WO2003017191A2 - Rfid tag having integral electrical bridge and method of assembling the same - Google Patents
Rfid tag having integral electrical bridge and method of assembling the same Download PDFInfo
- Publication number
- WO2003017191A2 WO2003017191A2 PCT/US2002/025433 US0225433W WO03017191A2 WO 2003017191 A2 WO2003017191 A2 WO 2003017191A2 US 0225433 W US0225433 W US 0225433W WO 03017191 A2 WO03017191 A2 WO 03017191A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- end portion
- spiral
- antenna
- spiral turns
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
- Y10T29/49201—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting
- Y10T29/49202—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting including oppositely facing end orienting
Definitions
- the present invention relates to a tag having an enclosed radio frequency identification (RFID) inlay and a method of making the same. More specifically, the present invention relates to an RFID iniay that includes an antenna having an integrally manufactured end portion which forms an electrical bridge over spiral turns of the antenna.
- RFID radio frequency identification
- a tag having an RFID inlay as part of an RFID system to identify and monitor objects is well known in the art.
- a reader of a conventional RFID system produces and emits an electromagnetic interrogation field at a specific frequency when excited by connected electronic drive circuitry. If a tag having an RFID inlay is positioned within the interrogation field for a sufficient time, the RFID inlay will become stimulated and transmit a uniquely coded signal that is received by the reader or a separate receiving antenna.
- a typical RFID inlay includes an antenna and an integrated circuit (IC) chip connected to the antenna.
- IC integrated circuit
- One known antenna pattern of an RFID inlay is one that comprises of a plurality of turns that spiral around on a planar substrate (e.g., see U.S. Patent No. 5,541 ,399 - de Vail (1996)).
- a problem with this known pattern is that an electrical bridge must be formed over the spiral turns of the antenna in order for the two ends of the antenna to be electrically connected to an IC chip.
- This bridge is typically formed using one of the following methods: (1 ) using the IC chip as the bridge, or (2) connecting an additional (separate) electrical conductor to form the bridge.
- the IC chip or the additional electrical conductor forming the bridge is positioned on the same side of the substrate on which the antenna is mounted or on the opposite side.
- the IC chip is sometimes mounted on the additional electrical conductor forming the bridge.
- the RFID antenna of the present invention fills this need by requiring a less costly and complex construction.
- a radio frequency identification (RFID) tag (and a method of assembling the same) comprises a substrate, an integrated circuit, and a single, continuous antenna having a plurality of spiral turns and an end portion that is integral with the spiral turns.
- the spiral turns of the antenna are disposed on the substrate and . the end portion crosses over at least one of the spiral turns.
- a non-conductive insulation may be arranged between the end portion and the at least one spiral turn that the end portion crosses.
- An electrical trace may be disposed on the substrate adjacent to an outermost spiral turn of the antenna.
- the end portion may be integrally connected to an innermost spiral turn and extend toward an outermost spiral turn to cross over substantially all of the spiral turns and connect to one end of the electrical trace.
- the other end of the electrical trace may be connected to the integrated circuit.
- the RFID tag By forming the end portion as an integral part of a single, continuous antenna, the RFID tag can be manufactured at a reduced cost.
- a separate electrical bridge that crosses over spiral turns of the antenna does not have to be manufactured, cut, placed and electrically connected to the antenna. Since one side of the end portion is already integrally connected with the spiral turns, the number of electrical connections that need to be made are reduced.
- aligning an integral end portion as a bridge is easier than aligning a separately constructed bridge since it is already connected on one side.
- a radio frequency identification (RFID) tag comprises a substrate, an integrated circuit and a continuous antenna including a plurality of spiral turns, a first end portion and a second end portion.
- the first and second end portions are integral with the spiral turns and the spiral turns of the antenna are disposed on the substrate.
- the first end portion crosses over at least a first one of the spiral turns, and a second end portion crosses over at least a second one of the plurality of spiral turns.
- the first end portion may be integrally connected to an innermost spiral turn of the antenna and extend toward an outermost spiral turn of the antenna.
- the second end portion may be integrally connected to an outermost spiral turn of the antenna and extend toward an innermost spiral turn of the antenna.
- non-conductive insulation is arranged between the first end portion and the at least a first one of the spiral turns and between the second end portion and the at least a second one of the spiral turns.
- Non- conductive insulation may also be arranged between the integrated circuit and at least some of the spiral turns.
- the first end portion' crosses over the at least a first one of the spiral turns on the side of the substrate on which the spiral turns of the antenna are not disposed and the second end portion crosses over the at least a second one of the spiral turns on the side of the substrate on which the spiral turns of the antenna are not disposed.
- the integrated circuit is disposed on the side of the substrate on which the spiral turns of the antenna are not disposed and is connected to both the first and second end portions.
- FIGURES 1A-1 D illustrate plan views of an RFID inlay as it is constructed in accordance with an exemplary embodiment of the present invention
- FIGURE 2 is a cross-sectional view along section line ll-ll of Fig. 1 D;
- FIGURES 3A-3D illustrate plan views of an RFID inlay as it is constructed in accordance with an exemplary embodiment of the present invention
- FIGURE 4 is a cross-sectional view along section line IV-IV of Fig. 3D;
- FIGURES 5A-5C illustrate plan views of one side of an RFID inlay as it is constructed in accordance with an exemplary embodiment of the present invention
- FIGURE 6 illustrates a plan view of the other side of the RFID inlay illustrated in FIG 5C.
- FIGURE 7 is a cross-sectional view along section line VII-VII of Fig. 6. DETAILED DESCRIPTION OF THE INVENTION
- FIGs 1 A-1 D and 2 illustrate a method of constructing an RFID inlay in accordance with an exemplary embodiment of the present invention.
- the completed RFID inlay illustrated in Fig. 1 D and 2 is enclosed in a tag as part of a RFID system.
- the RFID inlay will resonate when it is positioned within an interrogation field having a specific frequency (e.g., 13.56 MHz) from an RFID reader and transmit a coded signal for reception by an antenna (either the reader or another antenna) of the RFID system.
- a specific frequency e.g. 13.56 MHz
- the completed RFID inlay includes an antenna 1 and an IC chip 3 electrically connected to the antenna 1.
- the IC chip 3 contains receiver circuitry and logic that enable the coded signal to be transmitted in response to the interrogation field.
- the antenna 1 and the IC chip 3 are disposed on a substrate 2.
- the antenna 1 includes a plurality of spiral turns, a first end portion 1a and a second end portion 1b.
- the end portion 1b of the antenna 1 is directly connected to the IC chip 3.
- the IC chip 3 is also directly connected to one end of an electrically conductive trace 4 disposed on the substrate 2. .
- the other end of the trace 4 is directly connected to the first end portion 1a of the antenna 1.
- the end portion 1 a of the antenna 1 crosses over the antenna's spiral turns and is separated from the spiral turns by a non- conductive insulator 5.
- the first step in constructing the RFID inlay is to dispose (e.g., print or etch) the electrically conductive antenna 1 onto the substrate 2.
- the material forming the substrate 2 is preferably a transparent polyamide or polyester.
- the end portions of 1a, 1b of the antenna 1 are integrally formed with the antenna's spiral turns.
- the antenna 1 including the end portions 1a, 1b and spiral turns thus form a single, continuous trace in which the end portion 1a is integrally connected with innermost spiral turn and the end portion 1 b is integrally connected with the outermost spiral turn.
- the non-conductive insulator 5 is applied over a portion of the spiral turns of the antenna 1.
- a non-conductive adhesive such as a pressure sensitive adhesive (PSA) or an anisotropic ⁇ adhesive is applied on the portion of the spiral turns.
- the non- conductive insulator 5 is painted or coated with a polymer on the portion of the spiral turns.
- the end portion 1 a of the antenna 1 is either completely cut out or partially punched out (see, e.g., lines 7) and folded over the spiral turns of the antenna 1 starting from the innermost spiral turn with which the end portion 1a is integrally connected.
- the end portion 1 a is thus folded so that it crosses the spiral turns in a radially outward direction so that a pad at the very end of the end portion 1 a is adjacent to one end of the trace 4.
- the portion of the substrate 1 which is completely or partially cut through is folded along with the end portion 1 a.
- the end portion 1 a is folded onto the side of the substrate 2 on which the spiral turns are disposed.
- the non-conductive insulator 5 is arranged between the folded end portion 1 a and the spiral turns that are crossed by the end portion 1 a to prevent a short in the antenna 1. After the end portion 1 a is folded, the pad of the end portion 1 a is directly connected to one end of the trace 4 by a small of amount of conductive adhesive or solder.
- the construction of the RFID inlay is completed by installing the IC chip 3. Specifically, the IC chip 3 is directly connected to the end portion 1 b of the antenna 1 and to the other end of the trace 4.
- the connections are preferably made using a conductive adhesive or solder. An additional “underfill” adhesive may also be used.
- the end portion 1a By folding the end portion 1a over the spiral turns of the antenna 1 , the end portion 1a forms an electrical bridge over the spiral turns to enable the innermost spiral turn to be connected to the IC chip 3.
- a separate bridge therefore does not need to be manufactured, cut, placed and electrically connected to the antenna. Since the end portion 1a is integrally connected to the spiral turns of the antenna, the number of required connections is reduced during the manufacturing process of the RFID inlay;
- the bridge formed by end portion 1a may also be aligned with greater ease because it is attached on one side.
- Figs. 3A-3D and 4 illustrate a method of constructing an RFID inlay in accordance with another exemplary embodiment of the present invention. Elements which are the same or similar in nature are labeled using the same reference numerals in previous embodiment(s). Only the differences from previous embodiment(s) will be discussed in detail.
- the RFID inlay includes an antenna 1 disposed on a substrate 2.
- the antenna 1 includes a plurality of spiral turns and integrally connected end portions 1c, 1d.
- a non-conductive insulator 5 is disposed on a portion of the spiral turns and. an IC chip 3 is arranged on the non-conductive insulator 5.
- the end portion 1c is integrally connected to the innermost spiral turn and projects toward the outermost spiral turn to cross over some of the inner spiral turns.
- the end portion 1d is integrally connected to the outermost spiral turn and projects toward the innermost spiral turn to cross over some of the outer spiral turns.
- the sets of spiral turns crossed by the end portions 1a, 1 b may be mutually exclusive.
- the end portions 1c, 1d are separated from the spiral turns that each end portion crosses by the non- conductive insulator 5.
- the first step in constructing the RFID inlay according to the another exemplary embodiment of the present invention is to dispose (e.g., print or etch) the electrically conductive antenna 1 onto the substrate 2.
- the antenna 1 including the spiral turns and integrally connected end portions 1 c, 1 d form a single, continuous trace.
- the non-conductive insulator 5 such as a PSA or anisotropic adhesive is applied on a portion of the spiral turns. This portion is adjacent to the end portions 1c, 1d. Additional "underfill” adhesive may also be applied.
- the IC chip 3 is placed on the insulator 5.
- the insulator 5 thus prevents the IC chip 3 from contacting those spiral turns over which the IC chip 3 is positioned.
- the electrical connections of the IC chip 3 face the upward direction (i.e., the direction away from the substrate) so that the end portions 1 c, 1d can later be directly connected to the IC chip 3.
- the end portions 1c, 1d are either cut out or partially punched out and folded over some of the spiral turns.
- the end portions 1c, 1d are cut out or punched out by cutting completely or partially through the substrate 2 as illustrated by lines 7.
- the end portion 1c is folded over the inner spiral turns of the antenna starting from the innermost spiral turn with which the end portion 1c is integrally connected and projecting toward the outermost spiral turn.
- the end portion 1 d is folded over the outer spiral turns of the antenna starting from the outermost spiral turn with which the end portion 1 d is integrally connected and projecting toward an innermost spiral turn.
- Those portions of the substrate 2 which are partially or completely cut through are folded along with folded end portions 1c, 1d.
- the inner group of spiral turns crossed by the end portion 1c may be mutually exclusive from the outer group of spiral turns crossed by the end portion 1 d.
- the end portions 1 c, 1 d are both folded onto the side of the substrate 2 on which the spiral turns are disposed.
- the non-conductive insulator 5 is arranged between the end portions 1 c, 1 d and the respective spiral turns crossed by the end portions 1c, 1d to prevent a short in the antenna 1.
- the end portions 1c, 1d are folded, the end portions 1c, 1d are directly connected to the IC chip 3, although not directly to each other.
- the connections are preferably made using conductive adhesive or solder.
- Figs. 5A-5C and 6-7 illustrate a method of constructing an RFID inlay in accordance with yet another embodiment of the present invention. Elements which are the same or similar in nature are labeled using the same reference numerals in previous embodiment(s). Only the differences from previous embodiment(s) will be discussed in detail.
- the first step in constructing the RFID inlay is disposing an electrically conductive antenna 1 including end portions 1c, 1d onto a substrate 2.
- the antenna 1 including spiral turns and integrally connected end portions 1c, 1d form a single, continuous trace.
- the step disclosed in Fig. 5A is therefore identical to the step in the previous embodiment discussed in conjunction with Fig. 3A.
- the end portions 1c, 1d are either cut out or punched out by partially or completely cutting through the portion of the substrate 2 around three sides of each portion 1 c, 1 d as illustrated by line 7.
- the end portions 1c, 1d are then made to project through respective holes in the substrate 2 and folded over the spiral turns on the side of the substrate 2 on which the spiral turns of the antenna 1 are not disposed (hereinafter, the "non-spiral turns side" of the substrate).
- the end portion 1c is folded onto the non-spiral turns side of the substrate 2 over the inner spiral turns of the antenna 1 starting from the innermost spiral turn.
- the end portion 1d is folded on the non-spiral turns side over the outer spiral turns of the antenna 1 starting from the outermost spiral turn.
- the portions of the substrate 2 that have been cut are also folded along with the end portions 1c, 1d.
- the inner group of spiral turns crossed by the end portion 1c may be mutually exclusive from the outer group of spiral turns crossed by the end portion 1d.
- the IC chip 3 is electrically connected to the end portions 1c, 1d on the non-spiral turns side of the substrate 2.
- the IC chip 3 and/or the end portions 1 c, 1 d may optionally be held in place on the non-spiral turns side of the substrate 2 by an adhesive (not shown).
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003522024A JP2005500628A (en) | 2001-08-15 | 2002-08-13 | RFID tag with integrated electrical bridge and method for assembling the same. |
EP02759323A EP1417642A2 (en) | 2001-08-15 | 2002-08-13 | Rfid tag having integral electrical bridge and method of assembling the same |
BR0211934-0A BR0211934A (en) | 2001-08-15 | 2002-08-13 | RFID tag having integral electric bridge and mounting method |
CA002457115A CA2457115A1 (en) | 2001-08-15 | 2002-08-13 | Rfid tag having integral electrical bridge and method of assembling the same |
MXPA04001359A MXPA04001359A (en) | 2001-08-15 | 2002-08-13 | Rfid tag having integral electrical bridge and method of assembling the same. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/929,123 US6549176B2 (en) | 2001-08-15 | 2001-08-15 | RFID tag having integral electrical bridge and method of assembling the same |
US09/929,123 | 2001-08-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003017191A2 true WO2003017191A2 (en) | 2003-02-27 |
WO2003017191A3 WO2003017191A3 (en) | 2003-09-25 |
Family
ID=25457356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/025433 WO2003017191A2 (en) | 2001-08-15 | 2002-08-13 | Rfid tag having integral electrical bridge and method of assembling the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US6549176B2 (en) |
EP (1) | EP1417642A2 (en) |
JP (1) | JP2005500628A (en) |
CN (1) | CN1543626A (en) |
BR (1) | BR0211934A (en) |
CA (1) | CA2457115A1 (en) |
MX (1) | MXPA04001359A (en) |
WO (1) | WO2003017191A2 (en) |
Cited By (1)
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WO2019150740A1 (en) * | 2018-02-01 | 2019-08-08 | サトーホールディングス株式会社 | Circuit pattern, rfid inlay, rfid label, rfid medium, circuit pattern manufacturing method, rfid inlay manufacturing method, rfid label manufacturing method, and rfid medium manufacturing method |
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Also Published As
Publication number | Publication date |
---|---|
US20030033713A1 (en) | 2003-02-20 |
WO2003017191A3 (en) | 2003-09-25 |
CN1543626A (en) | 2004-11-03 |
EP1417642A2 (en) | 2004-05-12 |
BR0211934A (en) | 2004-10-26 |
CA2457115A1 (en) | 2003-02-27 |
US6549176B2 (en) | 2003-04-15 |
MXPA04001359A (en) | 2004-05-27 |
JP2005500628A (en) | 2005-01-06 |
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