WO2002082540A1 - Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe - Google Patents

Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe Download PDF

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Publication number
WO2002082540A1
WO2002082540A1 PCT/JP2001/002755 JP0102755W WO02082540A1 WO 2002082540 A1 WO2002082540 A1 WO 2002082540A1 JP 0102755 W JP0102755 W JP 0102755W WO 02082540 A1 WO02082540 A1 WO 02082540A1
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WO
WIPO (PCT)
Prior art keywords
chip
semiconductor
functional
manufacture
functional chip
Prior art date
Application number
PCT/JP2001/002755
Other languages
English (en)
French (fr)
Inventor
Yoshiharu Kato
Satoru Kawamoto
Fumihiko Taniguchi
Tetsuya Hiraoka
Akira Takashima
Original Assignee
Fujitsu Limited
Fujitsu Vlsi Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited, Fujitsu Vlsi Limited filed Critical Fujitsu Limited
Priority to PCT/JP2001/002755 priority Critical patent/WO2002082540A1/ja
Priority to JP2002536861A priority patent/JP4091838B2/ja
Priority to TW090108763A priority patent/TW488001B/zh
Priority to US10/058,877 priority patent/US6972487B2/en
Publication of WO2002082540A1 publication Critical patent/WO2002082540A1/ja
Priority to US11/080,414 priority patent/US20050161794A1/en
Priority to US11/448,863 priority patent/US20060226529A1/en

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  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
PCT/JP2001/002755 2001-03-30 2001-03-30 Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe WO2002082540A1 (fr)

Priority Applications (6)

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PCT/JP2001/002755 WO2002082540A1 (fr) 2001-03-30 2001-03-30 Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe
JP2002536861A JP4091838B2 (ja) 2001-03-30 2001-03-30 半導体装置
TW090108763A TW488001B (en) 2001-03-30 2001-04-12 Semiconductor device, manufacturing method thereof, and semiconductor substrate
US10/058,877 US6972487B2 (en) 2001-03-30 2002-01-25 Multi chip package structure having a plurality of semiconductor chips mounted in the same package
US11/080,414 US20050161794A1 (en) 2001-03-30 2005-03-16 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
US11/448,863 US20060226529A1 (en) 2001-03-30 2006-06-08 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

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PCT/JP2001/002755 WO2002082540A1 (fr) 2001-03-30 2001-03-30 Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe

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