WO2002089205A3 - Relay connector for an electronic component and a method for producing the same - Google Patents

Relay connector for an electronic component and a method for producing the same Download PDF

Info

Publication number
WO2002089205A3
WO2002089205A3 PCT/DE2002/001279 DE0201279W WO02089205A3 WO 2002089205 A3 WO2002089205 A3 WO 2002089205A3 DE 0201279 W DE0201279 W DE 0201279W WO 02089205 A3 WO02089205 A3 WO 02089205A3
Authority
WO
WIPO (PCT)
Prior art keywords
relay connector
plated
producing
same
electronic component
Prior art date
Application number
PCT/DE2002/001279
Other languages
German (de)
French (fr)
Other versions
WO2002089205A2 (en
Inventor
Dirk Striebel
Puymbroeck Jozef Van
Original Assignee
Siemens Production & Logistics
Dirk Striebel
Puymbroeck Jozef Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Production & Logistics, Dirk Striebel, Puymbroeck Jozef Van filed Critical Siemens Production & Logistics
Publication of WO2002089205A2 publication Critical patent/WO2002089205A2/en
Publication of WO2002089205A3 publication Critical patent/WO2002089205A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a relay connector comprising a three-dimensional base body consisting of insulating material, the upper side of said body having a bearing surface for the component in addition to internal contacts for electrically connecting to subassembly connections, and the underside having studs formed from insulating material for forming external contacts. The internal contacts are connected to the external contacts on the underside by means of printed conductors and plated holes. Said plated holes are created by vias in a plated hole region, preferably by means of laser drilling, whereby the wall thickness of the base body in the plated hole region is reduced by a recess. The invention enables the vias and the entire relay connector to be produced rapidly and cost-effectively by means of laser machining.
PCT/DE2002/001279 2001-04-25 2002-04-08 Relay connector for an electronic component and a method for producing the same WO2002089205A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001120257 DE10120257A1 (en) 2001-04-25 2001-04-25 Connection carrier for an electronic component and method for its production
DE10120257.1 2001-04-25

Publications (2)

Publication Number Publication Date
WO2002089205A2 WO2002089205A2 (en) 2002-11-07
WO2002089205A3 true WO2002089205A3 (en) 2003-08-07

Family

ID=7682669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/001279 WO2002089205A2 (en) 2001-04-25 2002-04-08 Relay connector for an electronic component and a method for producing the same

Country Status (2)

Country Link
DE (1) DE10120257A1 (en)
WO (1) WO2002089205A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
WO1998027588A1 (en) * 1996-12-19 1998-06-25 Telefonaktiebolaget Lm Ericsson (Publ) A via structure
US6107109A (en) * 1997-12-18 2000-08-22 Micron Technology, Inc. Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate
US6114240A (en) * 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
WO2001082372A1 (en) * 2000-04-20 2001-11-01 Siemens Aktiengesellschaft Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0953210A1 (en) * 1996-12-19 1999-11-03 TELEFONAKTIEBOLAGET L M ERICSSON (publ) Flip-chip type connection with elastic contacts
TW420853B (en) * 1998-07-10 2001-02-01 Siemens Ag Method of manufacturing the wiring with electric conducting interconnect between the over-side and the underside of the substrate and the wiring with such interconnect

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
WO1998027588A1 (en) * 1996-12-19 1998-06-25 Telefonaktiebolaget Lm Ericsson (Publ) A via structure
US6107109A (en) * 1997-12-18 2000-08-22 Micron Technology, Inc. Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate
US6114240A (en) * 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
WO2001082372A1 (en) * 2000-04-20 2001-11-01 Siemens Aktiengesellschaft Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type

Also Published As

Publication number Publication date
DE10120257A1 (en) 2002-11-14
WO2002089205A2 (en) 2002-11-07

Similar Documents

Publication Publication Date Title
EP1157821A4 (en) Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same
EP1729552A3 (en) Wiring board and manufacturing method of wiring board
HK1089328A1 (en) Method for manufacturing an electronic module and an electronic module
US5315072A (en) Printed wiring board having blind holes
TW200603387A (en) Interconnect structure with wings
JPH11204211A (en) Hf coaxial angle connector parts
CA2454289A1 (en) High speed circuit board and method for fabrication
TW200731908A (en) Multilayer printed wiring board and method for manufacturing same
KR960702172A (en) PROCESS FOR PRODUCING VERTICALLY CONNECTED SEMICONDUCTOR COMPONENTS
TW200607428A (en) PCB and its manufacturing method
US5647768A (en) Plated plastic filter header
TW200704325A (en) Wiring board, multilayer wiring board, and method for manufacturing the same
WO2005082087A3 (en) Method and apparatus for connecting metal structures on opposing sides of a circuit
WO2004054333A3 (en) Cross connect via for multilayer printed circuit boards
JP4256603B2 (en) Manufacturing method of laminated wiring board
EP1619719A3 (en) Method of manufacturing a wiring board including electroplating
MY149115A (en) Method of forming a circuit board with improved via design
US6913187B2 (en) Method and arrangement for providing Vias in printed circuit boards
JP4617900B2 (en) Built-up printed wiring board structure and processing method of built-up printed wiring board
WO2008135142A3 (en) Method for producing a circuit board having a cavity for the integration of components and circuit board and application
CA2378252A1 (en) A printed circuit board
WO2002089205A3 (en) Relay connector for an electronic component and a method for producing the same
JP2003142797A5 (en)
EP1545176A4 (en) Multilayer printed wiring board and production method therefor
EP1146780A3 (en) Circuit board and method of manufacture

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP KR US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP