WO2002079542A3 - Improved adhesion of polymeric materials to metal surfaces - Google Patents

Improved adhesion of polymeric materials to metal surfaces Download PDF

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Publication number
WO2002079542A3
WO2002079542A3 PCT/IB2001/002901 IB0102901W WO02079542A3 WO 2002079542 A3 WO2002079542 A3 WO 2002079542A3 IB 0102901 W IB0102901 W IB 0102901W WO 02079542 A3 WO02079542 A3 WO 02079542A3
Authority
WO
WIPO (PCT)
Prior art keywords
immersion
metal
polymeric materials
polymeric
tin
Prior art date
Application number
PCT/IB2001/002901
Other languages
French (fr)
Other versions
WO2002079542A2 (en
WO2002079542A8 (en
WO2002079542A9 (en
Inventor
Dickson L Whitney Jr
George S Bokisa
Craig V Bishop
Americus C Vitale
John R Kochilla
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CA002416019A priority Critical patent/CA2416019A1/en
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to EP01273512A priority patent/EP1310142B1/en
Priority to BR0112966-0A priority patent/BR0112966A/en
Priority to AU2001297732A priority patent/AU2001297732A1/en
Priority to MXPA03000825A priority patent/MXPA03000825A/en
Priority to KR1020037001211A priority patent/KR100699665B1/en
Priority to JP2002577943A priority patent/JP4668518B2/en
Priority to DE60128364T priority patent/DE60128364T2/en
Publication of WO2002079542A2 publication Critical patent/WO2002079542A2/en
Publication of WO2002079542A3 publication Critical patent/WO2002079542A3/en
Publication of WO2002079542A9 publication Critical patent/WO2002079542A9/en
Priority to HK03103910A priority patent/HK1051768A1/en
Publication of WO2002079542A8 publication Critical patent/WO2002079542A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The present invention relates to a process for treating a metal substrate to improve adhesion of polymeric materials thereto, comprising the steps of intergranular etching a surface of the metal substrate; and applying an immersion plated metal to the intergranular etched surface by immersing the surface in an immersion plating composition comprising one or more plating metals selected from tin, silver, bismuth, copper, nickel, gallium and germanium. In one embodiment, the immersion plated metal is tin. In one embodiment, the process further comprises a step of adhering the immersion metal plated surface to a surface of a polymeric non-conductive material. In another embodiment, the polymeric nonconductive material is one or more of PTFE, an epoxy resin , a polyimide, a polycyanate ester, a butadiene terephthalate resin, or mixtures thereof. In one embodiment, the process further comprises a step of applying a silane over the immersion plated metal from an aqueous solution of a silane.
PCT/IB2001/002901 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces WO2002079542A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020037001211A KR100699665B1 (en) 2000-07-27 2001-07-23 Improved Adhesion of Polymeric Materials to Metal Surfaces
EP01273512A EP1310142B1 (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces
BR0112966-0A BR0112966A (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces
AU2001297732A AU2001297732A1 (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces
MXPA03000825A MXPA03000825A (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces.
CA002416019A CA2416019A1 (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces
JP2002577943A JP4668518B2 (en) 2000-07-27 2001-07-23 Improvement of adhesion of polymer material to metal surface
DE60128364T DE60128364T2 (en) 2000-07-27 2001-07-23 IMPROVED LIABILITY OF POLYMER MATERIALS TO METAL SURFACES
HK03103910A HK1051768A1 (en) 2000-07-27 2003-06-02 Improved adhesion of polymeric materials to metal surfaces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/628,036 US6506314B1 (en) 2000-07-27 2000-07-27 Adhesion of polymeric materials to metal surfaces
US09/628,036 2000-07-27

Publications (4)

Publication Number Publication Date
WO2002079542A2 WO2002079542A2 (en) 2002-10-10
WO2002079542A3 true WO2002079542A3 (en) 2003-02-06
WO2002079542A9 WO2002079542A9 (en) 2003-03-20
WO2002079542A8 WO2002079542A8 (en) 2004-03-04

Family

ID=24517160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/002901 WO2002079542A2 (en) 2000-07-27 2001-07-23 Improved adhesion of polymeric materials to metal surfaces

Country Status (16)

Country Link
US (1) US6506314B1 (en)
EP (1) EP1310142B1 (en)
JP (1) JP4668518B2 (en)
KR (1) KR100699665B1 (en)
CN (2) CN101039553B (en)
AT (1) ATE362307T1 (en)
AU (1) AU2001297732A1 (en)
BR (1) BR0112966A (en)
CA (1) CA2416019A1 (en)
DE (1) DE60128364T2 (en)
ES (1) ES2283378T3 (en)
HK (1) HK1051768A1 (en)
MX (1) MXPA03000825A (en)
MY (1) MY129225A (en)
TW (1) TWI227751B (en)
WO (1) WO2002079542A2 (en)

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EP1310142A2 (en) 2003-05-14
JP2004536220A (en) 2004-12-02
CN101039553A (en) 2007-09-19
WO2002079542A2 (en) 2002-10-10
CN1322797C (en) 2007-06-20
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US6506314B1 (en) 2003-01-14
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BR0112966A (en) 2005-10-18
ATE362307T1 (en) 2007-06-15
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WO2002079542A8 (en) 2004-03-04
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WO2002079542A9 (en) 2003-03-20
CA2416019A1 (en) 2002-10-10
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HK1051768A1 (en) 2003-08-15
ES2283378T3 (en) 2007-11-01

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