WO2003000337A3 - Piezocomposite ultrasound array and integrated circuit assembly - Google Patents

Piezocomposite ultrasound array and integrated circuit assembly Download PDF

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Publication number
WO2003000337A3
WO2003000337A3 PCT/US2002/018876 US0218876W WO03000337A3 WO 2003000337 A3 WO2003000337 A3 WO 2003000337A3 US 0218876 W US0218876 W US 0218876W WO 03000337 A3 WO03000337 A3 WO 03000337A3
Authority
WO
WIPO (PCT)
Prior art keywords
array
integrated circuit
acoustically
thermal expansion
isolated
Prior art date
Application number
PCT/US2002/018876
Other languages
French (fr)
Other versions
WO2003000337A2 (en
Inventor
Kenneth R Erikson
George K Lewis
Timothy E White
Original Assignee
Bae Systems Information
Kenneth R Erikson
George K Lewis
Timothy E White
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/969,438 external-priority patent/US6524254B2/en
Application filed by Bae Systems Information, Kenneth R Erikson, George K Lewis, Timothy E White filed Critical Bae Systems Information
Priority to AU2002315142A priority Critical patent/AU2002315142A1/en
Publication of WO2003000337A2 publication Critical patent/WO2003000337A2/en
Publication of WO2003000337A3 publication Critical patent/WO2003000337A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
    • G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52023—Details of receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52046—Techniques for image enhancement involving transmitter or receiver
    • G01S7/52049—Techniques for image enhancement involving transmitter or receiver using correction of medium-induced phase aberration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079—Constructional features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079—Constructional features
    • G01S7/5208—Constructional features with integration of processing functions inside probe or scanhead
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/08—Detecting organic movements or changes, e.g. tumours, cysts, swellings
    • A61B8/0833—Detecting organic movements or changes, e.g. tumours, cysts, swellings involving detecting or locating foreign bodies or organic structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Abstract

An integrated piezoelectric ultrasound array (11) structure configured to minimize the effects of differential thermal expansion between the array (11) and the integrated circuit (32) and to improve the mechanical and acoustical integrity of the array. The transducer array (11) may have an interposed thinned supporting substrate (40) and is matched to the integrated circuit substrate for thermal expansion so as to retain mechanical integrity of the array/IC bond within the working temperature range. Transducer elements (10) are laterally isolated acoustically and as to thermal expansion by air or other acoustically attenuating medium of lower elastic modulus material between the elements (10). Acoustical effects are vertically acoustically isolated with capacitive coupling and small area solder bumps (34) relative to wavelength, and further laterally acoustically isolated by thin supporting substrates relative to wavelength, including thinned semiconductor integrated circuit substrates.
PCT/US2002/018876 2001-06-20 2002-06-13 Piezocomposite ultrasound array and integrated circuit assembly WO2003000337A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002315142A AU2002315142A1 (en) 2001-06-20 2002-06-13 Piezocomposite ultrasound array and integrated circuit assembly

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US29963401P 2001-06-20 2001-06-20
US60/299,634 2001-06-20
US09/969,438 2001-10-02
US09/969,438 US6524254B2 (en) 2001-06-20 2001-10-02 Orthogonally reconfigurable integrated matrix acoustical array
US10/094,851 2002-03-08
US10/094,851 US6589180B2 (en) 2001-06-20 2002-03-08 Acoustical array with multilayer substrate integrated circuits

Publications (2)

Publication Number Publication Date
WO2003000337A2 WO2003000337A2 (en) 2003-01-03
WO2003000337A3 true WO2003000337A3 (en) 2003-08-21

Family

ID=27377804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/018876 WO2003000337A2 (en) 2001-06-20 2002-06-13 Piezocomposite ultrasound array and integrated circuit assembly

Country Status (3)

Country Link
US (2) US6589180B2 (en)
AU (1) AU2002315142A1 (en)
WO (1) WO2003000337A2 (en)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084437B2 (en) * 2001-10-31 2006-08-01 International Business Machines Corporation Semiconductor device
US7686762B1 (en) * 2002-10-03 2010-03-30 Integrated Sensing Systems, Inc. Wireless device and system for monitoring physiologic parameters
US7280435B2 (en) * 2003-03-06 2007-10-09 General Electric Company Switching circuitry for reconfigurable arrays of sensor elements
US7443765B2 (en) 2003-03-06 2008-10-28 General Electric Company Reconfigurable linear sensor arrays for reduced channel count
US7313053B2 (en) * 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US7257051B2 (en) * 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US7353056B2 (en) 2003-03-06 2008-04-01 General Electric Company Optimized switching configurations for reconfigurable arrays of sensor elements
DE10325406B4 (en) * 2003-06-05 2005-04-28 Eads Deutschland Gmbh Damage determination on structures to be tested by means of ultrasound
US20040254471A1 (en) * 2003-06-13 2004-12-16 Andreas Hadjicostis Miniature ultrasonic phased array for intracardiac and intracavity applications
US7513147B2 (en) * 2003-07-03 2009-04-07 Pathfinder Energy Services, Inc. Piezocomposite transducer for a downhole measurement tool
US7036363B2 (en) * 2003-07-03 2006-05-02 Pathfinder Energy Services, Inc. Acoustic sensor for downhole measurement tool
US7247517B2 (en) * 2003-09-30 2007-07-24 Intel Corporation Method and apparatus for a dual substrate package
US20050251127A1 (en) * 2003-10-15 2005-11-10 Jared Brosch Miniature ultrasonic transducer with focusing lens for intracardiac and intracavity applications
WO2005055195A1 (en) * 2003-12-04 2005-06-16 Koninklijke Philips Electronics, N.V. Implementing ic mounted sensor with high attenuation backing
EP1691937B1 (en) * 2003-12-04 2017-03-22 Koninklijke Philips N.V. Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays
US20050124884A1 (en) * 2003-12-05 2005-06-09 Mirsaid Bolorforosh Multidimensional transducer systems and methods for intra patient probes
US7314445B2 (en) * 2003-12-30 2008-01-01 General Electric Company Integrated low-voltage transmit/receive switch for ultrasound imaging system
US7634061B1 (en) * 2004-03-26 2009-12-15 Nova R & D, Inc. High resolution imaging system
US7508113B2 (en) * 2004-05-18 2009-03-24 Siemens Medical Solutions Usa, Inc. Apparatus for two-dimensional transducers used in three-dimensional ultrasonic imaging
US20080027320A1 (en) * 2004-05-18 2008-01-31 Siemens Medical Solutions Usa, Inc. Multidimensional transducer systems and methods for intra patient probes
WO2006018805A1 (en) * 2004-08-18 2006-02-23 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
EP1789815B1 (en) * 2004-08-18 2011-06-22 Koninklijke Philips Electronics N.V. Transducer arrays for medical ultrasound
US20080243000A1 (en) * 2004-09-13 2008-10-02 Koninklijke Philips Electronics, N.V. Integrated Circuit For Implementing High-Voltage Ultrasound Functions
JP4575108B2 (en) * 2004-10-15 2010-11-04 株式会社東芝 Ultrasonic probe
US20060100522A1 (en) * 2004-11-08 2006-05-11 Scimed Life Systems, Inc. Piezocomposite transducers
JP4969456B2 (en) * 2005-01-11 2012-07-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Redistribution interconnect for microbeamformers and medical ultrasound systems
US7449821B2 (en) * 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
KR20080021635A (en) * 2005-06-07 2008-03-07 코닌클리케 필립스 일렉트로닉스 엔.브이. Multicomponent backing block for ultrasound sensor assemblies
US20070052700A1 (en) * 2005-09-07 2007-03-08 Wheeler Frederick W System and method for 3D CAD using projection images
JP4755500B2 (en) 2006-01-26 2011-08-24 株式会社日立製作所 Ultrasonic probe
FR2897461A1 (en) * 2006-02-16 2007-08-17 Gen Electric X-RAY DEVICE AND IMAGE PROCESSING METHOD
US7763961B2 (en) * 2006-04-01 2010-07-27 Stats Chippac Ltd. Hybrid stacking package system
US8330332B2 (en) * 2006-07-24 2012-12-11 Koninklijke Philips Electronics N.V. Ultrasound transducer featuring a pitch independent interposer and method of making the same
US20080125658A1 (en) * 2006-09-01 2008-05-29 General Electric Company Low-profile acoustic transducer assembly
JP4294678B2 (en) * 2006-10-30 2009-07-15 オリンパスメディカルシステムズ株式会社 Ultrasonic transducer, method for manufacturing ultrasonic transducer, and ultrasonic endoscope
US7583010B1 (en) * 2006-12-04 2009-09-01 Lockheed Martin Corporation Hybrid transducer
US7451651B2 (en) * 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7302866B1 (en) * 2007-01-10 2007-12-04 The Boeing Company Device, system, and method for structural health monitoring
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7587936B2 (en) * 2007-02-01 2009-09-15 Smith International Inc. Apparatus and method for determining drilling fluid acoustic properties
JP4909115B2 (en) * 2007-02-21 2012-04-04 富士フイルム株式会社 Ultrasound probe
US7892176B2 (en) * 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
US8008842B2 (en) * 2007-10-26 2011-08-30 Trs Technologies, Inc. Micromachined piezoelectric ultrasound transducer arrays
CN101897049B (en) * 2007-11-14 2013-12-18 怡德乐纳斯公司 Planar spring assembly with attached solder strip and manufacturing method thereof
WO2009063559A1 (en) * 2007-11-15 2009-05-22 Fujitsu Limited Elastic wave device, duplexer using the same, and communication apparatus using the duplexer
US7781238B2 (en) * 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8390174B2 (en) * 2007-12-27 2013-03-05 Boston Scientific Scimed, Inc. Connections for ultrasound transducers
US20090182229A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki UltraSound System With Highly Integrated ASIC Architecture
US20090182233A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki Ultrasound System With Integrated Control Switches
WO2009136862A1 (en) * 2008-05-07 2009-11-12 Agency For Science, Technology And Research A low profile permanent magnet synchronous motor with segment structure
JP2009291514A (en) * 2008-06-09 2009-12-17 Canon Inc Method for manufacturing capacitive transducer, and capacitive transducer
US7821108B2 (en) 2008-07-04 2010-10-26 Micron Technology, Inc. Systems and methods for lowering interconnect capacitance through adjustment of relative signal levels
US8956904B2 (en) 2008-09-10 2015-02-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US7943411B2 (en) 2008-09-10 2011-05-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US8117907B2 (en) * 2008-12-19 2012-02-21 Pathfinder Energy Services, Inc. Caliper logging using circumferentially spaced and/or angled transducer elements
JP5641701B2 (en) * 2009-03-25 2014-12-17 株式会社東芝 3D semiconductor integrated circuit
US20100280387A1 (en) * 2009-04-29 2010-11-04 Rea Richard Schmid Active Delay Line for Continuous Wave Ultrasound System
US8067829B2 (en) 2009-04-29 2011-11-29 Bae Systems Information And Electronic Systems Integration Inc. System and method for multi-chip module die extraction and replacement
EP2283935A1 (en) * 2009-08-13 2011-02-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ultrasound converter system and method for its operation
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
EP2498921B1 (en) * 2009-11-09 2016-09-14 Koninklijke Philips N.V. Curved ultrasonic hifu transducer formed by tiled segments
CN102596431B (en) * 2009-11-09 2016-01-20 皇家飞利浦电子股份有限公司 With the high-intensity focusing ultrasonic transducer of nonmagnetic conductive passage
CN102596432B (en) * 2009-11-09 2015-03-25 皇家飞利浦电子股份有限公司 Curved ultrasonic HIFU transducer with pre-formed spherical matching layer
US8278752B2 (en) 2009-12-23 2012-10-02 Intel Corporation Microelectronic package and method for a compression-based mid-level interconnect
ITMI20092328A1 (en) * 2009-12-29 2011-06-30 St Microelectronics Srl ULTRASONIC PROBE WITH MULTILAYER SEMICONDUCTOR STRUCTURE
KR101695846B1 (en) 2010-03-02 2017-01-16 삼성전자 주식회사 Stacked semiconductor packages
WO2011125003A1 (en) * 2010-04-08 2011-10-13 Koninklijke Philips Electronics N.V. Predicting urination
JP2011250119A (en) * 2010-05-26 2011-12-08 Toshiba Corp Ultrasonic probe
WO2012085724A1 (en) * 2010-12-21 2012-06-28 Koninklijke Philips Electronics N.V. Method of fabricating a flip chip electrical coupling, a flip chip electrical coupling, and a device comprising a flip chip electrical coupling
IT1403296B1 (en) * 2010-12-28 2013-10-17 St Microelectronics Srl ULTRASOUND IMAGE SYSTEM WITH 4D DATA AND CORRESPONDING CONTROL PROCESS
JP6066422B2 (en) 2011-02-15 2017-01-25 フジフィルム ディマティックス， インコーポレイテッド Piezoelectric transducer using microdome array
WO2012156863A2 (en) 2011-05-18 2012-11-22 Koninklijke Philips Electronics N.V. Spherical ultrasonic hifu transducer with modular cavitation sense element
US8844347B2 (en) 2012-02-29 2014-09-30 General Electric Company Sensor port insert apparatus
US8922005B2 (en) * 2012-04-11 2014-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package on package devices with reversed stud bump through via interconnections
US9003894B2 (en) 2012-04-25 2015-04-14 General Electric Company Ultrasonic flow measurement system
US9180490B2 (en) * 2012-05-22 2015-11-10 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
US8866285B2 (en) 2012-09-05 2014-10-21 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out package comprising bulk metal
US9140586B2 (en) 2012-09-25 2015-09-22 General Electric Company Removable sensor port insert apparatus
JP6392761B2 (en) * 2012-10-01 2018-09-19 ニクラス・ロックスヘッドＮｉｃｌａｓ ＲＯＸＨＥＤ Cerebrospinal fluid shunt for the treatment of hydrocephalus
JP6186696B2 (en) * 2012-10-25 2017-08-30 セイコーエプソン株式会社 Ultrasonic measuring device, head unit, probe and diagnostic device
JP6326716B2 (en) * 2013-03-04 2018-05-23 コニカミノルタ株式会社 Ultrasound diagnostic imaging equipment
US20140262798A1 (en) * 2013-03-15 2014-09-18 Xtalic Corporation Electrodeposition methods and baths for use with printed circuit boards and other articles
TWI617293B (en) * 2013-05-24 2018-03-11 富士膠片索諾聲公司 High frequency ultrasound probe
US9259827B2 (en) 2013-10-11 2016-02-16 General Electric Company Apparatus for holding and applying torque to a nut
US11231491B2 (en) 2013-11-11 2022-01-25 Koninklijke Philips N.V. Robust ultrasound transducer probes having protected integrated circuit interconnects
JP5771293B2 (en) * 2014-01-23 2015-08-26 日立アロカメディカル株式会社 Ultrasonic diagnostic equipment
KR102092589B1 (en) * 2014-04-23 2020-03-24 삼성전자주식회사 Ultrasound Probe and Manufacturing Method thereof
DE102014110179B4 (en) * 2014-07-18 2021-06-17 Valeo Schalter Und Sensoren Gmbh Ultrasonic sensor device for a motor vehicle, driver assistance system and motor vehicle
JP6548488B2 (en) 2014-07-31 2019-07-24 キヤノンメディカルシステムズ株式会社 X-ray computed tomography apparatus and X-ray detector
KR102373132B1 (en) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 An ultrasonic probe apparatus and an ultrasonic imaging apparatus using the same
US10918361B2 (en) * 2015-09-03 2021-02-16 Fujifilm Sonosite, Inc. Systems and methods of dissipating heat from a handheld medical imaging device
EP3397951B1 (en) * 2015-12-30 2023-05-24 Ventana Medical Systems, Inc. System and method for real time assay monitoring
US20170343346A1 (en) * 2016-05-31 2017-11-30 Qualcomm Incorporated Ultrasonic tilt sensor and related methods
JP2019519636A (en) 2016-06-14 2019-07-11 ダウ グローバル テクノロジーズ エルエルシー Moisture curable composition comprising a silane grafted polyolefin elastomer and a halogen free flame retardant
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
KR102444290B1 (en) * 2017-07-18 2022-09-16 삼성전자주식회사 Method of bonding interposer and integrated chip, and ultrasonic probe using the method
JP7175679B2 (en) * 2017-09-04 2022-11-21 キヤノンメディカルシステムズ株式会社 ultrasonic probe
JP2019054216A (en) * 2017-09-19 2019-04-04 東芝メモリ株式会社 Semiconductor device
US20190103547A1 (en) * 2017-09-29 2019-04-04 Olympus Scientific Solutions Americas Inc. Ultrasonic transducer using aerogel as filler material
CA3081760A1 (en) 2017-11-15 2019-05-23 Butterfly Network, Inc. Ultrasound apparatuses and methods for fabricating ultrasound devices
US11498096B2 (en) 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
US11877517B2 (en) 2019-03-05 2024-01-16 North Carolina State University Flexible piezo-composite sensors and transducers
JP7364259B2 (en) 2019-03-25 2023-10-18 エコー イメージング，インク． portable ultrasound imaging device
US11583248B2 (en) * 2020-03-08 2023-02-21 Qisda Corporation Ultrasound image system and ultrasound probe

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381067A (en) * 1993-03-10 1995-01-10 Hewlett-Packard Company Electrical impedance normalization for an ultrasonic transducer array
US5957851A (en) * 1996-06-10 1999-09-28 Acuson Corporation Extended bandwidth ultrasonic transducer

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311095A (en) 1992-05-14 1994-05-10 Duke University Ultrasonic transducer array
US5744898A (en) 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
US5329496A (en) 1992-10-16 1994-07-12 Duke University Two-dimensional array ultrasonic transducers
US5329498A (en) 1993-05-17 1994-07-12 Hewlett-Packard Company Signal conditioning and interconnection for an acoustic transducer
US5483963A (en) 1994-07-22 1996-01-16 Loral Infrared & Imaging Systems, Inc. Two dimensional transducer integrated circuit
DE69534284T2 (en) 1994-12-23 2006-03-23 Digirad Corp., San Diego SEMICONDUCTOR GAMMA RADIATION CAMERA AND MEDICAL IMAGING SYSTEM
US5629578A (en) 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
US5617865A (en) 1995-03-31 1997-04-08 Siemens Medical Systems, Inc. Multi-dimensional ultrasonic array interconnect
US5644085A (en) 1995-04-03 1997-07-01 General Electric Company High density integrated ultrasonic phased array transducer and a method for making
US5655538A (en) 1995-06-19 1997-08-12 General Electric Company Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making
US6159149A (en) 1996-03-22 2000-12-12 Lockheed Martin Corporation Ultrasonic camera
US5732706A (en) * 1996-03-22 1998-03-31 Lockheed Martin Ir Imaging Systems, Inc. Ultrasonic array with attenuating electrical interconnects
US5704105A (en) 1996-09-04 1998-01-06 General Electric Company Method of manufacturing multilayer array ultrasonic transducers
US5855049A (en) * 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
US5906580A (en) * 1997-05-05 1999-05-25 Creare Inc. Ultrasound system and method of administering ultrasound including a plurality of multi-layer transducer elements
US6246158B1 (en) 1999-06-24 2001-06-12 Sensant Corporation Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
US6409667B1 (en) * 2000-02-23 2002-06-25 Acuson Corporation Medical diagnostic ultrasound transducer system and method for harmonic imaging

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381067A (en) * 1993-03-10 1995-01-10 Hewlett-Packard Company Electrical impedance normalization for an ultrasonic transducer array
US5957851A (en) * 1996-06-10 1999-09-28 Acuson Corporation Extended bandwidth ultrasonic transducer

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AU2002315142A1 (en) 2003-01-08
US6776762B2 (en) 2004-08-17

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