WO2002095798A3 - Fibre optic wafer probe - Google Patents

Fibre optic wafer probe Download PDF

Info

Publication number
WO2002095798A3
WO2002095798A3 PCT/US2002/013916 US0213916W WO02095798A3 WO 2002095798 A3 WO2002095798 A3 WO 2002095798A3 US 0213916 W US0213916 W US 0213916W WO 02095798 A3 WO02095798 A3 WO 02095798A3
Authority
WO
WIPO (PCT)
Prior art keywords
fibre optic
wafer probe
optic wafer
probe
fibre
Prior art date
Application number
PCT/US2002/013916
Other languages
French (fr)
Other versions
WO2002095798A2 (en
Inventor
Peter R Mccann
John T Martin
Original Assignee
Cascade Microtexh Inc
Peter R Mccann
John T Martin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cascade Microtexh Inc, Peter R Mccann, John T Martin filed Critical Cascade Microtexh Inc
Priority to EP02726833A priority Critical patent/EP1405113A2/en
Priority to DE10296750T priority patent/DE10296750T5/en
Priority to AU2002257239A priority patent/AU2002257239A1/en
Priority to JP2002592164A priority patent/JP2004527762A/en
Publication of WO2002095798A2 publication Critical patent/WO2002095798A2/en
Publication of WO2002095798A3 publication Critical patent/WO2002095798A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3604—Rotary joints allowing relative rotational movement between opposing fibre or fibre bundle ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3855—Details of mounting fibres in ferrules; Assembly methods; Manufacture characterised by the method of anchoring or fixing the fibre within the ferrule
    • G02B6/3858—Clamping, i.e. with only elastic deformation

Abstract

A fibre optic wafer probe (10) that includes a fibre optic cable (14) for approaching a device under test.
PCT/US2002/013916 2001-05-04 2002-05-03 Fibre optic wafer probe WO2002095798A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02726833A EP1405113A2 (en) 2001-05-04 2002-05-03 Fibre optic wafer probe
DE10296750T DE10296750T5 (en) 2001-05-04 2002-05-03 Fiber optic wafer probe
AU2002257239A AU2002257239A1 (en) 2001-05-04 2002-05-03 Fibre optic wafer probe
JP2002592164A JP2004527762A (en) 2001-05-04 2002-05-03 Optical fiber wafer probe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/849,152 2001-05-04
US09/849,152 US6970634B2 (en) 2001-05-04 2001-05-04 Fiber optic wafer probe

Publications (2)

Publication Number Publication Date
WO2002095798A2 WO2002095798A2 (en) 2002-11-28
WO2002095798A3 true WO2002095798A3 (en) 2003-05-30

Family

ID=25305183

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/013916 WO2002095798A2 (en) 2001-05-04 2002-05-03 Fibre optic wafer probe

Country Status (7)

Country Link
US (2) US6970634B2 (en)
EP (1) EP1405113A2 (en)
JP (1) JP2004527762A (en)
AU (1) AU2002257239A1 (en)
DE (1) DE10296750T5 (en)
TW (1) TWI232963B (en)
WO (1) WO2002095798A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7682089B2 (en) * 2007-08-15 2010-03-23 Rohlen Brooks H System and method for positioning a probe
GB201011324D0 (en) * 2010-07-06 2010-08-18 Airbus Operations Ltd Apparatus for providing support for an optical fibre
TWI490576B (en) * 2010-11-29 2015-07-01 Hon Hai Prec Ind Co Ltd Optical transmission system
US9261556B2 (en) 2013-06-10 2016-02-16 Freescale Semiconductor, Inc. Optical wafer and die probe testing
US9094135B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9091820B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Communication system die stack
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
US9810843B2 (en) 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US10230458B2 (en) 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
JP2021527810A (en) 2018-06-20 2021-10-14 フィズィーク・インストゥルメンテ（ペーイー）ゲーエムベーハー・ウント・コー．カーゲー Sensor probe assembly
JP7101577B2 (en) 2018-09-21 2022-07-15 株式会社日本マイクロニクス Inspection method and inspection system
US10914897B2 (en) * 2018-12-12 2021-02-09 Globalfoundries Inc. Optical on-wafer probing with v-groove couplers
JP7402652B2 (en) 2019-10-04 2023-12-21 株式会社日本マイクロニクス Optical probes, optical probe arrays, inspection systems and inspection methods
JP2021182113A (en) 2020-05-20 2021-11-25 株式会社日本マイクロニクス Optical probe, optical probe array, optical probe card, and method for manufacturing optical probe

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101453A (en) * 1991-07-05 1992-03-31 Cascade Microtech, Inc. Fiber optic wafer probe
US5879289A (en) * 1996-07-15 1999-03-09 Universal Technologies International, Inc. Hand-held portable endoscopic camera
US6222970B1 (en) * 1995-11-20 2001-04-24 Cirrex Corp. Methods and apparatus for filtering an optical fiber

Family Cites Families (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US661417A (en) * 1899-04-27 1900-11-06 John F Mossman Mechanical movement.
US3740900A (en) * 1970-07-01 1973-06-26 Signetics Corp Vacuum chuck assembly for semiconductor manufacture
US3952156A (en) * 1972-09-07 1976-04-20 Xerox Corporation Signal processing system
US4383217A (en) * 1979-01-02 1983-05-10 Shiell Thomas J Collinear four-point probe head and mount for resistivity measurements
FI58719C (en) * 1979-06-01 1981-04-10 Instrumentarium Oy DIAGNOSTISERINGSANORDNING FOER BROESTKANCER
US4401945A (en) * 1981-04-30 1983-08-30 The Valeron Corporation Apparatus for detecting the position of a probe relative to a workpiece
DE3202461C1 (en) * 1982-01-27 1983-06-09 Fa. Carl Zeiss, 7920 Heidenheim Attachment of microscope objectives
US4705447A (en) * 1983-08-11 1987-11-10 Intest Corporation Electronic test head positioner for test systems
US4652082A (en) 1984-10-29 1987-03-24 Amp Incorporated Angled electro optic connector
DE3531893A1 (en) * 1985-09-06 1987-03-19 Siemens Ag METHOD FOR DETERMINING THE DISTRIBUTION OF DIELECTRICITY CONSTANTS IN AN EXAMINATION BODY, AND MEASURING ARRANGEMENT FOR IMPLEMENTING THE METHOD
US4746857A (en) * 1985-09-13 1988-05-24 Danippon Screen Mfg. Co. Ltd. Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer
US4696544A (en) 1985-11-18 1987-09-29 Olympus Corporation Fiberscopic device for inspection of internal sections of construction, and method for using same
EP0241724B1 (en) 1986-03-14 1993-01-20 Sumitomo Electric Industries Limited Optical connector and splicer
FR2603954B1 (en) 1986-09-15 1988-12-16 Olaer Ind Sa PRESSURE TANK WITH LIQUID PRESENCE SENSOR IN A GAS CHAMBER
US4727637A (en) * 1987-01-20 1988-03-01 The Boeing Company Computer aided connector assembly method and apparatus
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
JPH0660912B2 (en) * 1987-09-07 1994-08-10 浜松ホトニクス株式会社 Voltage detector
US4891584A (en) * 1988-03-21 1990-01-02 Semitest, Inc. Apparatus for making surface photovoltage measurements of a semiconductor
DE8901113U1 (en) 1989-02-02 1990-03-01 Felten & Guilleaume Energietechnik Ag, 5000 Koeln, De
US5232789A (en) * 1989-03-09 1993-08-03 Mtu Motoren- Und Turbinen-Union Muenchen Gmbh Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating
US4970386A (en) 1989-06-22 1990-11-13 Westinghouse Electric Corp. Vertical FET high speed optical sensor
US5097207A (en) * 1989-11-03 1992-03-17 John H. Blanz Company, Inc. Temperature stable cryogenic probe station
US5267088A (en) 1989-11-10 1993-11-30 Asahi Kogaku Kogyo Kabushiki Kaisha Code plate mounting device
US5298972A (en) * 1990-01-22 1994-03-29 Hewlett-Packard Company Method and apparatus for measuring polarization sensitivity of optical devices
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
US5408189A (en) * 1990-05-25 1995-04-18 Everett Charles Technologies, Inc. Test fixture alignment system for printed circuit boards
KR0138754B1 (en) * 1990-08-06 1998-06-15 이노우에 아키라 Touch sensor unit of probe for testing electric circuit and electric circuit testing apparatus using the touch sensor unit
US5159267A (en) * 1990-09-28 1992-10-27 Sematech, Inc. Pneumatic energy fluxmeter
GB9021448D0 (en) 1990-10-03 1990-11-14 Renishaw Plc Capacitance sensing probe
US5317656A (en) 1991-05-17 1994-05-31 Texas Instruments Incorporated Fiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometry
US5233197A (en) * 1991-07-15 1993-08-03 University Of Massachusetts Medical Center High speed digital imaging microscope
WO1993002774A1 (en) 1991-08-01 1993-02-18 Niro A/S Process of producing calcium hydroxide for fluidized bed absorption
US5321453A (en) * 1991-08-03 1994-06-14 Tokyo Electron Limited Probe apparatus for probing an object held above the probe card
US5404111A (en) * 1991-08-03 1995-04-04 Tokyo Electron Limited Probe apparatus with a swinging holder for an object of examination
US5159264A (en) * 1991-10-02 1992-10-27 Sematech, Inc. Pneumatic energy fluxmeter
US5202558A (en) * 1992-03-04 1993-04-13 Barker Lynn M Flexible fiber optic probe for high-pressure shock experiments
JPH06154238A (en) 1992-11-25 1994-06-03 Matsushita Electric Ind Co Ltd Optical probe
US5412330A (en) * 1993-06-16 1995-05-02 Tektronix, Inc. Optical module for an optically based measurement system
US5600258A (en) * 1993-09-15 1997-02-04 Intest Corporation Method and apparatus for automated docking of a test head to a device handler
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6064217A (en) * 1993-12-23 2000-05-16 Epi Technologies, Inc. Fine pitch contact device employing a compliant conductive polymer bump
US20020011859A1 (en) * 1993-12-23 2002-01-31 Kenneth R. Smith Method for forming conductive bumps for the purpose of contrructing a fine pitch test device
US5430813A (en) 1993-12-30 1995-07-04 The United States Of America As Represented By The Secretary Of The Navy Mode-matched, combination taper fiber optic probe
GB9401459D0 (en) 1994-01-26 1994-03-23 Secr Defence Method and apparatus for measurement of unsteady gas temperatures
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US5715819A (en) * 1994-05-26 1998-02-10 The Carolinas Heart Institute Microwave tomographic spectroscopy system and method
US5505150A (en) * 1994-06-14 1996-04-09 L&P Property Management Company Method and apparatus for facilitating loop take time adjustment in multi-needle quilting machine
US5704355A (en) * 1994-07-01 1998-01-06 Bridges; Jack E. Non-invasive system for breast cancer detection
US5829437A (en) 1994-07-01 1998-11-03 Interstitial, Inc. Microwave method and system to detect and locate cancers in heterogenous tissues
EP0694282B1 (en) * 1994-07-01 2004-01-02 Interstitial, LLC Breast cancer detection and imaging by electromagnetic millimeter waves
US5481196A (en) * 1994-11-08 1996-01-02 Nebraska Electronics, Inc. Process and apparatus for microwave diagnostics and therapy
US5583733A (en) * 1994-12-21 1996-12-10 Polaroid Corporation Electrostatic discharge protection device
US5731920A (en) * 1994-12-22 1998-03-24 Canon Kabushiki Kaisha Converting adapter for interchangeable lens assembly
JPH08179008A (en) * 1994-12-22 1996-07-12 Advantest Corp Test head cooling device
DE19517330C2 (en) 1995-05-11 2002-06-13 Helmuth Heigl handling device
US5804982A (en) * 1995-05-26 1998-09-08 International Business Machines Corporation Miniature probe positioning actuator
US5728091A (en) 1995-06-07 1998-03-17 Cardiogenesis Corporation Optical fiber for myocardial channel formation
US6002109A (en) * 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US5621400A (en) 1995-09-07 1997-04-15 Corbi; Ronald W. Ice detection method and apparatus for an aircraft
US6006002A (en) 1995-10-25 1999-12-21 Olympus Optical Co., Ltd. Rigid sleeve device fitted over a flexible insertion section of an endoscope for inspecting industrial equipment
JPH09127432A (en) 1995-11-01 1997-05-16 Olympus Optical Co Ltd Industrial endoscope
DE19542955C2 (en) 1995-11-17 1999-02-18 Schwind Gmbh & Co Kg Herbert endoscope
US5841288A (en) 1996-02-12 1998-11-24 Microwave Imaging System Technologies, Inc. Two-dimensional microwave imaging apparatus and methods
US5666063A (en) * 1996-10-23 1997-09-09 Motorola, Inc. Method and apparatus for testing an integrated circuit
US5945836A (en) * 1996-10-29 1999-08-31 Hewlett-Packard Company Loaded-board, guided-probe test fixture
US5876331A (en) 1996-11-12 1999-03-02 Johnson & Johnson Medical, Inc. Endoscope with improved flexible insertion tube
JPH10165522A (en) 1996-12-09 1998-06-23 Tokyo Iken Kk Physical treatment optical fiber device and optical fiber arm device
US5852232A (en) 1997-01-02 1998-12-22 Kla-Tencor Corporation Acoustic sensor as proximity detector
JPH10204102A (en) * 1997-01-27 1998-08-04 Mitsubishi Gas Chem Co Inc Production of water-soluble tricarboxy polysaccharide
US6127831A (en) * 1997-04-21 2000-10-03 Motorola, Inc. Method of testing a semiconductor device by automatically measuring probe tip parameters
EP0984722A4 (en) 1997-05-23 2004-04-14 Carolinas Heart Inst Electromagnetical imaging and therapeutic (emit) systems
JPH10335395A (en) * 1997-05-28 1998-12-18 Advantest Corp Contact position detecting method for probe card
US6034533A (en) * 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
WO1999004273A1 (en) * 1997-07-15 1999-01-28 Wentworth Laboratories, Inc. Probe station with multiple adjustable probe supports
US6215295B1 (en) * 1997-07-25 2001-04-10 Smith, Iii Richard S. Photonic field probe and calibration means thereof
JP2001514921A (en) * 1997-08-13 2001-09-18 サークス， インコーポレイテッド Non-invasive devices, methods, and systems for tissue contraction
US6071009A (en) 1997-10-03 2000-06-06 Micron Technology, Inc. Semiconductor wirebond machine leadframe thermal map system
US6278051B1 (en) * 1997-10-09 2001-08-21 Vatell Corporation Differential thermopile heat flux transducer
US6096567A (en) * 1997-12-01 2000-08-01 Electroglas, Inc. Method and apparatus for direct probe sensing
US5944093A (en) * 1997-12-30 1999-08-31 Intel Corporation Pickup chuck with an integral heat pipe
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JPH11281675A (en) * 1998-03-31 1999-10-15 Hewlett Packard Japan Ltd Signal measuring probe
US6181416B1 (en) * 1998-04-14 2001-01-30 Optometrix, Inc. Schlieren method for imaging semiconductor device properties
WO1999056940A1 (en) * 1998-05-01 1999-11-11 W. L. Gore & Associates, Inc. Repeatably positionable nozzle assembly
US6257564B1 (en) * 1998-05-15 2001-07-10 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
TW440699B (en) * 1998-06-09 2001-06-16 Advantest Corp Test apparatus for electronic parts
US7304486B2 (en) * 1998-07-08 2007-12-04 Capres A/S Nano-drive for high resolution positioning and for positioning of a multi-point probe
US6572608B1 (en) * 1999-04-08 2003-06-03 Eric T. Lee Directional laser probe
US6448788B1 (en) * 1999-05-26 2002-09-10 Microwave Imaging System Technologies, Inc. Fixed array microwave imaging apparatus and method
US6211663B1 (en) * 1999-05-28 2001-04-03 The Aerospace Corporation Baseband time-domain waveform measurement method
US6320372B1 (en) 1999-07-09 2001-11-20 Electroglas, Inc. Apparatus and method for testing a substrate having a plurality of terminals
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6275738B1 (en) * 1999-08-19 2001-08-14 Kai Technologies, Inc. Microwave devices for medical hyperthermia, thermotherapy and diagnosis
US6545492B1 (en) * 1999-09-20 2003-04-08 Europaisches Laboratorium Fur Molekularbiologie (Embl) Multiple local probe measuring device and method
US6528993B1 (en) * 1999-11-29 2003-03-04 Korea Advanced Institute Of Science & Technology Magneto-optical microscope magnetometer
US6891263B2 (en) * 2000-02-07 2005-05-10 Ibiden Co., Ltd. Ceramic substrate for a semiconductor production/inspection device
EP1205451A1 (en) * 2000-03-07 2002-05-15 Ibiden Co., Ltd. Ceramic substrate for manufacture/inspection of semiconductor
US20020070745A1 (en) * 2000-04-27 2002-06-13 Johnson James E. Cooling system for burn-in unit
US6396296B1 (en) * 2000-05-15 2002-05-28 Advanced Micro Devices, Inc. Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station
EP1296360A1 (en) 2000-05-26 2003-03-26 Ibiden Co., Ltd. Semiconductor manufacturing and inspecting device
US6379130B1 (en) * 2000-06-09 2002-04-30 Tecumseh Products Company Motor cover retention
JP2002022775A (en) * 2000-07-05 2002-01-23 Ando Electric Co Ltd Electro-optical probe and magneto-optical probe
JP2002039091A (en) * 2000-07-21 2002-02-06 Minebea Co Ltd Blower
JP4408538B2 (en) * 2000-07-24 2010-02-03 株式会社日立製作所 Probe device
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6611417B2 (en) 2001-03-22 2003-08-26 Winbond Electronics Corporation Wafer chuck system
IL154264A0 (en) * 2001-06-06 2003-09-17 Ibiden Co Ltd Wafer prober
US7570063B2 (en) * 2001-07-06 2009-08-04 Wisconsin Alumni Research Foundation Space-time microwave imaging for cancer detection
IL144806A (en) * 2001-08-08 2005-11-20 Nova Measuring Instr Ltd Method and apparatus for process control in semiconductor manufacturing
US6481939B1 (en) 2001-08-24 2002-11-19 Robb S. Gillespie Tool tip conductivity contact sensor and method
US20030139662A1 (en) * 2001-10-16 2003-07-24 Seidman Abraham Neil Method and apparatus for detecting, identifying and performing operations on microstructures including, anthrax spores, brain cells, cancer cells, living tissue cells, and macro-objects including stereotactic neurosurgery instruments, weapons and explosives
JP2004152916A (en) * 2002-10-29 2004-05-27 Nec Corp Inspecting device and inspecting method of semiconductor device
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101453A (en) * 1991-07-05 1992-03-31 Cascade Microtech, Inc. Fiber optic wafer probe
US6222970B1 (en) * 1995-11-20 2001-04-24 Cirrex Corp. Methods and apparatus for filtering an optical fiber
US5879289A (en) * 1996-07-15 1999-03-09 Universal Technologies International, Inc. Hand-held portable endoscopic camera

Also Published As

Publication number Publication date
US20020164145A1 (en) 2002-11-07
US20060008226A1 (en) 2006-01-12
WO2002095798A2 (en) 2002-11-28
EP1405113A2 (en) 2004-04-07
US7298536B2 (en) 2007-11-20
AU2002257239A1 (en) 2002-12-03
DE10296750T5 (en) 2004-12-09
US6970634B2 (en) 2005-11-29
TWI232963B (en) 2005-05-21
JP2004527762A (en) 2004-09-09

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