WO2002041378A2 - Semiconductor structure and process for fabricating same - Google Patents

Semiconductor structure and process for fabricating same Download PDF

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Publication number
WO2002041378A2
WO2002041378A2 PCT/US2001/031989 US0131989W WO0241378A2 WO 2002041378 A2 WO2002041378 A2 WO 2002041378A2 US 0131989 W US0131989 W US 0131989W WO 0241378 A2 WO0241378 A2 WO 0241378A2
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monocrystalline
layer
alkaline earth
substrate
earth metal
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PCT/US2001/031989
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French (fr)
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WO2002041378A3 (en
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Zhiyi Yu
Jamal Ramdani
Ravindranath Droopad
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Motorola, Inc.
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Priority to AU2002214580A priority Critical patent/AU2002214580A1/en
Publication of WO2002041378A2 publication Critical patent/WO2002041378A2/en
Publication of WO2002041378A3 publication Critical patent/WO2002041378A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158—Making the insulator
    • H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51—Insulating materials associated therewith
    • H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
    • H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51—Insulating materials associated therewith
    • H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2

Definitions

  • This invention relates generally to semiconductor structures and devices and to a method for their fabrication, and more specifically to semiconductor structures and devices and to the fabrication and use of semiconductor structures, devices, and integrated circuits that include an epitaxially grown, high dielectric constant oxide to reduce leakage current density.
  • Epitaxial growth of single crystal oxide thin films on silicon is of great interest in numerous device applications, such as, for example, ferroelectric devices, nonvolatile high density memory devices and next-generation MOS devices. Also, in the preparation of these films, it is pivotal to establish an ordered transition layer or buffer layer on the silicon surface for the subsequent growth of the single crystal oxides, such as, for example, perovskites.
  • Some of these oxides such as BaO and BaTi0 3 were formed on silicon (100) using a BaSi 2 (cubic) template by depositing one fourth monolayer of Ba on silicon (100) using molecular beam epitaxy at temperatures greater than 850°C.
  • a BaSi 2 (cubic) template by depositing one fourth monolayer of Ba on silicon (100) using molecular beam epitaxy at temperatures greater than 850°C.
  • R. McKee et al. Appl. Phys. Lett. 59(7), p. 782-784 (12 Aug. 1991); R. McKee et al., Appl. Phys. Lett. 63(20), p. 2818-2820 (15 Nov. 1993); R. McKee et al., Mat. Res. Soc. Symp. Proc, Vol. 21 , p. 131-135 (1991); U.S.
  • Patent No. 5,225,031 issued July 6, 1993, entitled “PROCESS FOR DEPOSITING AN OXIDE EPITAXIALLY ONTO A SILICON SUBSTRATE AND STRUCTURES PREPARED WITH THE PROCESS”; and U.S. Patent No. 5,482,003, issued January 9, 1996, entitled “PROCESS FOR DEPOSITING EPITAXIAL ALKALINE EARTH OXIDE ONTO A SUBSTRATE AND STRUCTURES PREPARED WITH THE PROCESS.”
  • a strontium suicide (SrSi 2 ) interface model with a c(4x2) structure was proposed. See, e.g., R. McKee et al., Phys. Rev. Lett. 81 (14), 3014 (5 Oct. 1998). Atomic level simulation of this proposed structure, however, indicates that it likely is not stable at elevated temperatures.
  • SrTi0 3 on silicon (100) using an SrO buffer layer has been accomplished. See, e.g., T. Tambo et al., Jpn. J. Appl. Phys., Vol. 37, p. 4454- 4459 (1998).
  • the SrO buffer layer was thick (100 A), thereby limiting application for transistor films, and crystallinity was not maintained throughout the growth.
  • SrTi0 3 has been grown on silicon using thick oxide layers (60- 120 A) of SrO or TiO. See, e.g., B.K. Moon et al., Jpn. J. Appl. Phys., Vol. 33, p. 1472-1477 (1994). These thick buffer layers, however, would limit the application for transistors.
  • these types of oxide layers are fabricated using molecular oxygen and are formed thin (i.e., less than 50 A). Accordingly, a result is leaky films in which high electrical leakage is experienced due to oxygen deficiencies or vacancies. Furthermore, these films require a post-growth anneal in oxygen to reduce leakage current density across the oxide layer.
  • a high dielectric constant oxide such as (A) y (Ti x M ⁇ - x ) ⁇ - y ⁇ 3 , wherein A is an alkaline earth metal or a combination of alkaline earth metals and M is a metallic or semi-metallic element.
  • FIG. 1 illustrates schematically, in cross section, a semiconductor structure fabricated in accordance with one embodiment of the present invention
  • FIG. 2 illustrates schematically, in cross section, a semiconductor device structure fabricated in accordance with an alternative embodiment of the present invention
  • FIG. 3 illustrates schematically, in cross section, a MOS device structure in accordance with a further embodiment of the present invention.
  • the present invention provides a method of fabricating a high dielectric constant oxide on a semiconductor structure using a high dielectric constant oxide such as (A) y (Ti x M ⁇ - ⁇ ) ⁇ -y0 3 , wherein A is an alkaline earth metal or a combination of alkaline earth metals and M is a metallic or semi-metallic element.
  • A is an alkaline earth metal or a combination of alkaline earth metals
  • M is a metallic or semi-metallic element.
  • the following example illustrates a process, in accordance with one embodiment of the invention, for fabricating such a semiconductor structure having a low leakage current density.
  • the process starts by providing a monocrystalline semiconductor substrate comprising, for example, silicon and/or germanium.
  • the semiconductor substrate is a silicon wafer having a (100) orientation.
  • the substrate may be oriented on axis or, at most, about 0.5° off axis. At least a portion of the semiconductor substrate has a bare surface, although other portions of the substrate, as described below, may encompass other structures.
  • bare in this context means that the surface in the portion of the substrate has been cleaned to remove any oxides, contaminants, or other foreign material.
  • bare silicon is highly reactive and readily forms a native oxide.
  • bare is intended to encompass such a native oxide.
  • a thin silicon oxide may also be intentionally grown on the semiconductor substrate, although such a grown oxide is not essential to the process in accordance with the invention.
  • the native oxide layer is first removed to expose the crystalline structure of the underlying substrate.
  • the following process is generally carried out by molecular beam epitaxy (MBE), although other processes, such as those outlined below, may also be used in accordance with the present invention.
  • MBE molecular beam epitaxy
  • the native oxide can be removed by first thermally depositing a thin layer of strontium, barium, a combination of strontium and barium, or other alkaline earth metals or combinations of alkaline earth metals in an MBE apparatus. In the case where strontium is used, the substrate is then heated to a temperature of about 750°C to cause the strontium to react with the native silicon oxide layer.
  • the strontium serves to reduce the silicon oxide to leave a silicon oxide-free surface.
  • the resultant surface which exhibits an ordered 2x1 structure, includes strontium, oxygen, and silicon.
  • the ordered 2x1 structure forms a template for the ordered growth of an overlying layer of a monocrystalline oxide.
  • the template provides the necessary chemical and physical properties to nucleate the crystalline growth of an overlying layer.
  • the native silicon oxide can be converted and the substrate surface can be prepared for the growth of a monocrystalline oxide layer by depositing an alkaline earth metal oxide, such as strontium oxide, strontium barium oxide, or barium oxide, onto the substrate surface by MBE at a low temperature and by subsequently heating the structure to a temperature of about 750°C. At this temperature, a solid state reaction takes place between the strontium oxide and the native silicon oxide causing the reduction of the native silicon oxide and leaving an ordered 2x1 structure with strontium, oxygen, and silicon remaining on the substrate surface. Again, this forms a template for the subsequent growth of an ordered monocrystalline oxide layer.
  • an alkaline earth metal oxide such as strontium oxide, strontium barium oxide, or barium oxide
  • the substrate is cooled to a temperature in the range of about 200-800°C and a layer of strontium titanate is grown on the template layer by molecular beam epitaxy.
  • the MBE process is initiated by opening shutters in the MBE apparatus to expose strontium, titanium and oxygen sources.
  • the ratio of strontium and titanium is approximately 1 :1.
  • the partial pressure of oxygen is initially set at a minimum value to grow stoichiometric strontium titanate at a growth rate of about 0.3-0.5 nm per minute. After initiating growth of the strontium titanate, the partial pressure of oxygen is increased above the initial minimum value.
  • the process described above illustrates a process for forming a semiconductor structure including a silicon substrate and an overlying oxide layer by the process of molecular beam epitaxy.
  • the process can also be carried out by the process of chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), migration enhanced epitaxy (MEE), atomic layer epitaxy (ALE), physical vapor deposition (PVD), chemical solution deposition (CSD), pulsed laser deposition (PLD), or the like.
  • CVD chemical vapor deposition
  • MOCVD metal organic chemical vapor deposition
  • MEE migration enhanced epitaxy
  • ALE atomic layer epitaxy
  • PVD physical vapor deposition
  • CSSD chemical solution deposition
  • PLD pulsed laser deposition
  • FIG. 1 illustrates schematically, in cross section, a structure 100 in accordance with an exemplary embodiment of the present invention.
  • Structure 100 may be a device such as, for example, a component for a MOS device or any high dielectric constant device.
  • Structure 100 includes a monocrystalline semiconductor substrate 101.
  • Substrate 101 may comprise any suitable monocrystalline semiconductor material, such as, for example, silicon (Si), germanium (Ge), silicon germanium (Si-Ge), or gallium arsenide (GaAs).
  • substrate 101 comprises a monocrystalline silicon wafer.
  • Substrate 101 may optionally include a plurality of material layers such that the composite substrate may be tailored to the quality, performance, and manufacturing requirements of a variety of semiconductor device applications.
  • a monocrystalline oxide transition layer 102 is optionally formed overlying substrate 101.
  • Monocrystalline oxide transition layer 102 when present, may comprise a monocrystalline oxide material selected for its crystalline compatibility with the underlying substrate and with any overlying material layers.
  • layer 102 may comprise, for example, barium titanate (BaTi0 3 ), strontium titanate (SrTi0 3 ), or barium strontium titanate (Sr z Ba ⁇ . z Ti0 3 , 0>z>1).
  • layer 102 is a layer of SrTi0 3 having a thickness of about 1 - 10 monolayers.
  • a template layer 105 Prior to forming layer 102, a template layer 105 is formed overlying substrate 101. Template layer may include 1 - 10 monolayers of silicon, oxygen, and an element suitable to successfully grow layer 102. For example, if layer 102 is formed of SrTi0 3 , a suitable template layer may be Si-O-Sr.
  • a monocrystalline oxide insulating layer 103 is formed overlying transition layer 102. If transition layer 102 is not present, insulating layer 103 may be formed overlying template layer 105. Layer 103 is formed by substitutionally incorporating an additional element into a monocrystalline oxide, such as an alkaline earth metal titanate, during formation of the layer. For example, during a molecular beam epitaxy growth process of SrTi0 3 or BaTi0 3 thin films on a silicon substrate, additional acceptor material sources can be used simultaneously with the Sr, Ba, Ti, and oxidant sources during epitaxial growth of the layer. The amount of additional material desired in the layer may be chosen such that the leakage current in the oxide film is minimized. Thus, the as- grown oxide film will exhibit insulative properties and will not require further treatment in oxygen.
  • layer 103 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of A y (Ti x M ⁇ - ⁇ ) ⁇ -y ⁇ 3 , where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0 ⁇ x ⁇ 1 , 0 ⁇ y ⁇ 1.
  • the concentration of the additional element in layer 103 may be chosen such that' the leakage current in the monocrystalline oxide film is minimized, or otherwise selected in accordance with the quality, performance, and/or manufacturing requirements of the device.
  • the concentration of additional element incorporated into alkaline earth metal titanate layer 103 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration ⁇ i.e., 0 ⁇ x ⁇ 0.5).
  • concentrations of alkaline earth metal, titanium, and additional elements in layer 103 may be achieved by establishing different flux rates for each of the materials during epitaxial growth of the alkaline earth metal titanate layer.
  • the thickness of layer 103 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm.
  • layers 102 and 103 may comprise a gate dielectric for a high dielectric constant semiconductor device
  • a conductive gate electrode 104 may be formed overlying layer 103 in accordance with techniques well known to those skilled in the art.
  • Electrode 104 may be formed of any suitable conductive material, such as, for example, platinum.
  • FIG. 2 illustrates schematically, in cross section, a semiconductor device structure 200 fabricated in accordance with one alternative embodiment of the present invention, wherein semiconductor device structure 200 comprises a MOS device.
  • Structure 200 includes a monocrystalline semiconductor substrate 201 , such as a monocrystalline silicon wafer.
  • Drain region 202 and source region 203 are formed in substrate 201 using techniques well known to those skilled in the art, such as, for example, selective n-type doping via ion implantation.
  • regions 202 and 203 are N+ doped at a concentration of at least 1 E19 atoms per cubic centimeter to enable ohmic contacts to be formed.
  • a channel region 204 is defined by drain region 202 and source region 203 as the portion of substrate 201 between regions 202 and 203.
  • a template layer 205 is formed overlying substrate 201 in channel region 204.
  • Template layer 205 may include 1 - 10 monolayers of silicon, oxygen, and an element suitable to successfully grow layer 206.
  • a suitable template layer 205 may comprise Si-O-Sr.
  • a monocrystalline oxide insulating layer 206 is formed overlying template layer 205.
  • layer 206 is formed by substitutionally incorporating an additional element into an alkaline earth metal titanate during formation of the layer.
  • Layer 206 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0 ⁇ x ⁇ 1 , 0 ⁇ y ⁇ 1.
  • the concentration of additional element incorporated into alkaline earth metal titanate layer 206 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration ⁇ i.e., 0 ⁇ x ⁇ 0.5). Moreover, the thickness of layer 206 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm.
  • a conductive gate electrode 207 is formed overlying insulating layer 206 in accordance with techniques well known to those skilled in the art. Gate electrode 207 may be formed of any suitable conductive material, such as, for example, platinum.
  • FIG. 3 illustrates schematically, in cross section, a semiconductor device structure 300 fabricated in accordance with a further alternative embodiment of the present invention, wherein semiconductor device structure 300 comprises a MOS device.
  • Structure 300 includes a monocrystalline semiconductor substrate 301 , preferably a monocrystalline silicon wafer.
  • Drain region 302 and source region 303 are formed in substrate 301 using techniques well known to those skilled in the art, such as, for example, selective n-type doping via ion implantation.
  • regions 302 and 303 are N+ doped at a concentration of at least 1 E19 atoms per cubic centimeter to enable ohmic contacts to be formed.
  • a channel region 304 is defined by drain region 302 and source region 303 as the portion of substrate 301 between regions 302 and 303.
  • a template layer 305 is formed overlying substrate 301 in channel region 304.
  • Template layer 305 may be formed in accordance with the above description or in accordance with any other conventional techniques.
  • template layer 305 may include oxygen and an alkaline earth metal element suitable to successfully grow an overlying monocrystalline oxide layer, such as an alkaline earth metal titanate layer.
  • template layer 305 is formed of 1 - 10 monolayers of Sr-O, Ba-O, or Sr- Ba-O.
  • a monocrystalline oxide transition layer 306 may be epitaxially grown overlying template layer 305 in channel region 304.
  • Monocrystalline oxide transition layer 306, when present, may comprise, for example, barium titanate (BaTi0 3 ), strontium titanate (SrTi0 3 ), or barium strontium titanate (Sr z Ba- ⁇ - z Ti0 3 , 0>z>1).
  • layer 306 is a layer of SrTi0 3 having a thickness of about 1 - 10 monolayers.
  • a monocrystalline oxide insulating layer 307 is formed overlying transition layer 306.
  • insulating layer 307 may be formed overlying substrate 301 or template layer 305.
  • layer 307 is formed by substitutionally incorporating an additional element into an alkaline earth metal titanate during formation of the layer.
  • Layer 307 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of A y (Ti x M ⁇ - ⁇ ) ⁇ - y 0 3 , where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0 ⁇ x ⁇ 1 , 0 ⁇ y ⁇ 1.
  • the concentration of additional element incorporated into alkaline earth metal titanate layer 307 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration ⁇ i.e., 0 ⁇ x ⁇ 0.5).
  • the thickness of layer 307 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm.
  • a conductive gate electrode 308 is formed overlying insulating layer 307 in accordance with techniques well known to those skilled in the art. Gate electrode 308 may be formed of any suitable conductive material, such as, for example, platinum.

Abstract

A structure and method for forming a high dielectric constant device structure includes a monocrystalline semiconductor substrate (101) and an insulating layer (103) formed of an epitaxially grown oxide such as (A)y(TixM1-x)1-yO3, wherein A is an alkaline earth metal or a combination of alkaline earth metals and M is a metallic or semi-metallic element. Semiconductor devices formed in accordance with the present invention exhibit low leakage current density.

Description

SEM1CONDUCTOR STRUCTURE AND PROCESS FOR FABRICATING SAME
FIELD OF THE INVENTION
This invention relates generally to semiconductor structures and devices and to a method for their fabrication, and more specifically to semiconductor structures and devices and to the fabrication and use of semiconductor structures, devices, and integrated circuits that include an epitaxially grown, high dielectric constant oxide to reduce leakage current density.
BACKGROUND OF THE INVENTION
Epitaxial growth of single crystal oxide thin films on silicon is of great interest in numerous device applications, such as, for example, ferroelectric devices, nonvolatile high density memory devices and next-generation MOS devices. Also, in the preparation of these films, it is pivotal to establish an ordered transition layer or buffer layer on the silicon surface for the subsequent growth of the single crystal oxides, such as, for example, perovskites.
Some of these oxides, such as BaO and BaTi03 were formed on silicon (100) using a BaSi2 (cubic) template by depositing one fourth monolayer of Ba on silicon (100) using molecular beam epitaxy at temperatures greater than 850°C. See, e.g., R. McKee et al., Appl. Phys. Lett. 59(7), p. 782-784 (12 Aug. 1991); R. McKee et al., Appl. Phys. Lett. 63(20), p. 2818-2820 (15 Nov. 1993); R. McKee et al., Mat. Res. Soc. Symp. Proc, Vol. 21 , p. 131-135 (1991); U.S. Patent No. 5,225,031 , issued July 6, 1993, entitled "PROCESS FOR DEPOSITING AN OXIDE EPITAXIALLY ONTO A SILICON SUBSTRATE AND STRUCTURES PREPARED WITH THE PROCESS"; and U.S. Patent No. 5,482,003, issued January 9, 1996, entitled "PROCESS FOR DEPOSITING EPITAXIAL ALKALINE EARTH OXIDE ONTO A SUBSTRATE AND STRUCTURES PREPARED WITH THE PROCESS." A strontium suicide (SrSi2) interface model with a c(4x2) structure was proposed. See, e.g., R. McKee et al., Phys. Rev. Lett. 81 (14), 3014 (5 Oct. 1998). Atomic level simulation of this proposed structure, however, indicates that it likely is not stable at elevated temperatures.
Growth of SrTi03 on silicon (100) using an SrO buffer layer has been accomplished. See, e.g., T. Tambo et al., Jpn. J. Appl. Phys., Vol. 37, p. 4454- 4459 (1998). However, the SrO buffer layer was thick (100 A), thereby limiting application for transistor films, and crystallinity was not maintained throughout the growth.
Furthermore, SrTi03 has been grown on silicon using thick oxide layers (60- 120 A) of SrO or TiO. See, e.g., B.K. Moon et al., Jpn. J. Appl. Phys., Vol. 33, p. 1472-1477 (1994). These thick buffer layers, however, would limit the application for transistors.
In CMOS applications, these types of oxide layers are fabricated using molecular oxygen and are formed thin (i.e., less than 50 A). Accordingly, a result is leaky films in which high electrical leakage is experienced due to oxygen deficiencies or vacancies. Furthermore, these films require a post-growth anneal in oxygen to reduce leakage current density across the oxide layer.
Accordingly, a need exists for a method for fabricating a high dielectric constant oxide on a semiconductor structure having low leakage current density. It is a purpose of the present invention to provide for a method of fabricating a high dielectric constant oxide on a semiconductor structure having low leakage current density.
It is a further purpose of the present invention to provide for a method of fabricating a high dielectric constant oxide on a semiconductor structure in which the gate dielectric leakage current density is near zero.
It is another purpose of the present invention to provide for a method of fabricating a high dielectric constant semiconductor device structure using a high dielectric constant oxide such as (A)y(TixMι-x)ι-yθ3, wherein A is an alkaline earth metal or a combination of alkaline earth metals and M is a metallic or semi-metallic element.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example and not limitation in the accompanying figures, in which like references indicate similar elements, and in which:
FIG. 1 illustrates schematically, in cross section, a semiconductor structure fabricated in accordance with one embodiment of the present invention; FIG. 2 illustrates schematically, in cross section, a semiconductor device structure fabricated in accordance with an alternative embodiment of the present invention; and
FIG. 3 illustrates schematically, in cross section, a MOS device structure in accordance with a further embodiment of the present invention.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention.
DETAILED DESCRIPTION OF THE DRAWINGS
The present invention provides a method of fabricating a high dielectric constant oxide on a semiconductor structure using a high dielectric constant oxide such as (A)y(TixMι-χ)ι-y03, wherein A is an alkaline earth metal or a combination of alkaline earth metals and M is a metallic or semi-metallic element. The following example illustrates a process, in accordance with one embodiment of the invention, for fabricating such a semiconductor structure having a low leakage current density. The process starts by providing a monocrystalline semiconductor substrate comprising, for example, silicon and/or germanium. In accordance with one embodiment of the invention, the semiconductor substrate is a silicon wafer having a (100) orientation. The substrate may be oriented on axis or, at most, about 0.5° off axis. At least a portion of the semiconductor substrate has a bare surface, although other portions of the substrate, as described below, may encompass other structures. The term "bare" in this context means that the surface in the portion of the substrate has been cleaned to remove any oxides, contaminants, or other foreign material. As is well known, bare silicon is highly reactive and readily forms a native oxide. The term "bare," as used herein, is intended to encompass such a native oxide. A thin silicon oxide may also be intentionally grown on the semiconductor substrate, although such a grown oxide is not essential to the process in accordance with the invention. In order to epitaxially grow a monocrystalline oxide layer overlying the monocrystalline substrate, the native oxide layer is first removed to expose the crystalline structure of the underlying substrate. The following process is generally carried out by molecular beam epitaxy (MBE), although other processes, such as those outlined below, may also be used in accordance with the present invention. The native oxide can be removed by first thermally depositing a thin layer of strontium, barium, a combination of strontium and barium, or other alkaline earth metals or combinations of alkaline earth metals in an MBE apparatus. In the case where strontium is used, the substrate is then heated to a temperature of about 750°C to cause the strontium to react with the native silicon oxide layer. The strontium serves to reduce the silicon oxide to leave a silicon oxide-free surface. The resultant surface, which exhibits an ordered 2x1 structure, includes strontium, oxygen, and silicon. The ordered 2x1 structure forms a template for the ordered growth of an overlying layer of a monocrystalline oxide. The template provides the necessary chemical and physical properties to nucleate the crystalline growth of an overlying layer.
In accordance with an alternate embodiment of the invention, the native silicon oxide can be converted and the substrate surface can be prepared for the growth of a monocrystalline oxide layer by depositing an alkaline earth metal oxide, such as strontium oxide, strontium barium oxide, or barium oxide, onto the substrate surface by MBE at a low temperature and by subsequently heating the structure to a temperature of about 750°C. At this temperature, a solid state reaction takes place between the strontium oxide and the native silicon oxide causing the reduction of the native silicon oxide and leaving an ordered 2x1 structure with strontium, oxygen, and silicon remaining on the substrate surface. Again, this forms a template for the subsequent growth of an ordered monocrystalline oxide layer.
Following the removal of the silicon oxide from the surface of the substrate, in accordance with one embodiment of the invention, the substrate is cooled to a temperature in the range of about 200-800°C and a layer of strontium titanate is grown on the template layer by molecular beam epitaxy. The MBE process is initiated by opening shutters in the MBE apparatus to expose strontium, titanium and oxygen sources. The ratio of strontium and titanium is approximately 1 :1. The partial pressure of oxygen is initially set at a minimum value to grow stoichiometric strontium titanate at a growth rate of about 0.3-0.5 nm per minute. After initiating growth of the strontium titanate, the partial pressure of oxygen is increased above the initial minimum value.
The process described above illustrates a process for forming a semiconductor structure including a silicon substrate and an overlying oxide layer by the process of molecular beam epitaxy. The process can also be carried out by the process of chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), migration enhanced epitaxy (MEE), atomic layer epitaxy (ALE), physical vapor deposition (PVD), chemical solution deposition (CSD), pulsed laser deposition (PLD), or the like.
FIG. 1 illustrates schematically, in cross section, a structure 100 in accordance with an exemplary embodiment of the present invention. Structure 100 may be a device such as, for example, a component for a MOS device or any high dielectric constant device. Structure 100 includes a monocrystalline semiconductor substrate 101. Substrate 101 may comprise any suitable monocrystalline semiconductor material, such as, for example, silicon (Si), germanium (Ge), silicon germanium (Si-Ge), or gallium arsenide (GaAs). In one embodiment, substrate 101 comprises a monocrystalline silicon wafer. Substrate 101 may optionally include a plurality of material layers such that the composite substrate may be tailored to the quality, performance, and manufacturing requirements of a variety of semiconductor device applications.
A monocrystalline oxide transition layer 102 is optionally formed overlying substrate 101. Monocrystalline oxide transition layer 102, when present, may comprise a monocrystalline oxide material selected for its crystalline compatibility with the underlying substrate and with any overlying material layers. In an exemplary embodiment, layer 102 may comprise, for example, barium titanate (BaTi03), strontium titanate (SrTi03), or barium strontium titanate (SrzBaι.zTi03, 0>z>1). In one embodiment, layer 102 is a layer of SrTi03 having a thickness of about 1 - 10 monolayers. Prior to forming layer 102, a template layer 105 is formed overlying substrate 101. Template layer may include 1 - 10 monolayers of silicon, oxygen, and an element suitable to successfully grow layer 102. For example, if layer 102 is formed of SrTi03, a suitable template layer may be Si-O-Sr.
In the embodiment of the invention illustrated in FIG. 1 , a monocrystalline oxide insulating layer 103 is formed overlying transition layer 102. If transition layer 102 is not present, insulating layer 103 may be formed overlying template layer 105. Layer 103 is formed by substitutionally incorporating an additional element into a monocrystalline oxide, such as an alkaline earth metal titanate, during formation of the layer. For example, during a molecular beam epitaxy growth process of SrTi03 or BaTi03 thin films on a silicon substrate, additional acceptor material sources can be used simultaneously with the Sr, Ba, Ti, and oxidant sources during epitaxial growth of the layer. The amount of additional material desired in the layer may be chosen such that the leakage current in the oxide film is minimized. Thus, the as- grown oxide film will exhibit insulative properties and will not require further treatment in oxygen.
In an exemplary embodiment, layer 103 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of Ay(TixMι-χ)ι-yθ3, where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0<x<1 , 0<y<1. The concentration of the additional element in layer 103 may be chosen such that' the leakage current in the monocrystalline oxide film is minimized, or otherwise selected in accordance with the quality, performance, and/or manufacturing requirements of the device. In an exemplary embodiment, the concentration of additional element incorporated into alkaline earth metal titanate layer 103 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration {i.e., 0<x<0.5). Various relative concentrations of alkaline earth metal, titanium, and additional elements in layer 103 may be achieved by establishing different flux rates for each of the materials during epitaxial growth of the alkaline earth metal titanate layer. Moreover, the thickness of layer 103 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm.
In FIG. 1 , insofar as layers 102 and 103 may comprise a gate dielectric for a high dielectric constant semiconductor device, a conductive gate electrode 104 may be formed overlying layer 103 in accordance with techniques well known to those skilled in the art. Electrode 104 may be formed of any suitable conductive material, such as, for example, platinum.
FIG. 2 illustrates schematically, in cross section, a semiconductor device structure 200 fabricated in accordance with one alternative embodiment of the present invention, wherein semiconductor device structure 200 comprises a MOS device. Structure 200 includes a monocrystalline semiconductor substrate 201 , such as a monocrystalline silicon wafer. Drain region 202 and source region 203 are formed in substrate 201 using techniques well known to those skilled in the art, such as, for example, selective n-type doping via ion implantation. In one aspect of this embodiment, regions 202 and 203 are N+ doped at a concentration of at least 1 E19 atoms per cubic centimeter to enable ohmic contacts to be formed. A channel region 204 is defined by drain region 202 and source region 203 as the portion of substrate 201 between regions 202 and 203.
In one embodiment, a template layer 205 is formed overlying substrate 201 in channel region 204. Template layer 205 may include 1 - 10 monolayers of silicon, oxygen, and an element suitable to successfully grow layer 206. For example, if layer 206 is formed of SrTi03, a suitable template layer 205 may comprise Si-O-Sr.
A monocrystalline oxide insulating layer 206 is formed overlying template layer 205. As with layer 103 (FIG. 1), layer 206 is formed by substitutionally incorporating an additional element into an alkaline earth metal titanate during formation of the layer. Layer 206 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of
Figure imgf000008_0001
where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0<x<1 , 0<y<1. In an exemplary embodiment, the concentration of additional element incorporated into alkaline earth metal titanate layer 206 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration {i.e., 0<x<0.5). Moreover, the thickness of layer 206 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm. In this embodiment, where device 200 is a MOS device, a conductive gate electrode 207 is formed overlying insulating layer 206 in accordance with techniques well known to those skilled in the art. Gate electrode 207 may be formed of any suitable conductive material, such as, for example, platinum.
FIG. 3 illustrates schematically, in cross section, a semiconductor device structure 300 fabricated in accordance with a further alternative embodiment of the present invention, wherein semiconductor device structure 300 comprises a MOS device. Structure 300 includes a monocrystalline semiconductor substrate 301 , preferably a monocrystalline silicon wafer. Drain region 302 and source region 303 are formed in substrate 301 using techniques well known to those skilled in the art, such as, for example, selective n-type doping via ion implantation. In one aspect of this embodiment, regions 302 and 303 are N+ doped at a concentration of at least 1 E19 atoms per cubic centimeter to enable ohmic contacts to be formed. A channel region 304 is defined by drain region 302 and source region 303 as the portion of substrate 301 between regions 302 and 303. In this embodiment, a template layer 305 is formed overlying substrate 301 in channel region 304. Template layer 305 may be formed in accordance with the above description or in accordance with any other conventional techniques. For example, template layer 305 may include oxygen and an alkaline earth metal element suitable to successfully grow an overlying monocrystalline oxide layer, such as an alkaline earth metal titanate layer. In one aspect of an embodiment of the invention, template layer 305 is formed of 1 - 10 monolayers of Sr-O, Ba-O, or Sr- Ba-O.
A monocrystalline oxide transition layer 306 may be epitaxially grown overlying template layer 305 in channel region 304. Monocrystalline oxide transition layer 306, when present, may comprise, for example, barium titanate (BaTi03), strontium titanate (SrTi03), or barium strontium titanate (SrzBa-ι-zTi03, 0>z>1). In one embodiment, layer 306 is a layer of SrTi03 having a thickness of about 1 - 10 monolayers. In the embodiment of the invention illustrated in FIG. 3, a monocrystalline oxide insulating layer 307 is formed overlying transition layer 306. If transition layer 306 is not present, insulating layer 307 may be formed overlying substrate 301 or template layer 305. As with layer 103 (FIG. 1), layer 307 is formed by substitutionally incorporating an additional element into an alkaline earth metal titanate during formation of the layer. Layer 307 is formed by epitaxially growing by a process of molecular beam epitaxy a layer of Ay(TixMι-χ)ι-y03, where A is an alkaline earth metal, M is an additional element, such as aluminum (Al), silicon (Si), erbium (Er), lanthanum (La), gallium (Ga), or indium (In), and 0<x<1 , 0<y<1. In an exemplary embodiment, the concentration of additional element incorporated into alkaline earth metal titanate layer 307 may range from greater than 0 to less than about 50 atomic percent of the titanium concentration {i.e., 0<x<0.5). Moreover, the thickness of layer 307 may vary widely according to the desired application of the semiconductor device, but is generally in the range of from about 5 - 100 nm. In this embodiment, where device 300 is a MOS device, a conductive gate electrode 308 is formed overlying insulating layer 307 in accordance with techniques well known to those skilled in the art. Gate electrode 308 may be formed of any suitable conductive material, such as, for example, platinum. In the foregoing specification, the invention has been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of present invention.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential features or elements of any or all the claims. As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Further, no element described herein is essential to the practice of the invention unless expressly described as "essential" or "required."

Claims

1. A high dielectric constant device structure comprising: a monocrystalline semiconductor substrate; and a monocrystalline insulating layer overlying the substrate, the insulating layer comprising
Figure imgf000011_0001
where A is an alkaline earth metal, M is an element selected from the group consisting of Al, Si, Er, La, Ga, and In, and 0<x<1 , 0<y<1.
2. The structure of claim 1 wherein the alkaline earth metal is selected from the group consisting of Ba, Sr, and combinations of Ba and Sr.
3. The structure of claim 1 further comprising a monocrystalline transition layer comprising an alkaline earth metal titanate underlying the monocrystalline insulating layer.
4. The structure of claim 3 wherein the monocrystalline transition layer comprises (Ba,Sr)Ti03.
5. The structure of claim 3 wherein the monocrystalline transition layer has a thickness of less than about 1 nm.
6. The structure of claim 1 wherein the monocrystalline insulating layer has an equivalent silicon dioxide thickness of less than about 1.5 nm.
7. The structure of claim 1 further comprising a conductive electrode formed overlying the monocrystalline insulating layer.
8. The structure of claim 7 further comprising an electrically conductive region formed in the substrate.
9. The structure of claim 1 wherein the monocrystalline semiconductor substrate comprises a semiconductor material selected from the group consisting of Si, Ge, Si-Ge, and GaAs.
10. The structure of claim 1 wherein the monocrystalline semiconductor substrate comprises a layer of semiconductor material selected from the group consisting of InGaAs, InAIAs, AIGaAs, and InGaP.
11. The structure of claim 1 wherein x is less than 1 and greater than or equal to 0.5.
12. The structure of claim 1 further comprising a template layer overlying the monocrystalline semiconductor substrate.
13. The structure of claim 12 wherein the template layer comprises 1 - 10 monolayers comprising oxygen and an alkaline earth metal element.
14. A high dielectric constant device structure comprising: a monocrystalline semiconductor substrate; and a monocrystalline oxide layer epitaxially grown overlying the substrate, the monocrystalline oxide layer comprising an alkaline earth metal titanate incorporating an additional material to increase the bandgap of the monocrystalline oxide layer.
15. The device structure of claim 14 wherein the monocrystalline oxide layer comprises less than 50 atomic percent of the additional material relative to the titanium concentration.
16. The device structure of claim 14 wherein the alkaline earth metal titanate comprises (Ba,Sr)Ti03 and the additional material comprises Al.
17. The device structure of claim 14 wherein the substrate comprises a semiconductor material selected from the group consisting of Si, Ge, Si-Ge, GaAs, AIGaAs, InAIAs, InGaAs, and InGaP.
18. The device structure of claim 14 further comprising a platinum electrode overlying the monocrystalline oxide layer.
19. The device structure of claim 14 wherein the monocrystalline oxide layer comprises less than 10 atomic percent of the additional material relative to the titanium concentration.
20. The device structure of claim 14 further comprising a monocrystalline transition layer underlying the monocrystalline oxide layer, the transition layer comprising an undoped alkaline earth metal titanate.
21. A high dielectric constant semiconductor device structure comprising: a monocrystalline silicon substrate; source, drain, and channel regions of a MOS transistor formed in the substrate; a monocrystalline gate dielectric epitaxially formed overlying the channel region, the gate dielectric comprising (A)y(TixMι-x)-ι-yθ3 where A is an alkaline earth metal, M is an element selected from the group consisting of Al, Si, Er, La, Ga, and In, and x is less than 1 and greater than or equal to 0.5 and y is greater than zero and less than 1 ; and a gate electrode overlying the gate dielectric.
22. The semiconductor device structure of claim 21 wherein the alkaline earth metal comprises an element selected from the group consisting of Ba, Sr, and Ba and Sr.
23. A process for fabricating a high dielectric constant device structure comprising the steps of: providing a monocrystalline semiconductor substrate; epitaxially growing, by a process selected from the group consisting of molecular beam epitaxy, chemical vapor deposition, metal organic chemical vapor deposition, migration enhanced epitaxy, atomic layer epitaxy, physical vapor deposition, chemical solution deposition, and pulsed laser deposition, a layer of monocrystalline alkaline earth metal titanate; and during the step of epitaxially growing, incorporating into the layer of monocrystalline alkaline earth metal titanate an additional element selected from the group consisting of Al, Si, Er, La, Ga, and In.
24. The process of claim 23 wherein the step of incorporating comprises incorporating to a concentration greater than 0 and less than 50 atomic percent of the titanium concentration.
25. The process of claim 23 wherein the step of incorporating is initiated after first growing a transition layer of monocrystalline alkaline earth metal titanate without any incorporated additional element.
26. The process of claim 23 further comprising the step of forming an electrically conductive region in the substrate.
27. The process of claim 23 further comprising the step of depositing a conductive electrode overlying the layer of monocrystalline alkaline earth metal titanate.
28. The process of claim 23 wherein the step of providing a semiconductor substrate comprises the step of providing a substrate comprising a bulk substrate selected from the group consisting of Si, Ge, Si-Ge, and GaAs.
29. The process of claim 23 further comprising the step of forming a template layer on the semiconductor substrate prior to the step of epitaxially growing.
30. The process of claim 29 wherein the step of forming a template layer comprises depositing 1 - 10 monolayers comprising oxygen and an alkaline earth metal element.
31. The process of claim 23 wherein the step of incorporating comprises incorporating to a concentration greater than 0 and less than 10 atomic percent of the titanium concentration.
32. A process for fabricating a semiconductor device structure comprising the steps of: providing a monocrystalline silicon substrate; forming a MOS device at least partially in the substrate; epitaxially growing by a process of molecular beam epitaxy a monocrystalline gate dielectric insulator layer comprising (Ba,Sr)Ti03 incorporating an element selected from the group consisting of Al, Si, Er, La, Ga, and In, the gate dielectric insulator overlying the MOS device; and depositing by physical vapor deposition a gate electrode overlying the gate dielectric insulator layer.
33. The process of claim 32 further comprising the step of forming a template layer on the substrate prior to the step of epitaxially growing.
34. The process of claim 33 wherein the step of forming a template layer comprises the step of forming 1 - 10 monolayers comprising silicon, oxygen, and an element selected from the group consisting of barium and strontium.
35. The process of claim 32 further comprising the step of epitaxially growing, by a process of molecular beam epitaxy, a monocrystalline transition layer comprising (Ba,Sr)Ti03 underlying the gate dielectric layer.
36. The process of claim 32 wherein the step of epitaxially growing comprises epitaxially growing a layer of (Ba,Sr)Ti03 incorporating Al to a concentration up to 10 atomic percent of the titanium concentration.
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