WO2002061811A3 - Laser cleaning process for semiconductor material - Google Patents

Laser cleaning process for semiconductor material Download PDF

Info

Publication number
WO2002061811A3
WO2002061811A3 PCT/US2002/000584 US0200584W WO02061811A3 WO 2002061811 A3 WO2002061811 A3 WO 2002061811A3 US 0200584 W US0200584 W US 0200584W WO 02061811 A3 WO02061811 A3 WO 02061811A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser cleaning
cleaning process
semiconductor material
wetting
undesirable
Prior art date
Application number
PCT/US2002/000584
Other languages
French (fr)
Other versions
WO2002061811A2 (en
Inventor
Danny L Thompson
Mary C Freeman
Ronald N Legge
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2002248330A priority Critical patent/AU2002248330A1/en
Publication of WO2002061811A2 publication Critical patent/WO2002061811A2/en
Publication of WO2002061811A3 publication Critical patent/WO2002061811A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

A laser cleaning process is disclosed for cleaning the surface of materials, such as semiconductor wafers (41) and the like, which process can be performed at atmospheric pressure. The process includes the steps of providing (40) a structure with a surface having undesirable contaminant particles thereon, wetting (44) the surface with a liquid including reactive or non-reactive liquids, and irradiating (47) the surface using photon energy with sufficient energy to remove the wetting liquid and the undesirable material.
PCT/US2002/000584 2001-01-23 2002-01-09 Laser cleaning process for semiconductor material WO2002061811A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002248330A AU2002248330A1 (en) 2001-01-23 2002-01-09 Laser cleaning process for semiconductor material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/768,107 2001-01-23
US09/768,107 US6494217B2 (en) 1998-03-12 2001-01-23 Laser cleaning process for semiconductor material and the like

Publications (2)

Publication Number Publication Date
WO2002061811A2 WO2002061811A2 (en) 2002-08-08
WO2002061811A3 true WO2002061811A3 (en) 2003-03-20

Family

ID=25081538

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/000584 WO2002061811A2 (en) 2001-01-23 2002-01-09 Laser cleaning process for semiconductor material

Country Status (4)

Country Link
US (1) US6494217B2 (en)
AU (1) AU2002248330A1 (en)
TW (1) TWI228265B (en)
WO (1) WO2002061811A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003244399A1 (en) * 2002-02-01 2003-09-02 Samuel W. Bross Method and apparatus for cleaning with electromagnetic radiation
SG114560A1 (en) 2002-07-31 2005-09-28 Inst Data Storage A method and apparatus for cleaning surfaces
US6924456B2 (en) * 2003-04-21 2005-08-02 Intel Corporation Method and apparatus for particle removal
US20050181141A1 (en) * 2004-02-18 2005-08-18 Aiden Flanagan Laser-induced explosive vaporization coating method, associated system, and device made by the method
US20050181116A1 (en) * 2004-02-18 2005-08-18 Rob Worsham Method for coating a medical device using a matrix assisted pulsed-laser evaporation technique and associated system and medical device
SG114754A1 (en) * 2004-02-25 2005-09-28 Kulicke & Soffa Investments Laser cleaning system for a wire bonding machine
US20050188921A1 (en) * 2004-02-27 2005-09-01 Anthony Malone Matrix assisted pulsed-laser evaporation technique for coating a medical device and associated system and medical device
US20060035475A1 (en) * 2004-08-12 2006-02-16 Applied Materials, Inc. Semiconductor substrate processing apparatus
TW200633033A (en) 2004-08-23 2006-09-16 Koninkl Philips Electronics Nv Hot source cleaning system
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
JP2006317726A (en) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd Method for correcting disconnection, method for manufacturing active matrix substrate, and display apparatus
US20070022623A1 (en) * 2005-07-29 2007-02-01 Board Of Regents Of University Of Nebraska Laser surface drying
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US8987632B2 (en) * 2009-10-09 2015-03-24 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modification of surface energy via direct laser ablative surface patterning
US9278374B2 (en) 2012-06-08 2016-03-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modified surface having low adhesion properties to mitigate insect residue adhesion
WO2015107325A1 (en) * 2014-01-15 2015-07-23 Woodrow Scientific Limited Methods and apparatus for laser cleaning
TWI651146B (en) * 2017-11-07 2019-02-21 財團法人工業技術研究院 Apparatus for laser cleaning and method thereof
CN108993829B (en) * 2018-08-02 2019-12-24 欣辰卓锐（苏州）智能装备有限公司 Control device capable of converting solid-liquid state of colloid
CN108906442B (en) * 2018-08-02 2019-12-24 欣辰卓锐（苏州）智能装备有限公司 Dispensing machine capable of correcting wrong dispensing
CN109201549B (en) * 2018-08-02 2020-12-25 欣辰卓锐（苏州）智能装备有限公司 Adhesive deposite machine is with revising arm
CN109772820A (en) * 2019-02-21 2019-05-21 天津欧泰激光科技有限公司 A kind of welding wire surface dirt laser cleaning method

Citations (3)

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US5800625A (en) * 1996-07-26 1998-09-01 Cauldron Limited Partnership Removal of material by radiation applied at an oblique angle
US5996594A (en) * 1994-11-30 1999-12-07 Texas Instruments Incorporated Post-chemical mechanical planarization clean-up process using post-polish scrubbing
US6074949A (en) * 1998-11-25 2000-06-13 Advanced Micro Devices, Inc. Method of preventing copper dendrite formation and growth

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US4081653A (en) 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
DE2943107C2 (en) 1979-10-25 1984-07-26 Robert 6600 Saarbrücken Langen Procedure for derusting
AU589353B2 (en) 1984-02-17 1989-10-12 Robert Langen Procedure for removal of impurities, in particular rust, from the surface of a metal
US4670637A (en) 1985-02-11 1987-06-02 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for transmitting a laser signal through fog
US4629859A (en) 1985-04-12 1986-12-16 Standard Oil Company (Indiana) Enhanced evaporation from a laser-heated target
US4752668A (en) 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
US5024968A (en) 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5643472A (en) 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
US5099557A (en) 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5531857A (en) 1988-07-08 1996-07-02 Cauldron Limited Partnership Removal of surface contaminants by irradiation from a high energy source
US4987286A (en) 1989-10-30 1991-01-22 University Of Iowa Research Foundation Method and apparatus for removing minute particles from a surface
US5114877A (en) 1991-01-08 1992-05-19 Xerox Corporation Method of fabricating quantum wire semiconductor laser via photo induced evaporation enhancement during in situ epitaxial growth
EP0964067B1 (en) 1993-12-07 2002-09-04 Toyota Jidosha Kabushiki Kaisha Laser shock processing method utilizing light absorbing material film
WO2000074113A1 (en) * 1999-05-27 2000-12-07 Lam Research Corporation Wafer drying apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5996594A (en) * 1994-11-30 1999-12-07 Texas Instruments Incorporated Post-chemical mechanical planarization clean-up process using post-polish scrubbing
US5800625A (en) * 1996-07-26 1998-09-01 Cauldron Limited Partnership Removal of material by radiation applied at an oblique angle
US6074949A (en) * 1998-11-25 2000-06-13 Advanced Micro Devices, Inc. Method of preventing copper dendrite formation and growth

Also Published As

Publication number Publication date
TWI228265B (en) 2005-02-21
WO2002061811A2 (en) 2002-08-08
US6494217B2 (en) 2002-12-17
US20010011545A1 (en) 2001-08-09
AU2002248330A1 (en) 2002-08-12

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