
  • the semiconductor chip is rather attached within the recess of the card body in such a way that it can be displaced in the plane of the chip or the card body relative to the card body when the card body is bent. It can therefore be advantageous if the semiconductor chip is fixed in the recess of the card body with only one edge or with two edges lying opposite one another.
  • an adhesive layer can preferably also be used, within which shearing of the material is possible.
  • the adhesive layer can thus allow a certain displacement between the surface of the card body in the recess and the surface (for example the rear side) of the semiconductor chip arranged thereon.
  • the semiconductor chip or the housing containing the chip is glued into the recess , it may be advantageous to choose the dimensions of the recess laterally somewhat larger than the dimensions of the semiconductor chip, so that when the card body is bent, lateral gaps between the semiconductor chip and the card body within the recess result in an otherwise occurring deformation of the semiconductor chip or the housing prevent.
  • the semiconductor chip therefore has sufficient play within the cutout, so that the bending occurring in the semiconductor chip is less than the bending of the hard body.
  • This effect can be further improved by making the sides of the semiconductor chip glued into the card body as smooth as possible, for which purpose an additional smoothing, in particular of the underside of the chip, can be carried out. A relative shift between the semiconductor chip and the card body can thus be additionally promoted.
  • FIG. 1 shows in cross section a semiconductor chip 1 with an integrated fingerprint sensor, not shown in detail, which is arranged in a card body 2 within a recess 3 therein.
  • the upper side of the semiconductor chip which in particular has a contact surface provided for a finger, is offset downwards by a depth d from the upper side of the card body into the card body.
  • the edges 4 of the semiconductor chip 1 and the underside 5 facing away from the outside can be designed and arranged in the manner described so that bending of the semiconductor chip is kept as low as possible when the card body 2 is bent out of the plane of the chip card.
  • the edges 4 of the semiconductor chip 1 can at least protrude from the edges of the card body 2 formed in the recess. are slightly protruded so that the chip is held securely in the card body and is not pressed out of the recess even when the card body 2 is bent in a shape that is convex in the direction of the recess.
  • the rear side 5 can be provided with a thin adhesive layer with which the semiconductor chip 1 is held at the bottom of the recess 3 of the card body 2. Spaces (not shown in the figure) can also be provided between the card body 2 and the edges 4 of the semiconductor chip 1, which enable the position of the semiconductor chip 1 to be compensated for by bending the card body 2 by a relative displacement of the chip relative to the card body.
  • the above-described floating arrangement of the chip in the card body can also be achieved with such an adhesive layer.
  • FIG. 2 shows an alternative exemplary embodiment, in which the semiconductor chip 1 is not inserted directly into the card body 2, but with a housing which essentially comprises a frame 6 and a casing 7, which does not necessarily completely surround the semiconductor chip.
  • the depth d by which the top side of the semiconductor chip is sunk relative to the top side of the card body can in principle be as small as desired; in particular, the surfaces of the semiconductor chip and the card body can also connect flush to one another within the same plane. If the semiconductor chip is chosen to be significantly thicker than shown in the figure, the top of the chip can also protrude above the card body. With regard to the given standard, this is not a preferred embodiment.
  • the semiconductor chip 1 can be inserted in the position shown in the figure and asymmetrical with respect to the central surface of the card body; instead, it is also possible to arrange the semiconductor chip symmetrically within the card body.
  • NEN semiconductor chips can also be used with a thickness that is substantially greater than the thickness of the card body than shown in the figure.
  • the arrangement according to the invention makes it possible to integrate very thin semiconductor substrates in the chip card in a break-proof manner.

Abstract

The invention relates to a semiconductor chip (1) comprising a fingerprint sensor. Said chip is arranged in the card body (2) in such a position that when the chip card is bent, the load on the chip inside the entire arrangement of card and chip is minimised in such a way that sufficient security against fracture is achieved, at least in terms of the bending tests necessary for the ISO norm. To this end, a recess (3) is provided in the card body, in which the semiconductor chip is applied, preferably without a housing, in an adapted selected depth (d).

Description

Beschreibungdescription
Chipkarte mit integriertem FingerabdrucksensorChip card with integrated fingerprint sensor
Die vorliegende Erfindung betrifft eine Chipkarte mit einem integrierten Fingerabdrucksensor, der insbesondere zur Personenidentifizierung vorgesehen ist.The present invention relates to a chip card with an integrated fingerprint sensor, which is provided in particular for personal identification.
Die Verwendung von Chipkarten, d. h. Kreditkarten und dergleichen mit einem eingesetzten Halbleiterchip, wird derzeit üblicherweise durch Eingabe einer PIN abgesichert. Dabei handelt es sich um eine persönliche Identifizierungsnummer, anhand deren festgestellt wird, dass der aktuelle Benutzer berechtigt ist, die Chipkarte zu benutzen. Fingerabdrucksensoren sind geeignet, die Identität und die Nutzungsberechtigung einer Person festzustellen. Ein elektronischer Fingerabdrucksensor lässt sich in einem Halbleiterchip integrieren, der prinzipiell Abmessungen aufweist, die eine Integration des Chips in eine Chipkarte gestatten.The use of smart cards, i. H. Credit cards and the like with an inserted semiconductor chip are currently usually secured by entering a PIN. It is a personal identification number that is used to determine that the current user is authorized to use the chip card. Fingerprint sensors are suitable for determining a person's identity and usage authorization. An electronic fingerprint sensor can be integrated in a semiconductor chip, which in principle has dimensions that allow the chip to be integrated into a chip card.
Ein Halbleiterchip, der in einer Chipkarte eingesetzt wird, darf nur Abmessungen aufweisen, die die ISO-Norm für die Chipkarten einhalten (ISO/IEC 7810) . Außerdem muss die Chipkarte einen gewissen Grad an Verbiegung tolerieren (gemäß ISO/IEC 10373-1) , die der integrierte Chip unversehrt übersteht. Bei Siliziumchips, wie sie für Fingerabdrucksensoren verwendet werden, kann diese ausreichende Widerstandsfähigkeit gegenüber Verbiegen nicht garantiert werden. Ein Fingerabdrucksensor in Form eines Halbleiterbauelementes ist z. B. auf einem Substrat aus Silizium integriert. Werden derartige mit einem Fingerabdrucksensor versehene Halbleiterchips gebogen, bricht das Substrat. Die Chips werden dadurch unbrauchbar. Es werden daher die Halbleiterchips in steife Gehäuse eingebaut, die allerdings so große Abmessungen aufweisen, dass sie nicht in Chipkarten eingebaut werden können, die der ISO-Norm entsprechen. In der WO 00/07420, der WO 00/06023, der WO 99/38112 und der DE 199 21 231 sind Anordnungen beschrieben, die die angegebenen Schwierigkeiten nicht oder nur teilweise beseitigen.A semiconductor chip used in a chip card may only have dimensions that comply with the ISO standard for the chip cards (ISO / IEC 7810). In addition, the chip card has to tolerate a certain degree of bending (according to ISO / IEC 10373-1) that the integrated chip survives intact. With silicon chips, such as those used for fingerprint sensors, this sufficient resistance to bending cannot be guaranteed. A fingerprint sensor in the form of a semiconductor device is e.g. B. integrated on a substrate made of silicon. If such semiconductor chips provided with a fingerprint sensor are bent, the substrate breaks. This will render the chips unusable. The semiconductor chips are therefore installed in rigid housings, which, however, have such large dimensions that they cannot be installed in chip cards which comply with the ISO standard. Arrangements are described in WO 00/07420, WO 00/06023, WO 99/38112 and DE 199 21 231 which do not or only partially eliminate the difficulties stated.
Aufgabe der vorliegenden Erfindung ist es, eine Chipkarte mit integriertem Fingerabdrucksensor anzugeben, die mit ausreichender Bruchsicherheit innerhalb der Abmessungen der ISO- Norm hergestellt werden kann.The object of the present invention is to provide a chip card with an integrated fingerprint sensor which can be manufactured with sufficient break resistance within the dimensions of the ISO standard.
Diese Aufgabe wird mit der Chipkarte mit dem Merkmal des Anspruches 1 gelöst. Ausgestaltungen ergeben sich aus den abhängigen Ansprüchen.This object is achieved with the chip card with the feature of claim 1. Refinements result from the dependent claims.
Bei der erfindungsgemäßen Chipkarte wird ein Halbleiterchip mit einem Fingerabdrucksensor in einer solchen Höhe, d. h. Lage, innerhalb des Kartenkörpers gemäß ISO/IEC 7810 angeordnet, dass die Belastung des Chips bei einem Verbiegen der Chipkarte innerhalb der gesamten Anordnung aus Karte und Chip so minimiert wird, dass die ausreichende Bruchsicherheit zumindest für die gemäß der Norm ISO/IEC 10373-1 erforderlichen Biegetests erreicht wird. Zu diesem Zweck ist in dem Kartenkörper in ISO-Abmessungen eine Aussparung vorgesehen, in der der Halbleiterchip, mit oder ohne ein eigenes Gehäuse, angebracht ist. Die Tiefe dieser Aussparung und damit die Position des Halbleiterchips innerhalb der Chipkarte wird so gewählt, dass der Halbleiterchip eine einem TestStandard entsprechende Verbiegung des Kartenkörpers bruchlos übersteht .In the chip card according to the invention, a semiconductor chip with a fingerprint sensor is at such a height, ie. H. Position, arranged within the card body according to ISO / IEC 7810, that the stress on the chip when the chip card is bent within the entire arrangement of card and chip is minimized in such a way that the sufficient break resistance at least for those according to the standard ISO / IEC 10373-1 required bending tests is achieved. For this purpose, a recess is provided in the card body in ISO dimensions, in which the semiconductor chip, with or without its own housing, is attached. The depth of this cutout and thus the position of the semiconductor chip within the chip card is selected such that the semiconductor chip survives a bending of the card body that conforms to a test standard.
Die für den Halbleiterchip innerhalb des Kartenkörpers geeignete Position kann in einer an sich bekannten Weise rechnerisch oder experimentell ermittelt werden. Dabei ist nur zu berücksichtigen, dass erfindungsgemäß die Aussparung auf einer Seite des Kartenkörpers vorhanden ist, so dass bei den üblichen Ausführungsbeispielen der Chipkarte die der Außenseite zugewandte Oberfläche des Halbleiterchips gegenüber der Oberseite der Chipkarte etwas versenkt ist. Der Halbleiterchip ist so etwas in den Kartenkörper vergraben. Insbesondere können auch die Randbereiche des Halbleiterchips von einem Anteil des Kartenkörpers, der üblicherweise aus einem Plastikmaterial hergestellt ist, überragt werden. Eine solche Anordnung ist herstellbar, wenn der Kartenkörper als Laminat hergestellt wird, indem mehrere Schichtanteile übereinander angeordnet und miteinander verpresst werden.The position suitable for the semiconductor chip within the card body can be determined by calculation or experiment in a manner known per se. It should only be taken into account here that, according to the invention, the cutout is present on one side of the card body, so that, in the usual exemplary embodiments of the chip card, the surface of the semiconductor chip facing the outside is somewhat recessed relative to the top of the chip card. The semiconductor chip is buried in the card body. In particular a portion of the card body, which is usually made of a plastic material, can also be surmounted over the edge regions of the semiconductor chip. Such an arrangement can be produced if the card body is produced as a laminate by arranging several layer parts one above the other and pressing them together.
Bei der Ermittlung der Bruchsicherheit der erfindungsgemäßen Chipkarte wird daher berücksichtigt, dass auf einer Seite der gesamten Anordnung aus Kartenkörper und Halbleiterchip eine Aussparung vorhanden ist, die zu einer Unsymmetrie in der Vertikalen bezüglich der Kartenebene führt. Der Chip wird daher im Allgemeinen nicht innerhalb der neutralen Faser des Kartenkörpers angeordnet, sondern etwas in der Vertikalen dazu verschoben.When determining the security against breakage of the chip card according to the invention, it is therefore taken into account that there is a recess on one side of the entire arrangement of card body and semiconductor chip, which leads to an asymmetry in the vertical with respect to the card plane. The chip is therefore generally not arranged within the neutral fiber of the card body, but is shifted somewhat to the vertical.
Der Halbleiterchip mit dem Fingerabdrucksensor wird vorzugsweise schwimmend eingebaut, womit gemeint •■ ist , dass der Halbleiterchip mit seiner dem Kartenkörper zugewandten Unterseite und mit seinen Rändern nicht starr mit dem Kartenkörper verbunden ist. Der Halbleiterchip ist vielmehr innerhalb der Aussparung des Kartenkörpers so angebracht, dass er in der Ebene des Chips bzw. des Kartenkörpers relativ zu dem Kartenkörper verschoben werden kann, wenn der Kartenkörper verbogen wird. Es kann daher von Vorteil sein, wenn der Halbleiterchip nur mit einer Kante oder mit zwei einander gegenüberliegenden Kanten in der Aussparung des Kartenkörpers befestigt wird.The semiconductor chip with the fingerprint sensor is preferably installed in a floating manner, which means that the semiconductor chip is not rigidly connected to the card body with its underside facing the card body and with its edges. The semiconductor chip is rather attached within the recess of the card body in such a way that it can be displaced in the plane of the chip or the card body relative to the card body when the card body is bent. It can therefore be advantageous if the semiconductor chip is fixed in the recess of the card body with only one edge or with two edges lying opposite one another.
Zum Befestigen des Chips an einem Kartenkörper oder einem Gehäuse sowie gegebenenfalls des Gehäuses an dem Kartenkörper kann vorzugsweise auch eine Klebeschicht verwendet werden, innerhalb deren eine Scherung des Materials möglich ist. Die Klebeschicht kann so eine gewisse Verschiebung zwischen der Oberfläche des Kartenkörpers in der Aussparung und der darauf angeordneten Oberfläche (zum Beispiel der Rückseite) des Halbleiterchips ermöglichen. Wenn der Halbleiterchip oder das den Chip enthaltende Gehäuse in die Aussparung eingeklebt wird, kann es von Vorteil sein, die Abmessungen der Aussparung seitlich etwas größer zu wählen als die Abmessungen des Halbleiterchips, so dass bei einer Verbiegung des Kartenkörpers seitliche Zwischenräume zwischen dem Halbleiterchip und dem Kartenkörper innerhalb der Aussparung eine ansonsten auftretende Verformung des Halbleiterchips oder des Gehäuses verhindern. Der Halbleiterchip hat bei dieser Ausgestaltung daher ausreichend Spiel innerhalb der Aussparung, so dass die in dem Halbleiterchip auftretende Verbiegung geringer ist, als die Verbiegung des harten Körpers. Dieser Effekt kann noch dadurch verbessert werden, dass die in den Kartenkörper eingeklebten Seiten des Halbleiterchips möglichst glatt ausgebildet werden, wozu eine zusätzliche Glättung insbesondere der Chipunterseite vorgenommen werden kann. Damit kann eine Relatiwerschiebung zwischen dem Halbleiterchip und dem Kartenkörper zusätzlich begünstigt werden.For attaching the chip to a card body or a housing and optionally the housing to the card body, an adhesive layer can preferably also be used, within which shearing of the material is possible. The adhesive layer can thus allow a certain displacement between the surface of the card body in the recess and the surface (for example the rear side) of the semiconductor chip arranged thereon. When the semiconductor chip or the housing containing the chip is glued into the recess , it may be advantageous to choose the dimensions of the recess laterally somewhat larger than the dimensions of the semiconductor chip, so that when the card body is bent, lateral gaps between the semiconductor chip and the card body within the recess result in an otherwise occurring deformation of the semiconductor chip or the housing prevent. In this embodiment, the semiconductor chip therefore has sufficient play within the cutout, so that the bending occurring in the semiconductor chip is less than the bending of the hard body. This effect can be further improved by making the sides of the semiconductor chip glued into the card body as smooth as possible, for which purpose an additional smoothing, in particular of the underside of the chip, can be carried out. A relative shift between the semiconductor chip and the card body can thus be additionally promoted.
In den beigefügten Figuren 1 und 2 sind Beispiele der erfindungsgemäßen Chipkarte in einem schematisierten Querschnitt dargestellt .In the attached Figures 1 and 2, examples of the chip card according to the invention are shown in a schematic cross section.
In der Figur 1 ist im Querschnitt ein Halbleiterchip 1 mit einem darin integrierten, nicht im Einzelnen dargestellten Fingerabdrucksensor gezeigt, der in einem Kartenkörper 2 innerhalb einer darin befindlichen Aussparung 3 angeordnet ist. Die Oberseite des Halbleiterchips, die insbesondere eine für einen Finger vorgesehene Auflagefläche aufweist, ist um eine Tiefe d von der Oberseite des Kartenkörpers ausgehend in den Kartenkörper hinein nach unten versetzt. Die Ränder 4 des Halbleiterchips 1 sowie die von der Außenseite abgewandte Unterseite 5 können in der beschriebenen Weise so ausgestaltet und angeordnet sein, dass ein Verbiegen des Halbleiterchips möglichst gering gehalten wird, wenn der Kartenkörper 2 aus der Ebene der Chipkarte heraus verbogen wird.1 shows in cross section a semiconductor chip 1 with an integrated fingerprint sensor, not shown in detail, which is arranged in a card body 2 within a recess 3 therein. The upper side of the semiconductor chip, which in particular has a contact surface provided for a finger, is offset downwards by a depth d from the upper side of the card body into the card body. The edges 4 of the semiconductor chip 1 and the underside 5 facing away from the outside can be designed and arranged in the manner described so that bending of the semiconductor chip is kept as low as possible when the card body 2 is bent out of the plane of the chip card.
Die Ränder 4 des Halbleiterchips 1 können von den in der Aussparung gebildeten Rändern des Kartenkörpers 2 zumindest ge- ringfügig überragt werden, so dass der Chip sicher in dem Kartenkörper gehalten wird und auch bei einer Verbiegung des Kartenkörpers 2 in einer in Richtung der Aussparung konvexen Form nicht aus der Aussparung herausgedrückt wird. Die Rückseite 5 kann mit einer dünnen Klebeschicht versehen sein, mit der der Halbleiterchip 1 am Boden der Aussparung 3 des Kartenkörpers 2 gehalten wird. Zwischen dem Kartenkörper 2 und den Rändern 4 des Halbleiterchips 1 können auch (in der Figur nicht dargestellt) Zwischenräume vorgesehen sein, die bei einem Verbiegen des Kartenkörpers 2 einen Positionsausgleich des Halbleiterchips 1 durch eine Relatiwerschiebung des Chips gegenüber dem Kartenkörper ermöglichen. Mit einer solchen Klebstoffschicht ist auch die oben beschriebene schwimmende Anordnung des Chips in dem Kartenkörper erreichbar.The edges 4 of the semiconductor chip 1 can at least protrude from the edges of the card body 2 formed in the recess. are slightly protruded so that the chip is held securely in the card body and is not pressed out of the recess even when the card body 2 is bent in a shape that is convex in the direction of the recess. The rear side 5 can be provided with a thin adhesive layer with which the semiconductor chip 1 is held at the bottom of the recess 3 of the card body 2. Spaces (not shown in the figure) can also be provided between the card body 2 and the edges 4 of the semiconductor chip 1, which enable the position of the semiconductor chip 1 to be compensated for by bending the card body 2 by a relative displacement of the chip relative to the card body. The above-described floating arrangement of the chip in the card body can also be achieved with such an adhesive layer.
In der Figur 2 ist ein alternatives Ausführungsbeispiel dargestellt, bei dem der Halbleiterchip 1 nicht direkt in den Kartenkörper 2 eingesetzt ist, sondern mit einem Gehäuse, das im Wesentlichen einen Rahmen 6 und eine Umhüllung 7, die den Halbleiterchip nicht notwendig vollständig umhüllt, umfasst .FIG. 2 shows an alternative exemplary embodiment, in which the semiconductor chip 1 is not inserted directly into the card body 2, but with a housing which essentially comprises a frame 6 and a casing 7, which does not necessarily completely surround the semiconductor chip.
Die Tiefe d, um die die Oberseite des Halbleiterchips gegenüber der Oberseite des Kartenkörpers versenkt ist, kann grundsätzlich beliebig gering sein; insbesondere können die Oberflächen des Halbleiterchips und des Kartenkörpers auch innerhalb derselben Ebene bündig aneinander anschließen. Falls der Halbleiterchip wesentlich dicker gewählt wird als in der Figur dargestellt, kann die Oberseite des Chips auch den Kartenkörper überragen. Im Hinblick auf die vorgegebene Norm handelt es sich dabei aber nicht um ein bevorzugtes Aus- führungsbeispiel .The depth d by which the top side of the semiconductor chip is sunk relative to the top side of the card body can in principle be as small as desired; in particular, the surfaces of the semiconductor chip and the card body can also connect flush to one another within the same plane. If the semiconductor chip is chosen to be significantly thicker than shown in the figure, the top of the chip can also protrude above the card body. With regard to the given standard, this is not a preferred embodiment.
Der Halbleiterchip 1 kann in der Position eingesetzt sein, die in der Figur dargestellt und bezüglich der Mittelfläche des Kartenkörpers unsymmetrisch ist; statt dessen ist es auch möglich, den Halbleiterchip symmetrisch innerhalb des Kartenkörpers anzuordnen. Bei der erfindungsgemäßen Chipkarte kön- nen auch Halbeiterchips mit einer relativ zur Dicke des Kartenkörpers wesentlich größeren Dicke als in der Figur dargestellt verwendet werden. Die erfindungsgemäße Anordnung ermöglicht es jedoch, sehr dünne Halbleitersubstrate bruchsicher in der Chipkarte zu integrieren. The semiconductor chip 1 can be inserted in the position shown in the figure and asymmetrical with respect to the central surface of the card body; instead, it is also possible to arrange the semiconductor chip symmetrically within the card body. With the chip card according to the invention, NEN semiconductor chips can also be used with a thickness that is substantially greater than the thickness of the card body than shown in the figure. However, the arrangement according to the invention makes it possible to integrate very thin semiconductor substrates in the chip card in a break-proof manner.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
1 Halbleiterchip1 semiconductor chip
2 Kartenkörper2 card bodies
3 Aussparung3 recess
4 Rand4 rand
5 Rückseite5 back
6 Rahmen6 frames
7 Umhüllung d Tiefe 7 wrapping d depth

Claims

Patentansprüche claims
1. Chipkarte mit integriertem Fingerabdrucksensor, die um- fasst :1. Chip card with integrated fingerprint sensor, which comprises:
- einen Halbleiterchip (1) mit einem Fingerabdrucksensor und- A semiconductor chip (1) with a fingerprint sensor and
- einen Kartenkörper (2) in ISO-Abmessungen mit einer Aussparung (3) , in der der Halbleiterchip (1) so angebracht ist, dass er eine einem Teststandard entsprechende Verbiegung des Kartenkörpers bruchlos übersteh .- A card body (2) in ISO dimensions with a recess (3) in which the semiconductor chip (1) is attached so that it can withstand a bending of the card body corresponding to a test standard.
2. Chipkarte nach Anspruch 1, bei der der Halbleiterchip (1) in dem Kartenkörper (2) versenkt angeordnet ist.2. Chip card according to claim 1, wherein the semiconductor chip (1) in the card body (2) is arranged sunk.
3. Chipkarte nach Anspruch 1 oder 2, bei der der Halbleiterchip (1) so in dem Kartenkörper (2) angebracht ist, dass er bei einer Verbiegung des Kartenkörpers eine zumindest teilweise Verschiebung relativ zu »dem Kartenkörper erf hrt .3. Chip card according to claim 1 or 2, wherein the semiconductor chip (1) is mounted in the card body (2) in such a way that when the card body is bent, it undergoes an at least partial displacement relative to the card body.
4. Chipkarte nach einem der Ansprüche 1 bis 3, bei der der Teststandard ein ISO-Teststandard für Chipkarten ist. 4. Chip card according to one of claims 1 to 3, wherein the test standard is an ISO test standard for chip cards.
PCT/DE2002/002757 2001-08-10 2002-07-26 Chip card comprising an integrated fingerprint sensor WO2003017211A2 (en)

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EP3035230A1 (en) 2014-12-19 2016-06-22 Cardlab ApS A method and an assembly for generating a magnetic field
US10614351B2 (en) 2014-12-19 2020-04-07 Cardlab Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US10558901B2 (en) 2015-04-17 2020-02-11 Cardlab Aps Device for outputting a magnetic field and a method of outputting a magnetic field
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