WO2002039099A3 - Measurement of surface defects - Google Patents

Measurement of surface defects Download PDF

Info

Publication number
WO2002039099A3
WO2002039099A3 PCT/EP2001/013042 EP0113042W WO0239099A3 WO 2002039099 A3 WO2002039099 A3 WO 2002039099A3 EP 0113042 W EP0113042 W EP 0113042W WO 0239099 A3 WO0239099 A3 WO 0239099A3
Authority
WO
WIPO (PCT)
Prior art keywords
lines
inspection
light source
measurement
interference pattern
Prior art date
Application number
PCT/EP2001/013042
Other languages
French (fr)
Other versions
WO2002039099A2 (en
Inventor
Teunis W Tukker
Hooft Gert W T
Original Assignee
Koninkl Philips Electronics Nv
Teunis W Tukker
Hooft Gert W T
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Teunis W Tukker, Hooft Gert W T filed Critical Koninkl Philips Electronics Nv
Priority to JP2002541373A priority Critical patent/JP2004513364A/en
Priority to EP01993826A priority patent/EP1336094A2/en
Publication of WO2002039099A2 publication Critical patent/WO2002039099A2/en
Publication of WO2002039099A3 publication Critical patent/WO2002039099A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Abstract

A device (1) for the inspection of one or a plurality of moving surfaces (8), more particularly for the inspection of a rotating surface (8) of a silicon wafer (13). The device comprises at least a laser light source (1) and a beam splitter (4) for splitting a light beam (2) that is emitted by said light source (1) into at least two sub-beams (5, 6) that interfere with one another so as to produce an interference pattern (10) on the surface (8) to be inspected. The device is arranged so that the interference pattern (10) contains a plurality of lines (11) of maximum intensity and lines (12) of minimum intensity, said lines extending essentially transversely of the direction of movement of the surface (8).
PCT/EP2001/013042 2000-11-13 2001-11-08 Measurement of surface defects WO2002039099A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002541373A JP2004513364A (en) 2000-11-13 2001-11-08 Measurement of surface defects
EP01993826A EP1336094A2 (en) 2000-11-13 2001-11-08 Measurement of surface defects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00203979 2000-11-13
EP00203979.0 2000-11-13

Publications (2)

Publication Number Publication Date
WO2002039099A2 WO2002039099A2 (en) 2002-05-16
WO2002039099A3 true WO2002039099A3 (en) 2003-02-13

Family

ID=8172263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/013042 WO2002039099A2 (en) 2000-11-13 2001-11-08 Measurement of surface defects

Country Status (4)

Country Link
US (1) US20020191179A1 (en)
EP (1) EP1336094A2 (en)
JP (1) JP2004513364A (en)
WO (1) WO2002039099A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6597446B2 (en) * 2001-03-22 2003-07-22 Sentec Corporation Holographic scatterometer for detection and analysis of wafer surface deposits
TWI280128B (en) 2002-05-22 2007-05-01 Smithkline Beecham Corp 3'-[(2Z)-[1-(3,4- dimethylphenyl)-1,5-dihydro-3-methyl-5-oxo-4H-pyrazol-4-ylidene]hydrazino]-2'-hydroxy-[1,1'-biphenyl]-3-carboxylic acid bis-(monoethanolamine)
WO2006014152A1 (en) * 2004-07-01 2006-02-09 Midwest Research Institute Optic probe for semiconductor characterization
FR2927175B1 (en) * 2008-02-05 2011-02-18 Altatech Semiconductor DEVICE FOR INSPECTING SEMICONDUCTOR WAFERS
CN103018258B (en) * 2011-09-23 2015-11-25 深圳中科飞测科技有限公司 Wafer detection method and wafer detecting apparatus
FR3026484B1 (en) * 2014-09-29 2018-06-15 Altatech Semiconductor METHOD AND SYSTEM FOR INSPECTING TRANSPARENT PLATES FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
FR3026485B1 (en) 2014-09-29 2016-09-23 Altatech Semiconductor METHOD AND SYSTEM FOR INSPECTING PLATELETS FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
FR3049710B1 (en) * 2016-03-31 2020-06-19 Unity Semiconductor LASER DOPPLER EFFECT INSPECTION METHOD AND SYSTEM FOR MICROELECTRONICS OR OPTICS
FR3076618B1 (en) * 2018-01-05 2023-11-24 Unity Semiconductor METHOD AND SYSTEM FOR OPTICAL INSPECTION OF A SUBSTRATE
EP4202423A1 (en) 2021-12-23 2023-06-28 Unity Semiconductor A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
US5502001A (en) * 1990-12-19 1996-03-26 Hitachi, Ltd. Method of forming light beam and method of fabricating semiconductor integrated circuits
WO1997034124A1 (en) * 1996-03-14 1997-09-18 Phase Metrics, Inc. Optical surface detection for magnetic disks
US5698069A (en) * 1995-09-10 1997-12-16 Nikon Precision Inc. Technique for detecting particles on a wafer support surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
US4334779A (en) * 1980-08-04 1982-06-15 Canadian Patents & Dev. Limited Non-contact optical apparatus for measuring the length or speed of a relatively moving surface
US4794265A (en) * 1987-05-08 1988-12-27 Qc Optics, Inc. Surface pit detection system and method
JP2711140B2 (en) * 1989-06-08 1998-02-10 三菱電機株式会社 Fine particle measuring device
JPH0427848A (en) * 1990-05-23 1992-01-30 Hitachi Electron Eng Co Ltd Sample scanning system of foreign matter inspection apparatus
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502001A (en) * 1990-12-19 1996-03-26 Hitachi, Ltd. Method of forming light beam and method of fabricating semiconductor integrated circuits
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
US5698069A (en) * 1995-09-10 1997-12-16 Nikon Precision Inc. Technique for detecting particles on a wafer support surface
WO1997034124A1 (en) * 1996-03-14 1997-09-18 Phase Metrics, Inc. Optical surface detection for magnetic disks

Also Published As

Publication number Publication date
US20020191179A1 (en) 2002-12-19
WO2002039099A2 (en) 2002-05-16
JP2004513364A (en) 2004-04-30
EP1336094A2 (en) 2003-08-20

Similar Documents

Publication Publication Date Title
US7916287B2 (en) Surface inspection method and surface inspection apparatus
EP1014036A3 (en) Device and procedure to examine an object
WO2003021352A1 (en) Reticle and optical characteristic measuring method
TW359852B (en) Apparatus for measuring an aerial image using transmitted light and reflected light
WO2002039099A3 (en) Measurement of surface defects
WO2000045196A3 (en) Method and device for optically examining structured surfaces of objects
GB2291500A (en) Inspection interferometer with scanning feature
WO2003078976A3 (en) Excimer laser inspection system
TW368714B (en) Method and apparatus for inspecting high-precision patterns
WO2009112704A8 (en) Device for the inspection of semiconductor wafers
CA2334225A1 (en) Method and device for opto-electrical acquisition of shapes by axial illumination
DE602005027211D1 (en) SURFACE ANALYSIS OF A LONG OBJECT
WO2002042754A3 (en) Measurement of surface defects
US11860091B2 (en) Apparatus and method for in-situ optical inspection of laser-induced surface modifications and laser process control
BR0205972B1 (en) "process for measuring distances on a metal strip"
ATE162306T1 (en) METHOD AND APPARATUS FOR INSPECTION
CA2038334A1 (en) Apparatus and method for detecting the power level in single and multi-stripe integrated lasers
SG11201808303YA (en) Method and system for inspecting boards for microelectronics or optics by laser doppler effect
WO2004029545A3 (en) Method and apparatus for determining the wavelength of an input light beam
JPS55101002A (en) Inspecting method for mirror face body
WO2002040976A3 (en) Inspection of surfaces
CN1197511A (en) Method and device for detecting surface flaws on metallurgical products
JPS5667739A (en) Defect inspecting apparatus
WO2003021237A3 (en) Method and device for measuring translational movements between a surface and a measuring device
ATE316355T1 (en) STEREO OPHTALMOSCOPE WITH LIMITED COHERENCE

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

WWE Wipo information: entry into national phase

Ref document number: 2001993826

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10169819

Country of ref document: US

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2002 541373

Kind code of ref document: A

Format of ref document f/p: F

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 2001993826

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2001993826

Country of ref document: EP