WO2002071611A3 - Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array - Google Patents

Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array Download PDF

Info

Publication number
WO2002071611A3
WO2002071611A3 PCT/US2002/003512 US0203512W WO02071611A3 WO 2002071611 A3 WO2002071611 A3 WO 2002071611A3 US 0203512 W US0203512 W US 0203512W WO 02071611 A3 WO02071611 A3 WO 02071611A3
Authority
WO
WIPO (PCT)
Prior art keywords
logic circuit
gate array
clock
forming
nmos
Prior art date
Application number
PCT/US2002/003512
Other languages
French (fr)
Other versions
WO2002071611A2 (en
Inventor
Leonard Forbes
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to DE60239052T priority Critical patent/DE60239052D1/en
Priority to EP02704367A priority patent/EP1378060B1/en
Priority to JP2002570406A priority patent/JP4036096B2/en
Priority to AU2002238056A priority patent/AU2002238056A1/en
Priority to KR1020037010613A priority patent/KR100581010B1/en
Priority to AT02704367T priority patent/ATE497279T1/en
Publication of WO2002071611A2 publication Critical patent/WO2002071611A2/en
Publication of WO2002071611A3 publication Critical patent/WO2002071611A3/en

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/0944Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
    • H03K19/0948Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET using CMOS or complementary insulated gate field-effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823487MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/096Synchronous circuits, i.e. using clock signals
    • H03K19/0963Synchronous circuits, i.e. using clock signals using transistors of complementary type

Abstract

A monotonic dynamic-static pseudo-NMOS logic circuit comprises a dynamic logic circuit having a clock input and having an output configured to be pre-charged high when a low clock signal is provided to the clock input; and a static logic circuit having a clock bar input and having an output configured to be precharged low when a high value of the complement of the clock signal is provided to the clock bar input. A logic gate array comprises a plurality of vertical ultrathin transistors coupled together.
PCT/US2002/003512 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array WO2002071611A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE60239052T DE60239052D1 (en) 2001-02-15 2002-02-07 MONOTONE DYNAMIC / STATIC PSEUDO-NMOS LOGIC SWITCHING AND METHOD FOR GENERATING A LOGICAL GATE FIELD
EP02704367A EP1378060B1 (en) 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array
JP2002570406A JP4036096B2 (en) 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-NMOS logic circuit and logic gate array forming method
AU2002238056A AU2002238056A1 (en) 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array
KR1020037010613A KR100581010B1 (en) 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-NMOS logic circuit and method of forming a logic gate array
AT02704367T ATE497279T1 (en) 2001-02-15 2002-02-07 MONOTONE DYNAMIC/STATIC PSEUDO-NMOS LOGIC CIRCUIT AND METHOD FOR GENERATING A LOGICAL GATE FIELD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/788,109 US6649476B2 (en) 2001-02-15 2001-02-15 Monotonic dynamic-static pseudo-NMOS logic circuit and method of forming a logic gate array
US09/788,109 2001-02-15

Publications (2)

Publication Number Publication Date
WO2002071611A2 WO2002071611A2 (en) 2002-09-12
WO2002071611A3 true WO2002071611A3 (en) 2003-10-30

Family

ID=25143469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/003512 WO2002071611A2 (en) 2001-02-15 2002-02-07 Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array

Country Status (9)

Country Link
US (3) US6649476B2 (en)
EP (1) EP1378060B1 (en)
JP (1) JP4036096B2 (en)
KR (1) KR100581010B1 (en)
CN (2) CN1738047B (en)
AT (1) ATE497279T1 (en)
AU (1) AU2002238056A1 (en)
DE (1) DE60239052D1 (en)
WO (1) WO2002071611A2 (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6898362B2 (en) * 2002-01-17 2005-05-24 Micron Technology Inc. Three-dimensional photonic crystal waveguide structure and method
US6972599B2 (en) * 2002-08-27 2005-12-06 Micron Technology Inc. Pseudo CMOS dynamic logic with delayed clocks
US7198974B2 (en) * 2003-03-05 2007-04-03 Micron Technology, Inc. Micro-mechanically strained semiconductor film
US6917221B2 (en) * 2003-04-28 2005-07-12 International Business Machines Corporation Method and apparatus for enhancing the soft error rate immunity of dynamic logic circuits
US7041575B2 (en) * 2003-04-29 2006-05-09 Micron Technology, Inc. Localized strained semiconductor on insulator
US7115480B2 (en) * 2003-05-07 2006-10-03 Micron Technology, Inc. Micromechanical strained semiconductor by wafer bonding
US6987037B2 (en) * 2003-05-07 2006-01-17 Micron Technology, Inc. Strained Si/SiGe structures by ion implantation
US7501329B2 (en) 2003-05-21 2009-03-10 Micron Technology, Inc. Wafer gettering using relaxed silicon germanium epitaxial proximity layers
US7662701B2 (en) 2003-05-21 2010-02-16 Micron Technology, Inc. Gettering of silicon on insulator using relaxed silicon germanium epitaxial proximity layers
US7439158B2 (en) 2003-07-21 2008-10-21 Micron Technology, Inc. Strained semiconductor by full wafer bonding
US6929984B2 (en) 2003-07-21 2005-08-16 Micron Technology Inc. Gettering using voids formed by surface transformation
US6969656B2 (en) * 2003-12-05 2005-11-29 Freescale Semiconductor, Inc. Method and circuit for multiplying signals with a transistor having more than one independent gate structure
US7142478B2 (en) * 2004-03-19 2006-11-28 Infineon Technologies Ag Clock stop detector
US7084667B2 (en) * 2004-07-13 2006-08-01 International Business Machines Corporation Low leakage monotonic CMOS logic
US7518182B2 (en) 2004-07-20 2009-04-14 Micron Technology, Inc. DRAM layout with vertical FETs and method of formation
US7247570B2 (en) * 2004-08-19 2007-07-24 Micron Technology, Inc. Silicon pillars for vertical transistors
US7285812B2 (en) * 2004-09-02 2007-10-23 Micron Technology, Inc. Vertical transistors
US7199419B2 (en) * 2004-12-13 2007-04-03 Micron Technology, Inc. Memory structure for reduced floating body effect
US7229895B2 (en) * 2005-01-14 2007-06-12 Micron Technology, Inc Memory array buried digit line
US7326611B2 (en) * 2005-02-03 2008-02-05 Micron Technology, Inc. DRAM arrays, vertical transistor structures and methods of forming transistor structures and DRAM arrays
US20060176757A1 (en) * 2005-02-09 2006-08-10 International Business Machines Corporation High performance CMOS NOR predecode circuit
US7371627B1 (en) 2005-05-13 2008-05-13 Micron Technology, Inc. Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
US7120046B1 (en) 2005-05-13 2006-10-10 Micron Technology, Inc. Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines
US7888721B2 (en) * 2005-07-06 2011-02-15 Micron Technology, Inc. Surround gate access transistors with grown ultra-thin bodies
US7768051B2 (en) 2005-07-25 2010-08-03 Micron Technology, Inc. DRAM including a vertical surround gate transistor
US7439576B2 (en) * 2005-08-29 2008-10-21 Micron Technology, Inc. Ultra-thin body vertical tunneling transistor
US7696567B2 (en) 2005-08-31 2010-04-13 Micron Technology, Inc Semiconductor memory device
US7312626B2 (en) * 2005-08-31 2007-12-25 Micron Technology, Inc. CMOS circuits with reduced crowbar current
US7446372B2 (en) * 2005-09-01 2008-11-04 Micron Technology, Inc. DRAM tunneling access transistor
US7687342B2 (en) 2005-09-01 2010-03-30 Micron Technology, Inc. Method of manufacturing a memory device
US7416943B2 (en) 2005-09-01 2008-08-26 Micron Technology, Inc. Peripheral gate stacks and recessed array gates
US7557032B2 (en) 2005-09-01 2009-07-07 Micron Technology, Inc. Silicided recessed silicon
US7544584B2 (en) * 2006-02-16 2009-06-09 Micron Technology, Inc. Localized compressive strained semiconductor
US7425491B2 (en) 2006-04-04 2008-09-16 Micron Technology, Inc. Nanowire transistor with surrounding gate
US7491995B2 (en) 2006-04-04 2009-02-17 Micron Technology, Inc. DRAM with nanofin transistors
US20070228491A1 (en) * 2006-04-04 2007-10-04 Micron Technology, Inc. Tunneling transistor with sublithographic channel
US8734583B2 (en) * 2006-04-04 2014-05-27 Micron Technology, Inc. Grown nanofin transistors
US8354311B2 (en) * 2006-04-04 2013-01-15 Micron Technology, Inc. Method for forming nanofin transistors
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
US7724036B2 (en) * 2007-09-06 2010-05-25 Ashutosh Das Clock guided logic with reduced switching
US8347165B2 (en) 2007-12-17 2013-01-01 Micron Technology, Inc. Self-timed error correcting code evaluation system and method
KR101468897B1 (en) * 2008-03-11 2014-12-04 삼성전자주식회사 Domino logic circuit and pipeline domino logic circuit
US8134854B2 (en) * 2008-11-25 2012-03-13 Mediatek Inc. Efuse device
WO2013018061A1 (en) * 2011-08-03 2013-02-07 Ben Gurion University Of The Negev Research And Development Authority Device and method for dual-mode logic
US9401363B2 (en) 2011-08-23 2016-07-26 Micron Technology, Inc. Vertical transistor devices, memory arrays, and methods of forming vertical transistor devices
US8806316B2 (en) 2012-01-11 2014-08-12 Micron Technology, Inc. Circuits, integrated circuits, and methods for interleaved parity computation
US9859286B2 (en) 2014-12-23 2018-01-02 International Business Machines Corporation Low-drive current FinFET structure for improving circuit density of ratioed logic in SRAM devices
US10505540B2 (en) 2017-03-08 2019-12-10 Tacho Holdings, Llc Unipolar logic circuits
US10079602B1 (en) 2017-10-10 2018-09-18 Tacho Holdings, Llc Unipolar latched logic circuits
US11750191B2 (en) 2017-10-10 2023-09-05 Tacho Holdings, Llc Three-dimensional logic circuit
US11228315B2 (en) 2017-10-10 2022-01-18 Tacho Holdings, Llc Three-dimensional logic circuit
KR102105945B1 (en) * 2018-12-10 2020-04-29 포항공과대학교 산학협력단 Pseudo complementary logic network

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082773A2 (en) * 1981-12-17 1983-06-29 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Apparatus and method for CMOS multistaged dynamic logic circuit
EP0700093A1 (en) * 1994-08-25 1996-03-06 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
US5545586A (en) * 1990-11-27 1996-08-13 Nec Corporation Method of making a transistor having easily controllable impurity profile
WO1997049134A2 (en) * 1996-06-21 1997-12-24 Micron Technology, Inc. Soi-transistor circuitry employing soi-transistors and method of manufacture thereof

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569032A (en) 1983-12-23 1986-02-04 At&T Bell Laboratories Dynamic CMOS logic circuits for implementing multiple AND-functions
US4797580A (en) 1987-10-29 1989-01-10 Northern Telecom Limited Current-mirror-biased pre-charged logic circuit
EP0457150A3 (en) * 1990-05-14 1992-06-17 Lsi Logic Corporation Bicmos compacted logic array
US5335106A (en) * 1992-10-30 1994-08-02 Mpb Technologies Inc. Optically-based frequency synthesizer for generating an electric output signal at a preselected frequency that can be changed over a wide band of frequencies for communication purpose
WO1994021088A2 (en) * 1993-03-02 1994-09-15 British Telecommunications Public Limited Company Optically encoded signals
US5440243A (en) 1993-09-21 1995-08-08 Apple Computer, Inc. Apparatus and method for allowing a dynamic logic gate to operation statically using subthreshold conduction precharging
DE69534362T2 (en) * 1994-08-15 2006-05-24 Nippon Telegraph And Telephone Corp. All-in-one multi-channel TDM-WDM converter and all-optical multi-channel time demultiplexer
US5525916A (en) 1995-04-10 1996-06-11 The University Of Waterloo All-N-logic high-speed single-phase dynamic CMOS logic
US5867036A (en) 1996-05-29 1999-02-02 Lsi Logic Corporation Domino scan architecture and domino scan flip-flop for the testing of domino and hybrid CMOS circuits
US5798938A (en) 1996-07-02 1998-08-25 Hewlett-Packard Co. System and method for verification of a precharge critical path for a system of cascaded dynamic logic gates
US5796282A (en) 1996-08-12 1998-08-18 Intel Corporation Latching mechanism for pulsed domino logic with inherent race margin and time borrowing
US5828234A (en) 1996-08-27 1998-10-27 Intel Corporation Pulsed reset single phase domino logic
US5691230A (en) 1996-09-04 1997-11-25 Micron Technology, Inc. Technique for producing small islands of silicon on insulator
US5862373A (en) * 1996-09-06 1999-01-19 Intel Corporation Pad cells for a 2/N mode clocking scheme
US5852373A (en) 1996-09-30 1998-12-22 International Business Machines Corporation Static-dynamic logic circuit
US5929477A (en) * 1997-01-22 1999-07-27 International Business Machines Corporation Self-aligned diffused source vertical transistors with stack capacitors in a 4F-square memory cell array
TW344131B (en) 1997-06-03 1998-11-01 Nat Science Council A 1.5V bootstrapped all-N-logic true-single-phase CMOS dynamic logic circuit suitable for low supply voltage and high speed pipelined
US6072209A (en) 1997-07-08 2000-06-06 Micro Technology, Inc. Four F2 folded bit line DRAM cell structure having buried bit and word lines
US6150687A (en) 1997-07-08 2000-11-21 Micron Technology, Inc. Memory cell having a vertical transistor with buried source/drain and dual gates
US6255853B1 (en) * 1997-09-29 2001-07-03 Texas Instruments Incorporated Integrated circuit having dynamic logic with reduced standby leakage current
US6107835A (en) 1997-12-11 2000-08-22 Intrinsity, Inc. Method and apparatus for a logic circuit with constant power consumption
US5982963A (en) * 1997-12-15 1999-11-09 University Of Southern California Tunable nonlinearly chirped grating
US5942917A (en) 1997-12-29 1999-08-24 Intel Corporation High speed ratioed CMOS logic structures for a pulsed input environment
US6297531B2 (en) * 1998-01-05 2001-10-02 International Business Machines Corporation High performance, low power vertical integrated CMOS devices
US5977579A (en) * 1998-12-03 1999-11-02 Micron Technology, Inc. Trench dram cell with vertical device and buried word lines
US6049106A (en) * 1999-01-14 2000-04-11 Micron Technology, Inc. Large grain single crystal vertical thin film polysilicon MOSFETs
US6275071B1 (en) * 1999-12-29 2001-08-14 Intel Corporation Domino logic circuit and method
US6252222B1 (en) * 2000-01-13 2001-06-26 Schlumberger Technologies, Inc. Differential pulsed laser beam probing of integrated circuits
JP3463988B2 (en) * 2000-03-28 2003-11-05 Necマイクロシステム株式会社 Intermediate potential circuit
US6406962B1 (en) * 2001-01-17 2002-06-18 International Business Machines Corporation Vertical trench-formed dual-gate FET device structure and method for creation
US6559491B2 (en) 2001-02-09 2003-05-06 Micron Technology, Inc. Folded bit line DRAM with ultra thin body transistors
US6448601B1 (en) 2001-02-09 2002-09-10 Micron Technology, Inc. Memory address and decode circuits with ultra thin body transistors
US6496034B2 (en) 2001-02-09 2002-12-17 Micron Technology, Inc. Programmable logic arrays with ultra thin body transistors
US6597203B2 (en) * 2001-03-14 2003-07-22 Micron Technology, Inc. CMOS gate array with vertical transistors
US6956406B2 (en) * 2001-07-02 2005-10-18 Intrinsity, Inc. Static storage element for dynamic logic
AU2001281094A1 (en) 2001-08-06 2003-02-24 Micron Technology, Inc. Interpolation error minimization for data reduction
US6650145B2 (en) 2002-04-04 2003-11-18 International Business Machines Corporation Circuits and systems for limited switch dynamic logic
US6664836B1 (en) * 2002-12-12 2003-12-16 International Business Machines Corporation Dynamic phase splitter circuit and method for low-noise and simultaneous production of true and complement dynamic logic signals

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082773A2 (en) * 1981-12-17 1983-06-29 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Apparatus and method for CMOS multistaged dynamic logic circuit
US5545586A (en) * 1990-11-27 1996-08-13 Nec Corporation Method of making a transistor having easily controllable impurity profile
EP0700093A1 (en) * 1994-08-25 1996-03-06 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
WO1997049134A2 (en) * 1996-06-21 1997-12-24 Micron Technology, Inc. Soi-transistor circuitry employing soi-transistors and method of manufacture thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
THORP T ET AL: "Monotonic static CMOS and dual VT technology", PROCEEDINGS 1999 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN. (ISLPED). SAN DIEGO, CA, AUG. 16 - 17, 1999, INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, NEW YORK, NY: ACM, US, 16 August 1999 (1999-08-16), pages 151 - 155, XP010355959, ISBN: 1-58113-133-X *

Also Published As

Publication number Publication date
US6649476B2 (en) 2003-11-18
JP2005505150A (en) 2005-02-17
US6801056B2 (en) 2004-10-05
KR100581010B1 (en) 2006-05-16
AU2002238056A1 (en) 2002-09-19
US20030049910A1 (en) 2003-03-13
CN1491483A (en) 2004-04-21
ATE497279T1 (en) 2011-02-15
CN100464502C (en) 2009-02-25
DE60239052D1 (en) 2011-03-10
CN1738047A (en) 2006-02-22
EP1378060B1 (en) 2011-01-26
US20020110032A1 (en) 2002-08-15
US6946879B2 (en) 2005-09-20
EP1378060A2 (en) 2004-01-07
CN1738047B (en) 2010-05-12
US20030153156A1 (en) 2003-08-14
WO2002071611A2 (en) 2002-09-12
JP4036096B2 (en) 2008-01-23
KR20040051575A (en) 2004-06-18

Similar Documents

Publication Publication Date Title
WO2002071611A3 (en) Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array
US4899066A (en) OR-type CMOS logic circuit with fast precharging
US5880608A (en) Pulsed domino latches
TW278152B (en) A design method of clock generating circuit and pll circuit and semi-conductor device combined with clock generating circuit
CA2338114C (en) Single rail domino logic for four-phase clocking scheme
DE69221109T2 (en) Digitally controlled CMOS delay gate
TW285771B (en) A complementary signal differential amplifier and a semiconductor memory device which have the complementary signal differential amplifier inside
GB2337168A (en) Method and apparatus for implementing an adiabatic logic family
EP0372273A3 (en) Pass gate multiplexer
IE813068L (en) Semiconductor buffer circuit
AU6346198A (en) An inverse toggle xor and xnor circuit
KR970013364A (en) High-Speed Synchronous Dynamic Random Access Memory
GR3006154T3 (en)
EP0270300A3 (en) Static pla or rom circuit with self-generated precharge
TW367653B (en) Division circuit of 4/5
JPS6467795A (en) Reading amplifier
KR960026760A (en) Pulse Signal Shaping Circuit
US5650735A (en) Low power, high performance latching interfaces for converting dynamic inputs into static outputs
EP0291963A3 (en) Fast c-mos adder
TW200506941A (en) Non-inverting domino register
US4496851A (en) Dynamic metal oxide semiconductor field effect transistor clocking circuit
EP0218451A3 (en) Schmitt circuit
US20050093578A1 (en) Output device for static random access memory
KR200296045Y1 (en) A ring oscillator
TW200518169A (en) Priority circuit

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002570406

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020037010613

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 028050738

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2002704367

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWP Wipo information: published in national office

Ref document number: 2002704367

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020037010613

Country of ref document: KR

WWR Wipo information: refused in national office

Ref document number: 1020037010613

Country of ref document: KR