WO2002084720A2 - Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif - Google Patents

Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif Download PDF

Info

Publication number
WO2002084720A2
WO2002084720A2 PCT/JP2002/003318 JP0203318W WO02084720A2 WO 2002084720 A2 WO2002084720 A2 WO 2002084720A2 JP 0203318 W JP0203318 W JP 0203318W WO 02084720 A2 WO02084720 A2 WO 02084720A2
Authority
WO
WIPO (PCT)
Prior art keywords
main body
supported
unit
body unit
points
Prior art date
Application number
PCT/JP2002/003318
Other languages
English (en)
French (fr)
Other versions
WO2002084720A3 (fr
Inventor
Kenji Nishi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU2002246319A priority Critical patent/AU2002246319A1/en
Publication of WO2002084720A2 publication Critical patent/WO2002084720A2/ja
Priority to US10/310,036 priority patent/US6853443B2/en
Publication of WO2002084720A3 publication Critical patent/WO2002084720A3/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70766Reaction force control means, e.g. countermass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
PCT/JP2002/003318 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif WO2002084720A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002246319A AU2002246319A1 (en) 2001-04-06 2002-04-03 Exposure device and substrate processing system and device producing method
US10/310,036 US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001108334A JP2002305140A (ja) 2001-04-06 2001-04-06 露光装置及び基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/310,036 Continuation US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Publications (2)

Publication Number Publication Date
WO2002084720A2 true WO2002084720A2 (fr) 2002-10-24
WO2002084720A3 WO2002084720A3 (fr) 2007-10-25

Family

ID=18960494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003318 WO2002084720A2 (fr) 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif

Country Status (6)

Country Link
US (1) US6853443B2 (ja)
JP (1) JP2002305140A (ja)
KR (1) KR20030011296A (ja)
CN (1) CN1636268A (ja)
AU (1) AU2002246319A1 (ja)
WO (1) WO2002084720A2 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7812925B2 (en) 2003-06-19 2010-10-12 Nikon Corporation Exposure apparatus, and device manufacturing method
US8035795B2 (en) 2003-04-11 2011-10-11 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the protection lens during wafer exchange in an immersion lithography machine
US8045136B2 (en) 2004-02-02 2011-10-25 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004286099A (ja) * 2003-03-20 2004-10-14 Yaskawa Electric Corp 制振装置
AU2003219097A1 (en) 2003-03-26 2004-10-18 Carl Zeiss Smt Ag Device for the low-deformation replaceable mounting of an optical element
JPWO2004107416A1 (ja) 2003-05-27 2006-07-20 株式会社ニコン 露光装置及びデバイスの製造方法
CN100576003C (zh) * 2003-06-06 2009-12-30 株式会社尼康 光学元件保持装置、镜筒、曝光装置及设备的制造方法
ATE489724T1 (de) 2003-07-09 2010-12-15 Nikon Corp Belichtungsvorrichtung und verfahren zur bauelementherstellung
KR101209539B1 (ko) 2003-07-09 2012-12-07 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
CN102043350B (zh) * 2003-07-28 2014-01-29 株式会社尼康 曝光装置、器件制造方法、及曝光装置的控制方法
WO2005054953A2 (en) * 2003-11-24 2005-06-16 Carl-Zeiss Smt Ag Holding device for an optical element in an objective
WO2005064382A1 (ja) * 2003-12-25 2005-07-14 Nikon Corporation 光学素子の保持装置、鏡筒、露光装置、及びデバイスの製造方法
JP4710308B2 (ja) * 2004-10-29 2011-06-29 株式会社ニコン レチクル搬送装置、露光装置、及びレチクルの搬送方法
US7869000B2 (en) * 2004-11-02 2011-01-11 Nikon Corporation Stage assembly with lightweight fine stage and low transmissibility
US7417714B2 (en) * 2004-11-02 2008-08-26 Nikon Corporation Stage assembly with measurement system initialization, vibration compensation, low transmissibility, and lightweight fine stage
KR20070085764A (ko) * 2004-11-04 2007-08-27 가부시키가이샤 니콘 미동 스테이지 z 지지 장치
KR101427056B1 (ko) * 2005-01-31 2014-08-05 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
US20070030462A1 (en) * 2005-08-03 2007-02-08 Nikon Corporation Low spring constant, pneumatic suspension with vacuum chamber, air bearing, active force compensation, and sectioned vacuum chambers
US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
JP2007294594A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置及び露光方法
US7936443B2 (en) * 2006-05-09 2011-05-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080073596A1 (en) * 2006-08-24 2008-03-27 Asml Netherlands B.V. Lithographic apparatus and method
TWI653511B (zh) * 2006-08-31 2019-03-11 日商尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
US8908144B2 (en) * 2006-09-27 2014-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100779372B1 (ko) * 2006-12-06 2007-11-23 동부일렉트로닉스 주식회사 진동측정수단이 구비된 노광장치 및 진동저감방법
EP2109133A4 (en) * 2006-12-27 2011-12-28 Nikon Corp PLATTER APPARATUS, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING THE APPARATUS
JP5013906B2 (ja) * 2007-03-05 2012-08-29 キヤノン株式会社 光学素子保持装置
KR100866447B1 (ko) * 2007-06-19 2008-10-31 주식회사 동부하이텍 반도체 장치 제조용 노광 장치
JP5188135B2 (ja) * 2007-10-05 2013-04-24 キヤノン株式会社 露光装置及びデバイス製造方法
NL1036167A1 (nl) 2007-11-20 2009-05-25 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5097166B2 (ja) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及び装置の動作方法
NL1036957A1 (nl) * 2008-06-13 2009-12-15 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5126076B2 (ja) * 2009-01-08 2013-01-23 富士通株式会社 位置測定装置、成膜方法並びに成膜プログラム及び成膜装置
JP5534910B2 (ja) * 2009-04-23 2014-07-02 ギガフォトン株式会社 極端紫外光源装置
DE102009026187A1 (de) * 2009-07-16 2011-01-27 Hseb Dresden Gmbh Inspektionssystem
EP2454031A4 (en) * 2009-07-17 2014-08-20 Diversitech Equipment And Sales 1984 Ltd EXTRACTOR SYSTEM WITH AUTOMATIC DUSTER POSITIONING
CN105185697B (zh) * 2009-12-18 2019-02-15 株式会社尼康 基板处理装置及其控制方法、控制电路与维护方法
EP2447777B1 (en) * 2010-10-27 2019-08-07 ASML Netherlands BV Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method
CN102955368B (zh) * 2011-08-22 2015-09-30 上海微电子装备有限公司 一种步进光刻设备及光刻曝光方法
TWI463593B (zh) * 2012-01-18 2014-12-01 Himax Tech Ltd 對位系統
US9242313B2 (en) 2012-07-30 2016-01-26 General Electric Company Welding furnace and viewport assembly
JP5398040B1 (ja) * 2012-08-03 2014-01-29 Necアクセステクニカ株式会社 画像読取装置および集光部材
CN104813462B (zh) * 2012-11-30 2017-04-26 应用材料公司 振动控制的基板传送机械手、系统及方法
US9368378B2 (en) * 2013-12-31 2016-06-14 Sophia Wen Semiconductor wafer cleaning system
US9176070B2 (en) * 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
CN110941151A (zh) 2014-06-16 2020-03-31 Asml荷兰有限公司 光刻设备、转移衬底的方法和器件制造方法
WO2016139012A1 (en) 2015-03-03 2016-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN107533956A (zh) * 2015-04-17 2018-01-02 株式会社尼康 曝光系统
JP7360308B2 (ja) * 2019-11-25 2023-10-12 キヤノン株式会社 露光装置、露光方法、および物品製造方法
CN111427148B (zh) * 2020-04-01 2022-02-22 北京航空航天大学 一种麦克斯韦力驱动的快速偏摆镜
CN117250832B (zh) * 2023-11-15 2024-02-23 福建安芯半导体科技有限公司 一种精密定位平台及光刻机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2000206279A (ja) * 1999-01-11 2000-07-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575615B2 (ja) * 1995-05-30 2004-10-13 アーエスエム リソグラフィ ベスローテン フェンノートシャップ 三次元的に位置決め可能なマスクホルダを有するリソグラフ装置
TW318255B (ja) * 1995-05-30 1997-10-21 Philips Electronics Nv
JPH09297018A (ja) * 1996-05-07 1997-11-18 Nikon Corp 位置検出装置
CN1244021C (zh) * 1996-11-28 2006-03-01 株式会社尼康 光刻装置和曝光方法
JPH11315883A (ja) * 1998-04-30 1999-11-16 Canon Inc 除振装置、露光装置およびデバイス製造方法
US6529260B2 (en) * 2001-05-03 2003-03-04 Nikon Corporation Lifting support assembly for an exposure apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2000206279A (ja) * 1999-01-11 2000-07-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Cited By (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9164393B2 (en) 2003-04-09 2015-10-20 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in four areas
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9329493B2 (en) 2003-04-11 2016-05-03 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8879047B2 (en) 2003-04-11 2014-11-04 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens using a pad member or second stage during wafer exchange in an immersion lithography machine
US8351019B2 (en) 2003-04-11 2013-01-08 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8610875B2 (en) 2003-04-11 2013-12-17 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8269944B2 (en) 2003-04-11 2012-09-18 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8035795B2 (en) 2003-04-11 2011-10-11 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the protection lens during wafer exchange in an immersion lithography machine
US9081298B2 (en) 2003-04-11 2015-07-14 Nikon Corporation Apparatus for maintaining immersion fluid in the gap under the projection lens during wafer exchange using a co-planar member in an immersion lithography machine
US9500960B2 (en) 2003-04-11 2016-11-22 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8848168B2 (en) 2003-04-11 2014-09-30 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8848166B2 (en) 2003-04-11 2014-09-30 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8488100B2 (en) 2003-04-11 2013-07-16 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US9946163B2 (en) 2003-04-11 2018-04-17 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8514367B2 (en) 2003-04-11 2013-08-20 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US8634057B2 (en) 2003-04-11 2014-01-21 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US9551943B2 (en) 2003-06-19 2017-01-24 Nikon Corporation Exposure apparatus and device manufacturing method
US8830445B2 (en) 2003-06-19 2014-09-09 Nikon Corporation Exposure apparatus, and device manufacturing method
US8436979B2 (en) 2003-06-19 2013-05-07 Nikon Corporation Exposure apparatus, and device manufacturing method
US10191388B2 (en) 2003-06-19 2019-01-29 Nikon Corporation Exposure apparatus, and device manufacturing method
US8018575B2 (en) 2003-06-19 2011-09-13 Nikon Corporation Exposure apparatus, and device manufacturing method
US8436978B2 (en) 2003-06-19 2013-05-07 Nikon Corporation Exposure apparatus, and device manufacturing method
US8692976B2 (en) 2003-06-19 2014-04-08 Nikon Corporation Exposure apparatus, and device manufacturing method
US8705001B2 (en) 2003-06-19 2014-04-22 Nikon Corporation Exposure apparatus, and device manufacturing method
US8027027B2 (en) 2003-06-19 2011-09-27 Nikon Corporation Exposure apparatus, and device manufacturing method
US9810995B2 (en) 2003-06-19 2017-11-07 Nikon Corporation Exposure apparatus and device manufacturing method
US8717537B2 (en) 2003-06-19 2014-05-06 Nikon Corporation Exposure apparatus, and device manufacturing method
US8724085B2 (en) 2003-06-19 2014-05-13 Nikon Corporation Exposure apparatus, and device manufacturing method
US9025129B2 (en) 2003-06-19 2015-05-05 Nikon Corporation Exposure apparatus, and device manufacturing method
US7812925B2 (en) 2003-06-19 2010-10-12 Nikon Corporation Exposure apparatus, and device manufacturing method
US8767177B2 (en) 2003-06-19 2014-07-01 Nikon Corporation Exposure apparatus, and device manufacturing method
US9019473B2 (en) 2003-06-19 2015-04-28 Nikon Corporation Exposure apparatus and device manufacturing method
US8319941B2 (en) 2003-06-19 2012-11-27 Nikon Corporation Exposure apparatus, and device manufacturing method
US9001307B2 (en) 2003-06-19 2015-04-07 Nikon Corporation Exposure apparatus and device manufacturing method
US9274437B2 (en) 2003-06-19 2016-03-01 Nikon Corporation Exposure apparatus and device manufacturing method
US9423697B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9244359B2 (en) 2003-10-28 2016-01-26 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9146476B2 (en) 2003-10-28 2015-09-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US9684248B2 (en) 2004-02-02 2017-06-20 Nikon Corporation Lithographic apparatus having substrate table and sensor table to measure a patterned beam
US8705002B2 (en) 2004-02-02 2014-04-22 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US8547528B2 (en) 2004-02-02 2013-10-01 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US10139737B2 (en) 2004-02-02 2018-11-27 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US10007196B2 (en) 2004-02-02 2018-06-26 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US8711328B2 (en) 2004-02-02 2014-04-29 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US8724079B2 (en) 2004-02-02 2014-05-13 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US8553203B2 (en) 2004-02-02 2013-10-08 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US8045136B2 (en) 2004-02-02 2011-10-25 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US9665016B2 (en) 2004-02-02 2017-05-30 Nikon Corporation Lithographic apparatus and method having substrate table and sensor table to hold immersion liquid
US9632431B2 (en) 2004-02-02 2017-04-25 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US8736808B2 (en) 2004-02-02 2014-05-27 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9423694B2 (en) 2004-02-06 2016-08-23 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9429848B2 (en) 2004-02-06 2016-08-30 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9360763B2 (en) 2005-05-12 2016-06-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9310696B2 (en) 2005-05-12 2016-04-12 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9429851B2 (en) 2005-05-12 2016-08-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9366970B2 (en) 2007-09-14 2016-06-14 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9057963B2 (en) 2007-09-14 2015-06-16 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8508717B2 (en) 2007-10-16 2013-08-13 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9057877B2 (en) 2007-10-24 2015-06-16 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8456624B2 (en) 2008-05-28 2013-06-04 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method

Also Published As

Publication number Publication date
AU2002246319A8 (en) 2008-01-03
WO2002084720A3 (fr) 2007-10-25
KR20030011296A (ko) 2003-02-07
JP2002305140A (ja) 2002-10-18
AU2002246319A1 (en) 2002-10-28
CN1636268A (zh) 2005-07-06
US6853443B2 (en) 2005-02-08
US20030117596A1 (en) 2003-06-26

Similar Documents

Publication Publication Date Title
WO2002084720A2 (fr) Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif
KR100375266B1 (ko) 동기위치제어장치 및 방법
US5508518A (en) Lithography tool with vibration isolation
EP1237044A3 (en) Lithographic tool with dual isolation system and method for configuring the same
WO2003107396A3 (en) SUBSTRATE PROCESSING APPARATUS AND RELATED SYSTEMS AND METHODS
CA2358529A1 (en) Method for constructing an optoelectronic assembly
WO2005010611A3 (en) Wafer table for immersion lithography
WO2003028048A3 (en) Low-force electrochemical mechanical processing method and apparatus
SG152291A1 (en) Stage drive method and stage unit, exposure apparatus, and device manufacturing method
WO2004027816A3 (en) A method and apparatus for the compensation of edge ring wear in a plasma processing chamber
TW200605195A (en) Production method of compound semiconductor device wafer
SG143963A1 (en) Recipe cascading in a wafer processing system
CA2534463A1 (en) Dynamic program module loading system and method
WO2004108617A3 (en) Methods of finishing quartz glass surfaces and components made by the methods
HK1042376A1 (en) An optoelectronic assembly
WO2004068538A3 (en) Object-moving method, object-moving apparatus and production process using the method
EP1604827A3 (en) A method of manufacturing a nozzle plate
WO2004027642A3 (fr) Procede et systeme de traitement d'une representation d'un champ acoustique
MY161815A (en) Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
WO2003038888A3 (en) Method and apparatus for cascade control using integrated metrology
EP1492208A3 (en) Semiconductor laser module and method of assembling the same
CA2383949A1 (en) An optoelectronic assembly and method for fabricating the same
WO2002058116A3 (en) Integrated system for processing semiconductor wafers
EP1586923A3 (en) Method of manufacturing an optical component and optical system using the same
WO2004038870A3 (en) Selectable area laser assisted processing of substrates

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 1020027013491

Country of ref document: KR

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 028010620

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 10310036

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1020027013491

Country of ref document: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase