WO2002080271A3 - Fluxless flip chip interconnection - Google Patents

Fluxless flip chip interconnection Download PDF

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Publication number
WO2002080271A3
WO2002080271A3 PCT/US2002/005087 US0205087W WO02080271A3 WO 2002080271 A3 WO2002080271 A3 WO 2002080271A3 US 0205087 W US0205087 W US 0205087W WO 02080271 A3 WO02080271 A3 WO 02080271A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal
chip
bumps
substrate
flow temperature
Prior art date
Application number
PCT/US2002/005087
Other languages
French (fr)
Other versions
WO2002080271A2 (en
Inventor
Jiro Kubota
Kenji Takahashi
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to JP2002578572A priority Critical patent/JP2005500672A/en
Priority to EP02713638A priority patent/EP1386356B1/en
Priority to AU2002245476A priority patent/AU2002245476A1/en
Priority to DE60219779T priority patent/DE60219779T2/en
Priority to KR1020037012629A priority patent/KR100555354B1/en
Publication of WO2002080271A2 publication Critical patent/WO2002080271A2/en
Publication of WO2002080271A3 publication Critical patent/WO2002080271A3/en
Priority to HK04104564A priority patent/HK1061741A1/en

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
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    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract

A flip chip method of joining a chip and a substrate is described. A thermocompression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps (305) on the substrate against metal bumps (320) on the chip. The chip is rapidly heated from its non-native side by a pulse heater (415) in the head (410) of the bonder until the re-flow temperature of the solder bumps (305) is reached. Proximate with reaching the re-flow temperature at the solder bumps (305), the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions (320) and joining. Metal caps (330) comprised of a noble metal such as palladium is applied to the surface of the metal bumps (320) to prevent the metal bumps (320) (which generally comprise a highly-conductive and highly-reactive metal such as copper) from oxidizing in the elevated temperatures just prior to and during the re-flow operation.
PCT/US2002/005087 2001-03-28 2002-02-21 Fluxless flip chip interconnection WO2002080271A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002578572A JP2005500672A (en) 2001-03-28 2002-02-21 Flip-free flip chip interconnect
EP02713638A EP1386356B1 (en) 2001-03-28 2002-02-21 Fluxless flip chip interconnection
AU2002245476A AU2002245476A1 (en) 2001-03-28 2002-02-21 Fluxless flip chip interconnection
DE60219779T DE60219779T2 (en) 2001-03-28 2002-02-21 FLUX-FREE FLIP CHIP CONNECTION
KR1020037012629A KR100555354B1 (en) 2001-03-28 2002-02-21 A method of coupling singulated chip to a substrate package, fluxless flip chip interconnection and a method of forming contact points on chip
HK04104564A HK1061741A1 (en) 2001-03-28 2004-06-25 Fluxless flip chip interconnection

Applications Claiming Priority (2)

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US09/821,331 2001-03-28
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