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Publication numberWO2002091469 A3
Publication typeApplication
Application numberPCT/IT2002/000304
Publication date4 Mar 2004
Filing date7 May 2002
Priority date8 May 2001
Also published asEP1419529A2, WO2002091469A2
Publication numberPCT/2002/304, PCT/IT/2/000304, PCT/IT/2/00304, PCT/IT/2002/000304, PCT/IT/2002/00304, PCT/IT2/000304, PCT/IT2/00304, PCT/IT2000304, PCT/IT2002/000304, PCT/IT2002/00304, PCT/IT2002000304, PCT/IT200200304, PCT/IT200304, WO 02091469 A3, WO 02091469A3, WO 2002/091469 A3, WO 2002091469 A3, WO 2002091469A3, WO-A3-02091469, WO-A3-2002091469, WO02091469 A3, WO02091469A3, WO2002/091469A3, WO2002091469 A3, WO2002091469A3
InventorsMario Palazzetti, Eugenio Faggioli, Riccardo Groppo
ApplicantFiat Ricerche, Mario Palazzetti, Eugenio Faggioli, Riccardo Groppo
Export CitationBiBTeX, EndNote, RefMan
External Links: Patentscope, Espacenet
Three-dimensional electronic device and relative manufacture method
WO 2002091469 A3
Abstract
There is described a three-dimensional electronic device (10) having a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22); and a substantially C-shaped spacer member (26) made of electrically conducting material and extending between the first and second electronic circuit (12, 14) to connect a first contact pad (22a) of the first integrated circuit (12) electrically to a second contact pad (22b) of the second integrated circuit (14).
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US4551629 *23 Jan 19845 Nov 1985Irvine Sensors CorporationDetector array module-structure and fabrication
US5568356 *18 Apr 199522 Oct 1996Hughes Aircraft CompanyStacked module assembly including electrically interconnected switching module and plural electronic modules
US5631497 *9 Jul 199120 May 1997Hitachi, Ltd.Film carrier tape and laminated multi-chip semiconductor device incorporating the same
US5673478 *16 Nov 19957 Oct 1997Texas Instruments IncorporatedMethod of forming an electronic device having I/O reroute
US5818107 *17 Jan 19976 Oct 1998International Business Machines CorporationChip stacking by edge metallization
US6098278 *22 Aug 19978 Aug 2000Cubic Memory, Inc.Method for forming conductive epoxy flip-chip on chip
Classifications
International ClassificationH01L25/065
Cooperative ClassificationH01L2924/0002, H01L2225/06575, H01L25/0657, H01L2225/0651, H01L2225/06551, H01L2225/06572
European ClassificationH01L25/065S
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