WO2002064495A3 - Enhanced sacrificial layer etching technique for microstructure release - Google Patents
Enhanced sacrificial layer etching technique for microstructure release Download PDFInfo
- Publication number
- WO2002064495A3 WO2002064495A3 PCT/IB2002/000395 IB0200395W WO02064495A3 WO 2002064495 A3 WO2002064495 A3 WO 2002064495A3 IB 0200395 W IB0200395 W IB 0200395W WO 02064495 A3 WO02064495 A3 WO 02064495A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- enhanced
- sacrificial layer
- etching technique
- layer etching
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/00468—Releasing structures
- B81C1/00476—Releasing structures removing a sacrificial layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0105—Sacrificial layer
- B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7009865A KR20030086989A (en) | 2001-02-12 | 2002-02-08 | Enhanced sacrificial layer etching technique for microstructure release |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01810141 | 2001-02-12 | ||
EP01810141.0 | 2001-02-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002064495A2 WO2002064495A2 (en) | 2002-08-22 |
WO2002064495A3 true WO2002064495A3 (en) | 2003-06-05 |
Family
ID=8183726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2002/000395 WO2002064495A2 (en) | 2001-02-12 | 2002-02-08 | Enhanced sacrificial layer etching technique for microstructure release |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20030086989A (en) |
TW (1) | TW535232B (en) |
WO (1) | WO2002064495A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100586675B1 (en) * | 2004-09-22 | 2006-06-12 | 주식회사 파이컴 | Manufacture method of vertical-type electric contactor and vertical-type electric contactor thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262000A (en) * | 1989-09-26 | 1993-11-16 | British Telecommunications Public Limited Company | Method for making micromechanical switch |
US5374792A (en) * | 1993-01-04 | 1994-12-20 | General Electric Company | Micromechanical moving structures including multiple contact switching system |
US5652559A (en) * | 1993-12-20 | 1997-07-29 | General Electric Company | Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
-
2001
- 2001-09-14 TW TW090122886A patent/TW535232B/en not_active IP Right Cessation
-
2002
- 2002-02-08 WO PCT/IB2002/000395 patent/WO2002064495A2/en not_active Application Discontinuation
- 2002-02-08 KR KR10-2003-7009865A patent/KR20030086989A/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262000A (en) * | 1989-09-26 | 1993-11-16 | British Telecommunications Public Limited Company | Method for making micromechanical switch |
US5374792A (en) * | 1993-01-04 | 1994-12-20 | General Electric Company | Micromechanical moving structures including multiple contact switching system |
US5652559A (en) * | 1993-12-20 | 1997-07-29 | General Electric Company | Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
Also Published As
Publication number | Publication date |
---|---|
WO2002064495A2 (en) | 2002-08-22 |
TW535232B (en) | 2003-06-01 |
KR20030086989A (en) | 2003-11-12 |
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