WO2002037572A1 - Reseau a pointes, circuit non, et circuit electronique contenant ceux-ci - Google Patents
Reseau a pointes, circuit non, et circuit electronique contenant ceux-ci Download PDFInfo
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- WO2002037572A1 WO2002037572A1 PCT/JP2001/009464 JP0109464W WO0237572A1 WO 2002037572 A1 WO2002037572 A1 WO 2002037572A1 JP 0109464 W JP0109464 W JP 0109464W WO 0237572 A1 WO0237572 A1 WO 0237572A1
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- circuit
- point contact
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Classifications
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- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5614—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using conductive bridging RAM [CBRAM] or programming metallization cells [PMC]
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- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
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- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
- H01L29/242—AIBVI or AIBVII compounds, e.g. Cu2O, Cu I
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/54—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements of vacuum tubes
- H03K17/545—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements of vacuum tubes using microengineered devices, e.g. field emission devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
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- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of the switching material, e.g. layer deposition
- H10N70/028—Formation of the switching material, e.g. layer deposition by conversion of electrode material, e.g. oxidation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8416—Electrodes adapted for supplying ionic species
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8822—Sulfides, e.g. CuS
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
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- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
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- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/81—Array wherein the array conductors, e.g. word lines, bit lines, are made of nanowires
Definitions
- the present invention is directed to a point contact array, a NOT circuit, and an electronic circuit using the same, in which a plurality of elements that control or conduct by forming or cutting a point contact between opposing electrodes are provided.
- a method of controlling conductance by configuring a point contact is described in, for example, JK Gimz ews ki and R. Mo 11 er: Phy. Rev. B 36 (1 987) 1284, J. L, Costa-Kramer, N. Garcia, P. Garcia-Mochales, PA Serena, MI Marques and A. Corrcia: Phy s. Rev. B 55 (1 997) 5416, H. Ohnishi, Y. Kondo and K. Takayanagi: Naturé 395 (1998) 780 and the like.
- an AND circuit and an OR circuit can be configured using a diode that is a two-terminal element.
- All logic circuits can be configured with a combination of AND circuits, OR circuits, and NOT circuits. In other words, a three-terminal circuit was indispensable to construct an arbitrary logic circuit. These are described in detail, for example, in (I) Introductory Electronics Course (Nikkan Kogyo Shimbun), Digital Circuit, Vol. 2, pages 1 to 7.
- a first object of the present invention is to electrically and reversibly control the conductance between electrodes and to provide a point contact applicable to an arithmetic circuit, a logic circuit, a memory element, and the like.
- the purpose is to provide an array of point contacts.
- a second object of the present invention is to provide an N 0 T circuit using an nm-sized electronic element and an electronic circuit using the same.
- Point contact-An electronic element in an array that can control the conductance between electrodes composed of a first electrode made of a mixed conductive material having ion conductivity and electron conductivity and a second electrode made of a conductive substance. It is characterized by using a plurality of.
- the mixed conductive material having movable ions (M ions: M is a metal electron) is formed on the movable ion supply source (M). It is characterized by the following.
- the mixed conductor material is Ag 2 S, Ag 2 Se, Cu 2 S or Cu 2 Se. It is characterized by.
- the first electrode and the second electrode are formed by mobile ions contained in the mixed conductor material. It is characterized in that a bridge is formed between the electrodes and that the conductance between the electrodes changes.
- the point contact array according to [1], [2], [3], [4], [5], or [6], wherein at least a part of the point contact array is coated with a mixed conductive material.
- the quantized conductance of the point connection is used as an input signal, and by controlling the potential of each of the electrodes, addition or addition between the input signals is performed. It is characterized by performing subtraction.
- the NOT circuit is characterized in that it is configured using an atomic switch composed of two terminal elements.
- the atomic switch comprises a first electrode made of a mixed conductor material having ion conductivity and electron conductivity and a second electrode made of a conductive material. And an element capable of controlling the conductance between the first electrode and the second electrode.
- the mixed conductive material is Ag 2 S, Ag 2 Se, Cu 2 S, or Cu 2 Se.
- the conductance of the atomic switch is controlled by controlling a voltage applied to the atomic switch via the capacitor.
- FIG. 1 is a schematic perspective view showing a point contact array in which a plurality of point contacts according to the present invention are arranged.
- FIG. 2 is a schematic diagram showing a point contact array constituting the multiple storage memory according to the present invention.
- FIG. 3 is a diagram showing a read result of a multiplex-stored memory according to the first embodiment of the present invention.
- FIG. 4 is a diagram showing a calculation result of an adder circuit constituted by a point contact array according to a second embodiment of the present invention.
- FIG. 5 is a diagram showing a calculation result of a subtraction circuit constituted by a point contact array according to a third embodiment of the present invention.
- FIG. 6 is a schematic view of an R gate constituted by a point contact array showing a fourth embodiment of the present invention.
- FIG. 7 is a diagram showing an operation result of an OR gate constituted by a point contact array according to a fourth embodiment of the present invention.
- FIG. 8 is an equivalent circuit diagram of a point contact array logic circuit showing a fourth embodiment of the present invention.
- FIG. 9 is a schematic diagram of an AND gate constituted by point contacts according to a fifth embodiment of the present invention.
- FIG. 10 is a diagram showing a calculation result of an AND gate composed of a point contact array according to a fifth embodiment of the present invention.
- FIG. 11 is a view showing a method of manufacturing a point contact array according to a sixth embodiment of the present invention.
- FIG. 12 is a schematic view of a point contact array for controlling the conductivity of a semiconductor according to a seventh embodiment of the present invention.
- FIG. 13 is a schematic view of a point contact array having electrodes partially covered with a mixed conductor, showing an eighth embodiment of the present invention.
- FIG. 14 is a schematic diagram of a NOT circuit showing a ninth embodiment of the present invention.
- FIG. 15 is a diagram showing the operating principle of the NOT circuit according to the ninth embodiment of the present invention.
- FIG. 16 is a schematic diagram of a NOT circuit showing a tenth embodiment of the present invention.
- FIG. 17 is a diagram showing the operation principle of the NOT circuit showing the tenth embodiment of the present invention.
- FIG. 18 is a schematic diagram of a NOT circuit showing the eleventh embodiment of the present invention.
- FIG. 19 is a diagram showing the operating principle of the NOT circuit showing the eleventh embodiment of the present invention.
- FIG. 20 is a schematic diagram of a NOT circuit showing the 12th embodiment of the present invention.
- FIG. 21 is a schematic diagram of a binary one-digit adder showing a thirteenth embodiment of the present invention.
- FIG. 22 is a diagram showing a logical symbol display of a binary one-digit adder showing a thirteenth embodiment of the present invention.
- FIG. 23 is a diagram showing a truth table of a binary 1-digit adder showing a thirteenth embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a schematic perspective view showing a point contact array in which a plurality of point contacts according to the present invention are arranged.
- a movable ion (atom) 5 is formed at the intersection of a metal wire (first electrode) 2 covered with a mixed conductor 1 and metal wires 3 and 4 (second electrode).
- Point contacts (crosslinks) 6 and 7 are formed. These are set on an insulating substrate 8 and fixed by an insulating material (not shown).
- the conductance between the electrodes changes. Note that the amount of change depends on the amount of mobile ions that form a solid solution in the semiconductor or insulator material.
- Fig. 1 shows a point contact array consisting of one metal wire (first electrode) 2 and two metal wires (second electrodes) 3 and 4 covered with mixed conductor 1. It is shown.
- the number of point contacts is a multiplication of the number of metal wires constituting the electrode, and here, 2 ⁇ 1 point contacts are formed. If the number of metal wires constituting the first electrode and the second electrode is increased, an n ⁇ n point contact array can be formed.
- a voltage is applied between the first electrode 2 and the second electrodes 3 and 4 to form or eliminate the bridges 6 and 7 made of ionic atoms, thereby forming a point contact formed between the electrodes.
- To control the conductance More specifically, when an appropriate negative voltage is applied to the second electrodes 3 and 4 with respect to the first electrode 2, mobile ions (atoms) in the mixed conductor material are changed due to the effect of the voltage and the current. It precipitates and bridges 6 and 7 are formed between the electrodes. As a result, the conductance between the electrodes increases. Conversely, when an appropriate positive voltage is applied to the second electrodes 3 and 4, mobile ions (atoms) return to the mixed conductor material, and the bridges 6 and 7 disappear. That is, the conductance decreases.
- mixed conducting material A g 2 S a first electrode composed of the movable Ion source A g, although described an embodiment using a second electrode made of P t, the same also with other materials It goes without saying that the result is obtained.
- Crosslinking is sufficiently possible if there are about 10 Ag atoms. From the measurement results, when the voltage is 100 mV and the initial interelectrode resistance is 100 k ⁇ , the time required to extract 10 Ag atoms from the mixed conductor Ag 2 S, i.e., The required time was estimated at most tens of nanoseconds. The power required to form the bridge is as small as nanowatts. Therefore, according to the present invention, a high-speed and low-power-consumption device can be constructed.
- FIG. 2 is a schematic diagram of a point contact array applied to a multiple memory device according to the present invention.
- a sample consisting of two point contacts was used as in Fig. 1.
- Ag 2 S was used as the mixed conductor material 11 constituting the first electrode
- an Ag wire was used as the metal wire 10.
- Pt wires were used as metal wires 13 and 14 constituting the second electrode.
- the first electrode is grounded, and the voltages V 1 and V 2 are applied to the second electrodes 13 and 14 independently.
- VI and V2 When negative voltages are selected as VI and V2, Ag atoms 12 in the mixed conductor material 11 are precipitated, and crosslinks 15 and 16 are formed.
- VI and V2 are set to positive voltages, Ag atoms 12 in the bridges 15 and 16 return to the mixed conductive material 11 and the bridges 15 and 16 disappear.
- the conductance of the point contact is controlled by applying a pulse voltage. That is, in order to increase the conductance, a voltage of 5 OmV was applied for 5 ms. To reduce the conductance, a voltage of —5 OmV was applied for 5 ms. As a result, at each point contact, The transition between quantized conductances is realized. That is, this corresponds to a write operation as a memory.
- VI and 2 were set to 1 OmV so that the recorded conductance value did not change due to the reading operation.
- the currents I 1 and I 2 flowing through the metal wires 13 and 14 constituting the second electrode of each point contact were measured.
- Figure 3 shows the results.
- FIG. 3 in a thin solid line, it is shown 1 2 by a thick solid line.
- a write operation was performed on point contacts 15 to 16 every second, and the recorded state was read each time.
- the left vertical axis shows the actually measured current value, and the right vertical axis shows the corresponding quantization conductance. Conductance is obtained by dividing the measured current by the applied voltage (1 OmV).
- the conductance of each point contact is quantized. That is, the quantum number of the quantized I spoon conductance of a first point contact due to crosslinking 1 5, the quantum number of the quantized conductance of a second point contact due to crosslinking 1 6
- the recording density can be increased. It goes without saying that the recording density can be increased by increasing the number of point contacts.
- VI and V2 may be selected as voltages having the same absolute value and opposite polarities.
- 1 OMV as VI by setting an 1 OMV as a V2, current to correspond to quantization conductance corresponding to Ni -N 2 I. ut flows from the first electrode to the ground potential. At this time, if the direction of the current is from the first electrode to the ground potential, the calculation result has a positive value, and if the direction is from the ground potential to the first electrode, the calculation result has a negative value.
- FIG. 5 shows the calculation result of the third embodiment.
- Ni one N 2 is correct. Furthermore, the use of three or more points Con Takt, it is possible to perform operations such as + N 2 one N 3 at a time. For example, in this case, the calculation may be performed by setting VI and V2 to 1 OmV and 3 to -1 OmV.
- a logic circuit is configured using the point contacts of the present invention.
- the transition between the quantized conductance states at the point contact is not used. That is, a point contact is used as an on / off switching element.
- the on-state resistance is 1 or less, and the off-state resistance is 100 or more.
- FIG. 6 is a schematic diagram of an OR gate configured using the point contact of the present invention.
- Ag wires 21 and 22 are covered with Ag 2 S 23 and 24 to form the first electrode.
- a point contact is formed opposite to the Pt electrode 20, which is two electrodes.
- One end of the Pt electrode 20 is connected to a reference voltage V s via a resistor 27 (10 kQ in this embodiment), and the other end is an output terminal, which is the output voltage V. ut is output.
- the bridges 25 and 26 are formed or disappear, and the point contacts function as on / off switching elements.
- Fig. 7 shows the operation results.
- the input is changed every second, that is, VI and V2 are changed and the output V is changed. ut was measured.
- the output In a two-input OR gate, the output must be at the H igh level if either of the binarized inputs at the low level and the high level is at the high level.
- Fig. 7 (a) shows the result when operating at 0V as the Low level (same for the reference potential Vs) and at 20 OmV as the High level. According to this figure, when one of the two inputs VI and V 2 is 20 OmV, the output V. ut is about 20 OmV, indicating that it is operating normally. Similar results (FIG. 7 (b)) were obtained even when the High level voltage was increased to 50 OmV.
- FIG. 8 is a diagram showing an equivalent circuit of the present logic circuit.
- the bridges 25 and 26 are generated and disappear, and the resistance of the resistors R1 and R2 (the resistance of the point contact formed by the bridge) is reduced.
- the value changes.
- the resistance value of R2 is one order of magnitude smaller than that of R0, so V2 'is about 20 OmV (50 OmV).
- V 1 ′ is also almost 20 OmV (500 mV)
- a voltage was applied to bridge 24 (Fig. 6) to eliminate the bridge, and 1 became a large value of 1 ⁇ or more.
- V ⁇ ⁇ is about 20 OmV (50 OmV), which is the same as V 2 ′.
- the output is 20 OmV (50 OmV). Precisely, the growth of the bridge 25 and the cutting of the bridge 24 occur in parallel, leading to the results described above.
- VI is 20 OmV (50 OmV) and V2 is 0 V. If both VI and V2 are 20 OmV (50 OmV), the bridges 25 and 26 grow together, and the voltage of VI and V2, that is, 20 OmV (50 OmV) is output. Become.
- one end of the Ag wire 30 covered with the Ag 2 S thin film 31 is connected to the reference voltage Vs via the resistor 37.
- the other end is an output terminal.
- bridges 33 and 34 formed by the precipitation of Ag atoms, which are mobile ions, are formed toward the two Pt electrodes 35 and 36.
- the input voltages V1 and V2 are applied to the two Pt electrodes 35 and 36.
- reference numeral 32 denotes Ag ions in the Ag 2 S thin film 31.
- FIG. 10 shows the operation result of the AND gate. With a two-input AND gate, output V only when both inputs are High level. ut becomes High level.
- FIG. 10 (a) shows the result when the operation was performed with the High level set to 20 OmV. At this time, the reference voltage was also set to 20 OmV.
- Figure 10 (b) shows the results when operating with the High level set to 500 mV.
- the reference voltage at this time is 50 OmV.
- the reference voltage Vs is at the High level (200 to 50 OmV).
- VI and V2 are both 0 V
- the bridges 33 and 34 grow together, so that the resistance values of the resistors R1 and R2 are typically 1 or less. That is, output V is connected to the input voltage whose output terminal is at low level with a resistance value that is at least one digit smaller than resistance R 0 (10 kQ). ut becomes 0 V.
- V 1 is 0 V and V 2 is 20 OmV (50 OmV)
- only the bridge 33 (FIG. 9) grows.
- the bridge 34 has the voltage V 2 ′ / J lower than 200 mV (500 mV) due to the voltage V 1. That is, a voltage having a polarity that causes the bridge to disappear is applied, and the bridge 34 disappears, and the resistance value of R 2 increases to about 1 ⁇ . If the potential difference between V 2 'and V 2 at this time is small, the bridge is not sufficiently eliminated and the resistance value of R 2 is not sufficiently large, so that the above-mentioned half-way output may occur. . However, if the High-level voltage is set to 50001 ⁇ , the potential difference between ⁇ 2 'and V2 becomes sufficiently large, so that the device operates completely normally.
- V 1 is 20 OmV (50 OmV) and V 2 is 0 V.
- VI and V2 are 20 OmV (50 OmV)
- the formation and disappearance of the bridges 33 and 34 do not occur. Since all voltages are 20 OmV (50 OmV), the output voltage is also 20 OmV (50 OmV).
- FIG. 11 shows a method for manufacturing a point contact array according to a sixth embodiment of the present invention.
- Ag lines 4 1 on an insulating substrate 40, 42 is formed, and Iou the surface of its forming an Ag 2 3 film 43, 44.
- Pt line 4 5
- the present invention can be realized only by mounting the Pt lines 45 and 46 by a wiring device or the like.
- Ag may be vapor-deposited at the intersections in advance by vapor deposition using a mask or the like, or Ag atoms may be deposited by irradiating an Ag beam covered with an Ag 2 S film with an electron beam. Good les. What is important is that Ag exists between Ag 2 S forming the first electrode and Pt forming the second electrode.
- FIG. 12 is a schematic view of a point contact array for controlling the conductivity of a semiconductor according to a seventh embodiment of the present invention.
- Ag lines 51 and 52 also covered with Ag 2 S films 53 and 54 are formed on an insulating substrate 50.
- a semiconductor or insulator 57, 58, 59, 60 capable of dissolving Ag atoms is composed of 83 lines 51, 52 and Pt lines.
- Ag ions flow out of the Ag 2 S films 53, 54 according to the same principle as described above.
- the leached Ag ions form a semiconductor or insulator 57, 5 8, 59, and 60 can be dissolved to change the conductivity of the semiconductor or insulator, and the same effect as in the above-described embodiment can be realized.
- no space is required in the device for the generation and elimination of the cross-links, so that the device can be easily embedded in the insulating member.
- an Ag thin film is formed in advance instead of a semiconductor or an insulator, the structure becomes the same as that described in the sixth embodiment. In this case, the thin film disappears when the Ag atoms in the thin film Ag enter the Ag 2 S film.
- the semiconductor or insulator may be a solid solution of Ag ions, Ge S x, GeS e x, GeTe x, to crystals or non of WO x (0 rather x rather 1 00) A crystalline body was used.
- FIG. 13 shows an embodiment in which a part of the metal wiring as the first electrode is covered with the mixed conductor.
- the metal Z mixed conductor forming the first electrode / cross-linked or semiconductor / second electrode It is only necessary that a point contact composed of “metal constituting” is formed.
- the metal constituting the first electrode may be different from the portion in contact with the mixed conductor and the wiring material between the point contacts.
- Ag wires 79 and 80 are used for portions in contact with the mixed conductor (Ag 2 S) 77 and 78, and tungsten wires are used for other portions 81 to 83.
- the member in contact with the mixed conductor must be made of the same element as the mobile ion atoms in the mixed conductor. Therefore, in the present embodiment, since Ag 2 S was used as the mixed conductor, Ag was used as a member in contact with the mixed conductor.
- FIG. 14 is a schematic diagram of a NOT circuit showing a ninth embodiment of the present invention.
- a first electrode 102 that is a mixed conductor is formed on a conductive member 101.
- the mobile ions (atoms) 104 in the mixed conductor are transferred to the surface of the first electrode 102 as metal atoms. It is possible to control the precipitation or the solid solution of the deposited metal atoms as movable ions (atoms) in the first electrode 102. That is, when an appropriate negative voltage is applied to the second electrode 103 with respect to the first electrode 102, mobile ions (atoms) 104 in the mixed conductor material are precipitated due to the effects of voltage and current.
- a bridge 105 is formed between the electrodes 102 and 103. As a result, the resistance between the electrodes 102 and 103 decreases.
- the voltage VH / 2 corresponding to the high level of the output is applied to the second electrode 103 of the atomic switch via the resistor 106 (resistance value R1), and the capacitor 108 ( via the capacitor C 1), the input terminal V in is connected.
- the voltage VL corresponding to the low level of the output is applied to the conductive member 101 forming the first electrode 102 of the atomic switch via the resistor 107 (resistance value R 2). With output V. ut is connected.
- the present invention provides:
- the output V When using VL and VH as a high level input V in the mouth first level, the output V.
- VL ut is VH / 2
- the input V in is the output Vout when the VH the VL. That is, when the input is at a high level, the output is at a single level, and when the input is at a low level, the output is at a high level, thus operating as a NOT circuit.
- the NOT circuit can be formed by using other mixed conductors such as Ag 2 Se, Cu 2 S or Cu 2 Se and an atomic switch using a metal other than Pt.
- a two-terminal element is used by using an atomic switch, which is a two-terminal element composed of the first electrode 102 made of the mixed conductive material and the second electrode 103 made of the conductive material.
- an atomic switch which is a two-terminal element composed of the first electrode 102 made of the mixed conductive material and the second electrode 103 made of the conductive material.
- VH as a high-level input V in
- VL (0 V) as the mouth level one example
- the switching time ts is substantially determined by the capacitance C1 of the capacitor 108 and the resistance R1 of the resistor 106. For example, if the capacitance C 1 of the capacitor is 1 pF and the resistance R 1 is 10 ⁇ , switching on the order of GHz is possible.
- FIG. 15 (e) shows the potential difference between the electrodes 102 and 103 of the atomic switch.
- the potential difference between the electrodes 1 02, 1 03 ⁇ Tomitsukusu I Tutsi when the input V in is at the low level (VL) is substantially zero, on state of the atomic sweep rate Tutsi is kept stable.
- the potential difference between the electrodes 1 02, 1 03 atomic switch when the input V in is at the high level (VH) is a VH / 2, this is because Atomitsu Kusuitsuchi is a potential difference to be turned off, off The state is kept stable. That is, the NOT circuit according to the present embodiment operates reliably and stably.
- VH or VL as an input and VHZ2 or VL as an output
- VH-VL the input potential difference
- VH / 2-VL the output potential difference
- the potential difference between input and output can be set freely within that range. Examples in which the potential difference between input and output is equal will be described in detail in the third and fourth embodiments. That is, according to the present invention, a NOT circuit having the same input / output level can be configured.
- FIG. 16 is a schematic diagram of a NOT circuit showing a tenth embodiment of the present invention.
- the conductive member is a A g 1 1 1 on the mixed conductor (Ag 2 S) and the first electrode 1 1 2 is made form a mobile ions (Ag ions) in the mixed conductor 1
- Atomic switches are used in which 14 precipitates and forms a bridge 115 with Ag atoms between the second electrode (Pt) 113 and Ag.
- the voltage VH / 2 corresponding to the high level of the output is applied to the second electrode (Pt) 113 of the atomic switch via the resistor 116 (resistance value R3), and the output terminal Vt. . ut is connected.
- the conductive member (Ag) 111 constituting the first electrode 112 of the atom switch is connected to a low-level output corresponding to the output via the resistor 117 (resistance R4).
- the capacitor one 1 1 8 (capacitance C 2) With pressure VL is applied, via the capacitor one 1 1 8 (capacitance C 2), the input terminal V in is connected.
- FIG. 17 (e) shows the potential difference between the electrodes 112, 113 of the atomic switch.
- VL mouth level
- VH / 2 the potential difference at which the atomic switch is to be turned off
- the potential difference between the two electrodes 1 12, 1 1 3 atomic switch when the input V in is at the high level (VH) is substantially zero, the ON state of the atomic sweep rate Tutsi is kept stable. That is, the NOT circuit according to the present embodiment operates reliably and stably.
- VH and VL as inputs and VH / 2 and VL as outputs has been described. Similar to the NOT circuit shown in Fig. 14), there is a restriction that the input potential difference must always be greater than the output potential difference, but the input / output potential difference can be set freely within that range.
- the arrangement and number of the atomic switches, the resistors and the capacitors can be other than the above-described embodiment, and the main feature of the present invention is to use them as components.
- FIG. 18 is a schematic diagram of a NOT circuit showing the eleventh embodiment of the present invention
- FIG. 19 is a diagram showing an operation principle of the N 0 T circuit shown in FIG.
- a diode 109 is connected to the portion (V. ut 'in FIG. 18) corresponding to the output of the NOT circuit shown in the ninth embodiment (FIG. 14), and the other end of the diode 109 is connected to a resistor. 1 VH is applied via 10 (resistance value R5) and output terminal V. ut is connected. Further, the voltage applied via the resistor 107 (resistance R2) is not VL but VS, which is different from the NOT circuit shown in the ninth embodiment (FIG. 14).
- VH ⁇ VS the threshold voltage of the diode 109
- VF the threshold voltage of the diode 109
- RF, 8 >>5:>?
- Figure 19 (c) shows the voltage applied to the diode.
- R5XR2 (VH-VL) / (VL-VF-VS)
- FIG. 20 is a schematic diagram of a NOT circuit showing a twelfth embodiment of the present invention.
- a diode 119 is connected to the part (V. ut ') corresponding to the output of the NOT circuit shown in the tenth embodiment (FIG. 16), and the other end of the diode 119 is connected to a resistor 120 (resistance value). VH is applied via R6) and the output terminal V. ut is connected. In addition, resistance 1 17
- the difference from the NOT circuit of the tenth embodiment is that the voltage applied via (resistance value R4) is not VL but VS.
- the operating principle is almost the same as the NOT circuit described in the first embodiment, and the use of the resistor 120 that satisfies RB >> R 6 >> RF is used.
- R6 / 2R4 (VH-VL) / (VL-VF-VS)
- a NOT circuit having the same potential difference between input and output can be configured by simply adding a diode and a resistor to a NOT circuit in which an arti- mic switch, a resistor, and a capacitor are variously arranged. That is, the arrangement of the atomic switch, the resistor, the capacitor, and the diode is not limited to the arrangement described in the above embodiment, and the use of them as components is a feature of the present invention.
- FIG. 21 is a schematic diagram of a binary 1-digit adder showing a thirteenth embodiment of the present invention.
- a binary one-digit adder is configured using a NOT circuit, an AND circuit using an atomic switch, and an OR circuit according to the present invention.
- the NOT circuit used was that of the eleventh embodiment shown in FIG.
- the AND circuit and the OR circuit those proposed by the present inventors as Japanese Patent Application No. 2000-334686 were used.
- the parts that make up each NOT circuit, AND circuit, and OR circuit are surrounded by dotted lines. That is, this binary 1 ⁇ adder is composed of two NOT circuits 122 1 and 122, three AND circuits 123, 124 and 125, and one ⁇ R circuit 126.
- This circuit is represented by a logical symbol as shown in FIG. 22, 121 ', 122' are NOT circuits, 123 ', 124', and 125 'are AND circuits, and 126' is an OR circuit.
- the outputs S and C are as shown in FIG. 23.
- the binary 1 ⁇ It can be seen that an adder can be configured.
- a NOT circuit, an AND circuit, and an OR circuit can be configured using two-terminal elements, so that all logic circuits can be configured with only two-terminal elements. Will be possible.
- the present invention is not limited to the above embodiments, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention. As described above, according to the present invention, the following effects can be obtained.
- a point-contact array that operates at high speed and consumes low power can be constructed, and a multiplex-recording memory element, a logic circuit, and an arithmetic circuit can be realized.
- the point contact array, NOT circuit, and electronic circuit using the same according to the present invention can be used for nanoscale logic circuits, arithmetic circuits, and memory elements.
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60126310T DE60126310T2 (de) | 2000-11-01 | 2001-10-29 | Punktkontaktarray, Not-Schaltung und elektronische Schaltung damit |
EP01980925A EP1331671B1 (en) | 2000-11-01 | 2001-10-29 | Point contact array and electronic circuit comprising the same |
KR1020037004682A KR100751736B1 (ko) | 2000-11-01 | 2001-10-29 | 포인트 컨택트 어레이, not 회로, 및 이를 이용한 전자회로 |
US10/363,259 US7026911B2 (en) | 2000-11-01 | 2001-10-29 | Point contact array, not circuit, and electronic circuit comprising the same |
US10/918,360 US7473982B2 (en) | 2000-11-01 | 2004-08-16 | Point contact array, not circuit, and electronic circuit comprising the same |
US11/165,037 US7525410B2 (en) | 2000-11-01 | 2005-06-24 | Point contact array, not circuit, and electronic circuit using the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000334686A JP4118500B2 (ja) | 2000-11-01 | 2000-11-01 | ポイントコンタクト・アレー |
JP2000-334686 | 2000-11-01 | ||
JP2001138103A JP4097912B2 (ja) | 2001-05-09 | 2001-05-09 | Not回路及びそれを用いた電子回路 |
JP2001-138103 | 2001-05-09 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
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US10363259 A-371-Of-International | 2001-10-29 | ||
US10/918,360 Division US7473982B2 (en) | 2000-11-01 | 2004-08-16 | Point contact array, not circuit, and electronic circuit comprising the same |
US11/165,037 Division US7525410B2 (en) | 2000-11-01 | 2005-06-24 | Point contact array, not circuit, and electronic circuit using the same |
Publications (1)
Publication Number | Publication Date |
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WO2002037572A1 true WO2002037572A1 (fr) | 2002-05-10 |
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ID=26603286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2001/009464 WO2002037572A1 (fr) | 2000-11-01 | 2001-10-29 | Reseau a pointes, circuit non, et circuit electronique contenant ceux-ci |
Country Status (6)
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US (3) | US7026911B2 (ja) |
EP (2) | EP1331671B1 (ja) |
KR (1) | KR100751736B1 (ja) |
DE (2) | DE60131036T2 (ja) |
TW (1) | TW523983B (ja) |
WO (1) | WO2002037572A1 (ja) |
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US6635525B1 (en) * | 2002-06-03 | 2003-10-21 | International Business Machines Corporation | Method of making backside buried strap for SOI DRAM trench capacitor |
US6952042B2 (en) * | 2002-06-17 | 2005-10-04 | Honeywell International, Inc. | Microelectromechanical device with integrated conductive shield |
-
2001
- 2001-10-29 US US10/363,259 patent/US7026911B2/en not_active Expired - Lifetime
- 2001-10-29 KR KR1020037004682A patent/KR100751736B1/ko not_active IP Right Cessation
- 2001-10-29 DE DE60131036T patent/DE60131036T2/de not_active Expired - Lifetime
- 2001-10-29 TW TW090126677A patent/TW523983B/zh not_active IP Right Cessation
- 2001-10-29 DE DE60126310T patent/DE60126310T2/de not_active Expired - Lifetime
- 2001-10-29 EP EP01980925A patent/EP1331671B1/en not_active Expired - Lifetime
- 2001-10-29 EP EP06001940A patent/EP1662575B1/en not_active Expired - Lifetime
- 2001-10-29 WO PCT/JP2001/009464 patent/WO2002037572A1/ja active IP Right Grant
-
2004
- 2004-08-16 US US10/918,360 patent/US7473982B2/en not_active Expired - Fee Related
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2005
- 2005-06-24 US US11/165,037 patent/US7525410B2/en not_active Expired - Fee Related
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WO2003028124A1 (fr) * | 2001-09-25 | 2003-04-03 | Japan Science And Technology Agency | Dispositif electrique comprenant un electrolyte solide |
US7875883B2 (en) | 2001-09-25 | 2011-01-25 | Japan Science And Technology Agency | Electric device using solid electrolyte |
WO2004051763A2 (de) * | 2002-12-03 | 2004-06-17 | Infineon Technologies Ag | Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung |
WO2004051763A3 (de) * | 2002-12-03 | 2004-09-30 | Infineon Technologies Ag | Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung |
CN100428519C (zh) * | 2002-12-03 | 2008-10-22 | 因芬尼昂技术股份公司 | 制造记忆胞元之方法、记忆胞元及记忆胞元装置 |
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US10791490B2 (en) | 2003-11-05 | 2020-09-29 | Signal Trust For Wireless Innovation | Supporting enhanced uplink transmission during soft handover |
US10791491B2 (en) | 2003-11-05 | 2020-09-29 | Signal Trust For Wireless Innovation | Supporting uplink transmissions |
US10219196B2 (en) | 2003-11-05 | 2019-02-26 | Signal Trust For Wireless Innovation | Supporting enhanced uplink transmission during soft handover |
US11706681B2 (en) | 2003-11-05 | 2023-07-18 | Pantech Wireless, Llc | Supporting uplink transmissions |
Also Published As
Publication number | Publication date |
---|---|
EP1662575A3 (en) | 2006-06-07 |
US7473982B2 (en) | 2009-01-06 |
TW523983B (en) | 2003-03-11 |
DE60126310T2 (de) | 2007-06-06 |
EP1662575A2 (en) | 2006-05-31 |
KR100751736B1 (ko) | 2007-08-27 |
DE60131036T2 (de) | 2008-02-14 |
US7026911B2 (en) | 2006-04-11 |
EP1662575B1 (en) | 2007-10-17 |
KR20030048421A (ko) | 2003-06-19 |
US20050243844A1 (en) | 2005-11-03 |
EP1331671A4 (en) | 2005-05-04 |
EP1331671B1 (en) | 2007-01-24 |
DE60126310D1 (de) | 2007-03-15 |
US20030174042A1 (en) | 2003-09-18 |
EP1331671A1 (en) | 2003-07-30 |
US20050014325A1 (en) | 2005-01-20 |
DE60131036D1 (de) | 2007-11-29 |
US7525410B2 (en) | 2009-04-28 |
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