WO2002099163A3 - Autocatalytic coating method - Google Patents

Autocatalytic coating method Download PDF

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Publication number
WO2002099163A3
WO2002099163A3 PCT/GB2002/002470 GB0202470W WO02099163A3 WO 2002099163 A3 WO2002099163 A3 WO 2002099163A3 GB 0202470 W GB0202470 W GB 0202470W WO 02099163 A3 WO02099163 A3 WO 02099163A3
Authority
WO
WIPO (PCT)
Prior art keywords
autocatalytic
substrate
metal
plating
coating method
Prior art date
Application number
PCT/GB2002/002470
Other languages
French (fr)
Other versions
WO2002099163A2 (en
Inventor
Daniel Robert Johnson
William Norman Damerell
Stephen George Appleton
Gregory Peter Wade Fixter
Original Assignee
Qinetiq Ltd
Daniel Robert Johnson
William Norman Damerell
Stephen George Appleton
Gregory Peter Wade Fixter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Ltd, Daniel Robert Johnson, William Norman Damerell, Stephen George Appleton, Gregory Peter Wade Fixter filed Critical Qinetiq Ltd
Priority to AU2002302775A priority Critical patent/AU2002302775A1/en
Publication of WO2002099163A2 publication Critical patent/WO2002099163A2/en
Publication of WO2002099163A3 publication Critical patent/WO2002099163A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition

Abstract

Autocatalytic plating is a form of electrode-less plating in which a metal, for example, cobalt, nickel, gold, silver or copper, is deposited onto a substrate via a chemical reduction process. Coatings derived from this process are usually more uniform and adherent than from other processes and can be applied to unusually shaped surfaces. Non-metallic surfaces can also be coated via this process following suitable sensitisation of the substrate. Autocatalytic deposition is used to coat whole surfaces and the formation of metal patterns requires additional and costly additional processing such as photolithography and etching. This invention therefore provides a method of preparing a substrate material for subsequent autocatalytic deposition of a metal coating in a pre-determined pattern.
PCT/GB2002/002470 2001-06-04 2002-05-27 Autocatalytic coating method WO2002099163A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002302775A AU2002302775A1 (en) 2001-06-04 2002-05-27 Autocatalytic coating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0113408.9 2001-06-04
GB0113408A GB0113408D0 (en) 2001-06-04 2001-06-04 Autocatalytic coating method

Publications (2)

Publication Number Publication Date
WO2002099163A2 WO2002099163A2 (en) 2002-12-12
WO2002099163A3 true WO2002099163A3 (en) 2003-10-16

Family

ID=9915760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002470 WO2002099163A2 (en) 2001-06-04 2002-05-27 Autocatalytic coating method

Country Status (4)

Country Link
AU (1) AU2002302775A1 (en)
GB (1) GB0113408D0 (en)
WO (1) WO2002099163A2 (en)
ZA (1) ZA200309379B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2393736A (en) * 2002-10-01 2004-04-07 Qinetiq Ltd A Cathode for use in an Electroplating Cell
US7794629B2 (en) 2003-11-25 2010-09-14 Qinetiq Limited Composite materials
GB0422386D0 (en) * 2004-10-08 2004-11-10 Qinetiq Ltd Active filler particles in inks
ES2359641T3 (en) 2006-01-27 2011-05-25 European Central Bank ELECTRONIC SECURITY MEANS FOR SECURITY DOCUMENTS USING AN ELECTROCHEMICAL CELL.
EP1813439B1 (en) 2006-01-27 2013-01-09 European Central Bank Electronic security means for security documents using a thermoelectric power generator
DE102008063030A1 (en) * 2008-12-23 2010-06-24 Bundesdruckerei Gmbh Security and / or value document with a conductive structure and method for its production
CN110284126A (en) * 2019-08-02 2019-09-27 湖州胜僖电子科技有限公司 Conductive film nickel plating gold process for touch screen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132677A1 (en) * 1983-07-22 1985-02-13 Bayer Ag Process for activating substrate surfaces for the direct partial metallization of support materials
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US5453121A (en) * 1993-07-01 1995-09-26 Tonejet Corporation Pty Ltd. Liquid ink jet ink
DE19823112A1 (en) * 1998-05-22 1999-11-25 Htw Dresden Dielectric substrates for producing electrochemical electrodes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132677A1 (en) * 1983-07-22 1985-02-13 Bayer Ag Process for activating substrate surfaces for the direct partial metallization of support materials
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US5453121A (en) * 1993-07-01 1995-09-26 Tonejet Corporation Pty Ltd. Liquid ink jet ink
DE19823112A1 (en) * 1998-05-22 1999-11-25 Htw Dresden Dielectric substrates for producing electrochemical electrodes

Also Published As

Publication number Publication date
WO2002099163A2 (en) 2002-12-12
ZA200309379B (en) 2005-03-02
AU2002302775A1 (en) 2002-12-16
GB0113408D0 (en) 2001-07-25

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