WO2002044699A3 - Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung - Google Patents

Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung Download PDF

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Publication number
WO2002044699A3
WO2002044699A3 PCT/EP2001/014005 EP0114005W WO0244699A3 WO 2002044699 A3 WO2002044699 A3 WO 2002044699A3 EP 0114005 W EP0114005 W EP 0114005W WO 0244699 A3 WO0244699 A3 WO 0244699A3
Authority
WO
WIPO (PCT)
Prior art keywords
properties
determining
integrated circuit
circuit
design
Prior art date
Application number
PCT/EP2001/014005
Other languages
English (en)
French (fr)
Other versions
WO2002044699A2 (de
Inventor
Christian K Kalus
Iouri Malov
Original Assignee
Sigma C Gmbh
Christian K Kalus
Iouri Malov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sigma C Gmbh, Christian K Kalus, Iouri Malov filed Critical Sigma C Gmbh
Priority to US10/433,250 priority Critical patent/US7302090B2/en
Priority to DE50111874T priority patent/DE50111874D1/de
Priority to EP01989545A priority patent/EP1337838B1/de
Priority to AU2002227965A priority patent/AU2002227965A1/en
Priority to JP2002546194A priority patent/JP4216592B2/ja
Priority to KR1020037007344A priority patent/KR100846018B1/ko
Publication of WO2002044699A2 publication Critical patent/WO2002044699A2/de
Publication of WO2002044699A3 publication Critical patent/WO2002044699A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

Verfahren zur rechnerischen Bestimmung von Eigenschaften, insbesondere der Integrität, einer integrierten Schaltung, wobei ein rechnerisch simuliertes Bild der Schaltung mit einem Entwurf der Schaltung verglichen, und Abweichungen zwischen Bild und Entwurf festgestellt werden.
PCT/EP2001/014005 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung WO2002044699A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/433,250 US7302090B2 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit
DE50111874T DE50111874D1 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung
EP01989545A EP1337838B1 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung
AU2002227965A AU2002227965A1 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit
JP2002546194A JP4216592B2 (ja) 2000-11-30 2001-11-30 集積回路の特性を測定するプロセスと装置
KR1020037007344A KR100846018B1 (ko) 2000-11-30 2001-11-30 집적 회로의 특성 측정 장치 및 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10059516.2 2000-11-30
DE10059516 2000-11-30

Publications (2)

Publication Number Publication Date
WO2002044699A2 WO2002044699A2 (de) 2002-06-06
WO2002044699A3 true WO2002044699A3 (de) 2002-09-19

Family

ID=7665267

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2001/014005 WO2002044699A2 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung
PCT/EP2001/014004 WO2002045014A2 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/014004 WO2002045014A2 (de) 2000-11-30 2001-11-30 Verfahren und vorrichtung zur bestimmung von eigenschaften einer integrierten schaltung

Country Status (7)

Country Link
US (1) US7302090B2 (de)
EP (1) EP1337838B1 (de)
JP (1) JP4216592B2 (de)
KR (1) KR100846018B1 (de)
AU (2) AU2002227965A1 (de)
DE (1) DE50111874D1 (de)
WO (2) WO2002044699A2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100979484B1 (ko) * 2002-07-15 2010-09-02 케이엘에이-텐코 코포레이션 다른 리소그래픽 과정 변수들을 위한 레티클의 가상 이미지를 얻는 것을 포함하는 결점 조사 방법
US7698665B2 (en) 2003-04-06 2010-04-13 Luminescent Technologies, Inc. Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern
US7480889B2 (en) * 2003-04-06 2009-01-20 Luminescent Technologies, Inc. Optimized photomasks for photolithography
US7124394B1 (en) * 2003-04-06 2006-10-17 Luminescent Technologies, Inc. Method for time-evolving rectilinear contours representing photo masks
JP4351928B2 (ja) * 2004-02-23 2009-10-28 株式会社東芝 マスクデータの補正方法、フォトマスクの製造方法及びマスクデータの補正プログラム
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2007536673A (ja) * 2004-05-09 2007-12-13 メンター・グラフィクス・コーポレーション 見込み欠陥位置同定方法、見込み欠陥位置同定ツール
US7251807B2 (en) * 2005-02-24 2007-07-31 Synopsys, Inc. Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model
US7707541B2 (en) * 2005-09-13 2010-04-27 Luminescent Technologies, Inc. Systems, masks, and methods for photolithography
WO2007041600A2 (en) 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Mask-pattern determination using topology types
WO2007041602A2 (en) 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Lithography verification using guard bands
US7793253B2 (en) 2005-10-04 2010-09-07 Luminescent Technologies, Inc. Mask-patterns including intentional breaks
WO2007044557A2 (en) 2005-10-06 2007-04-19 Luminescent Technologies, Inc. System, masks, and methods for photomasks optimized with approximate and accurate merit functions
KR101285967B1 (ko) * 2005-11-18 2013-07-12 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
US8160350B2 (en) * 2006-02-01 2012-04-17 Applied Materials Israel, Ltd. Method and system for evaluating a variation in a parameter of a pattern
WO2007147826A1 (en) * 2006-06-23 2007-12-27 Sagantec Israel Ltd Layout processing system
WO2008039674A2 (en) 2006-09-20 2008-04-03 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8331645B2 (en) * 2006-09-20 2012-12-11 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8006203B2 (en) * 2008-08-28 2011-08-23 Synopsys, Inc. Bulk image modeling for optical proximity correction
US8551283B2 (en) 2010-02-02 2013-10-08 Apple Inc. Offset control for assembling an electronic device housing
US8463016B2 (en) * 2010-02-05 2013-06-11 Luminescent Technologies, Inc. Extending the field of view of a mask-inspection image
US8612903B2 (en) 2010-09-14 2013-12-17 Luminescent Technologies, Inc. Technique for repairing a reflective photo-mask
US8555214B2 (en) 2010-09-14 2013-10-08 Luminescent Technologies, Inc. Technique for analyzing a reflective photo-mask
US8458622B2 (en) 2010-11-29 2013-06-04 Luminescent Technologies, Inc. Photo-mask acceptance technique
US8386968B2 (en) 2010-11-29 2013-02-26 Luminescent Technologies, Inc. Virtual photo-mask critical-dimension measurement
US9005852B2 (en) 2012-09-10 2015-04-14 Dino Technology Acquisition Llc Technique for repairing a reflective photo-mask
US8653454B2 (en) 2011-07-13 2014-02-18 Luminescent Technologies, Inc. Electron-beam image reconstruction
US9091935B2 (en) 2013-03-11 2015-07-28 Kla-Tencor Corporation Multistage extreme ultra-violet mask qualification
US9494854B2 (en) 2013-03-14 2016-11-15 Kla-Tencor Corporation Technique for repairing an EUV photo-mask
US11798157B2 (en) 2019-10-11 2023-10-24 The Regents Of The University Of Michigan Non-destructive imaging techniques for integrated circuits and other applications

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801954A (en) * 1996-04-24 1998-09-01 Micron Technology, Inc. Process for designing and checking a mask layout
WO1999014706A2 (en) * 1997-09-17 1999-03-25 Numerical Technologies, Inc. Visual inspection and verification system
US6081659A (en) * 1997-05-08 2000-06-27 Lsi Logic Corporation Comparing aerial image to actual photoresist pattern for masking process characterization
US6091845A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801954A (en) * 1996-04-24 1998-09-01 Micron Technology, Inc. Process for designing and checking a mask layout
US6081659A (en) * 1997-05-08 2000-06-27 Lsi Logic Corporation Comparing aerial image to actual photoresist pattern for masking process characterization
WO1999014706A2 (en) * 1997-09-17 1999-03-25 Numerical Technologies, Inc. Visual inspection and verification system
US6091845A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask

Also Published As

Publication number Publication date
KR20040022201A (ko) 2004-03-11
DE50111874D1 (de) 2007-02-22
AU2002238409A1 (en) 2002-06-11
WO2002044699A2 (de) 2002-06-06
EP1337838B1 (de) 2007-01-10
US7302090B2 (en) 2007-11-27
KR100846018B1 (ko) 2008-07-11
JP4216592B2 (ja) 2009-01-28
JP2004514938A (ja) 2004-05-20
US20040136587A1 (en) 2004-07-15
EP1337838A2 (de) 2003-08-27
AU2002227965A1 (en) 2002-06-11
WO2002045014A2 (de) 2002-06-06

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