WO2003015136A3 - Method and apparatus for vacuum pumping a susceptor shaft - Google Patents

Method and apparatus for vacuum pumping a susceptor shaft Download PDF

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Publication number
WO2003015136A3
WO2003015136A3 PCT/US2002/024508 US0224508W WO03015136A3 WO 2003015136 A3 WO2003015136 A3 WO 2003015136A3 US 0224508 W US0224508 W US 0224508W WO 03015136 A3 WO03015136 A3 WO 03015136A3
Authority
WO
WIPO (PCT)
Prior art keywords
shaft
pressure
substrate
susceptor
support plate
Prior art date
Application number
PCT/US2002/024508
Other languages
French (fr)
Other versions
WO2003015136A2 (en
Inventor
Sanjay Yadav
Quanyuan Shang
Ernst Keller
Wei Chang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2003519973A priority Critical patent/JP4656280B2/en
Priority to EP02759245A priority patent/EP1415329A2/en
Priority to KR1020047001705A priority patent/KR100601576B1/en
Publication of WO2003015136A2 publication Critical patent/WO2003015136A2/en
Publication of WO2003015136A3 publication Critical patent/WO2003015136A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

Provided herein is a method of improving the planarity of a support plate of a susceptor for use during deposition of a film of material onto a substrate comprising the steps of reducing pressure in a hollow core of a shaft to a level below atmospheric pressure; and reducing a pressure in the deposition chamber to a level required for the deposition of the film of material onto the substrate, where the pressure in the hollow core of the shaft acts upon a lower surface of the support plate connected to the shaft and interfacing with the hollow core of the shaft and the pressure in the deposition chamber acts upon a upper surface of the support plate adapted to support the substrate thereby improving planarity. Also provided are a susceptor and a method of depositing a film onto a substrate affixed to the susceptor of the present invention.
PCT/US2002/024508 2001-08-03 2002-07-31 Method and apparatus for vacuum pumping a susceptor shaft WO2003015136A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003519973A JP4656280B2 (en) 2001-08-03 2002-07-31 Method and susceptor for improving the planarity of a support plate of a susceptor in a deposition chamber
EP02759245A EP1415329A2 (en) 2001-08-03 2002-07-31 Method and apparatus for vacuum pumping a susceptor shaft
KR1020047001705A KR100601576B1 (en) 2001-08-03 2002-07-31 Method and apparatus for vacuum pumping a susceptor shaft

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/922,352 2001-08-03
US09/922,352 US6896929B2 (en) 2001-08-03 2001-08-03 Susceptor shaft vacuum pumping

Publications (2)

Publication Number Publication Date
WO2003015136A2 WO2003015136A2 (en) 2003-02-20
WO2003015136A3 true WO2003015136A3 (en) 2003-10-16

Family

ID=25446919

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/024508 WO2003015136A2 (en) 2001-08-03 2002-07-31 Method and apparatus for vacuum pumping a susceptor shaft

Country Status (7)

Country Link
US (1) US6896929B2 (en)
EP (1) EP1415329A2 (en)
JP (1) JP4656280B2 (en)
KR (1) KR100601576B1 (en)
CN (1) CN100437893C (en)
TW (1) TW588117B (en)
WO (1) WO2003015136A2 (en)

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