WO2002052615A3 - Radiation-emitting semiconductor component with a luminescence conversion element - Google Patents

Radiation-emitting semiconductor component with a luminescence conversion element Download PDF

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Publication number
WO2002052615A3
WO2002052615A3 PCT/DE2001/004880 DE0104880W WO02052615A3 WO 2002052615 A3 WO2002052615 A3 WO 2002052615A3 DE 0104880 W DE0104880 W DE 0104880W WO 02052615 A3 WO02052615 A3 WO 02052615A3
Authority
WO
WIPO (PCT)
Prior art keywords
conversion element
luminescence conversion
radiation
semiconductor component
emitting semiconductor
Prior art date
Application number
PCT/DE2001/004880
Other languages
German (de)
French (fr)
Other versions
WO2002052615A2 (en
Inventor
Bert Braune
Stefan Gruber
Guenter Waitl
Ulrich Zehnder
Original Assignee
Osram Opto Semiconductors Gmbh
Bert Braune
Stefan Gruber
Guenter Waitl
Ulrich Zehnder
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Bert Braune, Stefan Gruber, Guenter Waitl, Ulrich Zehnder filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2002052615A2 publication Critical patent/WO2002052615A2/en
Publication of WO2002052615A3 publication Critical patent/WO2002052615A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

The invention relates to a radiation-emitting semiconductor component with a luminescence conversion element (8). A reflector (7) is connected downstream of a semiconductor body (3), this reflector being coated with a luminescence conversion element (8) or containing a luminescence conversion element (8). Said luminescence conversion element (8) converts part of the radiation (6) that is emitted by the semiconductor body during operation in a first wavelength range into radiation (9) in a second wavelength range. The semiconductor body (3) and the luminescence conversion element (8) are preferably tuned to each other in such a way that mixed-colour white light is emitted.
PCT/DE2001/004880 2000-12-27 2001-12-21 Radiation-emitting semiconductor component with a luminescence conversion element WO2002052615A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000165381 DE10065381B4 (en) 2000-12-27 2000-12-27 Radiation-emitting semiconductor component with luminescence conversion element
DE10065381.2 2000-12-27

Publications (2)

Publication Number Publication Date
WO2002052615A2 WO2002052615A2 (en) 2002-07-04
WO2002052615A3 true WO2002052615A3 (en) 2002-12-19

Family

ID=7669239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004880 WO2002052615A2 (en) 2000-12-27 2001-12-21 Radiation-emitting semiconductor component with a luminescence conversion element

Country Status (2)

Country Link
DE (1) DE10065381B4 (en)
WO (1) WO2002052615A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047748A (en) 2002-07-12 2004-02-12 Stanley Electric Co Ltd Light-emitting diode
JP2004128273A (en) * 2002-10-03 2004-04-22 Sharp Corp Light emitting element
DE602005004297T2 (en) 2004-08-06 2008-12-24 Philips Intellectual Property & Standards Gmbh HIGH PERFORMANCE LED LAMP SYSTEM
US7256057B2 (en) 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
DE102004045950A1 (en) 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component, optoelectronic component and method for producing an optoelectronic component
DE102004047640A1 (en) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelectronic component and housing for an optoelectronic component
JP4264109B2 (en) * 2007-01-16 2009-05-13 株式会社東芝 Light emitting device
DE102007059548A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelectronic component and coupling-out lens for an optoelectronic component
KR101488448B1 (en) 2007-12-06 2015-02-02 서울반도체 주식회사 Led package and method for fabricating the same
DE102010054591B4 (en) * 2010-12-15 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Housing and method for producing a housing for an optoelectronic component
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US8480254B2 (en) * 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
JP5923183B2 (en) 2011-12-30 2016-05-24 ティコナ・エルエルシー Reflector for light emitting device
DE102012109650A1 (en) 2012-10-10 2014-04-10 Osram Opto Semiconductors Gmbh Ceramic conversion element, optoelectronic semiconductor element and method for producing a ceramic conversion element
WO2014099745A1 (en) 2012-12-18 2014-06-26 Ticona Llc Molded reflectors for light-emitting diode assemblies
DE102017111426A1 (en) 2017-05-24 2018-11-29 Osram Opto Semiconductors Gmbh Radiation-emitting component and method for producing a radiation-emitting component
DE102018204163A1 (en) 2018-03-19 2019-09-19 Osram Opto Semiconductors Gmbh Conversion element for LED applications with high performance and high color rendering
CN109786517B (en) * 2019-01-25 2020-05-15 京东方科技集团股份有限公司 Light-emitting structure, light-emitting diode and preparation method thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (en) * 1972-09-05 1974-04-04 Matsushita Electronics Corp SOLID DISPLAY DEVICE
JPH07176794A (en) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd Planar light source
DE29804149U1 (en) * 1998-03-09 1998-06-18 Chen Hsing Light emitting diode (LED) with an improved structure
WO1998054930A2 (en) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Uv/blue led-phosphor device with enhanced light output
JPH1168166A (en) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd Light-emitting diode
JP2000022220A (en) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd Reflective led lamp
JP2000082849A (en) * 1999-09-27 2000-03-21 Toshiba Corp Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof
WO2000019546A1 (en) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Lighting system
JP2000347601A (en) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp Light emitting device
WO2001059851A1 (en) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Light source

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1439586B1 (en) * 1996-06-26 2014-03-12 OSRAM Opto Semiconductors GmbH Light-emitting semiconductor component with luminescence conversion element

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (en) * 1972-09-05 1974-04-04 Matsushita Electronics Corp SOLID DISPLAY DEVICE
JPH07176794A (en) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd Planar light source
WO1998054930A2 (en) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Uv/blue led-phosphor device with enhanced light output
JPH1168166A (en) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd Light-emitting diode
DE29804149U1 (en) * 1998-03-09 1998-06-18 Chen Hsing Light emitting diode (LED) with an improved structure
JP2000022220A (en) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd Reflective led lamp
WO2000019546A1 (en) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Lighting system
JP2000347601A (en) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp Light emitting device
JP2000082849A (en) * 1999-09-27 2000-03-21 Toshiba Corp Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof
WO2001059851A1 (en) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Light source
EP1187228A1 (en) * 2000-02-09 2002-03-13 Nippon Leiz Corporation Light source

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06) *

Also Published As

Publication number Publication date
WO2002052615A2 (en) 2002-07-04
DE10065381B4 (en) 2010-08-26
DE10065381A1 (en) 2002-07-11

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