WO2002059704A3 - Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool - Google Patents

Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool Download PDF

Info

Publication number
WO2002059704A3
WO2002059704A3 PCT/US2002/002378 US0202378W WO02059704A3 WO 2002059704 A3 WO2002059704 A3 WO 2002059704A3 US 0202378 W US0202378 W US 0202378W WO 02059704 A3 WO02059704 A3 WO 02059704A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer processing
wafer
schedules
tool
semiconductor wafer
Prior art date
Application number
PCT/US2002/002378
Other languages
French (fr)
Other versions
WO2002059704A2 (en
Inventor
Dusan B Jevtic
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/771,254 external-priority patent/US6725114B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002059704A2 publication Critical patent/WO2002059704A2/en
Publication of WO2002059704A3 publication Critical patent/WO2002059704A3/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method and apparatus for producing schedules for a wafer in a multichamber semiconductor wafer processing tool comprising the steps of providing a trace defining a series of chambers that are visited by a wafer as the wafer is processed by the tool; initializing a sequence generator with a vertex defining initial wafer positioning within the tool; generating all successor vertices to produce a series of vectors interconnecting the vertices that, when taken together produce a cycle that represents a schedule. All the possible schedules are analyzed to determine a schedule that produces the highest throughput of all the schedules.
PCT/US2002/002378 2001-01-26 2002-01-28 Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool WO2002059704A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/771,254 US6725114B1 (en) 1997-06-09 2001-01-26 Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US09/771,254 2001-01-26

Publications (2)

Publication Number Publication Date
WO2002059704A2 WO2002059704A2 (en) 2002-08-01
WO2002059704A3 true WO2002059704A3 (en) 2003-05-08

Family

ID=25091218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/002378 WO2002059704A2 (en) 2001-01-26 2002-01-28 Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool

Country Status (2)

Country Link
TW (1) TW526530B (en)
WO (1) WO2002059704A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1826645A1 (en) * 2006-02-25 2007-08-29 MTU Aero Engines GmbH Method for generating process chains
TWI426459B (en) * 2007-10-26 2014-02-11 Hon Hai Prec Ind Co Ltd System and method for judging inputting and outputting operations of a mold automatically

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444632A (en) * 1994-04-28 1995-08-22 Texas Instruments Incorporated Apparatus and method for controlling and scheduling processing machines
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
EP1058172A2 (en) * 1999-06-01 2000-12-06 Applied Materials, Inc. Semiconductor processing techniques
WO2000079355A1 (en) * 1999-06-22 2000-12-28 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444632A (en) * 1994-04-28 1995-08-22 Texas Instruments Incorporated Apparatus and method for controlling and scheduling processing machines
US6074443A (en) * 1996-10-21 2000-06-13 Applied Materials, Inc. Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot
EP1058172A2 (en) * 1999-06-01 2000-12-06 Applied Materials, Inc. Semiconductor processing techniques
WO2000079355A1 (en) * 1999-06-22 2000-12-28 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication

Also Published As

Publication number Publication date
WO2002059704A2 (en) 2002-08-01
TW526530B (en) 2003-04-01

Similar Documents

Publication Publication Date Title
WO2003102771A3 (en) Specialization of active software agents in an automated manufacturing environment
WO2004015627A3 (en) Rule engine
WO2004059556A3 (en) Method and device for optimizing a nucleotide sequence for the purpose of expression of a protein
EP1155164A4 (en) In situ chemical generator and method
HK1070485A1 (en) Method and apparatus for reducing power consumption in bluetooth and cdma modes of operation
WO2002086670A3 (en) Simplified modeling software interface and method
TW352453B (en) Method and apparatus for priority based scheduling of wafer processing with a multiple chamber semiconductor wafer processing tool
HUE044616T2 (en) Motion vector calculating method
WO2006049922A3 (en) Method and system for sequencing and scheduling
HK1073148A1 (en) Method of manufacturing turbine frame of vgs type turbo charger vgs
WO2000077965A3 (en) Method and apparatus for enhancing scheduling in an advanced microprocessor
WO2001075534A3 (en) System and method for predicting software models using material-centric process instrumentation
WO2006018741A3 (en) A method for improving efficiency of a manufacturing process such as a semiconductor fab process
EP1529605A3 (en) Method and system for control of robots
AU2003256825A1 (en) Method and apparatus for manufacturing net shape semiconductor wafers
EP1428393A4 (en) Method and apparatus for motion vector coding with global motion parameters
GB0601396D0 (en) Data Processing System And Method
EP1498517A4 (en) Method for producing silicon single crystal and, silicon single crystal and silicon wafer
WO2002059704A3 (en) Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
PL1591557T3 (en) Coating method for In-line apparatus.
TW200420383A (en) Methods and apparatus for polishing control
WO2007078791A3 (en) Enhanced state estimation based upon information credibility
SG142130A1 (en) Method of providing for an automated split runcard processing
WO2003050628A3 (en) Method and apparatus for scheduling production lots based on lot and tool health metrics
DK1506235T3 (en) Method for producing monoclonal antibodies

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP