WO2002097861A3 - Semiconductor device, semiconductor layer and production method thereof - Google Patents

Semiconductor device, semiconductor layer and production method thereof Download PDF

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Publication number
WO2002097861A3
WO2002097861A3 PCT/JP2002/005007 JP0205007W WO02097861A3 WO 2002097861 A3 WO2002097861 A3 WO 2002097861A3 JP 0205007 W JP0205007 W JP 0205007W WO 02097861 A3 WO02097861 A3 WO 02097861A3
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
production method
semiconductor layer
semiconductor
boron phosphide
Prior art date
Application number
PCT/JP2002/005007
Other languages
French (fr)
Other versions
WO2002097861A2 (en
Inventor
Takashi Udagawa
Original Assignee
Showa Denko Kk
Takashi Udagawa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001158282A external-priority patent/JP4431290B2/en
Application filed by Showa Denko Kk, Takashi Udagawa filed Critical Showa Denko Kk
Priority to KR1020037001053A priority Critical patent/KR100583243B1/en
Priority to US10/332,200 priority patent/US7315050B2/en
Priority to AU2002302968A priority patent/AU2002302968A1/en
Priority to EP02730700A priority patent/EP1393352B1/en
Publication of WO2002097861A2 publication Critical patent/WO2002097861A2/en
Publication of WO2002097861A3 publication Critical patent/WO2002097861A3/en
Priority to US11/819,382 priority patent/US7622398B2/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
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    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
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    • H01L29/205Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
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    • H01L29/66462Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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    • H01L29/7783Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
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    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/0304Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
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    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1852Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

A semiconductor device is prepared by the use of a vapor phase method and is provided with a semiconductor layer composed of boron phosphide (BP) having a band gap at room temperature of not less than 2.8 eV and not more than 3.4 eV or a boron phosphide (BP)-base mixed crystal which contains the boron phosphide (BP) and which is represented by the formula: BαAlβGaηIn¿1-αβη?PδAsεN¿1-δ-ε?(0∫α=1, 0=β∫1, 0=η∫1, 0∫α+β+η=1, 0∫δ=1, 0=ε∫1, 0∫δ+ε=1).
PCT/JP2002/005007 2001-05-28 2002-05-23 Semiconductor device, semiconductor layer and production method thereof WO2002097861A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020037001053A KR100583243B1 (en) 2001-05-28 2002-05-23 Semiconductor device, semiconductor layer and production method thereof
US10/332,200 US7315050B2 (en) 2001-05-28 2002-05-23 Semiconductor device, semiconductor layer and production method thereof
AU2002302968A AU2002302968A1 (en) 2001-05-28 2002-05-23 Semiconductor device, semiconductor layer and production method thereof
EP02730700A EP1393352B1 (en) 2001-05-28 2002-05-23 Semiconductor device, semiconductor layer and production method thereof
US11/819,382 US7622398B2 (en) 2001-05-28 2007-06-27 Semiconductor device, semiconductor layer and production method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-158282 2001-05-28
JP2001158282A JP4431290B2 (en) 2001-05-28 2001-05-28 Semiconductor element and semiconductor layer
US30042501P 2001-06-26 2001-06-26
US60/300,425 2001-06-26

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10332200 A-371-Of-International 2002-05-23
US11/819,382 Division US7622398B2 (en) 2001-05-28 2007-06-27 Semiconductor device, semiconductor layer and production method thereof

Publications (2)

Publication Number Publication Date
WO2002097861A2 WO2002097861A2 (en) 2002-12-05
WO2002097861A3 true WO2002097861A3 (en) 2003-07-24

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Country Status (6)

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US (2) US7315050B2 (en)
EP (1) EP1393352B1 (en)
KR (1) KR100583243B1 (en)
CN (1) CN1214467C (en)
AU (1) AU2002302968A1 (en)
WO (1) WO2002097861A2 (en)

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US6730987B2 (en) * 2001-09-10 2004-05-04 Showa Denko K.K. Compound semiconductor device, production method thereof, light-emitting device and transistor
AU2003206129A1 (en) * 2002-01-28 2003-09-02 Showa Denko K.K. Boron phosphide-based semiconductor device, production method thereof, light-emitting diode and boron phosphide-based semiconductor layer
US6730941B2 (en) 2002-01-30 2004-05-04 Showa Denko Kabushiki Kaisha Boron phosphide-based semiconductor light-emitting device, production method thereof, and light-emitting diode
TWI273724B (en) * 2002-11-18 2007-02-11 Showa Denko Kk Boron phosphide-based semiconductor light-emitting device, production method thereof and light-emitting diode
US7508010B2 (en) 2002-12-02 2009-03-24 Showa Denko K.K. Boron phoshide-based compound semiconductor device, production method thereof and light-emitting diode
JP4134715B2 (en) * 2002-12-19 2008-08-20 住友電気工業株式会社 Bipolar transistor
WO2004061981A1 (en) * 2003-01-06 2004-07-22 Showa Denko K. K. Boron phosphide-based semiconductor light-emitting device and production method thereof
WO2005043635A1 (en) * 2003-10-31 2005-05-12 Showa Denko K.K. Compound semiconductor light-emitting device having pn-junction type hetero structure and forming method thereof
KR101200722B1 (en) * 2003-11-18 2012-11-13 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 Single crystal of hexagonal boron nitride capable of far ultraviolet high-luminance light emission, process for producing the same, far ultraviolet high-luminance light emitting device including the single crystal, and utilizing the device, solid laser and solid light emitting unit
CN100413105C (en) * 2004-03-05 2008-08-20 昭和电工株式会社 Boron phosphide-based semiconductor light-emitting device
KR100818457B1 (en) * 2004-03-15 2008-04-02 쇼와 덴코 가부시키가이샤 Compound semiconductor light-emitting diode
DE112005000529B4 (en) 2004-03-30 2011-04-28 Showa Denko K.K., Minato-ku Compound semiconductor device, compound semiconductor device manufacturing method and diode
TWI296160B (en) * 2004-05-06 2008-04-21 Showa Denko Kk Pn junction-type compound semiconductor light emitting diode
CN100433372C (en) * 2005-04-15 2008-11-12 香港理工大学 Ultraviolet detecting apparatus
US20100252805A1 (en) * 2005-06-29 2010-10-07 University Of Houston GaN Nanorod Arrays Formed by Ion Beam Implantation
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JP4486701B1 (en) * 2008-11-06 2010-06-23 パナソニック株式会社 Nitride-based semiconductor device and manufacturing method thereof
JP5234022B2 (en) * 2009-07-15 2013-07-10 住友電気工業株式会社 Nitride semiconductor light emitting device
US20110163298A1 (en) * 2010-01-04 2011-07-07 Chien-Min Sung Graphene and Hexagonal Boron Nitride Devices
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JP6197344B2 (en) * 2013-04-18 2017-09-20 住友電気工業株式会社 Semiconductor device
CN113526476A (en) * 2020-04-15 2021-10-22 四川大学 High-pressure high-temperature method for preparing high-temperature semiconductor material Boron Phosphide (BP)

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US20030234400A1 (en) 2003-12-25
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