WO2002068321A3 - Forming tool for forming a contoured microelectronic spring mold - Google Patents

Forming tool for forming a contoured microelectronic spring mold Download PDF

Info

Publication number
WO2002068321A3
WO2002068321A3 PCT/US2002/003882 US0203882W WO02068321A3 WO 2002068321 A3 WO2002068321 A3 WO 2002068321A3 US 0203882 W US0203882 W US 0203882W WO 02068321 A3 WO02068321 A3 WO 02068321A3
Authority
WO
WIPO (PCT)
Prior art keywords
forming
microelectronic spring
forming tool
methods
embossing
Prior art date
Application number
PCT/US2002/003882
Other languages
French (fr)
Other versions
WO2002068321A2 (en
Inventor
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Stuart W Wenzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Stuart W Wenzel filed Critical Formfactor Inc
Priority to AU2002243921A priority Critical patent/AU2002243921A1/en
Publication of WO2002068321A2 publication Critical patent/WO2002068321A2/en
Publication of WO2002068321A3 publication Critical patent/WO2002068321A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
PCT/US2002/003882 2001-02-27 2002-02-06 Forming tool for forming a contoured microelectronic spring mold WO2002068321A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002243921A AU2002243921A1 (en) 2001-02-27 2002-02-06 Forming tool for forming a contoured microelectronic spring mold

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/795,772 US6780001B2 (en) 1999-07-30 2001-02-27 Forming tool for forming a contoured microelectronic spring mold
US09/795,772 2001-02-27

Publications (2)

Publication Number Publication Date
WO2002068321A2 WO2002068321A2 (en) 2002-09-06
WO2002068321A3 true WO2002068321A3 (en) 2003-10-30

Family

ID=25166401

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/003882 WO2002068321A2 (en) 2001-02-27 2002-02-06 Forming tool for forming a contoured microelectronic spring mold

Country Status (4)

Country Link
US (3) US6780001B2 (en)
AU (1) AU2002243921A1 (en)
TW (1) TW515777B (en)
WO (1) WO2002068321A2 (en)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
EP2270592B1 (en) 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
DE10143173A1 (en) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafer probe has contact finger array with impedance matching network suitable for wide band
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
US7168160B2 (en) * 2001-12-21 2007-01-30 Formfactor, Inc. Method for mounting and heating a plurality of microelectronic components
US7179079B2 (en) * 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
FR2849016B1 (en) * 2002-12-18 2005-06-10 Commissariat Energie Atomique METHOD FOR MAKING A PLANE SUSPENDED MICRO-STRUCTURE USING A SACRIFICIAL LAYER OF POLYMERIC MATERIAL AND COMPONENT OBTAINED
WO2004078639A1 (en) * 2003-03-07 2004-09-16 Tosoh Corporation Minute flow path structure body and die
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2004363380A (en) * 2003-06-05 2004-12-24 Sanyo Electric Co Ltd Optical semiconductor device and its fabricating process
JP2007517231A (en) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド Active wafer probe
US20050255170A1 (en) * 2004-05-13 2005-11-17 Post Sarah S Large volume enema
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US20060266916A1 (en) * 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US7491049B2 (en) * 2005-09-30 2009-02-17 Hon Hai Precision Industry Co., Ltd. Apparatus for hot embossing lithography
US7388542B2 (en) * 2005-11-10 2008-06-17 Rcd Technology, Inc. Method for an element using two resist layers
JP4929753B2 (en) * 2006-02-22 2012-05-09 オムロン株式会社 Method for forming thin film structure, thin film structure, vibration sensor, pressure sensor, and acceleration sensor
GB2436163A (en) * 2006-03-10 2007-09-19 Seiko Epson Corp Device fabrication by ink-jet printing materials into bank structures, and embossing tool
JP4641321B2 (en) * 2006-03-27 2011-03-02 パイオニア株式会社 Mold for pattern transfer
JP5306989B2 (en) * 2006-04-03 2013-10-02 モレキュラー・インプリンツ・インコーポレーテッド Method for simultaneously patterning a substrate having a plurality of fields and alignment marks
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
TWI305930B (en) * 2006-06-19 2009-02-01 Touch Micro System Tech Method of fabricating suspended structure
US20080303187A1 (en) * 2006-12-29 2008-12-11 Molecular Imprints, Inc. Imprint Fluid Control
JP5274128B2 (en) * 2007-08-03 2013-08-28 キヤノン株式会社 Imprint method and substrate processing method
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7906274B2 (en) * 2007-11-21 2011-03-15 Molecular Imprints, Inc. Method of creating a template employing a lift-off process
FR2932791B1 (en) * 2008-06-23 2010-06-18 Commissariat Energie Atomique METHOD OF MAKING A STRUCTURE COMPRISING A MOVING ELEMENT USING A HETEROGENEOUS SACRIFICIAL LAYER
JP2010009729A (en) * 2008-06-30 2010-01-14 Toshiba Corp Imprint stamper, method of manufacturing imprint stamper, magnetic recording medium, method of manufacturing magnetic recording medium and magnetic disk apparatus
CN102171012B (en) * 2008-07-25 2014-10-01 汉高美国知识产权有限责任公司 Mold assembly and attenuated light process for fabricating molded parts
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US20100104678A1 (en) * 2008-10-28 2010-04-29 Formfactor, Inc. Apparatus and method for making and using a tooling die
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP2010149482A (en) * 2008-12-26 2010-07-08 Toshiba Corp Mold for inprint and pattern forming method
WO2011033584A1 (en) * 2009-09-18 2011-03-24 株式会社 東芝 Mold
TW201141340A (en) * 2009-12-28 2011-11-16 Fujikura Ltd Die and manufacturing method therefor
US9034233B2 (en) * 2010-11-30 2015-05-19 Infineon Technologies Ag Method of processing a substrate
FR2986901B1 (en) * 2012-02-15 2015-07-03 Commissariat Energie Atomique MICROELECTRONIC SUBSTRATE COMPRISING A LAYER OF ORGANIC MATERIAL ENTERREE
KR20150124408A (en) * 2014-04-28 2015-11-05 아사히 가라스 가부시키가이샤 Imprint mold, and imprint method
US10058890B1 (en) 2015-11-20 2018-08-28 Seagate Technology Llc Methods of forming an air bearing surface on a slider and related sliders
IL258026B2 (en) * 2015-11-22 2023-03-01 Orbotech Ltd Control of surface properties of printed three-dimensional structures
US20180105455A1 (en) * 2016-10-17 2018-04-19 Corning Incorporated Silica test probe and other such devices
US10991582B2 (en) * 2016-12-21 2021-04-27 Canon Kabushiki Kaisha Template for imprint lithography including a recession, an apparatus of using the template, and a method of fabricating an article
US11806444B2 (en) 2019-08-06 2023-11-07 New Jersey Institute Of Technology Additive manufacturing of cell-laden functional hydrogel and live cell constructs
US11491702B2 (en) * 2018-08-08 2022-11-08 New Jersey Institute Of Technology Additive manufacturing of channels
CN114764163A (en) * 2021-01-15 2022-07-19 宁波元芯光电子科技有限公司 Suspended waveguide supporting structure and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001009952A2 (en) * 1999-07-30 2001-02-08 Formfactor, Inc. Interconnect assemblies and methods
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3173737A (en) * 1963-08-05 1965-03-16 Amp Inc Connector with tab terminal latching means
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3649153A (en) * 1969-11-04 1972-03-14 Peter E Brudy Faceted core
US3899154A (en) * 1970-09-05 1975-08-12 Ichikoh Industries Ltd Light reflector mold
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
JPS58191453A (en) 1982-05-04 1983-11-08 Nec Corp Semiconductor device
US4516253A (en) * 1983-03-15 1985-05-07 Micronix Partners Lithography system
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4615573A (en) * 1983-10-28 1986-10-07 Honeywell Inc. Spring finger interconnect for IC chip carrier
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
NL8503234A (en) * 1985-11-25 1987-06-16 Philips Nv DIE.
US4832790A (en) * 1986-04-11 1989-05-23 Advanced Tool Technologies, Inc. Method of making metal molds and dies
JPS63102948A (en) * 1986-10-20 1988-05-07 Canon Inc Production of ink jet recording head
JP2533511B2 (en) * 1987-01-19 1996-09-11 株式会社日立製作所 Electronic component connection structure and manufacturing method thereof
US4772228A (en) * 1987-10-20 1988-09-20 Gte Products Corporation Electrical contact
US5103557A (en) 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
USH842H (en) 1989-06-30 1990-11-06 American Telephone And Telegraph Company Metal conductor structure having low electro-migration at high currents for semiconductor devices
JP3030574B2 (en) 1990-08-16 2000-04-10 キヤノン株式会社 Micro-displacement information detecting probe element, scanning tunnel microscope, atomic force microscope, and information processing apparatus using the same
JPH07109780B2 (en) * 1991-02-19 1995-11-22 山一電機株式会社 Contacts in sockets for electrical components
US5173055A (en) * 1991-08-08 1992-12-22 Amp Incorporated Area array connector
JPH0580530A (en) * 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JP3028875B2 (en) 1992-01-18 2000-04-04 ソニー株式会社 Lead frame manufacturing method
US5210939A (en) * 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
DE69311277T2 (en) * 1992-12-15 1998-01-15 Asulab Sa Protection tube switch and manufacturing process for suspended three-dimensional metallic microstructures
JPH06267408A (en) 1993-03-09 1994-09-22 Canon Inc Manufacture of detection probe for very small displacement, detection probe for very small displacement, and scanning probe microscope and information processor using these
EP0615131A1 (en) * 1993-03-10 1994-09-14 Co-Operative Facility For Aging Tester Development Prober for semiconductor integrated circuit element wafer
US5914614A (en) * 1996-03-12 1999-06-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US5348616A (en) * 1993-05-03 1994-09-20 Motorola, Inc. Method for patterning a mold
EP0629867B1 (en) * 1993-06-16 1999-01-27 Nitto Denko Corporation Probe structure
GB2279805B (en) 1993-07-02 1997-09-17 Plessey Semiconductors Ltd Bare die testing
JPH0721968A (en) 1993-07-06 1995-01-24 Canon Inc Cantilever type displacement element, cantilever type probe using the displacement element, and scanning type probe microscope and data processer using the probe
US6184053B1 (en) * 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US5462440A (en) * 1994-03-11 1995-10-31 Rothenberger; Richard E. Micro-power connector
US5666190A (en) * 1994-04-12 1997-09-09 The Board Of Trustees Of The Leland Stanford, Jr. University Method of performing lithography using cantilever array
US5534784A (en) * 1994-05-02 1996-07-09 Motorola, Inc. Method for probing a semiconductor wafer
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JPH07333232A (en) 1994-06-13 1995-12-22 Canon Inc Formation of cantilever having probe
US5513430A (en) * 1994-08-19 1996-05-07 Motorola, Inc. Method for manufacturing a probe
AU4283996A (en) 1994-11-15 1996-06-19 Formfactor, Inc. Electrical contact structures from flexible wire
JPH08306708A (en) 1995-05-09 1996-11-22 Sanyo Electric Co Ltd Semiconductor device and its fabrication
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US5835256A (en) * 1995-06-19 1998-11-10 Reflectivity, Inc. Reflective spatial light modulator with encapsulated micro-mechanical elements
US5701085A (en) * 1995-07-05 1997-12-23 Sun Microsystems, Inc. Apparatus for testing flip chip or wire bond integrated circuits
US6010609A (en) * 1995-07-28 2000-01-04 Nippon Carside Kogyo Kabushiki Kaisha Method of making a microprism master mold
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
JP3838381B2 (en) * 1995-11-22 2006-10-25 株式会社アドバンテスト Probe card
US5688699A (en) * 1996-01-16 1997-11-18 Raytheon Company Microbolometer
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
EP1482314B1 (en) 1996-05-17 2009-11-11 FormFactor, Inc. Microelectronic spring contact element
US5900350A (en) * 1996-06-06 1999-05-04 Velcro Industries B.V. Molding methods, molds and products
NL1004510C2 (en) 1996-11-12 1998-05-14 Charmant Beheer B V Method for manufacturing a test adapter as well as test adapter and a method for testing printed circuit boards.
FR2762140B1 (en) * 1997-04-10 2000-01-14 Mesatronic METHOD FOR MANUFACTURING A MULTIPLE CONTACT POINT CARD FOR TESTING SEMICONDUCTOR CHIPS
US5958469A (en) * 1997-05-14 1999-09-28 Eastman Kodak Company Method for fabricating tools for molding diffractive surfaces on optical lenses
WO1998052224A1 (en) 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
JPH1138041A (en) * 1997-07-24 1999-02-12 Mitsubishi Electric Corp Cantilever probe needle for probe card, its manufacture, and control method
JP3524343B2 (en) * 1997-08-26 2004-05-10 キヤノン株式会社 Method for forming minute opening, projection having minute opening, probe or multi-probe using the same, surface observation apparatus, exposure apparatus, and information processing apparatus using the probe
EP0899538B1 (en) 1997-08-27 2003-05-14 IMEC vzw A probe tip configuration, a method of fabricating probe tips and use thereof
US6014032A (en) * 1997-09-30 2000-01-11 International Business Machines Corporation Micro probe ring assembly and method of fabrication
US6059982A (en) * 1997-09-30 2000-05-09 International Business Machines Corporation Micro probe assembly and method of fabrication
JP3123483B2 (en) * 1997-10-28 2001-01-09 日本電気株式会社 Probe card and probe card forming method
US5985748A (en) * 1997-12-01 1999-11-16 Motorola, Inc. Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
US6090712A (en) * 1997-12-18 2000-07-18 Advanced Micro Devices, Inc. Shallow trench isolation formation with no polish stop
US6497581B2 (en) 1998-01-23 2002-12-24 Teradyne, Inc. Robust, small scale electrical contactor
US6207247B1 (en) * 1998-03-27 2001-03-27 Nikon Corporation Method for manufacturing a molding tool used for sustrate molding
SG108210A1 (en) * 1998-06-19 2005-01-28 Advantest Corp Probe contactor formed by photolithography process
JP3554228B2 (en) * 1998-07-29 2004-08-18 キヤノン株式会社 Microlens mold or mold master, and method for producing them
USRE41515E1 (en) * 1998-08-12 2010-08-17 Tokyo Electron Limited Contactor and production method for contactor
US6031282A (en) * 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
US6184576B1 (en) * 1998-09-21 2001-02-06 Advantest Corp. Packaging and interconnection of contact structure
US6214631B1 (en) * 1998-10-30 2001-04-10 The Trustees Of Princeton University Method for patterning light emitting devices incorporating a movable mask
US6255727B1 (en) * 1999-08-03 2001-07-03 Advantest Corp. Contact structure formed by microfabrication process
KR20080047629A (en) 1998-12-02 2008-05-29 폼팩터, 인크. Method of making an electrical contact structure
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
JP4414502B2 (en) * 1999-02-25 2010-02-10 東京エレクトロン株式会社 Probing card
US6183267B1 (en) * 1999-03-11 2001-02-06 Murray Hill Devices Ultra-miniature electrical contacts and method of manufacture
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6713374B2 (en) * 1999-07-30 2004-03-30 Formfactor, Inc. Interconnect assemblies and methods
US7189077B1 (en) * 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7057246B2 (en) * 2000-08-23 2006-06-06 Reflectivity, Inc Transition metal dielectric alloy materials for MEMS
KR100419233B1 (en) * 2002-03-11 2004-02-21 삼성전자주식회사 MEMS device and a fabrication method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001009952A2 (en) * 1999-07-30 2001-02-08 Formfactor, Inc. Interconnect assemblies and methods
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof

Also Published As

Publication number Publication date
WO2002068321A2 (en) 2002-09-06
AU2002243921A1 (en) 2002-09-12
US20060138076A1 (en) 2006-06-29
US6780001B2 (en) 2004-08-24
TW515777B (en) 2003-01-01
US20030099737A1 (en) 2003-05-29
US20050016251A1 (en) 2005-01-27

Similar Documents

Publication Publication Date Title
WO2002068321A3 (en) Forming tool for forming a contoured microelectronic spring mold
EP1777194A3 (en) Method for forming microelectronic spring structures on a substrate
MY130777A (en) Method for making a molded polymeric article
TW200606114A (en) Method and apparatus for forming an optical element and substrate and moulding tool
CA2497175A1 (en) Method and mold for making ophthalmic devices
AU2001290486A1 (en) A process for the manufacture of surface elements
EP1280204A8 (en) Wiring substrate having position information
WO2003032354A3 (en) Method for forming ceramic microstructures on a substrate using a mold and articles formed by the method
EP1363370A3 (en) Fixed wavelength vertical cavity optical devices and method of manufacture thereof
SG65787A1 (en) Method for the production of a ceramic layer on a metallic base material
DE60238998D1 (en) LEATHER SURFACE PATTERN AND METHOD FOR THE PRODUCTION THEREOF
AU4951399A (en) Mechanical patterning of a device layer
DK1404514T3 (en) Process for manufacturing decorative surface elements
WO2007030320A3 (en) Resilient floor tile and method for making same
WO2003067330A3 (en) Radiation patterning tools, and methods of forming radiation patterning tools
WO2005039544A8 (en) Porous calcium phosphate ceramic and process for producing the same
AU2003233973A1 (en) Method for producing a product having a structured surface
USD466042S1 (en) Diamond or precious stone
DE60106973D1 (en) METHOD AND DEVICE FOR PRODUCING A LAYER ELEMENT
USD575886S1 (en) Melting plate for a decorative candleholder
EP1721865A3 (en) Piezoresistive sensing structure
AU2002366374A1 (en) Method for the three-dimensional measurement of a surface
CA2430075A1 (en) A process for preparing a detergent tablet
EP1013391A3 (en) Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate
AU6836600A (en) Method for producing plates having a decorative surface

Legal Events

Date Code Title Description
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP