WO2003010817A3 - Light emitting diodes including modifications for submount bonding and manufacturing methods therefor - Google Patents
Light emitting diodes including modifications for submount bonding and manufacturing methods therefor Download PDFInfo
- Publication number
- WO2003010817A3 WO2003010817A3 PCT/US2002/023266 US0223266W WO03010817A3 WO 2003010817 A3 WO2003010817 A3 WO 2003010817A3 US 0223266 W US0223266 W US 0223266W WO 03010817 A3 WO03010817 A3 WO 03010817A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- opposite
- epitaxial region
- substrate
- light emitting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7001065A KR20040019363A (en) | 2001-07-23 | 2002-07-23 | Lighting emitting diodes including modifications for submount bonding and manufacturing methods therefor |
AU2002355138A AU2002355138A1 (en) | 2001-07-23 | 2002-07-23 | Light emitting diodes including modifications for submount bonding and manufacturing methods therefor |
JP2003516101A JP4654372B2 (en) | 2001-07-23 | 2002-07-23 | Light-emitting device including modification for submount bonding, and its manufacturing method |
EP02752514A EP1412989B1 (en) | 2001-07-23 | 2002-07-23 | Light emitting diodes including modifications for submount bonding |
CA002453581A CA2453581A1 (en) | 2001-07-23 | 2002-07-23 | Light emitting diodes including modifications for submount bonding and manufacturing methods therefor |
AT02752514T ATE511705T1 (en) | 2001-07-23 | 2002-07-23 | LEDS WITH MODIFICATIONS FOR SUBCARIER BONDING |
KR1020057000878A KR101028965B1 (en) | 2001-07-23 | 2003-07-15 | Light emitting diode including barrier layers and manufacturing methods therefor |
HK04104119.4A HK1061113A1 (en) | 2001-07-23 | 2004-06-09 | Light emitting diodes including modifications for submount bonding |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30731101P | 2001-07-23 | 2001-07-23 | |
US30723401P | 2001-07-23 | 2001-07-23 | |
US60/307,311 | 2001-07-23 | ||
US60/307,234 | 2001-07-23 | ||
US10/057,821 | 2002-01-25 | ||
US10/057,821 US6791119B2 (en) | 2001-02-01 | 2002-01-25 | Light emitting diodes including modifications for light extraction |
US35294102P | 2002-01-30 | 2002-01-30 | |
US60/352,941 | 2002-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003010817A2 WO2003010817A2 (en) | 2003-02-06 |
WO2003010817A3 true WO2003010817A3 (en) | 2003-07-10 |
Family
ID=27489930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/023266 WO2003010817A2 (en) | 2001-07-23 | 2002-07-23 | Light emitting diodes including modifications for submount bonding and manufacturing methods therefor |
Country Status (10)
Country | Link |
---|---|
US (2) | US6740906B2 (en) |
EP (2) | EP1412989B1 (en) |
JP (1) | JP4654372B2 (en) |
KR (1) | KR101028965B1 (en) |
CN (1) | CN1330008C (en) |
AT (1) | ATE511705T1 (en) |
AU (1) | AU2002355138A1 (en) |
CA (1) | CA2453581A1 (en) |
TW (1) | TW563262B (en) |
WO (1) | WO2003010817A2 (en) |
Families Citing this family (173)
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EP1412989B1 (en) | 2011-06-01 |
US20050019971A1 (en) | 2005-01-27 |
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CN1330008C (en) | 2007-08-01 |
TW563262B (en) | 2003-11-21 |
KR20050021503A (en) | 2005-03-07 |
US7037742B2 (en) | 2006-05-02 |
ATE511705T1 (en) | 2011-06-15 |
JP4654372B2 (en) | 2011-03-16 |
US20030015721A1 (en) | 2003-01-23 |
AU2002355138A1 (en) | 2003-02-17 |
EP2320484A1 (en) | 2011-05-11 |
CA2453581A1 (en) | 2003-02-06 |
US6740906B2 (en) | 2004-05-25 |
EP1412989A2 (en) | 2004-04-28 |
KR101028965B1 (en) | 2011-04-12 |
CN1582503A (en) | 2005-02-16 |
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