WO2002091469A3 - Three-dimensional electronic device and relative manufacture method - Google Patents
Three-dimensional electronic device and relative manufacture method Download PDFInfo
- Publication number
- WO2002091469A3 WO2002091469A3 PCT/IT2002/000304 IT0200304W WO02091469A3 WO 2002091469 A3 WO2002091469 A3 WO 2002091469A3 IT 0200304 W IT0200304 W IT 0200304W WO 02091469 A3 WO02091469 A3 WO 02091469A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic device
- manufacture method
- dimensional electronic
- relative manufacture
- relative
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/0651—Wire or wire-like electrical connections from device to substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02733231A EP1419529A2 (en) | 2001-05-08 | 2002-05-07 | Three-dimensional electronic device and relative manufacture method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2001TO000433A ITTO20010433A1 (en) | 2001-05-08 | 2001-05-08 | THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS. |
ITTO2001A000433 | 2001-05-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002091469A2 WO2002091469A2 (en) | 2002-11-14 |
WO2002091469A3 true WO2002091469A3 (en) | 2004-03-04 |
Family
ID=11458842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IT2002/000304 WO2002091469A2 (en) | 2001-05-08 | 2002-05-07 | Three-dimensional electronic device and relative manufacture method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1419529A2 (en) |
IT (1) | ITTO20010433A1 (en) |
WO (1) | WO2002091469A2 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551629A (en) * | 1980-09-16 | 1985-11-05 | Irvine Sensors Corporation | Detector array module-structure and fabrication |
US5568356A (en) * | 1995-04-18 | 1996-10-22 | Hughes Aircraft Company | Stacked module assembly including electrically interconnected switching module and plural electronic modules |
US5631497A (en) * | 1990-07-11 | 1997-05-20 | Hitachi, Ltd. | Film carrier tape and laminated multi-chip semiconductor device incorporating the same |
US5673478A (en) * | 1995-04-28 | 1997-10-07 | Texas Instruments Incorporated | Method of forming an electronic device having I/O reroute |
US5818107A (en) * | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
US6098278A (en) * | 1994-06-23 | 2000-08-08 | Cubic Memory, Inc. | Method for forming conductive epoxy flip-chip on chip |
-
2001
- 2001-05-08 IT IT2001TO000433A patent/ITTO20010433A1/en unknown
-
2002
- 2002-05-07 EP EP02733231A patent/EP1419529A2/en not_active Withdrawn
- 2002-05-07 WO PCT/IT2002/000304 patent/WO2002091469A2/en not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551629A (en) * | 1980-09-16 | 1985-11-05 | Irvine Sensors Corporation | Detector array module-structure and fabrication |
US5631497A (en) * | 1990-07-11 | 1997-05-20 | Hitachi, Ltd. | Film carrier tape and laminated multi-chip semiconductor device incorporating the same |
US6098278A (en) * | 1994-06-23 | 2000-08-08 | Cubic Memory, Inc. | Method for forming conductive epoxy flip-chip on chip |
US5568356A (en) * | 1995-04-18 | 1996-10-22 | Hughes Aircraft Company | Stacked module assembly including electrically interconnected switching module and plural electronic modules |
US5673478A (en) * | 1995-04-28 | 1997-10-07 | Texas Instruments Incorporated | Method of forming an electronic device having I/O reroute |
US5818107A (en) * | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
Also Published As
Publication number | Publication date |
---|---|
WO2002091469A2 (en) | 2002-11-14 |
ITTO20010433A1 (en) | 2002-11-08 |
ITTO20010433A0 (en) | 2001-05-08 |
EP1419529A2 (en) | 2004-05-19 |
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