WO2002056380A1 - A method of manufacturing an active matrix substrate - Google Patents
A method of manufacturing an active matrix substrate Download PDFInfo
- Publication number
- WO2002056380A1 WO2002056380A1 PCT/IB2001/002533 IB0102533W WO02056380A1 WO 2002056380 A1 WO2002056380 A1 WO 2002056380A1 IB 0102533 W IB0102533 W IB 0102533W WO 02056380 A1 WO02056380 A1 WO 02056380A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- row
- esd
- column conductors
- protective circuitry
- conductors
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 239000011159 matrix material Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 74
- 230000001681 protective effect Effects 0.000 claims abstract description 42
- 238000000151 deposition Methods 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 19
- 230000008021 deposition Effects 0.000 claims abstract description 18
- 239000010409 thin film Substances 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
Definitions
- This invention relates to a method of manufacturing an active matrix substrate comprising a row and column array of active elements, each element being associated with a switching thin film transistor (TFT), and ESD protective circuitry connected to the TFTs for protecting against electrostatic discharge (ESD).
- TFT switching thin film transistor
- ESD protective circuitry connected to the TFTs for protecting against electrostatic discharge (ESD).
- the invention relates to the manufacture of active matrix substrates using complementary metal oxide semiconductor (CMOS) technology, for example, an active matrix liquid crystal display (AMLCD) having CMOS based TFTs switching TFTs or CMOS based integrated row and column driver circuitry.
- CMOS complementary metal oxide semiconductor
- AMLCD active matrix liquid crystal display
- AMLCDs AMLCDs
- static electricity has the potential to destroy thin film devices comprising thin dielectric layers and of particular susceptibility to damage are the gate regions of MOS TFTs.
- TFT gate electrodes are connected to corresponding row conductors and TFT source and drain electrodes are connected to corresponding column conductors
- ESD ESD
- this may be achieved by connecting both the row and column conductors to a ground ring via a pair of opposing, partially resistive diodes connected in parallel.
- Such an arrangement is disclosed in PCT published patent application WO97/13177 and also US patents US5585949 and US5930607. It is an object of the invention to provide a method of manufacturing an active matrix substrate of the type described above in which the performance of ESD protective circuitry is enhanced.
- an active matrix substrate comprising a row and column array of active elements wherein each element is associated with a thin film transistor (TFT) having a gate electrode connected to a corresponding row conductor and source and drain electrodes connected to corresponding column conductors, and ESD protective circuitry connected to at least one of the row conductors for protecting the TFTs against electrostatic discharge (ESD).
- TFT thin film transistor
- the method comprises the steps of forming semiconductor regions of the TFTs and the ESD protective circuitry; depositing gate electrodes of the TFTs and corresponding row conductors; and depositing source and drain electrodes of the TFTs and corresponding column conductors, wherein the ESD protective circuitry is operative to control ESD prior to deposition of the column conductors.
- the ESD protective circuitry may be operative to control ESD between the substrate and its external environment and, in particular, operative upon deposition of the row conductors.
- a semiconductor region of the ESD protective circuitry may be doped so as to provide a gentle conductive path from the part of that semiconductor region connected to a row conductor, through that semiconductor region to the external environment of the substrate, and to discourage current flow through that semiconductor region in the opposite direction.
- a semiconductor region of the ESD protective circuitry may be doped so as to provide a gentle conductive path from external environment of the substrate, through that semiconductor region and to the part of that semiconductor region connected to a row conductor, and to discourage current flow through that semiconductor region in the opposite direction.
- the ESD protective circuitry may be operative to control ESD in a manner different from that used to control ESD prior to deposition of the column conductors.
- the ESD protective circuitry may be operative to control ESD between the substrate and its external environment prior to deposition of the column conductors, and operative to control ESD between row and column conductors upon completed manufacture of the active matrix substrate.
- the ESD protective circuitry may conveniently comprise either a lateral diode or a lateral, gate shorted TFT connected between row and column conductors and preferably at least one opposing pair of such diodes or TFTs connected in parallel between row and column conductors and, in particular, the semiconductor region of which may comprise two portions located either side of the active region of said diode or TFT, a first portion connected to the row conductor and a second portion on the other side of the active region at least twice and perhaps ten times the size of the first portion.
- an active matrix substrate manufactured by a method according to the present invention, an active matrix substrate according to any of claims 13 to 15 and an AMLCD comprising such an active matrix substrate.
- Figure 1 shows, schematically, an active matrix substrate of an AMLCD having ESD protective circuitry and manufactured in accordance with the present invention
- Figure 2 shows, schematically, the ESD protective circuitry of the active matrix substrate of figure 1 in greater detail
- Figures 3A to 3E illustrates a method of manufacturing the active matrix substrate of figure 1 ; and Figures 4A to 4C show alternative configurations of the ESD protective circuitry of the active matrix substrate.
- an AMLCD 1 manufactured by a method according to the present invention comprises an display area 10 on a display panel 18, the display area consisting of m rows (1 to m) and n columns (1 to n) of identical picture elements 11. Only a few of the picture elements are shown for simplicity whereas in practice, the total number of picture elements (m x n) in the display area 10 may be 200,000 or more.
- Each picture element 11 has a picture electrode 12 and associated therewith a switching TFT 13 of the type manufactured by the method illustrated in figures 1A to 1 D, and which serves to control the application of data signal voltages to the picture electrode.
- the switching TFTs 13 have common operational characteristics and are each arranged adjacent to their associated picture element with their respective drain being connected to the picture electrode.
- the sources of all switching TFTs associated with one column of picture elements are connected to a respective one of a set of parallel column conductors 14 and the gates of all switching TFTs associated with one row of picture elements are connected to a respective one of a set of parallel row conductors 15.
- the TFTs 13 are controlled by gating signals provided via the row conductors by CMOS based, row driver circuitry 16 located on the display panel 18.
- the TFTs associated with picture elements in the same column are provided with data signal voltages for the picture electrodes by CMOS based, column driver circuitry 26 also located on the display panel.
- CMOS based row driver circuitry
- integrated ESD protective circuitry 20 is provided at both ends of both row conductors 15 and column conductors 14, each connecting row and column conductors via a common power rail 19.
- One such protective circuitry 20 is shown in figure 2 in greater detail in which a pair of opposing, lateral p-i-n junction diodes 21 , 21' are connected in parallel whereby the voltage across the row and column conductors is regulated by allowing selective current flow in either direction.
- FIG. 3A to 3E A method of manufacturing the active matrix substrate of figure 1 is illustrated in figures 3A to 3E including the formation of CMOS p-type (in region R1) and n-type (in region R2) transistors for either the pixel elements or integrated row and column driver circuitry, and a p-i-n diode (in region R3) for the ESD protective circuitry.
- a polysilicon layer is formed and patterned to provide semiconductor device islands 302, 302' for the p-type and n-type transistors respectively and also an extended polysilicon region 303 including the active region of a p-i-n diode and extending to the periphery of the panel 18 where it is electrically connected to ground, external to the substrate.
- Such electrical connection can be inadvertent electrical contact with the environment, for example through a clamp (not shown) used for securing the glass substrate during the manufacturing process, or deliberate such as a contact pad (not shown) formed in the extended polysilicon region 303 for contacting an external electrical ground connector.
- gate electrodes 315 of the transistors R1 , R2 are provided, conveniently as heavily doped silicon layers connected to the row conductors as shown, or alternatively metal regions integral with the row conductors.
- Row conductors 15 are deposited so as to connect the gate electrodes to the p-type region 309 of the p-i-n diode R3.
- charge collecting at the TFT gate electrodes is able to dissipate to ground through the p-i-n diode as indicated by the arrow 317.
- the polarity of the diode junction protects the TFTs against ESD originating from the external environment, for example, caused by handling the substrate.
- the ESD protective circuitry serves to control current flow between the row and column conductors whereby charge collecting at the TFT gate electrodes is able to dissipate to ground through the p-i-n diode as indicated by the arrow 318.
- the p-i-n diode R3 is one of a pair of opposing, partially resistive diodes connected in parallel whereby the voltage across the row and column conductors is regulated by allowing selective current flow in either direction.
- Figures 4A to 4C show alternative configurations of ESD protective circuitry.
- figure 4A shows n-i-n gate shorted TFT structure able to operate in the manner of the p-i-n diode R3 shown in figures 3A to 3E. That is, the n-i-n gate shorted TFT structure enables charge to dissipate through the extended silicon area early in the manufacturing process and control charge flow between row and column conductors after deposition of the column conductors. Similarly, negative charge can be dissipated (in effect, a current flowing on to the plate from the environment) through an n-i-p diode structure or a p-i-p gate shorted TFT structure as shown in figures 4B and 4C respectively.
- the dual role of the ESD protective circuitry that is control charge flow between the plate and the external environment early in the manufacturing process and to control charge flow between row and column conductors after deposition of the column conductors, may to some extent dictate the geometry of the active layer in such ESD protective circuitry.
- the n-type portion 312 of the diode structure which extends towards the periphery of the substrate may be much greater in size than the p-type portion 309 of the diode structure, for example, twice, 5 times or even ten times greater.
- n-i- p structure shown in figure 4B where the n-type portion 312 of the diode structure is much smaller than the p-type portion 309, the charge flow as indicated by the arrow 400 being reversed.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60138224T DE60138224D1 (en) | 2001-01-11 | 2001-12-12 | MANUFACTURING METHOD FOR ACTIVE MATRIX SUBSTRATE |
KR1020027011658A KR20020092975A (en) | 2001-01-11 | 2001-12-12 | A method of manufacturing an active matrix substrate |
EP01273143A EP1352428B1 (en) | 2001-01-11 | 2001-12-12 | A method of manufacturing an active matrix substrate |
JP2002556947A JP4366076B2 (en) | 2001-01-11 | 2001-12-12 | Method for manufacturing active matrix substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0100733.5A GB0100733D0 (en) | 2001-01-11 | 2001-01-11 | A method of manufacturing an active matrix substrate |
GB0100733.5 | 2001-01-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002056380A1 true WO2002056380A1 (en) | 2002-07-18 |
Family
ID=9906656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2001/002533 WO2002056380A1 (en) | 2001-01-11 | 2001-12-12 | A method of manufacturing an active matrix substrate |
Country Status (10)
Country | Link |
---|---|
US (2) | US6599787B2 (en) |
EP (1) | EP1352428B1 (en) |
JP (2) | JP4366076B2 (en) |
KR (2) | KR20080059688A (en) |
CN (1) | CN1263132C (en) |
AT (1) | ATE427562T1 (en) |
DE (1) | DE60138224D1 (en) |
GB (1) | GB0100733D0 (en) |
TW (1) | TW550820B (en) |
WO (1) | WO2002056380A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100386849B1 (en) * | 2001-07-10 | 2003-06-09 | 엘지.필립스 엘시디 주식회사 | Circuit for electro static dischrging of tft-lcd |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW584953B (en) * | 2003-04-25 | 2004-04-21 | Toppoly Optoelectronics Corp | ESD protection device with thick poly film, electronic device and method for forming the same |
US6936895B2 (en) | 2003-10-09 | 2005-08-30 | Chartered Semiconductor Manufacturing Ltd. | ESD protection device |
DE102004008803B3 (en) * | 2004-02-20 | 2005-10-27 | Zentrum Mikroelektronik Dresden Ag | Protective diode for protection of semiconductor circuits against electrostatic discharges |
CN100421208C (en) * | 2004-03-04 | 2008-09-24 | 统宝光电股份有限公司 | Method and apparatus for manufacturing thin film transistor array |
JP4207858B2 (en) * | 2004-07-05 | 2009-01-14 | セイコーエプソン株式会社 | Semiconductor device, display device and electronic apparatus |
US20060118787A1 (en) * | 2004-12-02 | 2006-06-08 | Toppoly Optoelectronics Corp. | Electronic device with electrostatic discharge protection |
US20070091218A1 (en) * | 2005-10-25 | 2007-04-26 | Chin-Hai Huang | Electrostatic discharge protection structure and thin film transistor substrate including the same |
CN100388069C (en) * | 2005-11-23 | 2008-05-14 | 友达光电股份有限公司 | Display device and its common electrode configuration structure |
TWI285950B (en) * | 2006-01-20 | 2007-08-21 | Au Optronics Corp | Electro static discharge protection circuit and diode thereof |
JP5006580B2 (en) * | 2006-05-31 | 2012-08-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device provided with protection circuit |
US20080024427A1 (en) * | 2006-07-26 | 2008-01-31 | Prime View International Co., Ltd. | Electronic ink display panel |
KR101301155B1 (en) * | 2006-12-12 | 2013-09-03 | 삼성디스플레이 주식회사 | Thin film transitor substrate and menufacturing method thereof |
EP2096619B1 (en) * | 2006-12-22 | 2016-04-13 | Sharp Kabushiki Kaisha | Active matrix substrate and display panel equipped with the same |
TWI401019B (en) * | 2007-01-11 | 2013-07-01 | Prime View Int Co Ltd | Active matrix device with electrostatic protection |
US20140027769A1 (en) * | 2011-04-08 | 2014-01-30 | Sharp Kabushiki Kaisha | Semiconductor device and display device |
KR102038633B1 (en) | 2012-11-13 | 2019-10-30 | 삼성전자주식회사 | Driving device of display apparatus and Manufacturing method of the same |
US9548293B2 (en) * | 2014-02-14 | 2017-01-17 | Infineon Technologies Ag | III-nitride based ESD protection device |
KR20160023977A (en) | 2014-08-21 | 2016-03-04 | 삼성디스플레이 주식회사 | Liquid crystal display |
CN106920768A (en) * | 2015-12-24 | 2017-07-04 | 中微半导体设备(上海)有限公司 | Multi-region active-matrix temperature control system and temperature control method and its applicable electrostatic chuck and plasma treatment appts |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0423824A2 (en) | 1989-10-20 | 1991-04-24 | Hosiden Corporation | Active matrix liquid crystal display element |
US5019002A (en) * | 1989-07-12 | 1991-05-28 | Honeywell, Inc. | Method of manufacturing flat panel backplanes including electrostatic discharge prevention and displays made thereby |
US5219771A (en) * | 1988-07-30 | 1993-06-15 | Fuji Xerox Co., Ltd. | Method of producing a thin film transistor device |
US5220443A (en) * | 1991-04-29 | 1993-06-15 | Nec Corporation | Matrix wiring substrate and active matrix display having non-linear resistance elements for electrostatic discharge protection |
US5585949A (en) | 1991-03-25 | 1996-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
WO1997005654A1 (en) * | 1995-07-31 | 1997-02-13 | Litton Systems Canada Limited | Semiconductor switch array with electrostatic discharge protection and method of fabricating |
WO1997013177A1 (en) | 1995-10-03 | 1997-04-10 | Seiko Epson Corporation | Active matrix substrate |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3029531B2 (en) * | 1994-03-02 | 2000-04-04 | シャープ株式会社 | Liquid crystal display |
GB9416899D0 (en) * | 1994-08-20 | 1994-10-12 | Philips Electronics Uk Ltd | Manufacture of electronic devices comprising thin-film circuitry |
US5737041A (en) * | 1995-07-31 | 1998-04-07 | Image Quest Technologies, Inc. | TFT, method of making and matrix displays incorporating the TFT |
WO1997006465A1 (en) * | 1995-08-07 | 1997-02-20 | Hitachi, Ltd. | Active matrix type liquid crystal display device resistant to static electricity |
US5731216A (en) * | 1996-03-27 | 1998-03-24 | Image Quest Technologies, Inc. | Method of making an active matrix display incorporating an improved TFT |
US6111424A (en) * | 1997-09-04 | 2000-08-29 | Lucent Technologies Inc. | Testing method and apparatus for flat panel displays using infrared imaging |
-
2001
- 2001-01-11 GB GBGB0100733.5A patent/GB0100733D0/en not_active Ceased
- 2001-11-05 TW TW090127413A patent/TW550820B/en not_active IP Right Cessation
- 2001-12-12 DE DE60138224T patent/DE60138224D1/en not_active Expired - Lifetime
- 2001-12-12 JP JP2002556947A patent/JP4366076B2/en not_active Expired - Fee Related
- 2001-12-12 WO PCT/IB2001/002533 patent/WO2002056380A1/en active Application Filing
- 2001-12-12 AT AT01273143T patent/ATE427562T1/en not_active IP Right Cessation
- 2001-12-12 KR KR1020087015251A patent/KR20080059688A/en not_active IP Right Cessation
- 2001-12-12 CN CNB018063640A patent/CN1263132C/en not_active Expired - Fee Related
- 2001-12-12 KR KR1020027011658A patent/KR20020092975A/en not_active Application Discontinuation
- 2001-12-12 EP EP01273143A patent/EP1352428B1/en not_active Expired - Lifetime
-
2002
- 2002-01-11 US US10/043,537 patent/US6599787B2/en not_active Expired - Lifetime
-
2003
- 2003-08-08 US US10/638,266 patent/US6838700B2/en not_active Expired - Fee Related
-
2008
- 2008-10-22 JP JP2008272507A patent/JP2009094524A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5219771A (en) * | 1988-07-30 | 1993-06-15 | Fuji Xerox Co., Ltd. | Method of producing a thin film transistor device |
US5019002A (en) * | 1989-07-12 | 1991-05-28 | Honeywell, Inc. | Method of manufacturing flat panel backplanes including electrostatic discharge prevention and displays made thereby |
EP0423824A2 (en) | 1989-10-20 | 1991-04-24 | Hosiden Corporation | Active matrix liquid crystal display element |
US5585949A (en) | 1991-03-25 | 1996-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
US5220443A (en) * | 1991-04-29 | 1993-06-15 | Nec Corporation | Matrix wiring substrate and active matrix display having non-linear resistance elements for electrostatic discharge protection |
WO1997005654A1 (en) * | 1995-07-31 | 1997-02-13 | Litton Systems Canada Limited | Semiconductor switch array with electrostatic discharge protection and method of fabricating |
WO1997013177A1 (en) | 1995-10-03 | 1997-04-10 | Seiko Epson Corporation | Active matrix substrate |
US5930607A (en) | 1995-10-03 | 1999-07-27 | Seiko Epson Corporation | Method to prevent static destruction of an active element comprised in a liquid crystal display device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100386849B1 (en) * | 2001-07-10 | 2003-06-09 | 엘지.필립스 엘시디 주식회사 | Circuit for electro static dischrging of tft-lcd |
Also Published As
Publication number | Publication date |
---|---|
US6599787B2 (en) | 2003-07-29 |
DE60138224D1 (en) | 2009-05-14 |
EP1352428B1 (en) | 2009-04-01 |
TW550820B (en) | 2003-09-01 |
CN1416596A (en) | 2003-05-07 |
KR20020092975A (en) | 2002-12-12 |
JP4366076B2 (en) | 2009-11-18 |
GB0100733D0 (en) | 2001-02-21 |
US6838700B2 (en) | 2005-01-04 |
JP2004518278A (en) | 2004-06-17 |
JP2009094524A (en) | 2009-04-30 |
ATE427562T1 (en) | 2009-04-15 |
US20040066134A1 (en) | 2004-04-08 |
US20020088978A1 (en) | 2002-07-11 |
KR20080059688A (en) | 2008-06-30 |
EP1352428A1 (en) | 2003-10-15 |
CN1263132C (en) | 2006-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1352428B1 (en) | A method of manufacturing an active matrix substrate | |
JP3029531B2 (en) | Liquid crystal display | |
EP2096619B1 (en) | Active matrix substrate and display panel equipped with the same | |
US6812489B2 (en) | Liquid crystal display | |
JP3315829B2 (en) | Semiconductor device | |
US6088073A (en) | Display device with destaticizing elements and an electrostatic pulse delaying element connected to each of the destaticizing elements | |
US6472256B1 (en) | Method of manufacturing a thin-film transistor with a short-circuiting pattern | |
US20060092591A1 (en) | On-substrate ESD protection for array based image sensors | |
JP4410912B2 (en) | ESD protection circuit | |
KR100336827B1 (en) | Liquid crystal display and fabricating method of substrate of the liquid crystal display | |
US20070001949A1 (en) | Protective circuit for a thin film transistor and a liquid crystal display device | |
JP3348734B2 (en) | Protection circuit | |
JP3459560B2 (en) | Semiconductor device and display device | |
KR100336896B1 (en) | LCD | |
US5534722A (en) | Insulator substrate for a light valve device having an electrostatic protection region | |
JPH06186592A (en) | Liquid crystal display device and its manufacture | |
JP2003043523A (en) | Thin film transistor panel | |
KR20010045688A (en) | Apparatus For Protecting Electrostatic Damage in Liquid Crystal Display and Method of Fabricating the same | |
JP4018913B2 (en) | Manufacturing method of liquid crystal display device | |
KR100234860B1 (en) | Cmos semiconductor device | |
JPH1073845A (en) | Liquid crystal display device | |
JP2002110995A (en) | Active matrix substrate | |
KR100929666B1 (en) | Liquid Crystal Display and Manufacturing Method Thereof | |
JPH03129325A (en) | Manufacture of thin film integrated circuit | |
KR20000009437A (en) | Liquid crystal display with function of preventing static electricity |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2001273143 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020027011658 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 018063640 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: 1020027011658 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002556947 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2001273143 Country of ref document: EP |