WO2002056349A3 - Chamber for uniform substrate heating - Google Patents
Chamber for uniform substrate heating Download PDFInfo
- Publication number
- WO2002056349A3 WO2002056349A3 PCT/US2001/050262 US0150262W WO02056349A3 WO 2002056349 A3 WO2002056349 A3 WO 2002056349A3 US 0150262 W US0150262 W US 0150262W WO 02056349 A3 WO02056349 A3 WO 02056349A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- substrate heating
- uniform substrate
- thermal profile
- uniform thermal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037008591A KR100614327B1 (en) | 2000-12-29 | 2001-12-20 | Chamber for uniform substrate heating |
JP2002556921A JP2004527900A (en) | 2000-12-29 | 2001-12-20 | Chamber for heating the substrate uniformly |
EP01998097A EP1346400A2 (en) | 2000-12-29 | 2001-12-20 | Chamber for uniform substrate heating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25903500P | 2000-12-29 | 2000-12-29 | |
US60/259,035 | 2000-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002056349A2 WO2002056349A2 (en) | 2002-07-18 |
WO2002056349A3 true WO2002056349A3 (en) | 2002-09-26 |
Family
ID=22983228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/050262 WO2002056349A2 (en) | 2000-12-29 | 2001-12-20 | Chamber for uniform substrate heating |
Country Status (7)
Country | Link |
---|---|
US (2) | US6765178B2 (en) |
EP (1) | EP1346400A2 (en) |
JP (1) | JP2004527900A (en) |
KR (1) | KR100614327B1 (en) |
CN (1) | CN1293600C (en) |
TW (1) | TW529066B (en) |
WO (1) | WO2002056349A2 (en) |
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Also Published As
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WO2002056349A2 (en) | 2002-07-18 |
US6765178B2 (en) | 2004-07-20 |
US20020086260A1 (en) | 2002-07-04 |
EP1346400A2 (en) | 2003-09-24 |
TW529066B (en) | 2003-04-21 |
KR100614327B1 (en) | 2006-08-18 |
CN1483218A (en) | 2004-03-17 |
JP2004527900A (en) | 2004-09-09 |
CN1293600C (en) | 2007-01-03 |
US7022948B2 (en) | 2006-04-04 |
KR20030066760A (en) | 2003-08-09 |
US20040255861A1 (en) | 2004-12-23 |
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