WO2002049805A1 - Polishing platen with pressurized membrane - Google Patents
Polishing platen with pressurized membrane Download PDFInfo
- Publication number
- WO2002049805A1 WO2002049805A1 PCT/US2001/050625 US0150625W WO0249805A1 WO 2002049805 A1 WO2002049805 A1 WO 2002049805A1 US 0150625 W US0150625 W US 0150625W WO 0249805 A1 WO0249805 A1 WO 0249805A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- platen
- recited
- membrane
- piezoelectric elements
- annular
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
- B24D9/08—Circular back-plates for carrying flexible material
Definitions
- This invention relates generally to chemical mechanical polishing apparatuses, and more particularly to platen designs using pressurized membranes and piezoelectric elements for improved performance in chemical mechanical polishing applications.
- CMP Chemical Polishing
- integrated circuit devices are in the form of multi-level structures.
- transistor devices having diffusion regions are formed.
- interconnect metallization lines are patterned and electrically connected to the transistor devices to define the desired functional device.
- Patterned conductive layers are insulated from other conductive layers by dielectric materials, such as silicon dioxide.
- dielectric materials such as silicon dioxide.
- metallization line patterns are formed in the dielectric material, and then metal CMP operations are performed to remove excess metallization.
- CMP systems typically implement belt, orbital, or brush stations in which belts, pads, or brushes are used to scrub, buff, and polish one or both sides of a wafer.
- Slurry is used to facilitate and enhance the CMP operation. Slurry is most usually introduced onto a moving preparation surface, e.g., belt, pad, brush, and the like, and distributed over the preparation surface as well as the surface of the semiconductor wafer being buffed, polished, or otherwise prepared by the CMP process. The distribution is generally accomplished by a combination of the movement of the preparation surface, the movement of the semiconductor wafer and the friction created between the semiconductor wafer and the preparation surface.
- FIG. 1 illustrates an exemplary prior art CMP system 10.
- the CMP system 10 in Figure 1 is a belt-type system, so designated because the preparation surface is an endless belt 18 mounted on two drums 24 which drive the belt 18 in a rotational motion as indicated by belt rotation directional arrows 26.
- a wafer 12 is mounted on a wafer head 14, which is rotated in direction 16. The rotating wafer 12 is then applied against the rotating belt 18 with a force F to accomplish a CMP process. Some CMP processes require significant force F to be applied.
- a platen 22 is provided to stabilize the belt 18 and to provide a solid surface onto which to apply the wafer 12.
- Slurry 28 composing of an aqueous solution such as NFLiOH or DI containing dispersed abrasive particles is introduced upstream of the wafer 12.
- the process of scrubbing, buffing and polishing of the surface of the wafer is achieved by using an endless polishing pad glued to belt 18.
- the polishing pad is composed of porous or fibrous materials and lack
- FIG. 2 is a detailed view of a conventional wafer head and platen configuration 30.
- the wafer head and platen configuration 30 includes the wafer head 14 and the platen 22 positioned below the wafer head 14.
- the wafer head 14 includes a fixed retaining ring 32 that holds the wafer 12 in position below the wafer head 14.
- Between the wafer head 14 and the platen 22 is the polishing pad and belt 18.
- the polishing platen 22 is closely spaced from a polishing pad or belt 18 with a very thin air space, referred to as an "air bearing", being defined between the platen 22 and the polishing pad 18.
- the air bearing between the platen 22 and the pad 18 has been conventionally used in an attempt to create a uniform polishing of the surface.
- air source holes generally are formed in the platen 22 and are arranged in concentric ring patterns from the center of the platen 22 to the outer edge of the platen 22.
- Each ring establishes an air delivery zone where air from an air source is directed through the holes during polishing, thus establishing the air bearing. Air is exhausted past the platen edge.
- the air distribution profile of the air bearing can be varied radially as necessary to achieve optimal polishing by vary the polishing rate in each zone.
- the distribution profiles of the zones are not completely independent of each other. This complicates establishing different distribution profiles for different zones.
- the air bearing is very sensitive to conditions. For example, the pressure of the air bearing varies with the gap between the pad 18 and the platen 22. Thus, if the pad 18 is pushed toward the platen 22 in one area, the pressure of all areas of the air bearing are affected, thus adding unwanted complexity to the CMP process.
- a platen for improving performance in CMP applications is disclosed.
- the platen includes a membrane disposed above the platen. Disposed below the membrane is a plurality of annular bladders capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.
- a system for improving performance in CMP applications includes a wafer head capable of carrying a wafer, and a polishing belt positioned below the wafer head. Further included in the system is a platen having a membrane positioned below the polishing belt. The platen further includes annular bladders disposed below the membrane, which are capable of exerting force on the membrane.
- a further platen for improving performance in CMP applications is disclosed in another embodiment of the present invention.
- the platen includes a plurality of piezoelectric elements disposed above the platen.
- the piezoelectric elements are used to exert force on the polishing belt during a CMP process. In this manner, zonal control is provided during the
- the system includes a wafer head capable of carrying a wafer, and a polishing belt positioned below the wafer head. Further included in the system is a platen having piezoelectric elements positioned below the polishing belt. The piezoelectric elements are capable of exerting force on the polishing belt.
- the annular bladders and piezoelectric elements of the embodiments of the present invention improve performance during a CMP process by providing increased zonal control to the pressurized membrane. Further, unlike a conventional air bearing, the embodiments of the present invention greatly reduce the amount of air needed during the CMP process.
- a CMP process using the pressurized membrane or piezoelectric elements of the present invention is not as sensitive to conditions as conventional CMP processes utilizing air bearings. Unlike air bearings, the pressure of the pressurized membrane or piezoelectric elements of the present invention does not experience as great a variance as experienced by air bearings when the gap between the polishing pad and the platen varies. Thus, if the polishing pad is pushed toward the platen in one area, the pressure in other areas of the pressurized membrane or piezoelectric elements are not as affected as other areas would be when utilizing an air bearing.
- Figure 1 illustrates an exemplary prior art CMP system
- Figure 2 is a detailed view of a conventional wafer head and platen configuration
- FIG. 3 is a diagram showing a platen configuration, in accordance with an embodiment of the present invention.
- FIG. 4 is a detailed diagram showing a platen configuration, in accordance with an embodiment of the present invention.
- Figure 5 is a diagram showing a platen configuration having varied annular bladders, in accordance with an embodiment of the present invention.
- Figure 6A is a top view of an annular bladder configuration, in accordance with an embodiment of the present invention.
- Figure 6B is a top view showing an annular bladder configuration, in accordance with an embodiment of the present invention.
- Figure 7 is a diagram showing a platen configuration, in accordance with an embodiment of the present invention.
- Figure 8 is a top view of a piezoelectric element configuration, in accordance with an embodiment of the present invention.
- FIG. 9 is an illustration showing a CMP system, in accordance with an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
- An invention for improved performance in a CMP process using pressurized membranes and piezoelectric elements as replacements for a platen air bearing.
- a pressurized membrane is provided, which provides zonal control during the CMP process via concentric bladders.
- piezoelectric elements are provided atop a platen, which provide zonal control during the CMP process.
- FIG. 3 is a diagram showing a platen configuration 300, in accordance with an embodiment of the present invention.
- the platen configuration 300 includes a wafer head 302 having a retaining ring 304 and a wafer 306 positioned below the wafer head 302.
- the platen configuration 300 also includes a platen 308 disposed below a polishing belt 310.
- the platen 308 includes a pressurized membrane 312 pressurized via annular bladders 314.
- each bladder 314 may be individually pressurized via an air source.
- the annular bladders 314 improve performance in the CMP process by providing increased zonal control to the pressurized membrane 312.
- the pressurized membrane 312 of the embodiments of the present invention greatly reduces the amount of air needed during the CMP process.
- a CMP process using the pressurized membrane 312 of the present invention is not as sensitive to conditions as conventional CMP processes utilizing air bearings. Unlike air bearings, the pressure of the pressurized membrane 312 of the present invention does not experience as great a variance as experienced by air bearings when the gap between the polishing pad 310 and the platen 308 varies. Thus, if the polishing pad 310 is pushed toward the platen 308 in one area, the pressure in other areas of the pressurized membrane 312 are not as affected as other areas would be when utilizing an air bearing because the bladders are decoupled from each other.
- FIG 4 is a detailed diagram showing a platen configuration 400, in accordance with an embodiment of the present invention.
- the platen configuration 400 shows a polishing belt 310 positioned above a platen 308 having a pressurized membrane 312 pressurized by annular bladders 314.
- each annular bladder 314 comprises a thin tubular material 402.
- the tubular material 402 of each annular bladder 314 is pressurized via air.
- the tubular material 402 can be pressurized utilizing any other means capable of pressurizing an annular bladder 314, such as a fluid, as will be apparent to those skilled in the art.
- the pressurized membrane 312 preferably comprises a smooth, flexible material.
- Suitable materials include; polyurethane, silicon, thin metals (e.g., stainless steel), peek, and
- the annular bladders 314 provide increased zonal control during a CMP process.
- the size of the annular bladders 314 within the pressurized membrane 312 can be varied, as described in greater detail subsequently.
- FIG. 5 is a diagram showing a platen configuration 500 having varied annular bladders, in accordance with an embodiment of the present invention.
- the platen configuration
- 500 includes a platen 308 having a pressurized membrane 312 pressurized via annular bladders
- the platen configuration 500 includes annular bladders 314 having varying sizes.
- the annular bladders 314 decrease in size as the annular bladders 314 approach the edge of the platen 308. Generally, during a CMP process, more difficulty occurs within about 10-15 mm of the wafer edge. For this reason, one embodiment of the present invention increases resolution near the wafer edge by decreasing the size of the annular bladders 314 near the edge of the platen 308. Similarly, since the center of the wafer typically requires less resolution, the central annular bladders 314 often are larger than those at the edge of the platen 308.
- FIG. 6A is a top view of an annular bladder configuration 600a in accordance with an embodiment of the present invention.
- the annular bladder configuration 600a includes concentric annular bladders 314a.
- each concentric annular bladder 314a of the annular bladder configuration 600a forms a complete circle about the center of the platen.
- each annular bladder 314a can be individually pressurized to provide zonal control during the CMP process.
- the length of each annular bladder can be reduced, as discussed next with reference to Figure 6B.
- FIG. 6B is a top view showing an annular bladder configuration 600b in accordance with an embodiment of the present invention.
- the annular bladder configuration 600b includes concentric annular bladders 314b. Unlike the embodiment of Figure 6A, each concentric annular bladder 314b of the annular bladder configuration 600b does not form a complete circle about the center of the platen.
- Each concentric annular bladder 314b of the annular bladder configuration 600b varies in size depending on a particular annular bladder's 314 proximity to the edge of the platen.
- one embodiment of the present invention increases resolution near the wafer edge by decreasing the size of the annular bladders 314b near the edge of the platen. Similarly, since the center of the wafer typically requires less resolution, the central annular bladders 314b often are larger than those at the edge of the platen.
- embodiments of the present invention improve performance in CMP applications by providing increased zonal control via a membrane pressurized using internal annular bladders.
- Other embodiments of the present invention also improve performance in CMP applications by providing increased zonal control via piezoelectric transducers.
- FIG. 7 is a diagram showing a platen configuration 700, in accordance with an embodiment of the present invention.
- the platen configuration 700 includes a wafer head 302 disposed above a wafer 306, and having a retaining ring 304.
- a platen 308 is positioned below the polishing belt 310.
- the platen 308 of the platen configuration 700 includes a plurality of piezoelectric elements 702 disposed below the polishing belt 310. During operation, the platen 308 is placed against the polishing pad or belt 310 that polishes the surface of the wafer 306. To promote polishing uniformity, each piezoelectric element 702 may be individually activated to apply zonal force to the polishing pad.
- the piezoelectric elements 702 improve performance in the CMP process by providing increased zonal control to the polishing belt 310. Unlike a conventional air bearing, the piezoelectric elements 702 of the embodiments of the present invention greatly reduce the amount of air needed during the CMP process.
- a CMP process using the piezoelectric elements 702 of the present invention is not as sensitive to conditions as conventional CMP processes utilizing air bearings. Unlike air bearings, the force exerted by the piezoelectric elements 702 of the present invention does not experience as great a variance as experienced by air bearings when the gap between the polishing pad 310 and the platen 308 varies. Thus, if the polishing pad 310 is pushed toward the platen 308 in one area, the force exerted on the polishing belt 310 by other piezoelectric elements 702 is not as affected as other areas would be when utilizing an air bearing.
- FIG 8 is a top view of a piezoelectric element configuration 800, in accordance with an embodiment of the present invention.
- the piezoelectric element 702 configuration 800 includes concentric piezoelectric elements 702. Similar to the annular bladder configuration of Figure 6A, in one embodiment of the present invention, each concentric piezoelectric element 702 forms a complete circle about the center of the platen. However, to further increase zonal control during the CMP process, the length of each piezoelectric element 702 can be reduced, as shown Figure 8. Unlike the embodiment of Figure 6A, each concentric piezoelectric element 702 of the piezoelectric element configuration 800 does not form a complete circle about the center of the platen. Each concentric piezoelectric element 702 of the piezoelectric element configuration
- one embodiment of the present invention increases resolution near the wafer edge by decreasing the size of the piezoelectric elements 702 near the edge of the platen. Similarly, since the center of the wafer typically requires less resolution, the central piezoelectric elements 702 often are larger than those at the edge of the platen.
- the embodiments of the present invention make physical contact with the polishing belt during the CMP process. As result, wear on the platen may be increased do to friction from the polishing belt. To provide additional protection from wear to the platen, a sacrificial material can be positioned between the platen and the polishing belt, as discussed next with reference to Figure 9.
- FIG 9 is an illustration showing a CMP system 900, in accordance with an embodiment of the present invention.
- the CMP system 900 in Figure 9 is a belt-type system having an endless polishing belt 310 mounted on two drums 910, which drive the polishing belt 310 in a rotational motion as indicated by belt rotation directional arrows 906.
- a wafer 306 is mounted on the wafer head 302, which is rotated in direction 908. The rotating wafer 306 is then applied against the rotating polishing belt 310 with a force F to accomplish a CMP process.
- Some CMP processes require significant force F to be applied.
- a platen 308, having piezoelectric elements 702 is provided to stabilize the polishing belt 310 and to provide a solid surface onto which to apply the wafer 306.
- Slurry 904 composing of an aqueous solution such as N ⁇ 4 OH or DI containing dispersed abrasive particles is introduced upstream of the wafer 306.
- the process of scrubbing, buffing and polishing of the surface of the wafer is achieved by using an endless polishing pad glued to the polishing belt 310.
- the polishing pad is composed of porous or fibrous materials and lacks fix abrasives.
- Disposed between platen 308 and the polishing belt 310 is a sacrificial material 914 fed roll-to-roll over the platen 308 via rollers 916.
- the sacrificial material 914 is fed slowly over the platen 308 to provide protection from wear.
- the sacrificial material 914 is indexed as the CMP process progresses. In this manner, the sacrificial material 914 is worn, rather than the material of the platen 308. Hence, the piezoelectric elements 702 or the pressurized membrane are protected from wear caused by the friction of the rotating polishing belt 310.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002551130A JP4225465B2 (en) | 2000-12-21 | 2001-12-21 | Polishing platen with pressure membrane |
EP01992420A EP1349704B1 (en) | 2000-12-21 | 2001-12-21 | Polishing platen with pressurized membrane |
KR1020037007699A KR100855536B1 (en) | 2000-12-21 | 2001-12-21 | Polishing platen with pressurized membrane |
AU2002232889A AU2002232889A1 (en) | 2000-12-21 | 2001-12-21 | Polishing platen with pressurized membrane |
DE60104903T DE60104903T2 (en) | 2000-12-21 | 2001-12-21 | POLISHING DISC WITH PRESSURIZED MEMBRANE |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/747,844 US20020081945A1 (en) | 2000-12-21 | 2000-12-21 | Piezoelectric platen design for improving performance in CMP applications |
US09/747,845 | 2000-12-21 | ||
US09/747,844 | 2000-12-21 | ||
US09/747,845 US6607425B1 (en) | 2000-12-21 | 2000-12-21 | Pressurized membrane platen design for improving performance in CMP applications |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002049805A1 true WO2002049805A1 (en) | 2002-06-27 |
WO2002049805A8 WO2002049805A8 (en) | 2004-03-04 |
Family
ID=31949946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/050625 WO2002049805A1 (en) | 2000-12-21 | 2001-12-21 | Polishing platen with pressurized membrane |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4225465B2 (en) |
KR (1) | KR100855536B1 (en) |
DE (1) | DE60104903T2 (en) |
TW (1) | TW576774B (en) |
WO (1) | WO2002049805A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100685744B1 (en) * | 2006-02-06 | 2007-02-22 | 삼성전자주식회사 | Platen assembly, wafer polishing apparatus having the same, and wafer polishing method |
JP2014053355A (en) * | 2012-09-05 | 2014-03-20 | Disco Abrasive Syst Ltd | Wafer processing method |
US10131175B2 (en) * | 2015-01-09 | 2018-11-20 | Murata Manufacturing Co., Ltd. | Printing plate, laminated ceramic electronic component producing method, and printer |
KR102319571B1 (en) * | 2017-03-06 | 2021-11-02 | 주식회사 케이씨텍 | Air bearing and apparatus for polishing substrate having the air bearing |
KR102015647B1 (en) * | 2017-03-24 | 2019-08-28 | 주식회사 케이씨텍 | Substrate transfer unit and substrate chemical mechinical polishing system comprising the same |
KR102318972B1 (en) * | 2017-03-28 | 2021-11-02 | 주식회사 케이씨텍 | Apparatus for polishing substrate |
KR101998405B1 (en) * | 2017-06-07 | 2019-07-09 | 주식회사 케이씨텍 | Substrate transfer unit and substrate chemical mechenical polishing device comprising the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03259520A (en) * | 1990-03-08 | 1991-11-19 | Nec Corp | Rotary polishing equipment |
US5888126A (en) * | 1995-01-25 | 1999-03-30 | Ebara Corporation | Polishing apparatus including turntable with polishing surface of different heights |
EP0920956A2 (en) * | 1997-11-05 | 1999-06-09 | Aplex, Inc. | Polishing apparatus and method |
-
2001
- 2001-12-19 TW TW090131593A patent/TW576774B/en not_active IP Right Cessation
- 2001-12-21 WO PCT/US2001/050625 patent/WO2002049805A1/en active IP Right Grant
- 2001-12-21 JP JP2002551130A patent/JP4225465B2/en not_active Expired - Fee Related
- 2001-12-21 KR KR1020037007699A patent/KR100855536B1/en not_active IP Right Cessation
- 2001-12-21 DE DE60104903T patent/DE60104903T2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03259520A (en) * | 1990-03-08 | 1991-11-19 | Nec Corp | Rotary polishing equipment |
US5888126A (en) * | 1995-01-25 | 1999-03-30 | Ebara Corporation | Polishing apparatus including turntable with polishing surface of different heights |
EP0920956A2 (en) * | 1997-11-05 | 1999-06-09 | Aplex, Inc. | Polishing apparatus and method |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 064 (E - 1167) 18 February 1992 (1992-02-18) * |
Also Published As
Publication number | Publication date |
---|---|
DE60104903D1 (en) | 2004-09-16 |
DE60104903T2 (en) | 2005-09-08 |
KR100855536B1 (en) | 2008-09-01 |
TW576774B (en) | 2004-02-21 |
JP4225465B2 (en) | 2009-02-18 |
WO2002049805A8 (en) | 2004-03-04 |
JP2004521488A (en) | 2004-07-15 |
KR20030063409A (en) | 2003-07-28 |
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