WO2002084720A3 - Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif - Google Patents

Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif Download PDF

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Publication number
WO2002084720A3
WO2002084720A3 PCT/JP2002/003318 JP0203318W WO02084720A3 WO 2002084720 A3 WO2002084720 A3 WO 2002084720A3 JP 0203318 W JP0203318 W JP 0203318W WO 02084720 A3 WO02084720 A3 WO 02084720A3
Authority
WO
WIPO (PCT)
Prior art keywords
main body
supported
unit
body unit
points
Prior art date
Application number
PCT/JP2002/003318
Other languages
English (en)
French (fr)
Other versions
WO2002084720A2 (fr
Inventor
Kenji Nishi
Original Assignee
Nippon Kogaku Kk
Kenji Nishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk, Kenji Nishi filed Critical Nippon Kogaku Kk
Priority to AU2002246319A priority Critical patent/AU2002246319A1/en
Publication of WO2002084720A2 publication Critical patent/WO2002084720A2/ja
Priority to US10/310,036 priority patent/US6853443B2/en
Publication of WO2002084720A3 publication Critical patent/WO2002084720A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
PCT/JP2002/003318 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif WO2002084720A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002246319A AU2002246319A1 (en) 2001-04-06 2002-04-03 Exposure device and substrate processing system and device producing method
US10/310,036 US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001108334A JP2002305140A (ja) 2001-04-06 2001-04-06 露光装置及び基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/310,036 Continuation US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Publications (2)

Publication Number Publication Date
WO2002084720A2 WO2002084720A2 (fr) 2002-10-24
WO2002084720A3 true WO2002084720A3 (fr) 2007-10-25

Family

ID=18960494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003318 WO2002084720A2 (fr) 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif

Country Status (6)

Country Link
US (1) US6853443B2 (ja)
JP (1) JP2002305140A (ja)
KR (1) KR20030011296A (ja)
CN (1) CN1636268A (ja)
AU (1) AU2002246319A1 (ja)
WO (1) WO2002084720A2 (ja)

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KR20060009957A (ko) 2003-05-27 2006-02-01 가부시키가이샤 니콘 노광 장치 및 디바이스의 제조 방법
WO2004109357A1 (ja) * 2003-06-06 2004-12-16 Nikon Corporation 光学素子保持装置、鏡筒、露光装置、及びデバイスの製造方法
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CN102944981A (zh) 2003-07-09 2013-02-27 株式会社尼康 曝光装置、器件制造方法
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TWI609409B (zh) 2003-10-28 2017-12-21 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
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KR101440617B1 (ko) * 2005-01-31 2014-09-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
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US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
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KR101529845B1 (ko) * 2006-08-31 2015-06-17 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
US8908144B2 (en) * 2006-09-27 2014-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100779372B1 (ko) * 2006-12-06 2007-11-23 동부일렉트로닉스 주식회사 진동측정수단이 구비된 노광장치 및 진동저감방법
KR20150036734A (ko) * 2006-12-27 2015-04-07 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
JP5013906B2 (ja) * 2007-03-05 2012-08-29 キヤノン株式会社 光学素子保持装置
KR100866447B1 (ko) * 2007-06-19 2008-10-31 주식회사 동부하이텍 반도체 장치 제조용 노광 장치
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5188135B2 (ja) * 2007-10-05 2013-04-24 キヤノン株式会社 露光装置及びデバイス製造方法
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KR101546987B1 (ko) 2007-10-16 2015-08-24 가부시키가이샤 니콘 조명 광학 시스템, 노광 장치 및 디바이스 제조 방법
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
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JP5534910B2 (ja) * 2009-04-23 2014-07-02 ギガフォトン株式会社 極端紫外光源装置
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JPH09297018A (ja) * 1996-05-07 1997-11-18 Nikon Corp 位置検出装置
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
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JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Also Published As

Publication number Publication date
JP2002305140A (ja) 2002-10-18
US6853443B2 (en) 2005-02-08
AU2002246319A1 (en) 2002-10-28
WO2002084720A2 (fr) 2002-10-24
KR20030011296A (ko) 2003-02-07
CN1636268A (zh) 2005-07-06
AU2002246319A8 (en) 2008-01-03
US20030117596A1 (en) 2003-06-26

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